PIC12F609/615/617 PIC12HV609/615 Data Sheet 8-Pin, Flash-Based 8-Bit CMOS Microcontrollers *8-bit, 8-pin Devices Protected by Microchip's Low Pin Count Patent: U.S. Patent No. 5,847,450. Additional U.S. and foreign patents and applications may be issued or pending. 2010 Microchip Technology Inc. DS41302D Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. 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Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS41302D-page 2 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 8-Pin Flash-Based, 8-Bit CMOS Microcontrollers High-Performance RISC CPU: Peripheral Features: * Only 35 Instructions to Learn: - All single-cycle instructions except branches * Operating Speed: - DC - 20 MHz oscillator/clock input - DC - 200 ns instruction cycle * Interrupt Capability * 8-Level Deep Hardware Stack * Direct, Indirect and Relative Addressing modes * Shunt Voltage Regulator (PIC12HV609/615 only): - 5 volt regulation - 4 mA to 50 mA shunt range * 5 I/O Pins and 1 Input Only * High Current Source/Sink for Direct LED Drive - Interrupt-on-pin change or pins - Individually programmable weak pull-ups * Analog Comparator module with: - One analog comparator - Programmable on-chip voltage reference (CVREF) module (% of VDD) - Comparator inputs and output externally accessible - Built-In Hysteresis (software selectable) * Timer0: 8-Bit Timer/Counter with 8-Bit Programmable Prescaler * Enhanced Timer1: - 16-bit timer/counter with prescaler - External Timer1 Gate (count enable) - Option to use OSC1 and OSC2 in LP mode as Timer1 oscillator if INTOSC mode selected - Option to use system clock as Timer1 * In-Circuit Serial ProgrammingTM (ICSPTM) via Two Pins Special Microcontroller Features: * Precision Internal Oscillator: - Factory calibrated to 1%, typical - Software selectable frequency: 4 MHz or 8 MHz * Power-Saving Sleep mode * Voltage Range: - PIC12F609/615/617: 2.0V to 5.5V - PIC12HV609/615: 2.0V to user defined maximum (see note) * Industrial and Extended Temperature Range * Power-on Reset (POR) * Power-up Timer (PWRT) and Oscillator Start-up Timer (OST) * Brown-out Reset (BOR) * Watchdog Timer (WDT) with independent Oscillator for Reliable Operation * Multiplexed Master Clear with Pull-up/Input Pin * Programmable Code Protection * High Endurance Flash: - 100,000 write Flash endurance - Flash retention: > 40 years * Self Read/ Write Program Memory (PIC12F617 only) Low-Power Features: * Standby Current: - 50 nA @ 2.0V, typical * Operating Current: - 11 A @ 32 kHz, 2.0V, typical - 260 A @ 4 MHz, 2.0V, typical * Watchdog Timer Current: - 1 A @ 2.0V, typical Note: PIC12F615/617/HV615 ONLY: * Enhanced Capture, Compare, PWM module: - 16-bit Capture, max. resolution 12.5 ns - Compare, max. resolution 200 ns - 10-bit PWM with 1 or 2 output channels, 1 output channel programmable "dead time," max. frequency 20 kHz, auto-shutdown * A/D Converter: - 10-bit resolution and 4 channels, samples internal voltage references * Timer2: 8-Bit Timer/Counter with 8-Bit Period Register, Prescaler and Postscaler Voltage across the shunt regulator should not exceed 5V. 2010 Microchip Technology Inc. DS41302D-page 3 PIC12F609/615/617/12HV609/615 Device Program Memory Data Memory Flash (words) SRAM (bytes) Self Read/ Self Write PIC12HV615 1024 64 -- -- -- -- PIC12F617 2048 128 YES PIC12F609 1024 64 PIC12HV609 1024 64 PIC12F615 1024 64 I/O 10-bit A/D Comparators ECCP (ch) Timers 8/16-bit Voltage Range 5 0 1 2.0V-5.5V 0 1 -- -- 1/1 5 1/1 2.0V-user defined 5 4 1 YES 2/1 2.0V-5.5V 5 4 1 YES 2/1 2.0V-user defined 5 4 1 YES 2/1 2.0V-5.5V 8-Pin Diagram, PIC12F609/HV609 (PDIP, SOIC, MSOP, DFN) VDD 1 8 GP5/T1CKI/OSC1/CLKIN 2 GP4/CIN1-/T1G/OSC2/CLKOUT 3 PIC12F609/ 7 HV609 6 GP3/MCLR/VPP 4 5 VSS GP0/CIN+/ICSPDAT GP1/CIN0-/ICSPCLK GP2/T0CKI/INT/COUT PIC12F609/HV609 PIN SUMMARY (PDIP, SOIC, MSOP, DFN) TABLE 1: I/O Pin Comparators Timer Interrupts Pull-ups Basic GP0 7 CIN+ -- IOC Y ICSPDAT GP1 6 CIN0- -- IOC Y ICSPCLK GP2 5 COUT T0CKI INT/IOC Y -- -- IOC Y(2) MCLR/VPP GP3 (1) 4 -- GP4 3 CIN1- T1G IOC Y OSC2/CLKOUT GP5 2 -- T1CKI IOC Y OSC1/CLKIN -- 1 -- -- -- -- VDD -- 8 -- -- -- -- VSS Note 1: 2: Input only. Only when pin is configured for external MCLR. DS41302D-page 4 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 8-Pin Diagram, PIC12F615/617/HV615 (PDIP, SOIC, MSOP, DFN) VDD 1 8 GP5/T1CKI/P1A*/OSC1/CLKIN 2 GP4/AN3/CIN1-/T1G/P1B*/OSC2/CLKOUT 3 PIC12F615/ 7 617/HV615 6 GP3/T1G*/MCLR/VPP 4 5 * VSS GP0/AN0/CIN+/P1B/ICSPDAT GP1/AN1/CIN0-/VREF/ICSPCLK GP2/AN2/T0CKI/INT/COUT/CCP1/P1A Alternate pin function. PIC12F615/617/HV615 PIN SUMMARY (PDIP, SOIC, MSOP, DFN) TABLE 2: Pin Analog Comparator s Timer CCP Interrupts Pull-ups Basic 7 AN0 CIN+ -- P1B IOC Y ICSPDAT GP1 6 AN1 CIN0- -- -- IOC Y ICSPCLK/VREF GP2 5 AN2 COUT T0CKI CCP1/P1A INT/IOC Y -- IOC Y(2) MCLR/VPP I/O GP0 (1) 4 -- -- GP4 3 AN3 CIN1- T1G P1B* IOC Y OSC2/CLKOUT GP5 2 -- -- T1CKI P1A* IOC Y OSC1/CLKIN -- 1 -- -- -- -- -- -- VDD -- 8 -- -- -- -- -- -- VSS GP3 * Note 1: 2: T1G* -- Alternate pin function. Input only. Only when pin is configured for external MCLR. 2010 Microchip Technology Inc. DS41302D-page 5 PIC12F609/615/617/12HV609/615 Table of Contents 1.0 Device Overview ......................................................................................................................................................................... 7 2.0 Memory Organization ................................................................................................................................................................ 11 3.0 Flash Program Memory Self Read/Self Write Control (PIC12F617 only).................................................................................. 27 4.0 Oscillator Module ....................................................................................................................................................................... 37 5.0 I/O Port ...................................................................................................................................................................................... 43 6.0 Timer0 Module .......................................................................................................................................................................... 53 7.0 Timer1 Module with Gate Control .............................................................................................................................................. 57 8.0 Timer2 Module (PIC12F615/617/HV615 only) .......................................................................................................................... 65 9.0 Comparator Module ................................................................................................................................................................... 67 10.0 Analog-to-Digital Converter (ADC) Module (PIC12F615/617/HV615 only) ............................................................................... 79 11.0 Enhanced Capture/Compare/PWM (With Auto-Shutdown and Dead Band) Module (PIC12F615/617/HV615 only) ............... 89 12.0 Special Features of the CPU ................................................................................................................................................... 107 13.0 Voltage Regulator .................................................................................................................................................................... 127 14.0 Instruction Set Summary ........................................................................................................................................................ 129 15.0 Development Support ............................................................................................................................................................. 139 16.0 Electrical Specifications ........................................................................................................................................................... 143 17.0 DC and AC Characteristics Graphs and Tables ...................................................................................................................... 171 18.0 Packaging Information ............................................................................................................................................................ 195 Appendix A: Data Sheet Revision History ......................................................................................................................................... 203 Appendix B: Migrating from other PIC(R) Devices ............................................................................................................................... 203 Index ................................................................................................................................................................................................. 205 The Microchip Web Site 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As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: * Microchip's Worldwide Web site; http://www.microchip.com * Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. DS41302D-page 6 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 1.0 DEVICE OVERVIEW Block Diagrams and pinout descriptions of the devices are as follows: The PIC12F609/615/617/12HV609/615 devices are covered by this data sheet. They are available in 8-pin PDIP, SOIC, MSOP and DFN packages. FIGURE 1-1: * PIC12F609/HV609 (Figure 1-1, Table 1-1) * PIC12F615/617/HV615 (Figure 1-2, Table 1-2) PIC12F609/HV609 BLOCK DIAGRAM INT Configuration 13 8 Data Bus Program Counter Flash 1K X 14 Program Memory Program Bus GP0 GP1 GP2 GP3 GP4 GP5 RAM 64 Bytes File Registers 8-Level Stack (13-Bit) 14 RAM Addr GPIO 9 Addr MUX Instruction Reg 7 Direct Addr Indirect Addr 8 FSR Reg STATUS Reg 8 3 Power-up Timer OSC1/CLKIN Instruction Decode & Control Oscillator Start-up Timer Timing Generation Watchdog Timer Power-on Reset MUX ALU 8 W Reg Brown-out Reset OSC2/CLKOUT Internal Oscillator Block Shunt Regulator (PIC12HV609 only) MCLR T1G VDD VSS T1CKI Timer0 Timer1 T0CKI Comparator Voltage Reference Absolute Voltage Reference Analog Comparator and Reference CIN+ CIN0CIN1COUT 2010 Microchip Technology Inc. DS41302D-page 7 PIC12F609/615/617/12HV609/615 FIGURE 1-2: PIC12F615/617/HV615 BLOCK DIAGRAM INT Configuration 13 Flash 1K X 14 and 2K X 14** Program Memory Program Bus 8 Data Bus GPIO Program Counter GP0 GP1 GP2 GP3 GP4 GP5 RAM 64 Bytes and 128 Bytes** File Registers 8-Level Stack (13-Bit) 14 RAM Addr 9 Addr MUX Instruction Reg 7 Direct Addr Indirect Addr 8 FSR Reg STATUS Reg 8 3 Power-up Timer OSC1/CLKIN Instruction Decode & Control Oscillator Start-up Timer Timing Generation Watchdog Timer Power-on Reset ALU 8 W Reg Brown-out Reset OSC2/CLKOUT Internal Oscillator Block T1G* MUX Shunt Regulator (PIC12HV615 only) MCLR T1G VDD VSS T1CKI Timer0 Timer1 T0CKI Comparator Voltage Reference Analog-To-Digital Converter Absolute Voltage Reference ECCP CCP1/P1A P1B P1A* P1B* DS41302D-page 8 Analog Comparator and Reference CIN+ CIN0CIN1COUT AN0 AN1 AN2 AN3 VREF * ** Timer2 Alternate pin function. For the PIC12F617 only. 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 TABLE 1-1: PIC12F609/HV609 PINOUT DESCRIPTION Name Function Input Type Output Type GP0/CIN+/ICSPDAT GP0 TTL CMOS CIN+ AN -- ICSPDAT ST CMOS GP1 TTL CMOS CIN0- AN -- Comparator inverting input Serial Programming Clock GP1/CIN0-/ICSPCLK ICSPCLK ST -- GP2 ST CMOS T0CKI ST -- GP2/T0CKI/INT/COUT INT ST -- COUT -- CMOS General purpose I/O with prog. pull-up and interrupt-on-change Comparator non-inverting input Serial Programming Data I/O General purpose I/O with prog. pull-up and interrupt-on-change General purpose I/O with prog. pull-up and interrupt-on-change Timer0 clock input External Interrupt Comparator output GP3 TTL -- General purpose input with interrupt-on-change MCLR ST -- Master Clear w/internal pull-up VPP HV -- Programming voltage GP3/MCLR/VPP GP4/CIN1-/T1G/OSC2/ CLKOUT Description GP4 TTL CMOS CIN1- AN -- T1G ST -- OSC2 -- XTAL General purpose I/O with prog. pull-up and interrupt-on-change Comparator inverting input Timer1 gate (count enable) Crystal/Resonator CLKOUT -- CMOS FOSC/4 output GP5 TTL CMOS General purpose I/O with prog. pull-up and interrupt-on-change T1CKI ST -- OSC1 XTAL -- Crystal/Resonator CLKIN ST -- External clock input/RC oscillator connection VDD VDD Power -- Positive supply VSS VSS Power -- Ground reference GP5/T1CKI/OSC1/CLKIN Legend: AN=Analog input or output ST=Schmitt Trigger input with CMOS levels 2010 Microchip Technology Inc. Timer1 clock input CMOS = CMOS compatible input or output TTL = TTL compatible input HV= High Voltage XTAL=Crystal DS41302D-page 9 PIC12F609/615/617/12HV609/615 TABLE 1-2: PIC12F615/617/HV615 PINOUT DESCRIPTION Name GP0/AN0/CIN+/P1B/ICSPDAT GP1/AN1/CIN0-/VREF/ICSPCLK GP2/AN2/T0CKI/INT/COUT/CCP1/ P1A GP3/T1G*/MCLR/VPP GP4/AN3/CIN1-/T1G/P1B*/OSC2/ CLKOUT GP5/T1CKI/P1A*/OSC1/CLKIN Function Input Type Output Type GP0 TTL CMOS Description General purpose I/O with prog. pull-up and interrupt-onchange AN0 AN -- A/D Channel 0 input CIN+ AN -- Comparator non-inverting input P1B -- CMOS ICSPDAT ST CMOS PWM output Serial Programming Data I/O GP1 TTL CMOS General purpose I/O with prog. pull-up and interrupt-onchange AN1 AN -- A/D Channel 1 input CIN0- AN -- Comparator inverting input VREF AN -- External Voltage Reference for A/D ICSPCLK ST -- Serial Programming Clock GP2 ST CMOS General purpose I/O with prog. pull-up and interrupt-onchange AN2 AN -- A/D Channel 2 input T0CKI ST -- Timer0 clock input INT ST -- COUT -- CMOS Comparator output External Interrupt CCP1 ST CMOS Capture input/Compare input/PWM output P1A -- CMOS GP3 TTL -- General purpose input with interrupt-on-change T1G* ST -- Timer1 gate (count enable), alternate pin PWM output MCLR ST -- Master Clear w/internal pull-up VPP HV -- Programming voltage GP4 TTL CMOS General purpose I/O with prog. pull-up and interrupt-onchange AN3 AN -- A/D Channel 3 input CIN1- AN -- Comparator inverting input Timer1 gate (count enable) T1G ST -- P1B* -- CMOS PWM output, alternate pin OSC2 -- XTAL Crystal/Resonator CLKOUT -- CMOS FOSC/4 output GP5 TTL CMOS General purpose I/O with prog. pull-up and interrupt-onchange T1CKI ST -- P1A* -- CMOS OSC1 XTAL -- Crystal/Resonator Timer1 clock input PWM output, alternate pin CLKIN ST -- External clock input/RC oscillator connection VDD VDD Power -- Positive supply VSS VSS Power -- Ground reference * Legend: Alternate pin function. AN=Analog input or output ST=Schmitt Trigger input with CMOS levels DS41302D-page 10 CMOS=CMOS compatible input or output TTL = TTL compatible input HV= High Voltage XTAL=Crystal 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 2.0 MEMORY ORGANIZATION 2.1 Program Memory Organization FIGURE 2-2: The PIC12F609/615/617/12HV609/615 has a 13-bit program counter capable of addressing an 8K x 14 program memory space. Only the first 1K x 14 (0000h03FFh) for the PIC12F609/615/12HV609/615 is physically implemented. For the PIC12F617, the first 2K x 14 (0000h-07FFh) is physically implemented. Accessing a location above these boundaries will cause a wrap-around within the first 1K x 14 space for PIC12F609/615/12HV609/615 devices, and within the first 2K x 14 space for the PIC12F617 device. The Reset vector is at 0000h and the interrupt vector is at 0004h (see Figure 2-1). FIGURE 2-1: PROGRAM MEMORY MAP AND STACK FOR THE PIC12F609/615/12HV609/615 PC<12:0> CALL, RETURN RETFIE, RETLW PROGRAM MEMORY MAP AND STACK FOR THE PIC12F617 PC<12:0> CALL, RETURN RETFIE, RETLW 13 Stack Level 1 Stack Level 2 Stack Level 8 On-Chip Program Memory Reset Vector 0000h Interrupt Vector 0004h 0005h Page 0 07FFh 0800h Wraps to 0000h-07FFh 13 1FFFh Stack Level 1 Stack Level 2 2.2 Data Memory Organization 03FFh The data memory (see Figure 2-3) is partitioned into two banks, which contain the General Purpose Registers (GPR) and the Special Function Registers (SFR). The Special Function Registers are located in the first 32 locations of each bank. Register locations 40h-7Fh in Bank 0 are General Purpose Registers, implemented as static RAM. For the PIC12F617, the register locations 20h-7Fh in Bank 0 and A0h-EFh in Bank 1 are general purpose registers implemented as Static RAM. Register locations F0h-FFh in Bank 1 point to addresses 70h-7Fh in Bank 0. All other RAM is unimplemented and returns `0' when read. The RP0 bit of the STATUS register is the bank select bit. 0400h RP0 Stack Level 8 Reset Vector 0000h Interrupt Vector 0004h 0005h On-chip Program Memory Wraps to 0000h-03FFh 1FFFh 0 Bank 0 is selected 1 Bank 1 is selected Note: 2010 Microchip Technology Inc. The IRP and RP1 bits of the STATUS register are reserved and should always be maintained as `0's. DS41302D-page 11 PIC12F609/615/617/12HV609/615 2.2.1 GENERAL PURPOSE REGISTER FILE The register file is organized as 64 x 8 in the PIC12F609/615/12HV609/615, and as 128 x 8 in the PIC12F617. Each register is accessed, either directly or indirectly, through the File Select Register (FSR) (see Section 2.4 "Indirect Addressing, INDF and FSR Registers"). 2.2.2 FIGURE 2-3: DATA MEMORY MAP OF THE PIC12F609/HV609 File Address File Address Indirect Addr.(1) 00h Indirect Addr.(1) 80h TMR0 01h OPTION_REG 81h PCL 02h PCL 82h STATUS 03h STATUS 83h FSR 04h FSR 84h GPIO 05h TRISIO 85h SPECIAL FUNCTION REGISTERS The Special Function Registers are registers used by the CPU and peripheral functions for controlling the desired operation of the device (see Table 2-1). These registers are static RAM. 06h 86h 07h 87h 08h 88h 89h 09h The special registers can be classified into two sets: core and peripheral. The Special Function Registers associated with the "core" are described in this section. Those related to the operation of the peripheral features are described in the section of that peripheral feature. PCLATH 0Ah PCLATH 8Ah INTCON 0Bh INTCON 8Bh PIR1 0Ch PIE1 8Ch 8Dh 0Dh TMR1L 0Eh TMR1H 0Fh T1CON 10h PCON 8Eh 8Fh OSCTUNE 90h 11h 91h 12h 92h 13h 93h 94h 14h 15h WPU 95h 16h IOC 96h 17h 97h 18h 98h VRCON 19h 99h CMCON0 1Ah 9Ah 1Bh 9Bh 1Ch 9Ch 1Dh 9Dh CMCON1 9Eh 1Eh ANSEL 1Fh 20h 9Fh A0h 3Fh General Purpose Registers 64 Bytes Accesses 70h-7Fh 40h 6Fh 70h Accesses 70h-7Fh EFh F0h FFh 7Fh Bank 1 Bank 0 Unimplemented data memory locations, read as `0'. Note DS41302D-page 12 1: Not a physical register. 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 FIGURE 2-4: DATA MEMORY MAP OF THE PIC12F615/617/HV615 File Address File Address Indirect Addr.(1) 00h Indirect Addr.(1) 80h TMR0 01h OPTION_REG 81h PCL 02h PCL 82h STATUS 03h STATUS 83h FSR 04h FSR 84h GPIO 05h TRISIO 85h 06h 86h 07h 87h 08h 88h 89h 09h PCLATH 0Ah PCLATH 8Ah INTCON 0Bh INTCON 8Bh PIR1 0Ch PIE1 8Ch 8Dh 0Dh PCON TMR1L 0Eh TMR1H 0Fh T1CON 10h TMR2 11h T2CON 12h PR2 92h CCPR1L 13h APFCON 93h CCPR1H 14h CCP1CON 15h WPU 95h PWM1CON 16h IOC 96h ECCPAS 17h 8Eh 8Fh OSCTUNE 91h 94h 97h (2) 18h PMCON1 VRCON 19h PMCON2 CMCON0 1Ah PMADRL 1Bh PMADRH 1Ch PMDATL 1Dh PMDATH CMCON1 90h (2) (2) (2) (2) (2) 98h 99h 9Ah 9Bh 9Ch 9Dh ADRESH 1Eh ADRESL 9Eh ADCON0 1Fh ANSEL 9Fh A0h 20h General Purpose Registers 32 Bytes(2) General Purpose Registers 96 Bytes from 20h-7Fh(2) Unimplemented for PIC12F615/HV615 Unimplemented for PIC12F615/HV615 BFh C0h 3Fh General Purpose Registers 64 Bytes Accesses 70h-7Fh 40h 6Fh 70h Accesses 70h-7Fh FFh 7Fh Bank 0 EFh F0h Bank 1 Unimplemented data memory locations, read as `0'. Note 1: Not a physical register. 2: Used for the PIC12F617 only. 2010 Microchip Technology Inc. DS41302D-page 13 PIC12F609/615/617/12HV609/615 TABLE 2-1: Addr Name PIC12F609/HV609 SPECIAL FUNCTION REGISTERS SUMMARY BANK 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Page Bank 0 00h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx 25, 115 01h TMR0 Timer0 Module's Register xxxx xxxx 53, 115 02h PCL Program Counter's (PC) Least Significant Byte 0000 0000 25, 115 03h STATUS 0001 1xxx 18, 115 xxxx xxxx 25, 115 --x0 x000 43, 115 04h FSR 05h GPIO IRP(1) RP1(1) RP0 TO PD Z DC C GP4 GP3 GP2 GP1 GP0 Indirect Data Memory Address Pointer -- -- GP5 06h -- Unimplemented -- -- 07h -- Unimplemented -- -- 08h -- Unimplemented -- -- 09h -- Unimplemented -- -- ---0 0000 25, 115 0Ah PCLATH -- -- -- 0Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 20, 115 0Ch PIR1 -- -- -- -- CMIF -- -- TMR1IF ---- 0--0 22, 115 Write Buffer for upper 5 bits of Program Counter 0Dh -- 0Eh TMR1L Unimplemented Holding Register for the Least Significant Byte of the 16-bit TMR1 Register 0Fh TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register 10h T1CON 11h -- 12h -- 13h -- -- xxxx xxxx 57, 115 xxxx xxxx 57, 115 0000 0000 62, 115 Unimplemented -- -- Unimplemented -- -- -- Unimplemented -- -- 14h -- Unimplemented -- -- 15h -- Unimplemented -- -- 16h -- Unimplemented -- -- 17h -- Unimplemented -- -- 18h -- Unimplemented -- -- 19h VRCON 1Ah CMCON0 1Bh 1Ch T1GINV TMR1GE T1CKPS1 T1CKPS0 T1SYNC TMR1CS TMR1ON CMVREN -- VRR FVREN VR3 VR2 VR1 VR0 0-00 0000 76, 116 CMON COUT CMOE CMPOL -- CMR -- CMCH 0000 -0-0 72, 116 -- CMCON1 T1OSCEN -- -- -- -- T1ACS CMHYS -- -- T1GSS CMSYNC -- -- ---0 0-10 73, 116 1Dh -- Unimplemented -- -- 1Eh -- Unimplemented -- -- 1Fh -- Unimplemented -- -- Legend: 1: 2: - = Unimplemented locations read as `0', u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented IRP and RP1 bits are reserved, always maintain these bits clear. Read only register. DS41302D-page 14 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 TABLE 2-2: Addr Name PIC12F615/617/HV615 SPECIAL FUNCTION REGISTERS SUMMARY BANK 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Page Bank 0 00h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx 25, 116 01h TMR0 Timer0 Module's Register xxxx xxxx 53, 116 02h PCL Program Counter's (PC) Least Significant Byte 03h STATUS 04h FSR 05h GPIO IRP(1) RP1(1) RP0 0000 0000 25, 116 TO PD Z DC C 0001 1xxx 18, 116 GP4 GP3 GP2 GP1 GP0 --x0 x000 43, 116 Indirect Data Memory Address Pointer -- -- GP5 xxxx xxxx 25, 116 06h -- Unimplemented -- -- 07h -- Unimplemented -- -- 08h -- Unimplemented -- -- 09h -- Unimplemented -- -- 0Ah PCLATH -- 0Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 20, 116 0Ch PIR1 -- ADIF CCP1IF -- CMIF -- TMR2IF TMR1IF -00- 0-00 22, 116 -- -- Write Buffer for upper 5 bits of Program Counter 0Dh -- 0Eh TMR1L Unimplemented Holding Register for the Least Significant Byte of the 16-bit TMR1 Register 0Fh TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register 10h T1CON T1GINV ---0 0000 25, 116 -- TMR1GE -- xxxx xxxx 57, 116 xxxx xxxx 57, 116 T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 0000 0000 62, 116 11h TMR2(3) 12h T2CON(3) 13h CCPR1L(3) Capture/Compare/PWM Register 1 Low Byte 14h CCPR1H(3) Capture/Compare/PWM Register 1 High Byte 15h CCP1CON(3) P1M -- DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 16h PWM1CON(3) PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0 0000 0000 105, 116 17h ECCPAS(3) ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0 0000 0000 102, 116 -- -- 18h -- 19h VRCON 1Ah CMCON0 1Bh 1Ch Timer2 Module Register -- TOUTPS3 0000 0000 65, 116 1Dh -- 1Eh ADRESH(2, 3) 1Fh ADCON0(3) Legend: Note 1: 2: 3: XXXX XXXX 90, 116 Unimplemented 0-00 0000 89, 116 CMVREN -- VRR FVREN VR3 VR2 VR1 VR0 0-00 0000 76, 116 CMON COUT CMOE CMPOL -- CMR -- CMCH 0000 -0-0 72, 116 CMSYNC ---0 0-10 73, 116 -- CMCON1 -000 0000 66, 116 XXXX XXXX 90, 116 -- -- -- -- T1ACS CMHYS -- -- T1GSS -- Unimplemented -- Most Significant 8 bits of the left shifted A/D result or 2 bits of right shifted result ADFM VCFG -- CHS2 CHS1 CHS0 GO/DONE -- -- xxxx xxxx 85, 116 ADON 00-0 0000 84, 116 - = Unimplemented locations read as `0', u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented IRP and RP1 bits are reserved, always maintain these bits clear. Read only register. PIC12F615/617/HV615 only. 2010 Microchip Technology Inc. DS41302D-page 15 PIC12F609/615/617/12HV609/615 TABLE 2-3: Addr Name PIC12F609/HV609 SPECIAL FUNCTION REGISTERS SUMMARY BANK 1 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Page Bank 1 80h INDF 81h OPTION_RE G Addressing this location uses contents of FSR to address data memory (not a physical register) 82h PCL 83h STATUS 84h FSR 85h TRISIO GPPU INTEDG T0CS T0SE PS2 PS1 PS0 TO PD Z DC C 0001 1xxx 18, 116 TRISIO4 TRISIO3(4) TRISIO2 TRISIO1 TRISIO0 --11 1111 44, 116 Program Counter's (PC) Least Significant Byte IRP(1) RP1(1) RP0 -- TRISIO5 1111 1111 19, 116 0000 0000 25, 116 Indirect Data Memory Address Pointer -- xxxx xxxx 25, 116 PSA xxxx xxxx 25, 116 86h -- Unimplemented -- -- 87h -- Unimplemented -- -- 88h -- Unimplemented -- -- 89h -- Unimplemented -- -- 8Ah PCLATH -- -- -- 8Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF(3) 0000 0000 20, 116 8Ch PIE1 -- -- -- -- CMIE -- -- TMR1IE ---- 0--0 21, 116 -- -- -- -- -- POR BOR ---- --qq 23, 116 -- -- TUN4 TUN3 TUN2 TUN1 TUN0 ---0 0000 41, 116 8Dh 8Eh -- PCON 8Fh 90h -- OSCTUNE Write Buffer for upper 5 bits of Program Counter Unimplemented -- -- Unimplemented -- ---0 0000 25, 116 -- -- -- 91h -- Unimplemented -- -- 92h -- Unimplemented -- -- 93h -- Unimplemented -- -- 94h -- Unimplemented -- -- 95h WPU(2) 96h IOC -- -- WPU5 WPU4 -- WPU2 WPU1 WPU0 --11 -111 46, 116 -- -- IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 --00 0000 46, 116 97h -- Unimplemented -- -- 98h -- Unimplemented -- -- 99h -- Unimplemented -- -- 9Ah -- Unimplemented -- -- 9Bh -- Unimplemented -- -- 9Ch -- Unimplemented -- -- 9Dh -- Unimplemented -- -- 9Eh -- Unimplemented -- -- 9Fh ANSEL Legend: Note 1: 2: 3: 4: -- -- -- -- ANS3 -- ANS1 ANS0 ---- 1-11 45, 117 - = Unimplemented locations read as `0', u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented IRP and RP1 bits are reserved, always maintain these bits clear. GP3 pull-up is enabled when MCLRE is `1' in the Configuration Word register. MCLR and WDT Reset does not affect the previous value data latch. The GPIF bit will clear upon Reset but will set again if the mismatch exists. TRISIO3 always reads as `1' since it is an input only pin. DS41302D-page 16 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 TABLE 2-4: Addr Name PIC12F615/617/HV615 SPECIAL FUNCTION REGISTERS SUMMARY BANK 1 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Page Bank 1 80h INDF 81h OPTION_REG Addressing this location uses contents of FSR to address data memory (not a physical register) 82h PCL 83h STATUS GPPU INTEDG T0CS T0SE xxxx xxxx 25, 116 PSA PS2 PS1 PS0 1111 1111 19, 116 TO PD Z DC C 0001 1xxx 18, 116 TRISIO4 TRISIO3(4) TRISIO2 TRISIO1 TRISIO0 Program Counter's (PC) Least Significant Byte 84h FSR 85h TRISIO IRP(1) RP1(1) RP0 0000 0000 25, 116 Indirect Data Memory Address Pointer -- -- TRISIO5 xxxx xxxx 25, 116 --11 1111 44, 116 86h -- Unimplemented -- -- 87h -- Unimplemented -- -- 88h -- Unimplemented -- -- 89h -- Unimplemented -- -- 8Ah PCLATH -- 8Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF(3) 0000 0000 20, 116 8Ch PIE1 -- ADIE CCP1IE -- CMIE -- TMR2IE TMR1IE -00- 0-00 21, 116 -- -- -- -- -- POR BOR ---- --qq 23, 116 -- -- TUN4 TUN3 TUN2 TUN1 TUN0 ---0 0000 41, 116 8Dh 8Eh -- PCON 8Fh 90h -- OSCTUNE 91h -- 92h PR2 93h APFCON 94h -- Write Buffer for upper 5 bits of Program Counter 95h WPU(2) 96h IOC -- Unimplemented -- -- Unimplemented -- -- Unimplemented -- -- -- -- -- -- T1GSEL -- -- P1BSEL P1ASEL ---0 --00 21, 116 -- -- WPU5 WPU4 -- WPU2 WPU1 WPU0 --11 -111 46, 116 -- -- IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 --00 0000 46, 116 -- -- -- -- WREN WR RD PMADRL2 PMADRL1 Unimplemented -- Unimplemented PMCON1(7) 99h PMCON2(7) Program Memory Control Register 2 (not a physical register). 9Ah PMADRL(7) PMADRL7 PMADRL6 PMADRL5 PMADRL4 -- PMADRL3 9Bh PMADRH(7) -- -- -- -- -- 9Ch PMDATL(7) PMDATL7 PMDATL6 PMDATL5 PMDATL4 PMDATL3 9Dh PMDATH(7) -- -- 9Eh ADRESL(5, 6) 9Fh ANSEL 4: 5: 6: 7: -- 1111 1111 65, 116 98h Legend: Note 1: 2: 3: ---0 0000 25, 116 Timer2 Module Period Register -- 97h -- ADCS2 ADCS0 ANS3 -- 29 ---- ---- -- 28 PMADRH2 PMADRH1 PMADRH0 ---- -000 28 PMDATL2 0000 0000 28 --00 0000 28 PMDATL1 PMDATL0 Program Memory Data Register High Byte. ADCS1 -- ---- -000 PMADRL0 0000 0000 Least Significant 2 bits of the left shifted result or 8 bits of the right shifted result -- -- ANS2 xxxx xxxx 85, 117 ANS1 ANS0 -000 1111 45, 117 - = Unimplemented locations read as `0', u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented IRP and RP1 bits are reserved, always maintain these bits clear. GP3 pull-up is enabled when MCLRE is `1' in the Configuration Word register. MCLR and WDT Reset does not affect the previous value data latch. The GPIF bit will clear upon Reset but will set again if the mismatch exists. TRISIO3 always reads as `1' since it is an input only pin. Read only register. PIC12F615/617/HV615 only. PIC12F617 only. 2010 Microchip Technology Inc. DS41302D-page 17 PIC12F609/615/617/12HV609/615 2.2.2.1 STATUS Register The STATUS register, shown in Register 2-1, contains: * the arithmetic status of the ALU * the Reset status * the bank select bits for data memory (RAM) It is recommended, therefore, that only BCF, BSF, SWAPF and MOVWF instructions are used to alter the STATUS register, because these instructions do not affect any Status bits. For other instructions not affecting any Status bits, see the Section 14.0 "Instruction Set Summary". Note 1: Bits IRP and RP1 of the STATUS register are not used by the PIC12F609/615/617/ 12HV609/615 and should be maintained as clear. Use of these bits is not recommended, since this may affect upward compatibility with future products. The STATUS register can be the destination for any instruction, like any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. 2: The C and DC bits operate as a Borrow and Digit Borrow out bit, respectively, in subtraction. See the SUBLW and SUBWF instructions for examples. For example, CLRF STATUS, will clear the upper three bits and set the Z bit. This leaves the STATUS register as `000u u1uu' (where u = unchanged). REGISTER 2-1: STATUS: STATUS REGISTER Reserved Reserved R/W-0 R-1 R-1 R/W-x R/W-x R/W-x IRP RP1 RP0 TO PD Z DC C bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 7 IRP: This bit is reserved and should be maintained as `0' bit 6 RP1: This bit is reserved and should be maintained as `0' bit 5 RP0: Register Bank Select bit (used for direct addressing) 1 = Bank 1 (80h - FFh) 0 = Bank 0 (00h - 7Fh) bit 4 TO: Time-out bit 1 = After power-up, CLRWDT instruction or SLEEP instruction 0 = A WDT time-out occurred bit 3 PD: Power-down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit Carry/Borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions), For Borrow, the polarity is reversed. 1 = A carry-out from the 4th low-order bit of the result occurred 0 = No carry-out from the 4th low-order bit of the result bit 0 C: Carry/Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions) 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Note 1: For Borrow, the polarity is reversed. A subtraction is executed by adding the two's complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or low-order bit of the source register. DS41302D-page 18 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 2.2.2.2 OPTION Register Note: The OPTION register is a readable and writable register, which contains various control bits to configure: * * * * Timer0/WDT prescaler External GP2/INT interrupt Timer0 Weak pull-ups on GPIO REGISTER 2-2: To achieve a 1:1 prescaler assignment for Timer0, assign the prescaler to the WDT by setting PSA bit to `1' of the OPTION register. See Section 6.1.3 "Software Programmable Prescaler". OPTION_REG: OPTION REGISTER R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7 GPPU: GPIO Pull-up Enable bit 1 = GPIO pull-ups are disabled 0 = GPIO pull-ups are enabled by individual PORT latch values bit 6 INTEDG: Interrupt Edge Select bit 1 = Interrupt on rising edge of GP2/INT pin 0 = Interrupt on falling edge of GP2/INT pin bit 5 T0CS: Timer0 Clock Source Select bit 1 = Transition on GP2/T0CKI pin 0 = Internal instruction cycle clock (FOSC/4) bit 4 T0SE: Timer0 Source Edge Select bit 1 = Increment on high-to-low transition on GP2/T0CKI pin 0 = Increment on low-to-high transition on GP2/T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler is assigned to the WDT 0 = Prescaler is assigned to the Timer0 module bit 2-0 PS<2:0>: Prescaler Rate Select bits BIT VALUE 000 001 010 011 100 101 110 111 2010 Microchip Technology Inc. x = Bit is unknown TIMER0 RATE WDT RATE 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 1:1 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 DS41302D-page 19 PIC12F609/615/617/12HV609/615 2.2.2.3 INTCON Register Note: The INTCON register is a readable and writable register, which contains the various enable and flag bits for TMR0 register overflow, GPIO change and external GP2/INT pin interrupts. REGISTER 2-3: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. INTCON: INTERRUPT CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 GIE PEIE T0IE INTE GPIE T0IF INTF GPIF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 7 GIE: Global Interrupt Enable bit 1 = Enables all unmasked interrupts 0 = Disables all interrupts bit 6 PEIE: Peripheral Interrupt Enable bit 1 = Enables all unmasked peripheral interrupts 0 = Disables all peripheral interrupts bit 5 T0IE: Timer0 Overflow Interrupt Enable bit 1 = Enables the Timer0 interrupt 0 = Disables the Timer0 interrupt bit 4 INTE: GP2/INT External Interrupt Enable bit 1 = Enables the GP2/INT external interrupt 0 = Disables the GP2/INT external interrupt bit 3 GPIE: GPIO Change Interrupt Enable bit(1) 1 = Enables the GPIO change interrupt 0 = Disables the GPIO change interrupt bit 2 T0IF: Timer0 Overflow Interrupt Flag bit(2) 1 = Timer0 register has overflowed (must be cleared in software) 0 = Timer0 register did not overflow bit 1 INTF: GP2/INT External Interrupt Flag bit 1 = The GP2/INT external interrupt occurred (must be cleared in software) 0 = The GP2/INT external interrupt did not occur bit 0 GPIF: GPIO Change Interrupt Flag bit 1 = When at least one of the GPIO <5:0> pins changed state (must be cleared in software) 0 = None of the GPIO <5:0> pins have changed state Note 1: 2: IOC register must also be enabled. T0IF bit is set when TMR0 rolls over. TMR0 is unchanged on Reset and should be initialized before clearing T0IF bit. DS41302D-page 20 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 2.2.2.4 PIE1 Register The PIE1 register contains the Peripheral Interrupt Enable bits, as shown in Register 2-4. REGISTER 2-4: Note: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1 U-0 R/W-0 R/W-0 U-0 R/W-0 U-0 R/W-0 R/W-0 -- ADIE(1) CCP1IE(1) -- CMIE -- TMR2IE(1) TMR1IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7 Unimplemented: Read as `0' bit 6 ADIE: A/D Converter (ADC) Interrupt Enable bit(1) 1 = Enables the ADC interrupt 0 = Disables the ADC interrupt bit 5 CCP1IE: CCP1 Interrupt Enable bit(1) 1 = Enables the CCP1 interrupt 0 = Disables the CCP1 interrupt bit 4 Unimplemented: Read as `0' bit 3 CMIE: Comparator Interrupt Enable bit 1 = Enables the Comparator interrupt 0 = Disables the Comparator interrupt bit 2 Unimplemented: Read as `0' bit 1 TMR2IE: Timer2 to PR2 Match Interrupt Enable bit(1) 1 = Enables the Timer2 to PR2 match interrupt 0 = Disables the Timer2 to PR2 match interrupt bit 0 TMR1IE: Timer1 Overflow Interrupt Enable bit 1 = Enables the Timer1 overflow interrupt 0 = Disables the Timer1 overflow interrupt x = Bit is unknown Note 1: PIC12F615/617/HV615 only. PIC12F609/HV609 unimplemented, read as `0'. 2010 Microchip Technology Inc. DS41302D-page 21 PIC12F609/615/617/12HV609/615 2.2.2.5 PIR1 Register The PIR1 register contains the Peripheral Interrupt flag bits, as shown in Register 2-5. REGISTER 2-5: U-0 Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. PIR1: PERIPHERAL INTERRUPT REQUEST REGISTER 1 R/W-0 (1) -- Note: ADIF R/W-0 CCP1IF (1) U-0 -- R/W-0 CMIF U-0 R/W-0 (1) -- TMR2IF R/W-0 TMR1IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 7 Unimplemented: Read as `0' bit 6 ADIF: A/D Interrupt Flag bit(1) 1 = A/D conversion complete 0 = A/D conversion has not completed or has not been started bit 5 CCP1IF: CCP1 Interrupt Flag bit(1) Capture mode: 1 = A TMR1 register capture occurred (must be cleared in software) 0 = No TMR1 register capture occurred Compare mode: 1 = A TMR1 register compare match occurred (must be cleared in software) 0 = No TMR1 register compare match occurred PWM mode: Unused in this mode bit 4 Unimplemented: Read as `0' bit 3 CMIF: Comparator Interrupt Flag bit 1 = Comparator output has changed (must be cleared in software) 0 = Comparator output has not changed bit 2 Unimplemented: Read as `0' bit 1 TMR2IF: Timer2 to PR2 Match Interrupt Flag bit(1) 1 = Timer2 to PR2 match occurred (must be cleared in software) 0 = Timer2 to PR2 match has not occurred bit 0 TMR1IF: Timer1 Overflow Interrupt Flag bit 1 = Timer1 register overflowed (must be cleared in software) 0 = Timer1 has not overflowed Note 1: PIC12F615/617/HV615 only. PIC12F609/HV609 unimplemented, read as `0'. DS41302D-page 22 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 2.2.2.6 PCON Register The Power Control (PCON) register (see Table 12-2) contains flag bits to differentiate between a: * * * * Power-on Reset (POR) Brown-out Reset (BOR) Watchdog Timer Reset (WDT) External MCLR Reset The PCON register also controls the software enable of the BOR. The PCON register bits are shown in Register 2-6. REGISTER 2-6: PCON: POWER CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0(1) -- -- -- -- -- -- POR BOR bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 7-2 Unimplemented: Read as `0' bit 1 POR: Power-on Reset Status bit 1 = No Power-on Reset occurred 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) bit 0 BOR: Brown-out Reset Status bit 1 = No Brown-out Reset occurred 0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs) Note 1: Reads as `0' if Brown-out Reset is disabled. 2010 Microchip Technology Inc. DS41302D-page 23 PIC12F609/615/617/12HV609/615 2.2.2.7 APFCON Register (PIC12F615/617/HV615 only) The Alternate Pin Function Control (APFCON) register is used to steer specific peripheral input and output functions between different pins. For this device, the P1A, P1B and Timer1 Gate functions can be moved between different pins. The APFCON register bits are shown in Register 2-7. REGISTER 2-7: APFCON:ALTERNATE PIN FUNCTION REGISTER(1) U-0 U-0 U-0 R/W-0 U-0 U-0 R/W-0 R/W-0 -- -- -- T1GSEL -- -- P1BSEL P1ASEL bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-5 Unimplemented: Read as `0' bit 4 T1GSEL: TMR1 Input Pin Select bit 1 = T1G function is on GP3/T1G(2)/MCLR/VPP 0 = T1G function is on GP4/AN3/CIN1-/T1G/P1B(2)/OSC2/CLKOUT bit 3-2 Unimplemented: Read as `0' bit 1 P1BSEL: P1B Output Pin Select bit 1 = P1B function is on GP4/AN3/CIN1-/T1G/P1B(2)/OSC2/CLKOUT 0 = P1B function is on GP0/AN0/CIN+/P1B/ICSPDAT bit 0 P1ASEL: P1A Output Pin Select bit 1 = P1A function is on GP5/T1CKI/P1A(2)/OSC1/CLKIN 0 = P1A function is on GP2/AN2/T0CKI/INT/COUT/CCP1/P1A x = Bit is unknown Note 1: PIC12F615/617/HV615 only. 2: Alternate pin function. DS41302D-page 24 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 2.3 2.3.2 PCL and PCLATH The Program Counter (PC) is 13 bits wide. The low byte comes from the PCL register, which is a readable and writable register. The high byte (PC<12:8>) is not directly readable or writable and comes from PCLATH. On any Reset, the PC is cleared. Figure 2-5 shows the two situations for the loading of the PC. The upper example in Figure 2-5 shows how the PC is loaded on a write to PCL (PCLATH<4:0> PCH). The lower example in Figure 2-5 shows how the PC is loaded during a CALL or GOTO instruction (PCLATH<4:3> PCH). FIGURE 2-5: LOADING OF PC IN DIFFERENT SITUATIONS PCH PCL 12 8 7 0 PC The PIC12F609/615/617/12HV609/615 Family has an 8-level x 13-bit wide hardware stack (see Figure 2-1). The stack space is not part of either program or data space and the Stack Pointer is not readable or writable. The PC is PUSHed onto the stack when a CALL instruction is executed or an interrupt causes a branch. The stack is POPed in the event of a RETURN, RETLW or a RETFIE instruction execution. PCLATH is not affected by a PUSH or POP operation. The stack operates as a circular buffer. This means that after the stack has been PUSHed eight times, the ninth push overwrites the value that was stored from the first push. The tenth push overwrites the second push (and so on). Note 1: There are no Status bits to indicate stack overflow or stack underflow conditions. 2: There are no instructions/mnemonics called PUSH or POP. These are actions that occur from the execution of the CALL, RETURN, RETLW and RETFIE instructions or the vectoring to an interrupt address. 8 PCLATH<4:0> 5 Instruction with PCL as Destination ALU Result PCLATH PCH 12 11 10 PCL 8 0 7 PC GOTO, CALL 2 PCLATH<4:3> 11 OPCODE <10:0> PCLATH 2.3.1 STACK MODIFYING PCL Executing any instruction with the PCL register as the destination simultaneously causes the Program Counter PC<12:8> bits (PCH) to be replaced by the contents of the PCLATH register. This allows the entire contents of the program counter to be changed by writing the desired upper 5 bits to the PCLATH register. When the lower 8 bits are written to the PCL register, all 13 bits of the program counter will change to the values contained in the PCLATH register and those being written to the PCL register. A computed GOTO is accomplished by adding an offset to the program counter (ADDWF PCL). Care should be exercised when jumping into a look-up table or program branch table (computed GOTO) by modifying the PCL register. Assuming that PCLATH is set to the table start address, if the table length is greater than 255 instructions or if the lower 8 bits of the memory address rolls over from 0xFF to 0x00 in the middle of the table, then PCLATH must be incremented for each address rollover that occurs between the table beginning and the target location within the table. 2.4 Indirect Addressing, INDF and FSR Registers The INDF register is not a physical register. Addressing the INDF register will cause indirect addressing. Indirect addressing is possible by using the INDF register. Any instruction using the INDF register actually accesses data pointed to by the File Select Register (FSR). Reading INDF itself indirectly will produce 00h. Writing to the INDF register indirectly results in a no operation (although Status bits may be affected). An effective 9-bit address is obtained by concatenating the 8-bit FSR and the IRP bit of the STATUS register, as shown in Figure 2-6. A simple program to clear RAM location 40h-7Fh using indirect addressing is shown in Example 2-1. EXAMPLE 2-1: MOVLW MOVWF NEXT CLRF INCF BTFSS GOTO CONTINUE INDIRECT ADDRESSING 0x40 FSR INDF FSR FSR,7 NEXT ;initialize pointer ;to RAM ;clear INDF register ;inc pointer ;all done? ;no clear next ;yes continue For more information refer to Application Note AN556, "Implementing a Table Read" (DS00556). 2010 Microchip Technology Inc. DS41302D-page 25 PIC12F609/615/617/12HV609/615 FIGURE 2-6: DIRECT/INDIRECT ADDRESSING PIC12F609/615/617/12HV609/615 Direct Addressing RP1(1) RP0 6 Bank Select From Opcode Indirect Addressing IRP(1) 0 7 Bank Select Location Select 00 01 10 File Select Register 0 Location Select 11 00h 180h NOT USED(2) Data Memory 7Fh 1FFh Bank 0 Bank 1 Bank 2 Bank 3 For memory map detail, see Figure 2-3. Note 1: 2: The RP1 and IRP bits are reserved; always maintain these bits clear. Accesses in this area are mirrored back into Bank 0 and Bank 1. DS41302D-page 26 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 3.0 FLASH PROGRAM MEMORY SELF READ/SELF WRITE CONTROL (FOR PIC12F617 ONLY) The Flash program memory is readable and writable during normal operation (full VDD range). This memory is not directly mapped in the register file space. Instead, it is indirectly addressed through the Special Function Registers (see Registers 3-1 to 3-5). There are six SFRs used to read and write this memory: * * * * * * PMCON1 PMCON2 PMDATL PMDATH PMADRL PMADRH When interfacing the program memory block, the PMDATL and PMDATH registers form a two-byte word which holds the 14-bit data for read/write, and the PMADRL and PMADRH registers form a two-byte word which holds the 13-bit address of the Flash location being accessed. These devices have 2K words of program Flash with an address range from 0000h to 07FFh. 3.1 PMADRH and PMADRL Registers The PMADRH and PMADRL registers can address up to a maximum of 8K words of program memory. When selecting a program address value, the Most Significant Byte (MSB) of the address is written to the PMADRH register and the Least Significant Byte (LSB) is written to the PMADRL register. 3.2 PMCON1 and PMCON2 Registers PMCON1 is the control register for the data program memory accesses. Control bits RD and WR initiate read and write, respectively. These bits cannot be cleared, only set in software. They are cleared in hardware at completion of the read or write operation. The inability to clear the WR bit in software prevents the accidental premature termination of a write operation. The WREN bit, when set, will allow a write operation. On power-up, the WREN bit is clear. PMCON2 is not a physical register. Reading PMCON2 will read all `0's. The PMCON2 register is used exclusively in the Flash memory write sequence. The program memory allows single word read and a by four word write. A four word write automatically erases the row of the location and writes the new data (erase before write). The write time is controlled by an on-chip timer. The write/erase voltages are generated by an on-chip charge pump rated to operate over the voltage range of the device for byte or word operations. When the device is code-protected, the CPU may continue to read and write the Flash program memory. Depending on the settings of the Flash Program Memory Enable (WRT<1:0>) bits, the device may or may not be able to write certain blocks of the program memory, however, reads of the program memory are allowed. When the Flash program memory Code Protection (CP) bit in the Configuration Word register is enabled, the program memory is code-protected, and the device programmer (ICSPTM) cannot access data or program memory. 2010 Microchip Technology Inc. DS41302D-page 27 PIC12F609/615/617/12HV609/615 REGISTER 3-1: PMDATL: PROGRAM MEMORY DATA REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PMDATL7 PMDATL6 PMDATL5 PMDATL4 PMDATL3 PMDATL2 PMDATL1 PMDATL0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-0 x = Bit is unknown PMDATL<7:0>: 8 Least Significant Address bits to Write or Read from Program Memory REGISTER 3-2: PMADRL: PROGRAM MEMORY ADDRESS REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PMADRL7 PMADRL6 PMADRL5 PMADRL4 PMADRL3 PMADRL2 PMADRL1 PMADRL0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-0 x = Bit is unknown PMADRL<7:0>: 8 Least Significant Address bits for Program Memory Read/Write Operation REGISTER 3-3: PMDATH: PROGRAM MEMORY DATA HIGH BYTE REGISTER U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 -- -- PMDATH5 PMDATH4 PMDATH3 PMDATH2 PMDATH1 PMDATH0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 7-6 Unimplemented: Read as `0' bit 5-0 PMDATH<5:0>: 6 Most Significant Data bits from Program Memory REGISTER 3-4: PMADRH: PROGRAM MEMORY ADDRESS HIGH BYTE REGISTER U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 -- -- -- -- -- PMADRH2 PMADRH1 PMADRH0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 3 Unimplemented: Read as `0' bit 2-0 PMADRH<2:0>: Specifies the 3 Most Significant Address bits or high bits for program memory reads. DS41302D-page 28 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 REGISTER 3-5: U-1 -- PMCON1 - PROGRAM MEMORY CONTROL REGISTER 1 (ADDRESS: 93h) U-0 -- U-0 -- U-0 -- U-0 -- R/W-0 WREN R/S-0 WR bit 7 R/S-0 RD bit 0 bit 7 Unimplemented: Read as `1' bit 6-3 Unimplemented: Read as `0' bit 2 WREN: Program Memory Write Enable bit 1 = Allows write cycles 0 = Inhibits write to the EEPROM bit 1 WR: Write Control bit 1 = Initiates a write cycle to program memory. (The bit is cleared by hardware when write is complete. The WR bit can only be set (not cleared) in software.) 0 = Write cycle to the Flash memory is complete bit 0 RD: Read Control bit 1 = Initiates a program memory read (The read takes one cycle. The RD is cleared in hardware; the RD bit can only be set (not cleared) in software). 0 = Does not initiate a Flash memory read Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR 1 = bit is set 0 = bit is cleared 2010 Microchip Technology Inc. x = bit is unknown DS41302D-page 29 PIC12F609/615/617/12HV609/615 3.3 Reading the Flash Program Memory To read a program memory location, the user must write two bytes of the address to the PMADRL and PMADRH registers, and then set control bit RD (PMCON1<0>). Once the read control bit is set, the program memory Flash controller will use the second instruction cycle after to read the data. This causes the second instruction immediately following the "BSF PMCON1,RD" instruction to be ignored. The data is available in the very next cycle in the PMDATL and PMDATH registers; it can be read as two bytes in the following instructions. PMDATL and PMDATH registers will hold this value until another read or until it is written to by the user (during a write operation). EXAMPLE 3-1: BANKSEL MOVLW MOVWF MOVLW MOVWF BANKSEL BSF FLASH PROGRAM READ PM_ADR MS_PROG_PM_ADDR PMADRH LS_PROG_PM_ADDR PMADRL PMCON1 PMCON1, RD ; ; ; ; ; ; ; Change STATUS bits RP1:0 to select bank with PMADRL MS Byte of Program Address to read LS Byte of Program Address to read Bank to containing PMCON1 PM Read NOP ; First instruction after BSF PMCON1,RD executes normally NOP ; ; ; ; ; ; BANKSEL PMDATL MOVF PMDATL, W MOVF PMDATH, W DS41302D-page 30 Any instructions here are ignored as program memory is read in second cycle after BSF PMCON1,RD Bank to containing PMADRL W = LS Byte of Program PMDATL W = MS Byte of Program PMDATL 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 FIGURE 3-1: FLASH PROGRAM MEMORY READ CYCLE EXECUTION Q1 Flash ADDR Q2 Q3 Q4 PC Flash DATA Q1 Q2 Q4 PC + 1 INSTR (PC) INSTR (PC - 1) Executed here Q3 Q1 Q2 Q3 Q4 PMADRH,PMADRL INSTR (PC + 1) BSF PMCON1,RD Executed here Q1 Q2 Q3 PC+3 PC +3 PMDATH,PMDATL INSTR (PC + 1) Executed here Q4 Q1 Q2 Q3 Q4 NOP Executed here Q2 Q3 Q4 PC + 5 PC + 4 INSTR (PC + 3) Q1 INSTR (PC + 4) INSTR (PC + 3) Executed here INSTR (PC + 4) Executed here RD bit PMDATH PMDATL Register PMRHLT 2010 Microchip Technology Inc. DS41302D-page 31 PIC12F609/615/617/12HV609/615 3.4 Writing the Flash Program Memory A word of the Flash program memory may only be written to if the word is in an unprotected segment of memory. Flash program memory must be written in four-word blocks. See Figure 3-2 and Figure 3-3 for more details. A block consists of four words with sequential addresses, with a lower boundary defined by an address, where PMADRL<1:0> = 00. All block writes to program memory are done as 16-word erase by fourword write operations. The write operation is edgealigned and cannot occur across boundaries. To write program data, it must first be loaded into the buffer registers (see Figure 3-2). This is accomplished by first writing the destination address to PMADRL and PMADRH and then writing the data to PMDATL and PMDATH. After the address and data have been set up, then the following sequence of events must be executed: 1. 2. Write 55h, then AAh, to PMCON2 (Flash programming sequence). Set the WR control bit of the PMCON1 register. All four buffer register locations should be written to with correct data. If less than four words are being written to in the block of four words, then a read from the program memory location(s) not being written to must be performed. This takes the data from the program location(s) not being written and loads it into the PMDATL and PMDATH registers. Then the sequence of events to transfer data to the buffer registers must be executed. which the erase takes place (i.e., the last word of the sixteen-word block erase). This is not Sleep mode as the clocks and peripherals will continue to run. After the four-word write cycle, the processor will resume operation with the third instruction after the PMCON1 write instruction. The above sequence must be repeated for the higher 12 words. 3.5 Protection Against Spurious Write There are conditions when the device should not write to the program memory. To protect against spurious writes, various mechanisms have been built in. On power-up, WREN is cleared. Also, the Power-up Timer (64 ms duration) prevents program memory writes. The write initiate sequence and the WREN bit help prevent an accidental write during brown-out, power glitch or software malfunction. 3.6 Operation During Code-Protect When the device is code-protected, the CPU is able to read and write unscrambled data to the program memory. The test mode access is disabled. 3.7 Operation During Write Protect When the program memory is write-protected, the CPU can read and execute from the program memory. The portions of program memory that are write protected can be modified by the CPU using the PMCON registers, but the protected program memory cannot be modified using ICSP mode. To transfer data from the buffer registers to the program memory, the PMADRL and PMADRH must point to the last location in the four-word block (PMADRL<1:0> = 11). Then the following sequence of events must be executed: 1. 2. Write 55h, then AAh, to PMCON2 (Flash programming sequence). Set control bit WR of the PMCON1 register to begin the write operation. The user must follow the same specific sequence to initiate the write for each word in the program block, writing each program word in sequence (000, 001, 010, 011). When the write is performed on the last word (PMADRL<1:0> = 11), a block of sixteen words is automatically erased and the content of the four-word buffer registers are written into the program memory. After the "BSF PMCON1,WR" instruction, the processor requires two cycles to set up the erase/write operation. The user must place two NOP instructions after the WR bit is set. Since data is being written to buffer registers, the writing of the first three words of the block appears to occur immediately. The processor will halt internal operations for the typical 4 ms, only during the cycle in DS41302D-page 32 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 FIGURE 3-2: BLOCK WRITES TO 2K FLASH PROGRAM MEMORY 7 5 0 0 7 PMDATH If at a new row sixteen words of Flash are erased, then four buffers are transferred to Flash automatically after this word is written PMDATL 6 8 14 14 First word of block to be written 14 PMADRL<1:0> = 00 PMADRL<1:0> = 10 PMADRL<1:0> = 01 Buffer Register Buffer Register 14 PMADRL<1:0> = 11 Buffer Register Buffer Register Program Memory FIGURE 3-3: FLASH PROGRAM MEMORY LONG WRITE CYCLE EXECUTION Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 PMADRH,PMADRL PC + 1 Flash ADDR INSTR (PC) Flash DATA Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 INSTR (PC + 1) ignored read BSF PMCON1,WR INSTR (PC + 1) Executed here Executed here PMDATH,PMDATL Processor halted PM Write Time PC + 2 PC + 3 INSTR (PC+2) NOP Executed here PC + 4 INSTR (PC+3) (INSTR (PC + 2) NOP INSTR (PC + 3) Executed here Executed here Flash Memory Location WR bit PMWHLT 2010 Microchip Technology Inc. DS41302D-page 33 PIC12F609/615/617/12HV609/615 An example of the complete four-word write sequence is shown in Example 3-2. The initial address is loaded into the PMADRH and PMADRL register pair; the eight words of data are loaded using indirect addressing. EXAMPLE 3-2: LOOP WRITING TO FLASH PROGRAM MEMORY ;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;; ; This write routine assumes the following: ; A valid starting address (the least significant bits = '00') ; is loaded in ADDRH:ADDRL ; ADDRH, ADDRL and DATADDR are all located in data memory ; BANKSEL PMADRH MOVF ADDRH,W ; Load initial address MOVWF PMADRH ; MOVF ADDRL,W ; MOVWF PMADRL ; MOVF DATAADDR,W ; Load initial data address MOVWF FSR ; MOVF INDF,W ; Load first data byte into lower MOVWF PMDATL ; INCF FSR,F ; Next byte MOVF INDF,W ; Load second data byte into upper MOVWF PMDATH ; INCF FSR,F ; BANKSEL PMCON1 BSF PMCON1,WREN ; Enable writes BCF INTCON,GIE ; Disable interrupts (if using) BTFSC INTCON,GIE ; See AN576 GOTO $-2 ;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;; ; Required Sequence MOVLW 55h ; Start of required write sequence: MOVWF PMCON2 ; Write 55h MOVLW 0AAh ; MOVWF PMCON2 ; Write 0AAh BSF PMCON1,WR ; Set WR bit to begin write NOP ; Required to transfer data to the buffer NOP ; registers ;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;; BCF PMCON1,WREN ; Disable writes BSF INTCON,GIE ; Enable interrupts (comment out if not using interrupts) BANKSEL PMADRL MOVF PMADRL, W INCF PMADRL,F ; Increment address ANDLW 0x03 ; Indicates when sixteen words have been programmed SUBLW 0x03 ; 0x0F = 16 words ; 0x0B = 12 words ; 0x07 = 8 words ; 0x03 = 4 words BTFSS STATUS,Z ; Exit on a match, GOTO LOOP ; Continue if more data needs to be written DS41302D-page 34 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 TABLE 3-1: Name PMCON1 SUMMARY OF REGISTERS ASSOCIATED WITH PROGRAM MEMORY Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets -- -- -- -- -- WREN WR RD ---- -000 ---- -000 ---- ---- ---- ---- PMCON2 Program Memory Control Register 2 (not a physical register) PMADRL PMADRL7 PMADRL6 PMADRL5 PMADRH PMDATL PMDATH Legend: -- PMADRL3 PMADRL2 PMADRL1 PMADRL0 0000 0000 0000 0000 -- -- -- PMADRH2 PMADRH1 PMADRH0 ---- -000 ---- -000 PMDATL5 PMDATL4 PMDATL3 PMDATL2 PMDATL1 PMDATL0 0000 0000 0000 0000 PMDATH5 PMDATH4 PMDATH3 PMDATH2 PMDATH1 PMDATH0 --00 0000 --00 0000 -- PMDATL7 PMDATL6 -- PMADRL4 -- x = unknown, u = unchanged, -- = unimplemented read as `0', q = value depends upon condition. Shaded cells are not used by Program Memory module. 2010 Microchip Technology Inc. DS41302D-page 35 PIC12F609/615/617/12HV609/615 NOTES: DS41302D-page 36 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 4.0 OSCILLATOR MODULE The Oscillator module can be configured in one of eight clock modes. 4.1 Overview 3. 4. 5. The Oscillator module has a wide variety of clock sources and selection features that allow it to be used in a wide range of applications while maximizing performance and minimizing power consumption. Figure 4-1 illustrates a block diagram of the Oscillator module. Clock sources can be configured from external oscillators, quartz crystal resonators, ceramic resonators and Resistor-Capacitor (RC) circuits. In addition, the system clock source can be configured with a choice of two selectable speeds: internal or external system clock source. EC - External clock with I/O on OSC2/CLKOUT. LP - 32 kHz Low-Power Crystal mode. XT - Medium Gain Crystal or Ceramic Resonator Oscillator mode. 6. HS - High Gain Crystal or Ceramic Resonator mode. 7. RC - External Resistor-Capacitor (RC) with FOSC/4 output on OSC2/CLKOUT. 8. RCIO - External Resistor-Capacitor (RC) with I/O on OSC2/CLKOUT. 9. INTOSC - Internal oscillator with FOSC/4 output on OSC2 and I/O on OSC1/CLKIN. 10. INTOSCIO - Internal oscillator with I/O on OSC1/CLKIN and OSC2/CLKOUT. Clock Source modes are configured by the FOSC<2:0> bits in the Configuration Word register (CONFIG). The Internal Oscillator module provides a selectable system clock mode of either 4 MHz (Postscaler) or 8 MHz (INTOSC). FIGURE 4-1: PIC(R) MCU CLOCK SOURCE BLOCK DIAGRAM FOSC<2:0> IOSCFS<7> (Configuration Word Register) External Oscillator OSC2 Sleep INTOSC Internal Oscillator MUX LP, XT, HS, RC, RCIO, EC OSC1 System Clock (CPU and Peripherals) INTOSC 8 MHz Postscaler 4 MHz 2010 Microchip Technology Inc. DS41302D-page 37 PIC12F609/615/617/12HV609/615 4.2 Clock Source Modes Clock Source modes can be classified as external or internal. * External Clock modes rely on external circuitry for the clock source. Examples are: Oscillator modules (EC mode), quartz crystal resonators or ceramic resonators (LP, XT and HS modes) and Resistor-Capacitor (RC) mode circuits. * Internal clock sources are contained internally within the Oscillator module. The Oscillator module has two selectable clock frequencies: 4 MHz and 8 MHz The system clock can be selected between external or internal clock sources via the FOSC<2:0> bits of the Configuration Word register. TABLE 4-1: 4.3 External Clock Modes 4.3.1 OSCILLATOR START-UP TIMER (OST) If the Oscillator module is configured for LP, XT or HS modes, the Oscillator Start-up Timer (OST) counts 1024 oscillations from OSC1. This occurs following a Power-on Reset (POR) and when the Power-up Timer (PWRT) has expired (if configured), or a wake-up from Sleep. During this time, the program counter does not increment and program execution is suspended. The OST ensures that the oscillator circuit, using a quartz crystal resonator or ceramic resonator, has started and is providing a stable system clock to the Oscillator module. When switching between clock sources, a delay is required to allow the new clock to stabilize. These oscillator delays are shown in Table 4-1. OSCILLATOR DELAY EXAMPLES Switch From Switch To Frequency Oscillator Delay Sleep/POR INTOSC 125 kHz to 8 MHz Oscillator Warm-Up Delay (TWARM) Sleep/POR EC, RC DC - 20 MHz 2 instruction cycles Sleep/POR LP, XT, HS 32 kHz to 20 MHz 1024 Clock Cycles (OST) 4.3.2 EC MODE The External Clock (EC) mode allows an externally generated logic level as the system clock source. When operating in this mode, an external clock source is connected to the OSC1 input and the OSC2 is available for general purpose I/O. Figure 4-2 shows the pin connections for EC mode. The Oscillator Start-up Timer (OST) is disabled when EC mode is selected. Therefore, there is no delay in operation after a Power-on Reset (POR) or wake-up from Sleep. Because the PIC(R) MCU design is fully static, stopping the external clock input will have the effect of halting the device while leaving all data intact. Upon restarting the external clock, the device will resume operation as if no time had elapsed. FIGURE 4-2: EXTERNAL CLOCK (EC) MODE OPERATION OSC1/CLKIN Clock from Ext. System PIC(R) MCU I/O Note 1: OSC2/CLKOUT(1) Alternate pin functions are listed in the Section 1.0 "Device Overview". DS41302D-page 38 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 4.3.3 LP, XT, HS MODES The LP, XT and HS modes support the use of quartz crystal resonators or ceramic resonators connected to OSC1 and OSC2 (Figure 4-3). The mode selects a low, medium or high gain setting of the internal inverteramplifier to support various resonator types and speed. LP Oscillator mode selects the lowest gain setting of the internal inverter-amplifier. LP mode current consumption is the least of the three modes. This mode is designed to drive only 32.768 kHz tuning-fork type crystals (watch crystals). Note 1: Quartz crystal characteristics vary according to type, package and manufacturer. The user should consult the manufacturer data sheets for specifications and recommended application. 2: Always verify oscillator performance over the VDD and temperature range that is expected for the application. 3: For oscillator design assistance, reference the following Microchip Applications Notes: * AN826, "Crystal Oscillator Basics and Crystal Selection for rfPIC(R) and PIC(R) Devices" (DS00826) * AN849, "Basic PIC(R) Oscillator Design" (DS00849) * AN943, "Practical PIC(R) Oscillator Analysis and Design" (DS00943) * AN949, "Making Your Oscillator Work" (DS00949) XT Oscillator mode selects the intermediate gain setting of the internal inverter-amplifier. XT mode current consumption is the medium of the three modes. This mode is best suited to drive resonators with a medium drive level specification. HS Oscillator mode selects the highest gain setting of the internal inverter-amplifier. HS mode current consumption is the highest of the three modes. This mode is best suited for resonators that require a high drive setting. Figure 4-3 and Figure 4-4 show typical circuits for quartz crystal and ceramic resonators, respectively. FIGURE 4-3: FIGURE 4-4: QUARTZ CRYSTAL OPERATION (LP, XT OR HS MODE) PIC(R) MCU OSC1/CLKIN C1 PIC(R) MCU OSC1/CLKIN C1 To Internal Logic RP(3) RF(2) Sleep To Internal Logic Quartz Crystal C2 CERAMIC RESONATOR OPERATION (XT OR HS MODE) RS(1) RF(2) Sleep OSC2/CLKOUT Note 1: A series resistor (RS) may be required for quartz crystals with low drive level. 2: The value of RF varies with the Oscillator mode selected (typically between 2 M to 10 M. 2010 Microchip Technology Inc. C2 Ceramic RS(1) Resonator Note 1: OSC2/CLKOUT A series resistor (RS) may be required for ceramic resonators with low drive level. 2: The value of RF varies with the Oscillator mode selected (typically between 2 M to 10 M. 3: An additional parallel feedback resistor (RP) may be required for proper ceramic resonator operation. DS41302D-page 39 PIC12F609/615/617/12HV609/615 4.3.4 EXTERNAL RC MODES 4.4 Internal Clock Modes The external Resistor-Capacitor (RC) modes support the use of an external RC circuit. This allows the designer maximum flexibility in frequency choice while keeping costs to a minimum when clock accuracy is not required. There are two modes: RC and RCIO. The Oscillator module provides a selectable system clock source of either 4 MHz or 8 MHz. The selectable frequency is configured through the IOSCFS bit of the Configuration Word. In RC mode, the RC circuit connects to OSC1. OSC2/ CLKOUT outputs the RC oscillator frequency divided by 4. This signal may be used to provide a clock for external circuitry, synchronization, calibration, test or other application requirements. Figure 4-5 shows the external RC mode connections. 4.4.1 FIGURE 4-5: VDD EXTERNAL RC MODES PIC(R) MCU REXT OSC1/CLKIN Internal Clock CEXT VSS FOSC/4 or I/O(2) OSC2/CLKOUT (1) The frequency of the internal oscillator can be trimmed with a calibration value in the OSCTUNE register. INTOSC AND INTOSCIO MODES The INTOSC and INTOSCIO modes configure the internal oscillators as the system clock source when the device is programmed using the oscillator selection or the FOSC<2:0> bits in the Configuration Word register (CONFIG). See Section 12.0 "Special Features of the CPU" for more information. In INTOSC mode, OSC1/CLKIN is available for general purpose I/O. OSC2/CLKOUT outputs the selected internal oscillator frequency divided by 4. The CLKOUT signal may be used to provide a clock for external circuitry, synchronization, calibration, test or other application requirements. In INTOSCIO mode, OSC1/CLKIN and OSC2/CLKOUT are available for general purpose I/O. Recommended values: 10 k REXT 100 k, <3V 3 k REXT 100 k, 3-5V CEXT > 20 pF, 2-5V Note 1: 2: Alternate pin functions are listed in Section 1.0 "Device Overview". Output depends upon RC or RCIO Clock mode. In RCIO mode, the RC circuit is connected to OSC1. OSC2 becomes an additional general purpose I/O pin. The RC oscillator frequency is a function of the supply voltage, the resistor (REXT) and capacitor (CEXT) values and the operating temperature. Other factors affecting the oscillator frequency are: * threshold voltage variation * component tolerances * packaging variations in capacitance The user also needs to take into account variation due to tolerance of external RC components used. DS41302D-page 40 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 4.4.1.1 OSCTUNE Register The default value of the OSCTUNE register is `0'. The value is a 5-bit two's complement number. The oscillator is factory calibrated but can be adjusted in software by writing to the OSCTUNE register (Register 4-1). REGISTER 4-1: When the OSCTUNE register is modified, the frequency will begin shifting to the new frequency. Code execution continues during this shift. There is no indication that the shift has occurred. OSCTUNE: OSCILLATOR TUNING REGISTER U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 -- -- -- TUN4 TUN3 TUN2 TUN1 TUN0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-5 Unimplemented: Read as `0' bit 4-0 TUN<4:0>: Frequency Tuning bits 01111 = Maximum frequency 01110 = * * * 00001 = 00000 = Oscillator module is running at the calibrated frequency. 11111 = * * * 10000 = Minimum frequency TABLE 4-2: Name x = Bit is unknown SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES Value on POR, BOR Value on all other Resets(1) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 CONFIG(2) IOSCFS CP MCLRE PWRTE WDTE FOSC2 FOSC1 FOSC0 -- -- OSCTUNE -- -- -- TUN4 TUN3 TUN2 TUN1 TUN0 ---0 0000 ---u uuuu Legend: Note 1: 2: x = unknown, u = unchanged, - = unimplemented locations read as `0'. Shaded cells are not used by oscillators. Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation. See Configuration Word register (Register 12-1) for operation of all register bits. 2010 Microchip Technology Inc. DS41302D-page 41 PIC12F609/615/617/12HV609/615 NOTES: DS41302D-page 42 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 5.0 I/O PORT There are as many as six general purpose I/O pins available. Depending on which peripherals are enabled, some or all of the pins may not be available as general purpose I/O. In general, when a peripheral is enabled, the associated pin may not be used as a general purpose I/O pin. 5.1 GPIO and the TRISIO Registers GPIO is a 6-bit wide port with 5 bidirectional and 1 inputonly pin. The corresponding data direction register is TRISIO (Register 5-2). Setting a TRISIO bit (= 1) will make the corresponding GPIO pin an input (i.e., disable the output driver). Clearing a TRISIO bit (= 0) will make the corresponding GPIO pin an output (i.e., enables output driver and puts the contents of the output latch on the selected pin). The exception is GP3, which is input only and its TRIS bit will always read as `1'. Example 51 shows how to initialize GPIO. Note: GPIO = PORTA Reading the GPIO register (Register 5-1) reads the status of the pins, whereas writing to it will write to the PORT latch. All write operations are read-modify-write operations. Therefore, a write to a port implies that the port pins are read, this value is modified and then written to the PORT data latch. GP3 reads `0' when MCLRE = 1. The TRISIO register controls the direction of the GPIO pins, even when they are being used as analog inputs. The user must ensure the bits in the TRISIO register are maintained set when using them as analog inputs. I/O pins configured as analog input always read `0'. Note: The ANSEL register must be initialized to configure an analog channel as a digital input. Pins configured as analog inputs will read `0' and cannot generate an interrupt. EXAMPLE 5-1: BANKSEL CLRF BANKSEL CLRF GPIO GPIO ANSEL ANSEL MOVLW MOVWF 0Ch TRISIO TRISIO = TRISA REGISTER 5-1: INITIALIZING GPIO ; ;Init GPIO ; ;digital I/O, ADC clock ;setting `don't care' ;Set GP<3:2> as inputs ;and set GP<5:4,1:0> ;as outputs GPIO: GPIO REGISTER U-0 U-0 R/W-x R/W-x R-x R/W-x R/W-x R/W-x -- -- GP5 GP4 GP3 GP2 GP1 GP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-6 Unimplemented: Read as `0' bit 5-0 GP<5:0>: GPIO I/O Pin bit 1 = GPIO pin is > VIH 0 = GPIO pin is < VIL 2010 Microchip Technology Inc. x = Bit is unknown DS41302D-page 43 PIC12F609/615/617/12HV609/615 REGISTER 5-2: TRISIO: GPIO TRI-STATE REGISTER U-0 U-0 R/W-1 R/W-1 R-1 R/W-1 R/W-1 R/W-1 -- -- TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-6 Unimplemented: Read as `0' bit 5-0 TRISIO<5:0>: GPIO Tri-State Control bit 1 = GPIO pin configured as an input (tri-stated) 0 = GPIO pin configured as an output Note 1: 2: 5.2 TRISIO<3> always reads `1'. TRISIO<5:4> always reads `1' in XT, HS and LP Oscillator modes. Additional Pin Functions Every GPIO pin on the PIC12F609/615/617/12HV609/ 615 has an interrupt-on-change option and a weak pullup option. The next three sections describe these functions. 5.2.1 ANSEL REGISTER The ANSEL register is used to configure the Input mode of an I/O pin to analog. Setting the appropriate ANSEL bit high will cause all digital reads on the pin to be read as `0' and allow analog functions on the pin to operate correctly. The state of the ANSEL bits has no affect on digital output functions. A pin with TRIS clear and ANSEL set will still operate as a digital output, but the Input mode will be analog. This can cause unexpected behavior when executing read-modify-write instructions on the affected port. 5.2.2 WEAK PULL-UPS Each of the GPIO pins, except GP3, has an individually configurable internal weak pull-up. Control bits WPUx enable or disable each pull-up. Refer to Register 5-5. Each weak pull-up is automatically turned off when the port pin is configured as an output. The pull-ups are disabled on a Power-on Reset by the GPPU bit of the OPTION register). A weak pull-up is automatically enabled for GP3 when configured as MCLR and disabled when GP3 is an I/O. There is no software control of the MCLR pull-up. 5.2.3 x = Bit is unknown For enabled interrupt-on-change pins, the values are compared with the old value latched on the last read of GPIO. The `mismatch' outputs of the last read are OR'd together to set the GPIO Change Interrupt Flag bit (GPIF) in the INTCON register (Register 2-3). This interrupt can wake the device from Sleep. The user, in the Interrupt Service Routine, clears the interrupt by: a) Any read of GPIO AND Clear flag bit GPIF. This will end the mismatch condition; OR b) Any write of GPIO AND Clear flag bit GPIF will end the mismatch condition; A mismatch condition will continue to set flag bit GPIF. Reading GPIO will end the mismatch condition and allow flag bit GPIF to be cleared. The latch holding the last read value is not affected by a MCLR nor BOR Reset. After these resets, the GPIF flag will continue to be set if a mismatch is present. Note: If a change on the I/O pin should occur when any GPIO operation is being executed, then the GPIF interrupt flag may not get set. INTERRUPT-ON-CHANGE Each GPIO pin is individually configurable as an interrupt-on-change pin. Control bits IOCx enable or disable the interrupt function for each pin. Refer to Register 5-6. The interrupt-on-change is disabled on a Power-on Reset. DS41302D-page 44 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 REGISTER 5-3: ANSEL: ANALOG SELECT REGISTER (PIC12F609/HV609) U-0 U-0 U-0 U-0 R/W-1 U-0 R/W-1 R/W-1 -- -- -- -- ANS3 -- ANS1 ANS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 7-4 Unimplemented: Read as `0' bit 3 ANS3: Analog Select Between Analog or Digital Function on Pin GP4 1 = Analog input. Pin is assigned as analog input(1). 0 = Digital I/O. Pin is assigned to port or special function. bit 2 Unimplemented: Read as `0' bit 1 ANS1: Analog Select Between Analog or Digital Function on Pin GP1 1 = Analog input. Pin is assigned as analog input.(1) 0 = Digital I/O. Pin is assigned to port or special function. bit 0 ANS0: Analog Select Between Analog or Digital Function on Pin GP0 0 = Digital I/O. Pin is assigned to port or special function. 1 = Analog input. Pin is assigned as analog input.(1) Note 1: Setting a pin to an analog input automatically disables the digital input circuitry, weak pull-ups, and interrupt-onchange if available. The corresponding TRIS bit must be set to Input mode in order to allow external control of the voltage on the pin. REGISTER 5-4: ANSEL: ANALOG SELECT REGISTER (PIC12F615/617/HV615) U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 -- ADCS2 ADCS1 ADCS0 ANS3 ANS2 ANS1 ANS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 7 Unimplemented: Read as `0' bit 6-4 ADCS<2:0>: A/D Conversion Clock Select bits 000 = FOSC/2 001 = FOSC/8 010 = FOSC/32 x11 = FRC (clock derived from a dedicated internal oscillator = 500 kHz max) 100 = FOSC/4 101 = FOSC/16 110 = FOSC/64 bit 3-0 ANS<3:0>: Analog Select Between Analog or Digital Function on Pins GP4, GP2, GP1, GP0, respectively. 1 = Analog input. Pin is assigned as analog input(1). 0 = Digital I/O. Pin is assigned to port or special function. Note 1: Setting a pin to an analog input automatically disables the digital input circuitry, weak pull-ups, and interrupt-onchange if available. The corresponding TRIS bit must be set to Input mode in order to allow external control of the voltage on the pin. 2010 Microchip Technology Inc. DS41302D-page 45 PIC12F609/615/617/12HV609/615 REGISTER 5-5: WPU: WEAK PULL-UP GPIO REGISTER U-0 U-0 R/W-1 R/W-1 U-0 R/W-1 R/W-1 R/W-1 -- -- WPU5 WPU4 -- WPU2 WPU1 WPU0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-6 Unimplemented: Read as `0' bit 5-4 WPU<5:4>: Weak Pull-up Control bits 1 = Pull-up enabled 0 = Pull-up disabled bit 3 WPU<3>: Weak Pull-up Register bit(3) bit 2-0 WPU<2:0>: Weak Pull-up Control bits 1 = Pull-up enabled 0 = Pull-up disabled Note 1: 2: 3: 4: x = Bit is unknown Global GPPU must be enabled for individual pull-ups to be enabled. The weak pull-up device is automatically disabled if the pin is in Output mode (TRISIO = 0). The GP3 pull-up is enabled when configured as MCLR in the Configuration Word, otherwise it is disabled as an input and reads as `0'. WPU<5:4> always reads `1' in XT, HS and LP Oscillator modes. REGISTER 5-6: IOC: INTERRUPT-ON-CHANGE GPIO REGISTER U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 -- -- IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-6 Unimplemented: Read as `0' bit 5-0 IOC<5:0>: Interrupt-on-change GPIO Control bit 1 = Interrupt-on-change enabled 0 = Interrupt-on-change disabled Note 1: 2: x = Bit is unknown Global Interrupt Enable (GIE) must be enabled for individual interrupts to be recognized. IOC<5:4> always reads `1' in XT, HS and LP Oscillator modes. DS41302D-page 46 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 5.2.4 PIN DESCRIPTIONS AND DIAGRAMS Each GPIO pin is multiplexed with other functions. The pins and their combined functions are briefly described here. For specific information about individual functions such as the Comparator or the ADC, refer to the appropriate section in this data sheet. GP0/AN0(1)/CIN+/P1B(1)/ICSPDAT 5.2.4.1 Figure 5-1 shows the diagram for this pin. The GP1 pin is configurable to function as one of the following: * * * * * Figure 5-1 shows the diagram for this pin. The GP0 pin is configurable to function as one of the following: * * * * * a general purpose I/O an analog input for the ADC(1) an analog non-inverting input to the comparator a PWM output(1) In-Circuit Serial Programming data FIGURE 5-1: GP1/AN1(1)/CIN0-/VREF(1)/ICSPCLK 5.2.4.2 a general purpose I/O an analog input for the ADC(1) an analog inverting input to the comparator a voltage reference input for the ADC(1) In-Circuit Serial Programming clock Note 1: PIC12F615/617/HV615 only. BLOCK DIAGRAM OF GP<1:0> Analog(1) Input Mode VDD Data Bus D WR WPU Q Weak CK Q GPPU VDD RD WPU D WR GPIO Q I/O Pin CK Q VSS D WR TRISIO Q CK Q RD TRISIO Analog(1) Input Mode RD GPIO D WR IOC Q Q CK Q D EN RD IOC Q Interrupt-onChange S(2) R RD GPIO To Comparator To A/D Converter(3) 1: Comparator mode and ANSEL determines Analog Input mode. 2: Set has priority over Reset. 3: PIC12F615/617/HV615 only. 2010 Microchip Technology Inc. D EN From other GP<5:0> pins (GP0) GP<5:2, 0> pins (GP1) Write `0' to GBIF Note Q Q1 DS41302D-page 47 PIC12F609/615/617/12HV609/615 GP2/AN2(1)/T0CKI/INT/COUT/ CCP1(1)/P1A(1) 5.2.4.3 Note 1: Figure 5-2 shows the diagram for this pin. The GP2 pin is configurable to function as one of the following: * * * * * * * PIC12F615/617/HV615 only. a general purpose I/O an analog input for the ADC(1) the clock input for TMR0 an external edge triggered interrupt a digital output from Comparator a Capture input/Compare input/PWM output(1) a PWM output(1) FIGURE 5-2: BLOCK DIAGRAM OF GP2 Analog(1) Input Mode VDD Data Bus D WR WPU Q Weak CK Q C1OE Enable GPPU VDD RD WPU C1OE D WR GPIO Q 0 I/O Pin CK Q D WR TRISIO 1 VSS Q CK Q RD TRISIO Analog(1) Input Mode RD GPIO D WR IOC Q Q CK Q D EN RD IOC Q Interrupt-onChange Q S(2) R Q1 D EN From other GP<5:3, 1:0> pins Write `0' to GBIF RD GPIO To Timer0 To INT To A/D Converter(3) Note DS41302D-page 48 1: Comparator mode and ANSEL determines Analog Input mode. 2: Set has priority over Reset. 3: PIC12F615/617/HV615 only. 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 5.2.4.4 GP3/T1G(1, 2)/MCLR/VPP Figure 5-3 shows the diagram for this pin. The GP3 pin is configurable to function as one of the following: * a general purpose input * a Timer1 gate (count enable), alternate pin(1, 2) * as Master Clear Reset with weak pull-up Note 1: Alternate pin function. 2: PIC12F615/617/HV615 only. FIGURE 5-3: BLOCK DIAGRAM OF GP3 VDD MCLRE Weak Data Bus MCLRE Reset RD TRISIO Input Pin VSS MCLRE RD GPIO D WR IOC CK Q Q D Q EN RD IOC Q Interrupt-onChange S(1) R VSS Q Q1 D EN From other GP<5:4, 2:0> pins RD GPIO Write `0' to GBIF Note 1: Set has priority over Reset 2010 Microchip Technology Inc. DS41302D-page 49 PIC12F609/615/617/12HV609/615 5.2.4.5 GP4/AN3(2)/CIN1-/T1G/ P1B(1, 2)/OSC2/CLKOUT Figure 5-4 shows the diagram for this pin. The GP4 pin is configurable to function as one of the following: * * * * Note 1: Alternate pin function. a general purpose I/O an analog input for the ADC(2) Comparator inverting input a Timer1 gate (count enable) FIGURE 5-4: * PWM output, alternate pin(1, 2) * a crystal/resonator connection * a clock output 2: PIC12F615/617/HV615 only. BLOCK DIAGRAM OF GP4 Analog(3) Input Mode Data Bus D WR WPU CLK(1) Modes Q VDD CK Q Weak GPPU RD WPU Oscillator Circuit OSC1 VDD CLKOUT Enable D WR GPIO Q FOSC/4 CK Q 1 0 I/O Pin CLKOUT Enable D WR TRISIO Q CK Q VSS INTOSC/ RC/EC(2) CLKOUT Enable RD TRISIO Analog Input Mode RD GPIO D Q CK Q WR IOC Q D EN RD IOC Q Interrupt-onChange Q S(4) R Q1 D EN From other GP<5, 3:0> pins Write `0' to GBIF RD GPIO To T1G To A/D Converter(5) Note 1: CLK modes are XT, HS, LP, TMR1 LP and CLKOUT Enable. 2: With CLKOUT option. 3: Analog Input mode comes from ANSEL. 4: Set has priority over Reset. 5: PIC12F615/617/HV615 only. DS41302D-page 50 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 5.2.4.6 GP5/T1CKI/P1A(1, 2)/OSC1/CLKIN Note 1: Alternate pin function. Figure 5-5 shows the diagram for this pin. The GP5 pin is configurable to function as one of the following: * * * * * 2: PIC12F615/617/HV615 only. a general purpose I/O a Timer1 clock input PWM output, alternate pin(1, 2) a crystal/resonator connection a clock input FIGURE 5-5: BLOCK DIAGRAM OF GP5 INTOSC Mode TMR1LPEN(1) Data Bus D WR WPU CK VDD Q Weak Q GPPU RD WPU Oscillator Circuit OSC2 D WR GPIO CK VDD Q Q I/O Pin D WR TRISIO CK Q Q VSS INTOSC Mode RD TRISIO RD GPIO D WR IOC CK Q Q D Q EN Q1 RD IOC Q Q Interrupt-onChange S(2) R D EN From other GP<4:0> pins RD GPIO Write `0' to GBIF To Timer1 Note 1: 2: Timer1 LP Oscillator enabled. Set has priority over Reset. 2010 Microchip Technology Inc. DS41302D-page 51 PIC12F609/615/617/12HV609/615 TABLE 5-1: Name SUMMARY OF REGISTERS ASSOCIATED WITH GPIO Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets -000 1111 -- ADCS2(1) ADCS1(1) ADCS0(1) ANS3 ANS2(1) ANS1 ANS0 -000 1111 CMCON0 CMON COUT CMOE CMPOL -- CMR -- CMCH 0000 -0-0 0000 -0-0 INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000 -- -- IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 --00 0000 --00 0000 ANSEL IOC GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 GPIO OPTION_REG -- -- GP5 GP4 GP3 GP2 GP1 GP0 --xx xxxx --u0 u000 TRISIO -- -- TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111 WPU -- -- WPU5 WPU4 WPU3 WPU2 WPU1 WPU0 --11 1111 --11 -111 T1GINV TMR1GE TICKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 uuuu uuuu P1M -- DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0-00 0000 0-00 0000 -- -- -- T1GSEL -- -- P1BSEL P1ASEL ---0 --00 ---0 --00 T1CON CCP1CON(1) APFCON(1) Legend: Note 1: x = unknown, u = unchanged, - = unimplemented locations read as `0'. Shaded cells are not used by GPIO. PIC12F615/617/HV615 only. DS41302D-page 52 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 6.0 TIMER0 MODULE 6.1 Timer0 Operation The Timer0 module is an 8-bit timer/counter with the following features: When used as a timer, the Timer0 module can be used as either an 8-bit timer or an 8-bit counter. * * * * * 6.1.1 8-bit timer/counter register (TMR0) 8-bit prescaler (shared with Watchdog Timer) Programmable internal or external clock source Programmable external clock edge selection Interrupt on overflow 8-BIT TIMER MODE When used as a timer, the Timer0 module will increment every instruction cycle (without prescaler). Timer mode is selected by clearing the T0CS bit of the OPTION register to `0'. Figure 6-1 is a block diagram of the Timer0 module. When TMR0 is written, the increment is inhibited for two instruction cycles immediately following the write. Note: 6.1.2 The value written to the TMR0 register can be adjusted, in order to account for the two instruction cycle delay when TMR0 is written. 8-BIT COUNTER MODE When used as a counter, the Timer0 module will increment on every rising or falling edge of the T0CKI pin. The incrementing edge is determined by the T0SE bit of the OPTION register. Counter mode is selected by setting the T0CS bit of the OPTION register to `1'. FIGURE 6-1: BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER FOSC/4 Data Bus 0 8 1 Sync 2 TCY 1 T0CKI pin T0SE TMR0 0 0 T0CS Set Flag bit T0IF on Overflow 8-bit Prescaler PSA 1 PSA 8 PS<2:0> Watchdog Timer WDTE 1 WDT Time-out 0 PSA Note 1: 2: T0SE, T0CS, PSA, PS<2:0> are bits in the OPTION register. WDTE bit is in the Configuration Word register. 2010 Microchip Technology Inc. DS41302D-page 53 PIC12F609/615/617/12HV609/615 6.1.3 SOFTWARE PROGRAMMABLE PRESCALER A single software programmable prescaler is available for use with either Timer0 or the Watchdog Timer (WDT), but not both simultaneously. The prescaler assignment is controlled by the PSA bit of the OPTION register. To assign the prescaler to Timer0, the PSA bit must be cleared to a `0'. There are 8 prescaler options for the Timer0 module ranging from 1:2 to 1:256. The prescale values are selectable via the PS<2:0> bits of the OPTION register. In order to have a 1:1 prescaler value for the Timer0 module, the prescaler must be assigned to the WDT module. The prescaler is not readable or writable. When assigned to the Timer0 module, all instructions writing to the TMR0 register will clear the prescaler. When the prescaler is assigned to WDT, a CLRWDT instruction will clear the prescaler along with the WDT. 6.1.3.1 Switching Prescaler Between Timer0 and WDT Modules As a result of having the prescaler assigned to either Timer0 or the WDT, it is possible to generate an unintended device Reset when switching prescaler values. When changing the prescaler assignment from Timer0 to the WDT module, the instruction sequence shown in Example 6-1, must be executed. EXAMPLE 6-1: CHANGING PRESCALER (TIMER0 WDT) BANKSEL CLRWDT CLRF TMR0 BANKSEL BSF CLRWDT OPTION_REG OPTION_REG,PSA MOVLW ANDWF IORLW MOVWF b'11111000' OPTION_REG,W b'00000101' OPTION_REG TMR0 DS41302D-page 54 ; ;Clear WDT ;Clear TMR0 and ;prescaler ; ;Select WDT ; ; ;Mask prescaler ;bits ;Set WDT prescaler ;to 1:32 When changing the prescaler assignment from the WDT to the Timer0 module, the following instruction sequence must be executed (see Example 6-2). EXAMPLE 6-2: CHANGING PRESCALER (WDT TIMER0) CLRWDT ;Clear WDT and ;prescaler BANKSEL OPTION_REG ; MOVLW b'11110000' ;Mask TMR0 select and ANDWF OPTION_REG,W ;prescaler bits IORLW b'00000011' ;Set prescale to 1:16 MOVWF OPTION_REG ; 6.1.4 TIMER0 INTERRUPT Timer0 will generate an interrupt when the TMR0 register overflows from FFh to 00h. The T0IF interrupt flag bit of the INTCON register is set every time the TMR0 register overflows, regardless of whether or not the Timer0 interrupt is enabled. The T0IF bit must be cleared in software. The Timer0 interrupt enable is the T0IE bit of the INTCON register. Note: 6.1.5 The Timer0 interrupt cannot wake the processor from Sleep since the timer is frozen during Sleep. USING TIMER0 WITH AN EXTERNAL CLOCK When Timer0 is in Counter mode, the synchronization of the T0CKI input and the Timer0 register is accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the internal phase clocks. Therefore, the high and low periods of the external clock source must meet the timing requirements as shown in Section 16.0 "Electrical Specifications". 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 REGISTER 6-1: OPTION_REG: OPTION REGISTER R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 7 GPPU: GPIO Pull-up Enable bit 1 = GPIO pull-ups are disabled 0 = GPIO pull-ups are enabled by individual PORT latch values in WPU register bit 6 INTEDG: Interrupt Edge Select bit 1 = Interrupt on rising edge of INT pin 0 = Interrupt on falling edge of INT pin bit 5 T0CS: TMR0 Clock Source Select bit 1 = Transition on T0CKI pin 0 = Internal instruction cycle clock (FOSC/4) bit 4 T0SE: TMR0 Source Edge Select bit 1 = Increment on high-to-low transition on T0CKI pin 0 = Increment on low-to-high transition on T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler is assigned to the WDT 0 = Prescaler is assigned to the Timer0 module bit 2-0 PS<2:0>: Prescaler Rate Select bits BIT VALUE TMR0 RATE WDT RATE 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 000 001 010 011 100 101 110 111 TABLE 6-1: Name INTCON Legend: Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Timer0 Module Register OPTION_REG TRISIO SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0 Bit 7 TMR0 1:1 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 Value on POR, BOR Value on all other Resets xxxx xxxx uuuu uuuu 0000 000x GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 000x GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 -- -- --11 1111 --11 1111 TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 - = Unimplemented locations, read as `0', u = unchanged, x = unknown. Shaded cells are not used by the Timer0 module. 2010 Microchip Technology Inc. DS41302D-page 55 PIC12F609/615/617/12HV609/615 NOTES: DS41302D-page 56 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 7.0 TIMER1 MODULE WITH GATE CONTROL The Timer1 module is a 16-bit timer/counter with the following features: * * * * * * * * * * * 16-bit timer/counter register pair (TMR1H:TMR1L) Programmable internal or external clock source 3-bit prescaler Optional LP oscillator Synchronous or asynchronous operation Timer1 gate (count enable) via comparator or T1G pin Interrupt on overflow Wake-up on overflow (external clock, Asynchronous mode only) Time base for the Capture/Compare function Special Event Trigger (with ECCP) Comparator output synchronization to Timer1 clock 7.2 Clock Source Selection The TMR1CS bit of the T1CON register is used to select the clock source. When TMR1CS = 0, the clock source is FOSC/4. When TMR1CS = 1, the clock source is supplied externally. Clock Source TMR1CS T1ACS FOSC/4 0 0 FOSC 0 1 T1CKI pin 1 x Figure 7-1 is a block diagram of the Timer1 module. 7.1 Timer1 Operation The Timer1 module is a 16-bit incrementing counter which is accessed through the TMR1H:TMR1L register pair. Writes to TMR1H or TMR1L directly update the counter. When used with an internal clock source, the module is a timer. When used with an external clock source, the module can be used as either a timer or counter. 2010 Microchip Technology Inc. DS41302D-page 57 PIC12F609/615/617/12HV609/615 FIGURE 7-1: TIMER1 BLOCK DIAGRAM TMR1GE T1GINV TMR1ON Set flag bit TMR1IF on Overflow To Comparator Module Timer1 Clock TMR1(2) TMR1H TMR1L 0 EN Synchronized clock input 1 Oscillator (1) T1SYNC OSC1/T1CKI 1 Prescaler 1, 2, 4, 8 0 OSC2/T1G Synchronize(3) det 2 T1CKPS<1:0> TMR1CS 0 INTOSC Without CLKOUT T1OSCEN FOSC 1 1 1 FOSC/4 Internal Clock 0 COUT 0 T1GSEL(2) T1GSS T1ACS GP3/T1G(4, 5) Note 1: 2: 3: 4: 5: ST Buffer is low power type when using LP oscillator, or high speed type when using T1CKI. Timer1 register increments on rising edge. Synchronize does not operate while in Sleep. Alternate pin function. PIC12F615/617/HV615 only. DS41302D-page 58 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 7.2.1 INTERNAL CLOCK SOURCE When the internal clock source is selected, the TMR1H:TMR1L register pair will increment on multiples of TCY as determined by the Timer1 prescaler. 7.2.2 EXTERNAL CLOCK SOURCE When the external clock source is selected, the Timer1 module may work as a timer or a counter. When counting, Timer1 is incremented on the rising edge of the external clock input T1CKI. In addition, the Counter mode clock can be synchronized to the microcontroller system clock or run asynchronously. 7.5 If control bit T1SYNC of the T1CON register is set, the external clock input is not synchronized. The timer continues to increment asynchronous to the internal phase clocks. The timer will continue to run during Sleep and can generate an interrupt on overflow, which will wake-up the processor. However, special precautions in software are needed to read/write the timer (see Section 7.5.1 "Reading and Writing Timer1 in Asynchronous Counter Mode"). Note: When switching from synchronous to asynchronous operation, it is possible to skip an increment. When switching from asynchronous to synchronous operation, it is possible to produce a single spurious increment. Note: In asynchronous counter mode or when using the internal oscillator and T1ACS=1, Timer1 can not be used as a time base for the capture or compare modes of the ECCP module (for PIC12F615/617/ HV615 only). If an external clock oscillator is needed (and the microcontroller is using the INTOSC without CLKOUT), Timer1 can use the LP oscillator as a clock source. In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge after one or more of the following conditions: * Timer1 is enabled after POR or BOR Reset * A write to TMR1H or TMR1L * T1CKI is high when Timer1 is disabled and when Timer1 is re-enabled T1CKI is low. See Figure 7-2. 7.3 Timer1 Prescaler Timer1 has four prescaler options allowing 1, 2, 4 or 8 divisions of the clock input. The T1CKPS bits of the T1CON register control the prescale counter. The prescale counter is not directly readable or writable; however, the prescaler counter is cleared upon a write to TMR1H or TMR1L. 7.4 Timer1 Oscillator A low-power 32.768 kHz crystal oscillator is built-in between pins OSC1 (input) and OSC2 (output). The oscillator is enabled by setting the T1OSCEN control bit of the T1CON register. The oscillator will continue to run during Sleep. The Timer1 oscillator is shared with the system LP oscillator. Thus, Timer1 can use this mode only when the primary system clock is derived from the internal oscillator or when in LP oscillator mode. The user must provide a software time delay to ensure proper oscillator start-up. Timer1 Operation in Asynchronous Counter Mode 7.5.1 READING AND WRITING TIMER1 IN ASYNCHRONOUS COUNTER MODE Reading TMR1H or TMR1L while the timer is running from an external asynchronous clock will ensure a valid read (taken care of in hardware). However, the user should keep in mind that reading the 16-bit timer in two 8-bit values itself poses certain problems, since the timer may overflow between the reads. For writes, it is recommended that the user simply stop the timer and write the desired values. A write contention may occur by writing to the timer registers, while the register is incrementing. This may produce an unpredictable value in the TMR1H:TTMR1L register pair. TRISIO5 and TRISIO4 bits are set when the Timer1 oscillator is enabled. GP5 and GP4 bits read as `0' and TRISIO5 and TRISIO4 bits read as `1'. Note: The oscillator requires a start-up and stabilization time before use. Thus, T1OSCEN should be set and a suitable delay observed prior to enabling Timer1. 2010 Microchip Technology Inc. DS41302D-page 59 PIC12F609/615/617/12HV609/615 7.6 Timer1 Gate Timer1 gate source is software configurable to be the T1G pin (or the alternate T1G pin) or the output of the Comparator. This allows the device to directly time external events using T1G or analog events using the Comparator. See the CMCON1 Register (Register 9-2) for selecting the Timer1 gate source. This feature can simplify the software for a Delta-Sigma A/D converter and many other applications. For more information on Delta-Sigma A/D converters, see the Microchip web site (www.microchip.com). Note: TMR1GE bit of the T1CON register must be set to use either T1G or COUT as the Timer1 gate source. See Register 9-2 for more information on selecting the Timer1 gate source. 7.9 ECCP Capture/Compare Time Base (PIC12F615/617/HV615 only) The ECCP module uses the TMR1H:TMR1L register pair as the time base when operating in Capture or Compare mode. In Capture mode, the value in the TMR1H:TMR1L register pair is copied into the CCPR1H:CCPR1L register pair on a configured event. In Compare mode, an event is triggered when the value CCPR1H:CCPR1L register pair matches the value in the TMR1H:TMR1L register pair. This event can be a Special Event Trigger. For more information, see Section 11.0 "Enhanced Capture/Compare/PWM (With Auto-Shutdown and Dead Band) Module (PIC12F615/617/HV615 only)". Timer1 gate can be inverted using the T1GINV bit of the T1CON register, whether it originates from the T1G pin or the Comparator output. This configures Timer1 to measure either the active-high or active-low time between events. 7.7 Timer1 Interrupt The Timer1 register pair (TMR1H:TMR1L) increments to FFFFh and rolls over to 0000h. When Timer1 rolls over, the Timer1 interrupt flag bit of the PIR1 register is set. To enable the interrupt on rollover, you must set these bits: * Timer1 interrupt enable bit of the PIE1 register * PEIE bit of the INTCON register * GIE bit of the INTCON register The interrupt is cleared by clearing the TMR1IF bit in the Interrupt Service Routine. Note: 7.8 The TMR1H:TTMR1L register pair and the TMR1IF bit should be cleared before enabling interrupts. Timer1 Operation During Sleep Timer1 can only operate during Sleep when setup in Asynchronous Counter mode. In this mode, an external crystal or clock source can be used to increment the counter. To set up the timer to wake the device: * TMR1ON bit of the T1CON register must be set * TMR1IE bit of the PIE1 register must be set * PEIE bit of the INTCON register must be set The device will wake-up on an overflow and execute the next instruction. If the GIE bit of the INTCON register is set, the device will call the Interrupt Service Routine (0004h). DS41302D-page 60 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 7.10 ECCP Special Event Trigger (PIC12F615/617/HV615 only) If a ECCP is configured to trigger a special event, the trigger will clear the TMR1H:TMR1L register pair. This special event does not cause a Timer1 interrupt. The ECCP module may still be configured to generate a ECCP interrupt. In this mode of operation, the CCPR1H:CCPR1L register pair effectively becomes the period register for Timer1. Timer1 should be synchronized to the FOSC to utilize the Special Event Trigger. Asynchronous operation of Timer1 can cause a Special Event Trigger to be missed. For more information, see Section 11.0 "Enhanced Capture/Compare/PWM (With Auto-Shutdown and Dead Band) Module (PIC12F615/617/HV615 only)". 7.11 Comparator Synchronization The same clock used to increment Timer1 can also be used to synchronize the comparator output. This feature is enabled in the Comparator module. When using the comparator for Timer1 gate, the comparator output should be synchronized to Timer1. This ensures Timer1 does not miss an increment if the comparator changes. For more information, see Section 9.0 "Comparator Module". In the event that a write to TMR1H or TMR1L coincides with a Special Event Trigger from the ECCP, the write will take precedence. FIGURE 7-2: TIMER1 INCREMENTING EDGE T1CKI = 1 when TMR1 Enabled T1CKI = 0 when TMR1 Enabled Note 1: 2: Arrows indicate counter increments. In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge of the clock. 2010 Microchip Technology Inc. DS41302D-page 61 PIC12F609/615/617/12HV609/615 7.12 Timer1 Control Register The Timer1 Control register (T1CON), shown in Register 7-1, is used to control Timer1 and select the various features of the Timer1 module. REGISTER 7-1: R/W-0 R/W-0 (1) T1GINV T1CON: TIMER 1 CONTROL REGISTER (2) TMR1GE R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7 T1GINV: Timer1 Gate Invert bit(1) 1 = Timer1 gate is active-high (Timer1 counts when gate is high) 0 = Timer1 gate is active-low (Timer1 counts when gate is low) bit 6 TMR1GE: Timer1 Gate Enable bit(2) If TMR1ON = 0: This bit is ignored If TMR1ON = 1: 1 = Timer1 is on if Timer1 gate is active 0 = Timer1 is on bit 5-4 T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits 11 = 1:8 Prescale Value 10 = 1:4 Prescale Value 01 = 1:2 Prescale Value 00 = 1:1 Prescale Value bit 3 T1OSCEN: LP Oscillator Enable Control bit If INTOSC without CLKOUT oscillator is active: 1 = LP oscillator is enabled for Timer1 clock 0 = LP oscillator is off For all other system clock modes: This bit is ignored. LP oscillator is disabled. bit 2 T1SYNC: Timer1 External Clock Input Synchronization Control bit TMR1CS = 1: 1 = Do not synchronize external clock input 0 = Synchronize external clock input TMR1CS = 0: This bit is ignored. Timer1 uses the internal clock bit 1 TMR1CS: Timer1 Clock Source Select bit 1 = External clock from T1CKI pin (on the rising edge) 0 = Internal clock (FOSC/4) or system clock (FOSC)(3) bit 0 TMR1ON: Timer1 On bit 1 = Enables Timer1 0 = Stops Timer1 Note 1: 2: 3: x = Bit is unknown T1GINV bit inverts the Timer1 gate logic, regardless of source. TMR1GE bit must be set to use either T1G pin or COUT, as selected by the T1GSS bit of the CMCON1 register, as a Timer1 gate source. See T1ACS bit in CMCON1 register. DS41302D-page 62 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 TABLE 7-1: Name SUMMARY OF REGISTERS ASSOCIATED WITH TIMER1 Bit 7 APFCON(1) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets -- -- -- T1GSEL -- -- P1BSEL P1ASEL ---0 --00 ---0 --00 CMCON0 CMON COUT CMOE CMPOL -- CMR -- CMCH 0000 -0-0 0000 -0-0 CMCON1 -- -- -- T1ACS CMHYS -- T1GSS CMSYNC ---0 0-10 ---0 0-10 INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 000x 0000 000x PIE1 -- ADIE(1) CCP1IE(1) -- CMIE -- TMR2IE(1) TMR1IE -00- 0-00 -00- 0-00 PIR1 -- ADIF(1) CCP1IF(1) -- CMIF -- TMR2IF(1) TMR1IF -00- 0-00 -00- 0-00 TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu 0000 0000 uuuu uuuu T1CON T1GINV Legend: Note TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON x = unknown, u = unchanged, - = unimplemented, read as `0'. Shaded cells are not used by the Timer1 module. 1: PIC12F615/617/HV615 only. 2010 Microchip Technology Inc. DS41302D-page 63 PIC12F609/615/617/12HV609/615 NOTES: DS41302D-page 64 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 8.0 TIMER2 MODULE (PIC12F615/617/HV615 ONLY) The TMR2 and PR2 registers are both fully readable and writable. On any Reset, the TMR2 register is set to 00h and the PR2 register is set to FFh. The Timer2 module is an 8-bit timer with the following features: * * * * * 8-bit timer register (TMR2) 8-bit period register (PR2) Interrupt on TMR2 match with PR2 Software programmable prescaler (1:1, 1:4, 1:16) Software programmable postscaler (1:1 to 1:16) The Timer2 prescaler is controlled by the T2CKPS bits in the T2CON register. The Timer2 postscaler is controlled by the TOUTPS bits in the T2CON register. The prescaler and postscaler counters are cleared when: See Figure 8-1 for a block diagram of Timer2. 8.1 Timer2 is turned on by setting the TMR2ON bit in the T2CON register to a `1'. Timer2 is turned off by clearing the TMR2ON bit to a `0'. Timer2 Operation The clock input to the Timer2 module is the system instruction clock (FOSC/4). The clock is fed into the Timer2 prescaler, which has prescale options of 1:1, 1:4 or 1:16. The output of the prescaler is then used to increment the TMR2 register. * A write to TMR2 occurs. * A write to T2CON occurs. * Any device Reset occurs (Power-on Reset, MCLR Reset, Watchdog Timer Reset, or Brown-out Reset). Note: TMR2 is not cleared when T2CON is written. The values of TMR2 and PR2 are constantly compared to determine when they match. TMR2 will increment from 00h until it matches the value in PR2. When a match occurs, two things happen: * TMR2 is reset to 00h on the next increment cycle. * The Timer2 postscaler is incremented The match output of the Timer2/PR2 comparator is then fed into the Timer2 postscaler. The postscaler has postscale options of 1:1 to 1:16 inclusive. The output of the Timer2 postscaler is used to set the TMR2IF interrupt flag bit in the PIR1 register. FIGURE 8-1: TIMER2 BLOCK DIAGRAM TMR2 Output FOSC/4 Prescaler 1:1, 1:4, 1:16 2 TMR2 Sets Flag bit TMR2IF Reset Comparator EQ Postscaler 1:1 to 1:16 T2CKPS<1:0> PR2 4 TOUTPS<3:0> 2010 Microchip Technology Inc. DS41302D-page 65 PIC12F609/615/617/12HV609/615 REGISTER 8-1: T2CON: TIMER 2 CONTROL REGISTER U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 -- TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7 Unimplemented: Read as `0' bit 6-3 TOUTPS<3:0>: Timer2 Output Postscaler Select bits 0000 =1:1 Postscaler 0001 =1:2 Postscaler 0010 =1:3 Postscaler 0011 =1:4 Postscaler 0100 =1:5 Postscaler 0101 =1:6 Postscaler 0110 =1:7 Postscaler 0111 =1:8 Postscaler 1000 =1:9 Postscaler 1001 =1:10 Postscaler 1010 =1:11 Postscaler 1011 =1:12 Postscaler 1100 =1:13 Postscaler 1101 =1:14 Postscaler 1110 =1:15 Postscaler 1111 =1:16 Postscaler bit 2 TMR2ON: Timer2 On bit 1 = Timer2 is on 0 = Timer2 is off bit 1-0 T2CKPS<1:0>: Timer2 Clock Prescale Select bits 00 =Prescaler is 1 01 =Prescaler is 4 1x =Prescaler is 16 TABLE 8-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER2 Name Bit 7 INTCON GIE -- -- ADIF(1) PIE1 PIR1 x = Bit is unknown Bit 6 Bit 5 Bit 4 PEIE T0IE ADIE(1) CCP1IE(1) CCP1IF(1) Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Bit 3 Bit 2 INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000 -- CMIE -- TMR2IE(1) TMR1IE -00- 0-00 -00- 0-00 -- CMIF -- TMR2IF(1) TMR1IF -00- 0-00 -00- 0-00 PR2(1) Timer2 Module Period Register 1111 1111 1111 1111 TMR2(1) Holding Register for the 8-bit TMR2 Register 0000 0000 0000 0000 -000 0000 -000 0000 T2CON(1) Legend: Note 1: -- TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 x = unknown, u = unchanged, - = unimplemented read as `0'. Shaded cells are not used for Timer2 module. For PIC12F615/617/HV615 only. DS41302D-page 66 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 9.0 COMPARATOR MODULE than the analog voltage at VIN-, the output of the comparator is a digital low level. When the analog voltage at VIN+ is greater than the analog voltage at VIN-, the output of the comparator is a digital high level. The comparator can be used to interface analog circuits to a digital circuit by comparing two analog voltages and providing a digital indication of their relative magnitudes. The comparator is a very useful mixed signal building block because it provides analog functionality independent of the program execution. The Analog Comparator module includes the following features: * * * * * * * * * * FIGURE 9-1:SINGLE COMPARATOR Programmable input section Comparator output is available internally/externally Programmable output polarity Interrupt-on-change Wake-up from Sleep PWM shutdown Timer1 gate (count enable) Output synchronization to Timer1 clock input Programmable voltage reference User-enable Comparator Hysteresis 9.1 VIN+ + VIN- - VINVIN+ Output Comparator Overview Note: The black areas of the output of the comparator represents the uncertainty due to input offsets and response time. The comparator is shown in Figure 9-1 along with the relationship between the analog input levels and the digital output. When the analog voltage at VIN+ is less FIGURE 9-2: Output COMPARATOR SIMPLIFIED BLOCK DIAGRAM CMPOL D Q1 Q EN To Data Bus RD_CMCON0 CMCH Set CMIF D Q3*RD_CMCON0 CMON(1) GP1/CIN0- 0 Q EN CL Reset MUX GP4/CIN1- 1 CMVINTo PWM Auto-Shutdown CMVIN+ CMSYNC CMR CMPOL D GP0/CIN+ FixedRef CVREF CMVREN 0 CMVREF MUX 1 0 MUX 1 Note 1: 2: 3: 4: 2010 Microchip Technology Inc. Q 0 MUX 1 CMOE COUT(4) From Timer1 Clock SYNCCMOUT To Timer1 Gate When CMON = 0, the comparator will produce a `0' output to the XOR Gate. Q1 and Q3 are phases of the four-phase system clock (FOSC). Q1 is held high during Sleep mode. Output shown for reference only. See I/O port pin diagram for more details. DS41302D-page 67 PIC12F609/615/617/12HV609/615 9.2 Analog Input Connection Considerations A simplified circuit for an analog input is shown in Figure 9-3. Since the analog input pins share their connection with a digital input, they have reverse biased ESD protection diodes to VDD and VSS. The analog input, therefore, must be between VSS and VDD. If the input voltage deviates from this range by more than 0.6V in either direction, one of the diodes is forward biased and a latch-up may occur. Note 1: When reading a GPIO register, all pins configured as analog inputs will read as a `0'. Pins configured as digital inputs will convert as an analog input, according to the input specification. 2: Analog levels on any pin defined as a digital input, may cause the input buffer to consume more current than is specified. A maximum source impedance of 10 k is recommended for the analog sources. Also, any external component connected to an analog input pin, such as a capacitor or a Zener diode, should have very little leakage current to minimize inaccuracies introduced. FIGURE 9-3: ANALOG INPUT MODEL VDD VT 0.6V RS < 10K RIC To Comparator AIN VA CPIN 5 pF VT 0.6V ILEAKAGE 500 nA VSS Legend: CPIN = Input Capacitance ILEAKAGE = Leakage Current at the pin due to various junctions = Interconnect Resistance RIC = Source Impedance RS VA = Analog Voltage = Threshold Voltage VT DS41302D-page 68 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 9.3 Comparator Control The comparator has two control and Configuration registers: CMCON0 and CMCON1. The CMCON1 register is used for controlling the interaction with Timer1 and simultaneously reading the comparator output. The CMCON0 register (Register 9-1) contain the control and Status bits for the following: * * * * * Enable Input selection Reference selection Output selection Output polarity 9.3.1 COMPARATOR INPUT SELECTION The CMCH bit of the CMCON0 register directs one of four analog input pins to the comparator inverting input. Note: 9.3.3 To use CIN+ and CIN- pins as analog inputs, the appropriate bits must be set in the ANSEL register and the corresponding TRIS bits must also be set to disable the output drivers. COMPARATOR REFERENCE SELECTION COMPARATOR OUTPUT POLARITY Inverting the output of the comparator is functionally equivalent to swapping the comparator inputs. The polarity of the comparator output can be inverted by setting the CMPOL bit of the CMCON0 register. Clearing CMPOL results in a non-inverted output. A complete table showing the output state versus input conditions and the polarity bit is shown in Table 9-1. TABLE 9-1: COMPARATOR ENABLE Setting the CMON bit of the CMCON0 register enables the comparator for operation. Clearing the CMON bit disables the comparator for minimum current consumption. 9.3.2 9.3.5 Input Conditions CMPOL COUT CMVIN- > CMVIN+ 0 0 CMVIN- < CMVIN+ 0 1 CMVIN- > CMVIN+ 1 1 CMVIN- < CMVIN+ 1 0 Note: 9.4 OUTPUT STATE VS. INPUT CONDITIONS COUT refers to both the register bit and output pin. Comparator Response Time The comparator output is indeterminate for a period of time after the change of an input source or the selection of a new reference voltage. This period is referred to as the response time. The response time of the comparator differs from the settling time of the voltage reference. Therefore, both of these times must be considered when determining the total response time to a comparator input change. See Section 16.0 "Electrical Specifications" for more details. Setting the CMR bit of the CMxCON0 register directs an internal voltage reference or an analog input pin to the non-inverting input of the comparator. See Section 9.10 "Comparator Voltage Reference" for more information on the internal voltage reference module. 9.3.4 COMPARATOR OUTPUT SELECTION The output of the comparator can be monitored by reading either the COUT bit of the CMCON0 register. In order to make the output available for an external connection, the following conditions must be true: * CMOE bit of the CMxCON0 register must be set * Corresponding TRIS bit must be cleared * CMON bit of the CMCON0 register must be set. Note 1: The CMOE bit overrides the PORT data latch. Setting the CMON has no impact on the port override. 2: The internal output of the comparator is latched with each instruction cycle. Unless otherwise specified, external outputs are not latched. 2010 Microchip Technology Inc. DS41302D-page 69 PIC12F609/615/617/12HV609/615 9.5 Comparator Interrupt Operation The comparator interrupt flag can be set whenever there is a change in the output value of the comparator. Changes are recognized by means of a mismatch circuit which consists of two latches and an exclusiveor gate (see Figure 9-4 and Figure 9-5). One latch is updated with the comparator output level when the CMCON0 register is read. This latch retains the value until the next read of the CMCON0 register or the occurrence of a Reset. The other latch of the mismatch circuit is updated on every Q1 system clock. A mismatch condition will occur when a comparator output change is clocked through the second latch on the Q1 clock cycle. At this point the two mismatch latches have opposite output levels which is detected by the exclusive-or gate and fed to the interrupt circuitry. The mismatch condition persists until either the CMCON0 register is read or the comparator output returns to the previous state. FIGURE 9-4: Q1 Q3 CIN+ TRT COUT Set CMIF (edge) CMIF reset by software FIGURE 9-5: 2: Comparator interrupts will operate correctly regardless of the state of CMOE. The comparator interrupt is set by the mismatch edge and not the mismatch level. This means that the interrupt flag can be reset without the additional step of reading or writing the CMCON0 register to clear the mismatch registers. When the mismatch registers are cleared, an interrupt will occur upon the comparator's return to the previous state, otherwise no interrupt will be generated. Software will need to maintain information about the status of the comparator output, as read from the CMCON1 register, to determine the actual change that has occurred. COMPARATOR INTERRUPT TIMING WITH CMCON0 READ Q1 Q3 CIN+ Note 1: A write operation to the CMCON0 register will also clear the mismatch condition because all writes include a read operation at the beginning of the write cycle. COMPARATOR INTERRUPT TIMING W/O CMCON0 READ TRT COUT Set CMIF (edge) CMIF cleared by CMCON0 read reset by software Note 1: If a change in the CMCON0 register (COUT) should occur when a read operation is being executed (start of the Q2 cycle), then the CMIF of the PIR1 register interrupt flag may not get set. 2: When a comparator is first enabled, bias circuitry in the comparator module may cause an invalid output from the comparator until the bias circuitry is stable. Allow about 1 s for bias settling then clear the mismatch condition and interrupt flags before enabling comparator interrupts. The CMIF bit of the PIR1 register is the Comparator Interrupt flag. This bit must be reset in software by clearing it to `0'. Since it is also possible to write a '1' to this register, an interrupt can be generated. The CMIE bit of the PIE1 register and the PEIE and GIE bits of the INTCON register must all be set to enable comparator interrupts. If any of these bits are cleared, the interrupt is not enabled, although the CMIF bit of the PIR1 register will still be set if an interrupt condition occurs. DS41302D-page 70 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 9.6 Operation During Sleep The comparator, if enabled before entering Sleep mode, remains active during Sleep. The additional current consumed by the comparator is shown separately in the Section 16.0 "Electrical Specifications". If the comparator is not used to wake the device, power consumption can be minimized while in Sleep mode by turning off the comparator. The comparator is turned off by clearing the CMON bit of the CMCON0 register. A change to the comparator output can wake-up the device from Sleep. To enable the comparator to wake the device from Sleep, the CMIE bit of the PIE1 register and the PEIE bit of the INTCON register must be set. The instruction following the SLEEP instruction always executes following a wake from Sleep. If the GIE bit of the INTCON register is also set, the device will then execute the Interrupt Service Routine. 9.7 Effects of a Reset A device Reset forces the CMCON1 register to its Reset state. This sets the comparator and the voltage reference to the OFF state. 2010 Microchip Technology Inc. DS41302D-page 71 PIC12F609/615/617/12HV609/615 REGISTER 9-1: CMCON0: COMPARATOR CONTROL REGISTER 0 R/W-0 R-0 R/W-0 R/W-0 U-0 R/W-0 U-0 R/W-0 CMON COUT CMOE CMPOL -- CMR -- CMCH bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7 CMON: Comparator Enable bit 1 = Comparator is enabled 0 = Comparator is disabled bit 6 COUT: Comparator Output bit If C1POL = 1 (inverted polarity): COUT = 0 when CMVIN+ > CMVINCOUT = 1 when CMVIN+ < CMVINIf C1POL = 0 (non-inverted polarity): COUT = 1 when CMVIN+ > CMVINCOUT = 0 when CMVIN+ < CMVIN- bit 5 CMOE: Comparator Output Enable bit 1 = COUT is present on the COUT pin(1) 0 = COUT is internal only bit 4 CMPOL: Comparator Output Polarity Select bit 1 = COUT logic is inverted 0 = COUT logic is not inverted bit 3 Unimplemented: Read as `0' bit 2 CMR: Comparator Reference Select bit (non-inverting input) 1 = CMVIN+ connects to CMVREF output 0 = CMVIN+ connects to CIN+ pin bit 1 Unimplemented: Read as `0' bit 0 CMCH: Comparator C1 Channel Select bit 0 = CMVIN- pin of the Comparator connects to CIN01 = CMVIN- pin of the Comparator connects to CIN1- Note 1: x = Bit is unknown Comparator output requires the following three conditions: CMOE = 1, CMON = 1 and corresponding port TRIS bit = 0. DS41302D-page 72 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 9.8 Comparator Gating Timer1 9.9 This feature can be used to time the duration or interval of analog events. Clearing the T1GSS bit of the CMCON1 register will enable Timer1 to increment based on the output of the comparator. This requires that Timer1 is on and gating is enabled. See Section 7.0 "Timer1 Module with Gate Control" for details. It is recommended to synchronize the comparator with Timer1 by setting the CMSYNC bit when the comparator is used as the Timer1 gate source. This ensures Timer1 does not miss an increment if the comparator changes during an increment. REGISTER 9-2: Synchronizing Comparator Output to Timer1 The comparator output can be synchronized with Timer1 by setting the CMSYNC bit of the CMCON1 register. When enabled, the comparator output is latched on the falling edge of the Timer1 clock source. If a prescaler is used with Timer1, the comparator output is latched after the prescaling function. To prevent a race condition, the comparator output is latched on the falling edge of the Timer1 clock source and Timer1 increments on the rising edge of its clock source. See the Comparator Block Diagram (Figure 92) and the Timer1 Block Diagram (Figure 7-1) for more information. CMCON1: COMPARATOR CONTROL REGISTER 1 U-0 U-0 U-0 R/W-0 R/W-0 U-0 R/W-1 R/W-0 -- -- -- T1ACS CMHYS -- T1GSS CMSYNC bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 7-5 Unimplemented: Read as `0' bit 4 T1ACS: Timer1 Alternate Clock Select bit 1 = Timer 1 Clock Source is System Clock (FOSC) 0 = Timer 1 Clock Source is Instruction Clock (FOSC\4) bit 3 CMHYS: Comparator Hysteresis Select bit 1 = Comparator Hysteresis enabled 0 = Comparator Hysteresis disabled bit 2 Unimplemented: Read as `0' bit 1 T1GSS: Timer1 Gate Source Select bit(1) 1 = Timer 1 Gate Source is T1G pin (pin should be configured as digital input) 0 = Timer 1 Gate Source is comparator output bit 0 CMSYNC: Comparator Output Synchronization bit(2) 1 = Output is synchronized with falling edge of Timer1 clock 0 = Output is asynchronous Note 1: 2: Refer to Section 7.6 "Timer1 Gate". Refer to Figure 9-2. 2010 Microchip Technology Inc. DS41302D-page 73 PIC12F609/615/617/12HV609/615 9.10 Comparator Voltage Reference 9.10.3 OUTPUT CLAMPED TO VSS The Comparator Voltage Reference module provides an internally generated voltage reference for the comparators. The following features are available: The CVREF output voltage can be set to Vss with no power consumption by configuring VRCON as follows: * * * * * This allows the comparator to detect a zero-crossing while not consuming additional CVREF module current. Independent from Comparator operation 16-level voltage range Output clamped to VSS Ratiometric with VDD Fixed Reference (0.6) The VRCON register (Register 9-3) controls the Voltage Reference module shown in Register 9-6. 9.10.1 INDEPENDENT OPERATION The comparator voltage reference is independent of the comparator configuration. Setting the VREN bit of the VRCON register will enable the voltage reference. 9.10.2 OUTPUT VOLTAGE SELECTION The CVREF voltage reference has 2 ranges with 16 voltage levels in each range. Range selection is controlled by the VRR bit of the VRCON register. The 16 levels are set with the VR<3:0> bits of the VRCON register. The CVREF output voltage is determined by the following equations: EQUATION 9-1: CVREF OUTPUT VOLTAGE V RR = 1 (low range): CVREF = (VR<3:0>/24) V DD V RR = 0 (high range): CV REF = (VDD/4) + (VR<3:0> VDD/32) The full range of VSS to VDD cannot be realized due to the construction of the module. See Figure 9-6. * FVREN = 0 9.10.4 OUTPUT RATIOMETRIC TO VDD The comparator voltage reference is VDD derived and therefore, the CVREF output changes with fluctuations in VDD. The tested absolute accuracy of the Comparator Voltage Reference can be found in Section 16.0 "Electrical Specifications". 9.10.5 FIXED VOLTAGE REFERENCE The fixed voltage reference is independent of VDD, with a nominal output voltage of 0.6V. This reference can be enabled by setting the FVREN bit of the VRCON register to `1'. This reference is always enabled when the HFINTOSC oscillator is active. 9.10.6 FIXED VOLTAGE REFERENCE STABILIZATION PERIOD When the Fixed Voltage Reference module is enabled, it will require some time for the reference and its amplifier circuits to stabilize. The user program must include a small delay routine to allow the module to settle. See Section 16.0 "Electrical Specifications" for the minimum delay requirement. 9.10.7 VOLTAGE REFERENCE SELECTION Multiplexers on the output of the Voltage Reference module enable selection of either the CVREF or fixed voltage reference for use by the comparators. Setting the CMVREN bit of the VRCON register enables current to flow in the CVREF voltage divider and selects the CVREF voltage for use by the Comparator. Clearing the CMVREN bit selects the fixed voltage for use by the Comparator. When the CMVREN bit is cleared, current flow in the CVREF voltage divider is disabled minimizing the power drain of the voltage reference peripheral. DS41302D-page 74 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 FIGURE 9-6: COMPARATOR VOLTAGE REFERENCE BLOCK DIAGRAM 16 Stages 8R R R R R VDD VRR 8R CMVREN Analog MUX 15 CVREF(1) To Comparators and ADC Module 0 VR<3:0>(1) 4 FVREN Sleep HFINTOSC enable FixedRef To Comparators and ADC Module Note 1: 0.6V EN Fixed Voltage Reference Care should be taken to ensure CVREF remains within the comparator common mode input range. See Section 16.0 "Electrical Specifications" for more detail. 2010 Microchip Technology Inc. DS41302D-page 75 PIC12F609/615/617/12HV609/615 REGISTER 9-3: VRCON: VOLTAGE REFERENCE CONTROL REGISTER R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CMVREN -- VRR FVREN VR3 VR2 VR1 VR0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7 x = Bit is unknown CMVREN: Comparator Voltage Reference Enable bit(1, 2) 1 = CVREF circuit powered on and routed to CVREF input of the Comparator 0 = 0.6 Volt constant reference routed to CVREF input of the Comparator bit 6 Unimplemented: Read as `0' bit 5 VRR: CVREF Range Selection bit 1 = Low range 0 = High range bit 4 FVREN: 0.6V Reference Enable bit(2) 1 = Enabled 0 = Disabled bit 3-0 VR<3:0>: Comparator Voltage Reference CVREF Value Selection bits (0 VR<3:0> 15) When VRR = 1: CVREF = (VR<3:0>/24) * VDD When VRR = 0: CVREF = VDD/4 + (VR<3:0>/32) * VDD Note 1: 2: When CMVREN is low, the CVREF circuit is powered down and does not contribute to IDD current. When CMVREN is low and the FVREN bit is low, the CVREF signal should provide Vss to the comparator. DS41302D-page 76 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 9.11 Comparator Hysteresis Each comparator has built-in hysteresis that is user enabled by setting the CMHYS bit of the CMCON1 register. The hysteresis feature can help filter noise and reduce multiple comparator output transitions when the output is changing state. FIGURE 9-7: Figure 9-7 shows the relationship between the analog input levels and digital output of a comparator with and without hysteresis. The output of the comparator changes from a low state to a high state only when the analog voltage at VIN+ rises above the upper hysteresis threshold (VH+). The output of the comparator changes from a high state to a low state only when the analog voltage at VIN+ falls below the lower hysteresis threshold (VH-). COMPARATOR HYSTERESIS VIN+ + VIN- - Output V+ VH+ VINVHVIN+ Output (Without Hysteresis) Output (With Hysteresis) Note: The black areas of the comparator output represents the uncertainty due to input offsets and response time. 2010 Microchip Technology Inc. DS41302D-page 77 PIC12F609/615/617/12HV609/615 TABLE 9-2: Name ANSEL CMCON0 SUMMARY OF REGISTERS ASSOCIATED WITH THE COMPARATOR AND VOLTAGE REFERENCE MODULES Value on POR, BOR Bit 0 Value on all other Resets Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 -- ADCS2(1) ADCS1(1) ADCS0(1) ANS3 ANS2(1) ANS1 ANS0 -000 1111 -000 1111 CMON COUT CMOE CMPOL -- CMR -- CMCH 0000 -000 0000 -000 CMCON1 -- -- -- T1ACS CMHYS -- T1GSS CMSYNC 0000 0000 0000 0000 INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 000x 0000 000x PIE1 -- ADIE(1) CCP1IE(1) -- CMIE -- TMR2IE(1) TMR1IE -00- 0-00 -00- 0-00 PIR1 -- ADIF(1) CCP1IF(1) -- CMIF -- TMR2IF(1) TMR1IF -00- 0-00 -00- 0-00 GPIO -- -- GP5 GP4 GP3 GP2 GP1 GP0 --xx xxxx --uu uuuu TRISIO -- -- TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111 CMVREN -- VRR FVREN VR3 VR2 VR1 VR0 0-00 0000 0-00 0000 VRCON Legend: x = unknown, u = unchanged, - = unimplemented, read as `0'. Shaded cells are not used for comparator. Note 1: For PIC12F615/617/HV615 only. DS41302D-page 78 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 10.0 ANALOG-TO-DIGITAL CONVERTER (ADC) MODULE (PIC12F615/617/HV615 ONLY) Note: The ADRESL and ADRESH registers are Read Only. The Analog-to-Digital Converter (ADC) allows conversion of an analog input signal to a 10-bit binary representation of that signal. This device uses analog inputs, which are multiplexed into a single sample and hold circuit. The output of the sample and hold is connected to the input of the converter. The converter generates a 10-bit binary result via successive approximation and stores the conversion result into the ADC result registers (ADRESL and ADRESH). The ADC voltage reference is software selectable to either VDD or a voltage applied to the external reference pins. The ADC can generate an interrupt upon completion of a conversion. This interrupt can be used to wake-up the device from Sleep. Figure 10-1 shows the block diagram of the ADC. FIGURE 10-1: ADC BLOCK DIAGRAM VDD VCFG = 0 VREF GP0/AN0 GP1/AN1/VREF 000 GP2/AN2 010 011 VCFG = 1 001 GP4/AN3 100 CVREF 0.6V Reference 101 110 1.2V Reference A/D 10 GO/DONE ADFM 0 = Left Justify 1 = Right Justify ADON 10 CHS VSS 2010 Microchip Technology Inc. ADRESH ADRESL DS41302D-page 79 PIC12F609/615/617/12HV609/615 10.1 ADC Configuration When configuring and using the ADC the following functions must be considered: * * * * * * Port configuration Channel selection ADC voltage reference selection ADC conversion clock source Interrupt control Results formatting 10.1.1 PORT CONFIGURATION The ADC can be used to convert both analog and digital signals. When converting analog signals, the I/O pin should be configured for analog by setting the associated TRIS and ANSEL bits. See the corresponding port section for more information. Note: 10.1.2 Analog voltages on any pin that is defined as a digital input may cause the input buffer to conduct excess current. CHANNEL SELECTION The CHS bits of the ADCON0 register determine which channel is connected to the sample and hold circuit. When changing channels, a delay is required before starting the next conversion. Refer to Section 10.2 "ADC Operation" for more information. 10.1.3 The VCFG bit of the ADCON0 register provides control of the positive voltage reference. The positive voltage reference can be either VDD or an external voltage source. The negative voltage reference is always connected to the ground reference. 10.1.4 CONVERSION CLOCK The source of the conversion clock is software selectable via the ADCS bits of the ANSEL register. There are seven possible clock options: * * * * * * * FOSC/2 FOSC/4 FOSC/8 FOSC/16 FOSC/32 FOSC/64 FRC (dedicated internal oscillator) The time to complete one bit conversion is defined as TAD. One full 10-bit conversion requires 11 TAD periods as shown in Figure 10-3. For correct conversion, the appropriate TAD specification must be met. See A/D conversion requirements in Section 16.0 "Electrical Specifications" for more information. Table 10-1 gives examples of appropriate ADC clock selections. Note: DS41302D-page 80 ADC VOLTAGE REFERENCE Unless using the FRC, any changes in the system clock frequency will change the ADC clock frequency, which may adversely affect the ADC result. 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 TABLE 10-1: ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES (VDD > 3.0V) ADC Clock Period (TAD) ADC Clock Source Device Frequency (FOSC) ADCS<2:0> 20 MHz FOSC/2 000 100 ns FOSC/4 100 200 ns(2) 001 400 ns (2) 800 ns (2) FOSC/8 FOSC/16 101 FOSC/32 010 1.6 s FOSC/64 110 3.2 s FRC x11 2-6 s(1,4) Legend: Note 1: 2: 3: 4: 8 MHz (2) 4 MHz 1 MHz (2) 2.0 s 1.0 s(2) 4.0 s 2.0 s 8.0 s(3) 2.0 s 4.0 s 16.0 s(3) 4.0 s 8.0 s(3) 32.0 s(3) (3) 16.0 s 64.0 s(3) 2-6 s(1,4) 2-6 s(1,4) 250 ns (2) 500 ns 500 ns(2) 1.0 s (2) 8.0 s (3) 2-6 s(1,4) Shaded cells are outside of recommended range. The FRC source has a typical TAD time of 4 s for VDD > 3.0V. These values violate the minimum required TAD time. For faster conversion times, the selection of another clock source is recommended. When the device frequency is greater than 1 MHz, the FRC clock source is only recommended if the conversion will be performed during Sleep. FIGURE 10-2: ANALOG-TO-DIGITAL CONVERSION TAD CYCLES TCY to TAD TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD9 TAD10 TAD11 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0 Conversion Starts Holding Capacitor is Disconnected from Analog Input (typically 100 ns) Set GO/DONE bit 10.1.5 ADRESH and ADRESL registers are loaded, GO bit is cleared, ADIF bit is set, Holding capacitor is connected to analog input INTERRUPTS The ADC module allows for the ability to generate an interrupt upon completion of an Analog-to-Digital conversion. The ADC interrupt flag is the ADIF bit in the PIR1 register. The ADC interrupt enable is the ADIE bit in the PIE1 register. The ADIF bit must be cleared in software. Note: The ADIF bit is set at the completion of every conversion, regardless of whether or not the ADC interrupt is enabled. This interrupt can be generated while the device is operating or while in Sleep. If the device is in Sleep, the interrupt will wake-up the device. Upon waking from Sleep, the next instruction following the SLEEP instruction is always executed. If the user is attempting to wake-up from Sleep and resume in-line code execution, the global interrupt must be disabled. If the global interrupt is enabled, execution will switch to the Interrupt Service Routine. Please see Section 10.1.5 "Interrupts" for more information. 2010 Microchip Technology Inc. DS41302D-page 81 PIC12F609/615/617/12HV609/615 10.1.6 RESULT FORMATTING The 10-bit A/D conversion result can be supplied in two formats, left justified or right justified. The ADFM bit of the ADCON0 register controls the output format. Figure 10-4 shows the two output formats. FIGURE 10-3: 10-BIT A/D CONVERSION RESULT FORMAT ADRESH (ADFM = 0) ADRESL MSB LSB bit 7 bit 0 bit 7 10-bit A/D Result Unimplemented: Read as `0' MSB (ADFM = 1) bit 7 LSB bit 0 Unimplemented: Read as `0' 10.2 10.2.1 ADC Operation STARTING A CONVERSION To enable the ADC module, the ADON bit of the ADCON0 register must be set to a `1'. Setting the GO/ DONE bit of the ADCON0 register to a `1' will start the Analog-to-Digital conversion. Note: 10.2.2 The GO/DONE bit should not be set in the same instruction that turns on the ADC. Refer to Section 10.2.6 "A/D Conversion Procedure". COMPLETION OF A CONVERSION When the conversion is complete, the ADC module will: * Clear the GO/DONE bit * Set the ADIF flag bit * Update the ADRESH:ADRESL registers with new conversion result 10.2.3 TERMINATING A CONVERSION If a conversion must be terminated before completion, the GO/DONE bit can be cleared in software. The ADRESH:ADRESL registers will not be updated with the partially complete Analog-to-Digital conversion sample. Instead, the ADRESH:ADRESL register pair will retain the value of the previous conversion. Additionally, a 2 TAD delay is required before another acquisition can be initiated. Following this delay, an input acquisition is automatically started on the selected channel. Note: bit 0 bit 7 bit 0 10-bit A/D Result 10.2.4 ADC OPERATION DURING SLEEP The ADC module can operate during Sleep. This requires the ADC clock source to be set to the FRC option. When the FRC clock source is selected, the ADC waits one additional instruction before starting the conversion. This allows the SLEEP instruction to be executed, which can reduce system noise during the conversion. If the ADC interrupt is enabled, the device will wake-up from Sleep when the conversion completes. If the ADC interrupt is disabled, the ADC module is turned off after the conversion completes, although the ADON bit remains set. When the ADC clock source is something other than FRC, a SLEEP instruction causes the present conversion to be aborted and the ADC module is turned off, although the ADON bit remains set. 10.2.5 SPECIAL EVENT TRIGGER The ECCP Special Event Trigger allows periodic ADC measurements without software intervention. When this trigger occurs, the GO/DONE bit is set by hardware and the Timer1 counter resets to zero. Using the Special Event Trigger does not assure proper ADC timing. It is the user's responsibility to ensure that the ADC timing requirements are met. See Section 11.0 "Enhanced Capture/Compare/ PWM (With Auto-Shutdown and Dead Band) Module (PIC12F615/617/HV615 only)" for more information. A device Reset forces all registers to their Reset state. Thus, the ADC module is turned off and any pending conversion is terminated. DS41302D-page 82 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 10.2.6 A/D CONVERSION PROCEDURE This is an example procedure for using the ADC to perform an Analog-to-Digital conversion: 1. 2. 3. 4. 5. 6. 7. 8. Configure Port: * Disable pin output driver (See TRIS register) * Configure pin as analog Configure the ADC module: * Select ADC conversion clock * Configure voltage reference * Select ADC input channel * Select result format * Turn on ADC module Configure ADC interrupt (optional): * Clear ADC interrupt flag * Enable ADC interrupt * Enable peripheral interrupt * Enable global interrupt(1) Wait the required acquisition time(2). Start conversion by setting the GO/DONE bit. Wait for ADC conversion to complete by one of the following: * Polling the GO/DONE bit * Waiting for the ADC interrupt (interrupts enabled) Read ADC Result Clear the ADC interrupt flag (required if interrupt is enabled). EXAMPLE 10-1: A/D CONVERSION ;This code block configures the ADC ;for polling, Vdd reference, Frc clock ;and GP0 input. ; ;Conversion start & polling for completion ; are included. ; BANKSEL TRISIO ; BSF TRISIO,0 ;Set GP0 to input BANKSEL ANSEL ; MOVLW B'01110001' ;ADC Frc clock, IORWF ANSEL ; and GP0 as analog BANKSEL ADCON0 ; MOVLW B'10000001' ;Right justify, MOVWF ADCON0 ;Vdd Vref, AN0, On CALL SampleTime ;Acquisiton delay BSF ADCON0,GO ;Start conversion BTFSC ADCON0,GO ;Is conversion done? GOTO $-1 ;No, test again BANKSEL ADRESH ; MOVF ADRESH,W ;Read upper 2 bits MOVWF RESULTHI ;Store in GPR space BANKSEL ADRESL ; MOVF ADRESL,W ;Read lower 8 bits MOVWF RESULTLO ;Store in GPR space Note 1: The global interrupt can be disabled if the user is attempting to wake-up from Sleep and resume in-line code execution. 2: See Section 10.3 "A/D Acquisition Requirements". 2010 Microchip Technology Inc. DS41302D-page 83 PIC12F609/615/617/12HV609/615 10.2.7 ADC REGISTER DEFINITIONS The following registers are used to control the operation of the ADC. REGISTER 10-1: ADCON0: A/D CONTROL REGISTER 0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ADFM VCFG -- CHS2 CHS1 CHS0 GO/DONE ADON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 7 ADFM: A/D Conversion Result Format Select bit 1 = Right justified 0 = Left justified bit 6 VCFG: Voltage Reference bit 1 = VREF pin 0 = VDD bit 5 Unimplemented: Read as `0' bit 4-2 CHS<2:0>: Analog Channel Select bits 000 = Channel 00 (AN0) 001 = Channel 01 (AN1) 010 = Channel 02 (AN2) 011 = Channel 03 (AN3) 100 = CVREF 101 = 0.6V Reference 110 = 1.2V Reference 111 = Reserved. Do not use. bit 1 GO/DONE: A/D Conversion Status bit 1 = A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle. This bit is automatically cleared by hardware when the A/D conversion has completed. 0 = A/D conversion completed/not in progress bit 0 ADON: ADC Enable bit 1 = ADC is enabled 0 = ADC is disabled and consumes no operating current Note 1: When the CHS<2:0> bits change to select the 1.2V or 0.6V reference, the reference output voltage will have a transient. If the Comparator module uses this 0.6V reference voltage, the comparator output may momentarily change state due to the transient. DS41302D-page 84 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 REGISTER 10-2: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 0 (READ-ONLY) R-x R-x R-x R-x R-x R-x R-x R-x ADRES9 ADRES8 ADRES7 ADRES6 ADRES5 ADRES4 ADRES3 ADRES2 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-0 x = Bit is unknown ADRES<9:2>: ADC Result Register bits Upper 8 bits of 10-bit conversion result REGISTER 10-3: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 0 (READ-ONLY) R-x R-x U-0 U-0 U-0 U-0 U-0 U-0 ADRES1 ADRES0 -- -- -- -- -- -- bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-6 ADRES<1:0>: ADC Result Register bits Lower 2 bits of 10-bit conversion result bit 5-0 Unimplemented: Read as `0' REGISTER 10-4: x = Bit is unknown ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 1 (READ-ONLY) U-0 U-0 U-0 U-0 U-0 U-0 R-x R-x -- -- -- -- -- -- ADRES9 ADRES8 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-2 Unimplemented: Read as `0' bit 1-0 ADRES<9:8>: ADC Result Register bits Upper 2 bits of 10-bit conversion result REGISTER 10-5: x = Bit is unknown ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 1 (READ-ONLY) R-x R-x R-x R-x R-x R-x R-x R-x ADRES7 ADRES6 ADRES5 ADRES4 ADRES3 ADRES2 ADRES1 ADRES0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 7-0 x = Bit is unknown ADRES<7:0>: ADC Result Register bits Lower 8 bits of 10-bit conversion result 2010 Microchip Technology Inc. DS41302D-page 85 PIC12F609/615/617/12HV609/615 10.3 A/D Acquisition Requirements For the ADC to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the input channel voltage level. The Analog Input model is shown in Figure 10-4. The source impedance (RS) and the internal sampling switch (RSS) impedance directly affect the time required to charge the capacitor CHOLD. The sampling switch (RSS) impedance varies over the device voltage (VDD), see Figure 10-4. The maximum recommended impedance for analog sources is 10 k. As the source impedance is decreased, the acquisition time may be decreased. After the analog input channel is selected (or changed), EQUATION 10-1: an A/D acquisition must be done before the conversion can be started. To calculate the minimum acquisition time, Equation 10-1 may be used. This equation assumes that 1/2 LSb error is used (1024 steps for the ADC). The 1/2 LSb error is the maximum error allowed for the ADC to meet its specified resolution. ACQUISITION TIME EXAMPLE Temperature = 50C and external impedance of 10k 5.0V V DD Assumptions: T ACQ = Amplifier Settling Time + Hold Capacitor Charging Time + Temperature Coefficient = T AMP + T C + T COFF = 2s + T C + Temperature - 25C 0.05s/C The value for TC can be approximated with the following equations: 1 V AP PLIE D 1 - ------------ = V CHOLD 2047 ;[1] VCHOLD charged to within 1/2 lsb -TC ---------- RC V AP P LI ED 1 - e = V CHOLD ;[2] VCHOLD charge response to VAPPLIED - Tc --------- 1 RC V AP P LIED 1 - e = V A P PLIE D 1 - ------------ 2047 ;combining [1] and [2] Solving for TC: T C = - C HOLD R IC + R SS + R S ln(1/2047) = - 10pF 1k + 7k + 10k ln(0.0004885) = 1.37 s Therefore: T ACQ = 2s + 1.37s + 50C- 25C 0.05s/C = 4.67s Note 1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out. 2: The charge holding capacitor (CHOLD) is not discharged after each conversion. 3: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin leakage specification. DS41302D-page 86 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 FIGURE 10-4: ANALOG INPUT MODEL VDD ANx Rs CPIN 5 pF VA VT = 0.6V VT = 0.6V RIC 1k Sampling Switch SS Rss I LEAKAGE 500 nA CHOLD = 10 pF VSS/VREF- Legend: CPIN = Input Capacitance = Threshold Voltage VT I LEAKAGE = Leakage current at the pin due to various junctions RIC = Interconnect Resistance SS = Sampling Switch CHOLD = Sample/Hold Capacitance FIGURE 10-5: 6V 5V VDD 4V 3V 2V RSS 5 6 7 8 9 10 11 Sampling Switch (k) ADC TRANSFER FUNCTION Full-Scale Range 3FFh 3FEh ADC Output Code 3FDh 3FCh 1 LSB ideal 3FBh Full-Scale Transition 004h 003h 002h 001h 000h Analog Input Voltage 1 LSB ideal VSS/VREF- 2010 Microchip Technology Inc. Zero-Scale Transition VDD/VREF+ DS41302D-page 87 PIC12F609/615/617/12HV609/615 TABLE 10-2: SUMMARY OF ASSOCIATED ADC REGISTERS Name Bit 7 ADCON0(1) ADFM VCFG -- ADCS2(1) ANSEL (1,2) ADRESH Bit 6 Bit 5 Bit 4 Bit 3 -- CHS2 ADCS1(1) ADCS0(1) Value on POR, BOR Value on all other Resets Bit 2 Bit 1 Bit 0 CHS1 CHS0 GO/DONE ADON 00-0 0000 00-0 0000 ANS3 ANS2(1) ANS1 ANS0 -000 1111 -000 1111 A/D Result Register High Byte xxxx xxxx uuuu uuuu ADRESL(1,2) A/D Result Register Low Byte xxxx xxxx uuuu uuuu -- -- GP5 GP4 GP3 GP2 GP1 GP0 --x0 x000 --x0 x000 GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000 -- ADIE(1) CCP1IE(1) -- CMIE -- TMR2IE(1) TMR1IE -00- 0-00 -00- 0-00 PIR1 -- ADIF(1) CCP1IF(1) -- CMIF -- TMR2IF(1) TMR1IF -00- 0-00 -00- 0-00 TRISIO -- -- TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 GPIO INTCON PIE1 Legend: Note 1: 2: TRISIO0 --11 1111 --11 1111 x = unknown, u = unchanged, -- = unimplemented read as `0'. Shaded cells are not used for ADC module. For PIC12F615/617/HV615 only. Read Only Register. DS41302D-page 88 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 11.0 ENHANCED CAPTURE/ COMPARE/PWM (WITH AUTOSHUTDOWN AND DEAD BAND) MODULE (PIC12F615/617/ HV615 ONLY) The Enhanced Capture/Compare/PWM module is a peripheral which allows the user to time and control different events. In Capture mode, the peripheral allows the timing of the duration of an event.The Compare mode allows the user to trigger an external REGISTER 11-1: event when a predetermined amount of time has expired. The PWM mode can generate a Pulse-Width Modulated signal of varying frequency and duty cycle. Table 11-1 shows the timer resources required by the ECCP module. TABLE 11-1: ECCP MODE - TIMER RESOURCES REQUIRED ECCP Mode Timer Resource Capture Timer1 Compare Timer1 PWM Timer2 CCP1CON: ENHANCED CCP1 CONTROL REGISTER R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 P1M -- DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 7 P1M: PWM Output Configuration bits If CCP1M<3:2> = 00, 01, 10: x = P1A assigned as Capture/Compare input; P1B assigned as port pins If CCP1M<3:2> = 11: 0 = Single output; P1A modulated; P1B assigned as port pins 1 = Half-Bridge output; P1A, P1B modulated with dead-band control bit 6 Unimplemented: Read as `0' bit 5-4 DC1B<1:0>: PWM Duty Cycle Least Significant bits Capture mode: Unused. Compare mode: Unused. PWM mode: These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPR1L. bit 3-0 CCP1M<3:0>: ECCP Mode Select bits 0000 =Capture/Compare/PWM off (resets ECCP module) 0001 =Unused (reserved) 0010 =Compare mode, toggle output on match (CCP1IF bit is set) 0011 =Unused (reserved) 0100 =Capture mode, every falling edge 0101 =Capture mode, every rising edge 0110 =Capture mode, every 4th rising edge 0111 =Capture mode, every 16th rising edge 1000 =Compare mode, set output on match (CCP1IF bit is set) 1001 =Compare mode, clear output on match (CCP1IF bit is set) 1010 =Compare mode, generate software interrupt on match (CCP1IF bit is set, CCP1 pin is unaffected) 1011 =Compare mode, trigger special event (CCP1IF bit is set; CCP1 resets TMR1 or TMR2 and starts an A/D conversion, if the ADC module is enabled) 1100 =PWM mode; P1A active-high; P1B active-high 1101 =PWM mode; P1A active-high; P1B active-low 1110 =PWM mode; P1A active-low; P1B active-high 1111 =PWM mode; P1A active-low; P1B active-low 2010 Microchip Technology Inc. DS41302D-page 89 PIC12F609/615/617/12HV609/615 11.1 11.1.2 Capture Mode In Capture mode, CCPR1H:CCPR1L captures the 16-bit value of the TMR1 register when an event occurs on pin CCP1. An event is defined as one of the following and is configured by the CCP1M<3:0> bits of the CCP1CON register: * * * * Every falling edge Every rising edge Every 4th rising edge Every 16th rising edge When a capture is made, the Interrupt Request Flag bit CCP1IF of the PIR1 register is set. The interrupt flag must be cleared in software. If another capture occurs before the value in the CCPR1H, CCPR1L register pair is read, the old captured value is overwritten by the new captured value (see Figure 11-1). 11.1.1 CCP1 PIN CONFIGURATION In Capture mode, the CCP1 pin should be configured as an input by setting the associated TRIS control bit. Note: If the CCP1 pin is configured as an output, a write to the port can cause a capture condition. FIGURE 11-1: Prescaler 1, 4, 16 CAPTURE MODE OPERATION BLOCK DIAGRAM CCPR1H and Edge Detect 11.1.3 SOFTWARE INTERRUPT When the Capture mode is changed, a false capture interrupt may be generated. The user should keep the CCP1IE interrupt enable bit of the PIE1 register clear to avoid false interrupts. Additionally, the user should clear the CCP1IF interrupt flag bit of the PIR1 register following any change in operating mode. 11.1.4 CCP PRESCALER There are four prescaler settings specified by the CCP1M<3:0> bits of the CCP1CON register. Whenever the CCP module is turned off, or the CCP module is not in Capture mode, the prescaler counter is cleared. Any Reset will clear the prescaler counter. Switching from one capture prescaler to another does not clear the prescaler and may generate a false interrupt. To avoid this unexpected operation, turn the module off by clearing the CCP1CON register before changing the prescaler (see Example 11-1). EXAMPLE 11-1: CLRF MOVLW CCPR1L Capture Enable TMR1H Timer1 must be running in Timer mode or Synchronized Counter mode for the CCP module to use the capture feature. In Asynchronous Counter mode, the capture operation may not work. CHANGING BETWEEN CAPTURE PRESCALERS BANKSEL CCP1CON Set Flag bit CCP1IF (PIR1 register) CCP1 pin TIMER1 MODE SELECTION MOVWF ;Set Bank bits to point ;to CCP1CON CCP1CON ;Turn CCP module off NEW_CAPT_PS ;Load the W reg with ; the new prescaler ; move value and CCP ON CCP1CON ;Load CCP1CON with this ; value TMR1L CCP1CON<3:0> System Clock (FOSC) DS41302D-page 90 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 TABLE 11-2: Name CCP1CON SUMMARY OF REGISTERS ASSOCIATED WITH CAPTURE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 P1M -- DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 Bit 0 Value on POR, BOR Value on all other Resets CCP1M0 0-00 0000 0-00 0000 CCPR1L Capture/Compare/PWM Register 1 Low Byte xxxx xxxx uuuu uuuu CCPR1H Capture/Compare/PWM Register 1 High Byte xxxx xxxx uuuu uuuu GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000 PIE1 -- ADIE(1) CCP1IE(1) -- CMIE -- TMR2IE(1) TMR1IE -00- 0-00 -00- 0-00 PIR1 -- ADIF(1) CCP1IF(1) -- CMIF -- TMR2IF(1) TMR1IF -00- 0-00 -00- 0-00 INTCON T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 uuuu uuuu TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu TRISIO -- -- TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111 Legend: - = Unimplemented locations, read as `0', u = unchanged, x = unknown. Shaded cells are not used by the Capture. Note 1: For PIC12F615/617/HV615 only. 2010 Microchip Technology Inc. DS41302D-page 91 PIC12F609/615/617/12HV609/615 11.2 11.2.2 Compare Mode In Compare mode, the 16-bit CCPR1 register value is constantly compared against the TMR1 register pair value. When a match occurs, the CCP1 module may: * * * * * Toggle the CCP1 output. Set the CCP1 output. Clear the CCP1 output. Generate a Special Event Trigger. Generate a Software Interrupt. All Compare modes can generate an interrupt. FIGURE 11-2: COMPARE MODE OPERATION BLOCK DIAGRAM CCP1CON<3:0> Mode Select Q S R Output Logic Match TRIS Output Enable Comparator TMR1H TMR1L Special Event Trigger Special Event Trigger will: * Clear TMR1H and TMR1L registers. * NOT set interrupt flag bit TMR1IF of the PIR1 register. * Set the GO/DONE bit to start the ADC conversion. 11.2.1 CCP1 PIN CONFIGURATION The user must configure the CCP1 pin as an output by clearing the associated TRIS bit. Note: SOFTWARE INTERRUPT MODE When Generate Software Interrupt mode is chosen (CCP1M<3:0> = 1010), the CCP1 module does not assert control of the CCP1 pin (see the CCP1CON register). 11.2.4 SPECIAL EVENT TRIGGER When Special Event Trigger mode is chosen (CCP1M<3:0> = 1011), the CCP1 module does the following: * Resets Timer1 * Starts an ADC conversion if ADC is enabled The CCP1 module does not assert control of the CCP1 pin in this mode (see the CCP1CON register). Set CCP1IF Interrupt Flag (PIR1) 4 CCPR1H CCPR1L CCP1 Pin In Compare mode, Timer1 must be running in either Timer mode or Synchronized Counter mode. The compare operation may not work in Asynchronous Counter mode. 11.2.3 The action on the pin is based on the value of the CCP1M<3:0> control bits of the CCP1CON register. TIMER1 MODE SELECTION The Special Event Trigger output of the CCP occurs immediately upon a match between the TMR1H, TMR1L register pair and the CCPR1H, CCPR1L register pair. The TMR1H, TMR1L register pair is not reset until the next rising edge of the Timer1 clock. This allows the CCPR1H, CCPR1L register pair to effectively provide a 16-bit programmable period register for Timer1. Note 1: The Special Event Trigger from the CCP module does not set interrupt flag bit TMRxIF of the PIR1 register. 2: Removing the match condition by changing the contents of the CCPR1H and CCPR1L register pair, between the clock edge that generates the Special Event Trigger and the clock edge that generates the Timer1 Reset, will preclude the Reset from occurring. Clearing the CCP1CON register will force the CCP1 compare output latch to the default low level. This is not the PORT I/O data latch. DS41302D-page 92 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 TABLE 11-3: Name CCP1CON SUMMARY OF REGISTERS ASSOCIATED WITH COMPARE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 P1M -- DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 Bit 0 Value on POR, BOR Value on all other Resets CCP1M0 0-00 0000 0-00 0000 CCPR1L Capture/Compare/PWM Register 1 Low Byte xxxx xxxx uuuu uuuu CCPR1H Capture/Compare/PWM Register 1 High Byte xxxx xxxx uuuu uuuu GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000 PIE1 -- ADIE(1) CCP1IE(1) -- CMIE -- TMR2IE(1) TMR1IE -00- 0-00 -00- 0-00 PIR1 -- ADIF(1) CCP1IF(1) -- CMIF -- TMR2IF(1) TMR1IF -00- 0-00 -00- 0-00 TMR1CS TMR1ON 0000 0000 uuuu uuuu INTCON T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu TMR2 Timer2 Module Register TRISIO -- -- TRISIO5 0000 0000 0000 0000 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111 Legend: - = Unimplemented locations, read as `0', u = unchanged, x = unknown. Shaded cells are not used by the Compare. Note 1: For PIC12F615/617/HV615 only. 2010 Microchip Technology Inc. DS41302D-page 93 PIC12F609/615/617/12HV609/615 11.3 PWM Mode The PWM mode generates a Pulse-Width Modulated signal on the CCP1 pin. The duty cycle, period and resolution are determined by the following registers: * * * * PR2 T2CON CCPR1L CCP1CON FIGURE 11-4: CCP PWM OUTPUT Period Pulse Width In Pulse-Width Modulation (PWM) mode, the CCP module produces up to a 10-bit resolution PWM output on the CCP1 pin. Since the CCP1 pin is multiplexed with the PORT data latch, the TRIS for that pin must be cleared to enable the CCP1 pin output driver. Note: The PWM output (Figure 11-4) has a time base (period) and a time that the output stays high (duty cycle). TMR2 = PR2 TMR2 = CCPRxL:CCPxCON<5:4> TMR2 = 0 Clearing the CCP1CON register will relinquish CCP1 control of the CCP1 pin. Figure 11-3 shows a simplified block diagram of PWM operation. Figure 11-4 shows a typical waveform of the PWM signal. For a step-by-step procedure on how to set up the CCP module for PWM operation, see Section 11.3.7 "Setup for PWM Operation". FIGURE 11-3: SIMPLIFIED PWM BLOCK DIAGRAM CCP1CON<5:4> Duty Cycle Registers CCPR1L CCPR1H(2) (Slave) CCP1 R Comparator TMR2 (1) Q S TRIS Comparator PR2 Note 1: 2: Clear Timer2, toggle CCP1 pin and latch duty cycle The 8-bit timer TMR2 register is concatenated with the 2-bit internal system clock (FOSC), or 2 bits of the prescaler, to create the 10-bit time base. In PWM mode, CCPR1H is a read-only register. DS41302D-page 94 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 11.3.1 PWM PERIOD EQUATION 11-2: The PWM period is specified by the PR2 register of Timer2. The PWM period can be calculated using the formula of Equation 11-1. EQUATION 11-1: T OSC (TMR2 Prescale Value) EQUATION 11-3: (TMR2 Prescale Value) DUTY CYCLE RATIO CCPR1L:CCP1CON<5:4> Duty Cycle Ratio = ----------------------------------------------------------------------4 PR2 + 1 When TMR2 is equal to PR2, the following three events occur on the next increment cycle: * TMR2 is cleared * The CCP1 pin is set. (Exception: If the PWM duty cycle = 0%, the pin will not be set.) * The PWM duty cycle is latched from CCPR1L into CCPR1H. 11.3.2 Pulse Width = CCPR1L:CCP1CON<5:4> PWM PERIOD PWM Period = PR2 + 1 4 T OSC Note: PULSE WIDTH The CCPR1H register and a 2-bit internal latch are used to double buffer the PWM duty cycle. This double buffering is essential for glitchless PWM operation. The 8-bit timer TMR2 register is concatenated with either the 2-bit internal system clock (FOSC), or 2 bits of the prescaler, to create the 10-bit time base. The system clock is used if the Timer2 prescaler is set to 1:1. The Timer2 postscaler (see Section 8.1 "Timer2 Operation") is not used in the determination of the PWM frequency. When the 10-bit time base matches the CCPR1H and 2-bit latch, then the CCP1 pin is cleared (see Figure 113). PWM DUTY CYCLE 11.3.3 The PWM duty cycle is specified by writing a 10-bit value to multiple registers: CCPR1L register and DC1B<1:0> bits of the CCP1CON register. The CCPR1L contains the eight MSbs and the DC1B<1:0> bits of the CCP1CON register contain the two LSbs. CCPR1L and DC1B<1:0> bits of the CCP1CON register can be written to at any time. The duty cycle value is not latched into CCPR1H until after the period completes (i.e., a match between PR2 and TMR2 registers occurs). While using the PWM, the CCPR1H register is read-only. The resolution determines the number of available duty cycles for a given period. For example, a 10-bit resolution will result in 1024 discrete duty cycles, whereas an 8-bit resolution will result in 256 discrete duty cycles. The maximum PWM resolution is 10 bits when PR2 is 255. The resolution is a function of the PR2 register value as shown by Equation 11-4. EQUATION 11-4: TABLE 11-4: Note: If the pulse width value is greater than the period the assigned PWM pin(s) will remain unchanged. EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 20 MHz) PWM Frequency Timer Prescale (1, 4, 16) PR2 Value Maximum Resolution (bits) TABLE 11-5: PWM RESOLUTION log 4 PR2 + 1 Resolution = ------------------------------------------ bits log 2 Equation 11-2 is used to calculate the PWM pulse width. Equation 11-3 is used to calculate the PWM duty cycle ratio. PWM RESOLUTION 1.22 kHz 4.88 kHz 19.53 kHz 78.12 kHz 156.3 kHz 208.3 kHz 16 4 1 1 1 1 0xFF 0xFF 0xFF 0x3F 0x1F 0x17 10 10 10 8 7 6.6 EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 8 MHz) PWM Frequency Timer Prescale (1, 4, 16) PR2 Value Maximum Resolution (bits) 2010 Microchip Technology Inc. 1.22 kHz 4.90 kHz 19.61 kHz 76.92 kHz 153.85 kHz 200.0 kHz 16 4 1 1 1 1 0x65 0x65 0x65 0x19 0x0C 0x09 8 8 8 6 5 5 DS41302D-page 95 PIC12F609/615/617/12HV609/615 11.3.4 OPERATION IN SLEEP MODE In Sleep mode, the TMR2 register will not increment and the state of the module will not change. If the CCP1 pin is driving a value, it will continue to drive that value. When the device wakes up, TMR2 will continue from its previous state. 11.3.5 CHANGES IN SYSTEM CLOCK FREQUENCY The PWM frequency is derived from the system clock frequency. Any changes in the system clock frequency will result in changes to the PWM frequency. See Section 4.0 "Oscillator Module" for additional details. 11.3.6 11.3.7 The following steps should be taken when configuring the CCP module for PWM operation: 1. 2. 3. 4. 5. * EFFECTS OF RESET * Any Reset will force all ports to Input mode and the CCP registers to their Reset states. * 6. * * DS41302D-page 96 SETUP FOR PWM OPERATION Disable the PWM pin (CCP1) output drivers by setting the associated TRIS bit. Set the PWM period by loading the PR2 register. Configure the CCP module for the PWM mode by loading the CCP1CON register with the appropriate values. Set the PWM duty cycle by loading the CCPR1L register and DC1B bits of the CCP1CON register. Configure and start Timer2: Clear the TMR2IF interrupt flag bit of the PIR1 register. Set the Timer2 prescale value by loading the T2CKPS bits of the T2CON register. Enable Timer2 by setting the TMR2ON bit of the T2CON register. Enable PWM output after a new PWM cycle has started: Wait until Timer2 overflows (TMR2IF bit of the PIR1 register is set). Enable the CCP1 pin output driver by clearing the associated TRIS bit. 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 11.4 PWM (Enhanced Mode) The PWM outputs are multiplexed with I/O pins and are designated P1A and P1B. The polarity of the PWM pins is configurable and is selected by setting the CCP1M bits in the CCP1CON register appropriately. The Enhanced PWM Mode can generate a PWM signal on up to four different output pins with up to 10-bits of resolution. It can do this through four different PWM output modes: Table 11-6 shows the pin assignments for each Enhanced PWM mode. * Single PWM * Half-Bridge PWM Figure 11-5 shows an example of a simplified block diagram of the Enhanced PWM module. To select an Enhanced PWM mode, the P1M bits of the CCP1CON register must be set appropriately. FIGURE 11-5: Note: To prevent the generation of an incomplete waveform when the PWM is first enabled, the ECCP module waits until the start of a new PWM period before generating a PWM signal. EXAMPLE SIMPLIFIED BLOCK DIAGRAM OF THE ENHANCED PWM MODE CCP1<1:0> CCP1M<3:0> 4 P1M<1:0> Duty Cycle Registers 2 CCPR1L (APFCON<0>) P1ASEL CCP1/P1A 0 CCPR1H (Slave) CCP1/P1A TRISIO2 1 R Comparator TMR2 Q (1) (APFCON<1>) P1BSEL S P1B 0 Comparator PR2 CCP1/P1A* TRISIO5 Output Controller Clear Timer2, toggle PWM pin and latch duty cycle TRISIO0 P1B 1 P1B* TRISIO4 PWM1CON Note * 1: Alternate pin function. The 8-bit timer TMR2 register is concatenated with the 2-bit internal Q clock, or 2 bits of the prescaler to create the 10-bit time base. Note 1: The TRIS register value for each PWM output must be configured appropriately. 2: Clearing the CCP1CON register will relinquish ECCP control of all PWM output pins. 3: Any pin not used by an Enhanced PWM mode is available for alternate pin functions. TABLE 11-6: EXAMPLE PIN ASSIGNMENTS FOR VARIOUS PWM ENHANCED MODES ECCP Mode P1M<1:0> CCP1/P1A P1B Single 00 Yes(1) Yes(1) Half-Bridge 10 Yes Yes 2010 Microchip Technology Inc. DS41302D-page 97 PIC12F609/615/617/12HV609/615 FIGURE 11-6: EXAMPLE PWM (ENHANCED MODE) OUTPUT RELATIONSHIPS (ACTIVE-HIGH STATE) Signal P1M<1:0> PR2+1 Pulse Width 0 Period 00 (Single Output) P1A Modulated Delay(1) Delay(1) P1A Modulated 10 (Half-Bridge) P1B Modulated P1A Active Relationships: P1B Inactive * Period = 4 * TOSC * (PR2 + 1) * (TMR2 Prescale Value) * Pulse Width = TOSC * (CCPR1L<7:0>:CCP1CON<5:4>) * (TMR2 Prescale Value) P1C Inactive * Delay = 4 * TOSC * (PWM1CON<6:0>) Note 1: Dead-band delay is programmed using the PWM1CON register (Section 11.4.6 "Programmable Dead-Band Delay mode"). P1D Modulated FIGURE 11-7: EXAMPLE ENHANCED PWM OUTPUT RELATIONSHIPS (ACTIVE-LOW STATE) Signal P1M<1:0> PR2+1 Pulse Width 0 Period 00 (Single Output) P1A Modulated P1A Modulated Delay(1) 10 (Half-Bridge) Delay(1) P1B Modulated P1A Active Relationships: P1B Inactive * Period = 4 * TOSC * (PR2 + 1) * (TMR2 Prescale Value) * Pulse Width = TOSC * (CCPR1L<7:0>:CCP1CON<5:4>) * (TMR2 Prescale Value) P1C Inactive * Delay = 4 * TOSC * (PWM1CON<6:0>) Note 1: DS41302D-page 98 Dead-band delay is programmed using the PWM1CON register (Section 11.4.6 "Programmable Dead-Band Delay mode"). P1D Modulated 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 11.4.1 HALF-BRIDGE MODE In Half-Bridge mode, two pins are used as outputs to drive push-pull loads. The PWM output signal is output on the CCP1/P1A pin, while the complementary PWM output signal is output on the P1B pin (see Figure 11-8). This mode can be used for Half-Bridge applications, as shown in Figure 11-9, or for Full-Bridge applications, where four power switches are being modulated with two PWM signals. In Half-Bridge mode, the programmable dead-band delay can be used to prevent shoot-through current in HalfBridge power devices. The value of the PDC<6:0> bits of the PWM1CON register sets the number of instruction cycles before the output is driven active. If the value is greater than the duty cycle, the corresponding output remains inactive during the entire cycle. See Section 11.4.6 "Programmable Dead-Band Delay mode" for more details of the dead-band delay operations. Since the P1A and P1B outputs are multiplexed with the PORT data latches, the associated TRIS bits must be cleared to configure P1A and P1B as outputs. FIGURE 11-8: Period Period Pulse Width P1A(2) td td P1B(2) (1) (1) (1) td = Dead-Band Delay Note 1: 2: FIGURE 11-9: EXAMPLE OF HALFBRIDGE PWM OUTPUT At this time, the TMR2 register is equal to the PR2 register. Output signals are shown as active-high. EXAMPLE OF HALF-BRIDGE APPLICATIONS Standard Half-Bridge Circuit ("Push-Pull") FET Driver + P1A Load FET Driver + P1B - Half-Bridge Output Driving a Full-Bridge Circuit V+ FET Driver FET Driver P1A FET Driver Load FET Driver P1B 2010 Microchip Technology Inc. DS41302D-page 99 PIC12F609/615/617/12HV609/615 11.4.2 START-UP CONSIDERATIONS When any PWM mode is used, the application hardware must use the proper external pull-up and/or pull-down resistors on the PWM output pins. Note: When the microcontroller is released from Reset, all of the I/O pins are in the highimpedance state. The external circuits must keep the power switch devices in the OFF state until the microcontroller drives the I/O pins with the proper signal levels or activates the PWM output(s). The CCP1M<1:0> bits of the CCP1CON register allow the user to choose whether the PWM output signals are active-high or active-low for each PWM output pin (P1A and P1B). The PWM output polarities must be selected before the PWM pin output drivers are enabled. Changing the polarity configuration while the PWM pin output drivers are enable is not recommended since it may result in damage to the application circuits. The P1A and P1B output latches may not be in the proper states when the PWM module is initialized. Enabling the PWM pin output drivers at the same time as the Enhanced PWM modes may cause damage to the application circuit. The Enhanced PWM modes must be enabled in the proper Output mode and complete a full PWM cycle before configuring the PWM pin output drivers. The completion of a full PWM cycle is indicated by the TMR2IF bit of the PIR1 register being set as the second PWM period begins. 11.4.3 OPERATION DURING SLEEP When the device is placed in sleep, the allocated timer will not increment and the state of the module will not change. If the CCP1 pin is driving a value, it will continue to drive that value. When the device wakes up, it will continue from this state. DS41302D-page 100 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 11.4.4 ENHANCED PWM AUTOSHUTDOWN MODE A shutdown condition is indicated by the ECCPASE (Auto-Shutdown Event Status) bit of the ECCPAS register. If the bit is a `0', the PWM pins are operating normally. If the bit is a `1', the PWM outputs are in the shutdown state. Refer to Figure 1. The PWM mode supports an Auto-Shutdown mode that will disable the PWM outputs when an external shutdown event occurs. Auto-Shutdown mode places the PWM output pins into a predetermined state. This mode is used to help prevent the PWM from damaging the application. When a shutdown event occurs, two things happen: The ECCPASE bit is set to `1'. The ECCPASE will remain set until cleared in firmware or an auto-restart occurs (see Section 11.4.5 "Auto-Restart Mode"). The auto-shutdown sources are selected using the ECCPASx bits of the ECCPAS register. A shutdown event may be generated by: The enabled PWM pins are asynchronously placed in their shutdown states. The state of P1A is determined by the PSSAC bit. The state of P1B is determined by the PSSBD bit. The PSSAC and PSSBD bits are located in the ECCPAS register. Each pin may be placed into one of three states: * A logic `0' on the INT pin * Comparator * Setting the ECCPASE bit in firmware * Drive logic `1' * Drive logic `0' * Tri-state (high-impedance) FIGURE 11-10: AUTO-SHUTDOWN BLOCK DIAGRAM ECCPAS<2:0> 111 110 101 100 INT 011 010 From Comparator PSSAC<0> 001 000 P1A_DRV PRSEN 1 0 PSSAC<1> R From Data Bus Write to ECCPASE S P1A TRISx D Q ECCPASE PSSBD<0> P1B_DRV 1 0 PSSBD<1> TRISx 2010 Microchip Technology Inc. P1B DS41302D-page 101 PIC12F609/615/617/12HV609/615 REGISTER 11-2: ECCPAS: ENHANCED CAPTURE/COMPARE/PWM AUTO-SHUTDOWN CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 7 ECCPASE: ECCP Auto-Shutdown Event Status bit 1 = A shutdown event has occurred; ECCP outputs are in shutdown state 0 = ECCP outputs are operating bit 6-4 ECCPAS<2:0>: ECCP Auto-shutdown Source Select bits 000 =Auto-Shutdown is disabled 001 =Comparator output change 010 =Auto-Shutdown is disabled 011 =Comparator output change(1) 100 =VIL on INT pin 101 =VIL on INT pin or Comparator change 110 =VIL on INT pin(1) 111 =VIL on INT pin or Comparator change bit 3-2 PSSAC<1:0>: Pin P1A Shutdown State Control bits 00 = Drive pin P1A to `0' 01 = Drive pin P1A to `1' 1x = Pin P1A tri-state bit 1-0 PSSBD<1:0>: Pin P1B Shutdown State Control bits 00 = Drive pin P1B to `0' 01 = Drive pin P1B to `1' 1x = Pin P1B tri-state Note 1: If CMSYNC is enabled, the shutdown will be delayed by Timer1. Note 1: The auto-shutdown condition is a levelbased signal, not an edge-based signal. As long as the level is present, the autoshutdown will persist. 2: Writing to the ECCPASE bit is disabled while an auto-shutdown condition persists. 3: Once the auto-shutdown condition has been removed and the PWM restarted (either through firmware or auto-restart) the PWM signal will always restart at the beginning of the next PWM period. DS41302D-page 102 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 FIGURE 11-11: PWM AUTO-SHUTDOWN WITH FIRMWARE RESTART (PRSEN = 0) Shutdown Event ECCPASE bit PWM Activity PWM Period ECCPASE Cleared by Shutdown Shutdown Firmware PWM Event Occurs Event Clears Resumes Start of PWM Period 11.4.5 AUTO-RESTART MODE The Enhanced PWM can be configured to automatically restart the PWM signal once the auto-shutdown condition has been removed. Auto-restart is enabled by setting the PRSEN bit in the PWM1CON register. If auto-restart is enabled, the ECCPASE bit will remain set as long as the auto-shutdown condition is active. When the auto-shutdown condition is removed, the ECCPASE bit will be cleared via hardware and normal operation will resume. FIGURE 11-12: PWM AUTO-SHUTDOWN WITH AUTO-RESTART ENABLED (PRSEN = 1) Shutdown Event ECCPASE bit PWM Activity PWM Period Start of PWM Period 2010 Microchip Technology Inc. Shutdown Shutdown Event Occurs Event Clears PWM Resumes DS41302D-page 103 PIC12F609/615/617/12HV609/615 11.4.6 PROGRAMMABLE DEAD-BAND DELAY MODE FIGURE 11-13: In Half-Bridge applications where all power switches are modulated at the PWM frequency, the power switches normally require more time to turn off than to turn on. If both the upper and lower power switches are switched at the same time (one turned on, and the other turned off), both switches may be on for a short period of time until one switch completely turns off. During this brief interval, a very high current (shootthrough current) will flow through both power switches, shorting the bridge supply. To avoid this potentially destructive shoot-through current from flowing during switching, turning on either of the power switches is normally delayed to allow the other switch to completely turn off. Period Period Pulse Width P1A(2) td td P1B(2) (1) (1) (1) td = Dead-Band Delay Note 1: 2: In Half-Bridge mode, a digitally programmable deadband delay is available to avoid shoot-through current from destroying the bridge power switches. The delay occurs at the signal transition from the non-active state to the active state. See Figure 11-13 for illustration. The lower seven bits of the associated PWMxCON register (Register 11-3) sets the delay period in terms of microcontroller instruction cycles (TCY or 4 TOSC). FIGURE 11-14: EXAMPLE OF HALFBRIDGE PWM OUTPUT At this time, the TMR2 register is equal to the PR2 register. Output signals are shown as active-high. EXAMPLE OF HALF-BRIDGE APPLICATIONS V+ Standard Half-Bridge Circuit ("Push-Pull") FET Driver + V - P1A Load FET Driver + V - P1B V- DS41302D-page 104 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 REGISTER 11-3: PWM1CON: ENHANCED PWM CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 7 PRSEN: PWM Restart Enable bit 1 = Upon auto-shutdown, the ECCPASE bit clears automatically once the shutdown event goes away; the PWM restarts automatically 0 = Upon auto-shutdown, ECCPASE must be cleared in software to restart the PWM bit 6-0 PDC<6:0>: PWM Delay Count bits PDCn =Number of FOSC/4 (4 * TOSC) cycles between the scheduled time when a PWM signal should transition active and the actual time it transitions active TABLE 11-7: Name APFCON (1) CCP1CON SUMMARY OF REGISTERS ASSOCIATED WITH PWM Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 -- -- -- T1GSEL -- -- P1BSEL P1ASEL P1M -- DC1B1 DC1B0 CCPR1L(1) Capture/Compare/PWM Register 1 Low Byte CCPR1H(1) Capture/Compare/PWM Register 1 High Byte CMCON0 CMCON1 ECCPAS(1) CMON COUT CMOE CMPOL -- -- -- T1ACS Value on all other Resets ---0 --00 ---0 --00 CCP1M0 0-00 0000 0-00 0000 xxxx xxxx uuuu uuuu xxxx xxxx uuuu uuuu -- CMR -- CMHYS -- T1GSS PSSAC1 PSSAC0 PSSBD1 CMCH 0000 -0-0 0000 -0-0 CMSYNC ---0 0-10 ---0 0-10 PSSBD0 0000 0000 0000 0000 PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0 0000 0000 0000 0000 GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000 PIE1 -- ADIE(1) CCP1IE(1) -- CMIE -- TMR2IE(1) TMR1IE -00- 0-00 -00- 0-00 PIR1 -- ADIF(1) CCP1IF(1) -- CMIF -- TMR2IF(1) TMR1IF -00- 0-00 -00- 0-00 T2CON(1) -- PWM1CON INTCON TMR2(1) TRISIO ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 CCP1M3 CCP1M2 CCP1M1 Value on POR, BOR TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000 Timer2 Module Register -- -- 0000 0000 0000 0000 TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111 Legend: - = Unimplemented locations, read as `0', u = unchanged, x = unknown. Shaded cells are not used by the PWM. Note 1: For PIC12F615/617/HV615 only. 2010 Microchip Technology Inc. DS41302D-page 105 PIC12F609/615/617/12HV609/615 NOTES: DS41302D-page 106 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 12.0 SPECIAL FEATURES OF THE CPU The PIC12F609/615/617/12HV609/615 has a host of features intended to maximize system reliability, minimize cost through elimination of external components, provide power-saving features and offer code protection. These features are: * Reset - Power-on Reset (POR) - Power-up Timer (PWRT) - Oscillator Start-up Timer (OST) - Brown-out Reset (BOR) * Interrupts * Watchdog Timer (WDT) * Oscillator selection * Sleep * Code protection * ID Locations * In-Circuit Serial Programming 12.1 Configuration Bits The Configuration bits can be programmed (read as `0'), or left unprogrammed (read as `1') to select various device configurations as shown in Register 12-1. These bits are mapped in program memory location 2007h. Note: Address 2007h is beyond the user program memory space. It belongs to the special configuration memory space (2000h3FFFh), which can be accessed only during programming. See Memory Programming Specification (DS41204) for more information. The PIC12F609/615/617/12HV609/615 has two timers that offer necessary delays on power-up. One is the Oscillator Start-up Timer (OST), intended to keep the chip in Reset until the crystal oscillator is stable. The other is the Power-up Timer (PWRT), which provides a fixed delay of 64 ms (nominal) on power-up only, designed to keep the part in Reset while the power supply stabilizes. There is also circuitry to reset the device if a brown-out occurs, which can use the Powerup Timer to provide at least a 64 ms Reset. With these three functions-on-chip, most applications need no external Reset circuitry. The Sleep mode is designed to offer a very low-current Power-Down mode. The user can wake-up from Sleep through: * External Reset * Watchdog Timer Wake-up * An interrupt Several oscillator options are also made available to allow the part to fit the application. The INTOSC option saves system cost while the LP crystal option saves power. A set of Configuration bits are used to select various options (see Register 12-1). 2010 Microchip Technology Inc. DS41302D-page 107 PIC12F609/615/617/12HV609/615 REGISTER 12-1: U-1 -- U-1 -- U-1 -- CONFIG: CONFIGURATION WORD REGISTER (ADDRESS: 2007h) FOR PIC12F609/615/HV609/615 ONLY U-1 -- R/P-1 BOREN1 R/P-1 (1) BOREN0 R/P-1 (1) R/P-1 IOSCFS CP (2) R/P-1 MCLRE (3) R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 PWRTE WDTE FOSC2 FOSC1 FOSC0 bit 13 bit 0 Legend: R = Readable bit W = Writable bit P = Programmable U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 13-10 Unimplemented: Read as `1' bit 9-8 BOREN<1:0>: Brown-out Reset Selection bits(1) 11 = BOR enabled 10 = BOR enabled during operation and disabled in Sleep 0x = BOR disabled bit 7 IOSCFS: Internal Oscillator Frequency Select bit 1 = 8 MHz 0 = 4 MHz bit 6 CP: Code Protection bit(2) 1 = Program memory code protection is disabled 0 = Program memory code protection is enabled bit 5 MCLRE: MCLR Pin Function Select bit(3) 1 = MCLR pin function is MCLR 0 = MCLR pin function is digital input, MCLR internally tied to VDD bit 4 PWRTE: Power-up Timer Enable bit 1 = PWRT disabled 0 = PWRT enabled bit 3 WDTE: Watchdog Timer Enable bit 1 = WDT enabled 0 = WDT disabled bit 2-0 Note 1: 2: 3: FOSC<2:0>: Oscillator Selection bits 111 =RC oscillator: CLKOUT function on GP4/OSC2/CLKOUT pin, RC on GP5/OSC1/CLKIN 110 =RCIO oscillator: I/O function on GP4/OSC2/CLKOUT pin, RC on GP5/OSC1/CLKIN 101 =INTOSC oscillator: CLKOUT function on GP4/OSC2/CLKOUT pin, I/O function on GP5/OSC1/CLKIN 100 = INTOSCIO oscillator: I/O function on GP4/OSC2/CLKOUT pin, I/O function on GP5/OSC1/CLKIN 011 =EC: I/O function on GP4/OSC2/CLKOUT pin, CLKIN on GP5/OSC1/CLKIN 010 =HS oscillator: High-speed crystal/resonator on GP4/OSC2/CLKOUT and GP5/OSC1/CLKIN 001 = XT oscillator: Crystal/resonator on GP4/OSC2/CLKOUT and GP5/OSC1/CLKIN 000 = LP oscillator: Low-power crystal on GP4/OSC2/CLKOUT and GP5/OSC1/CLKIN Enabling Brown-out Reset does not automatically enable Power-up Timer. The entire program memory will be erased when the code protection is turned off. When MCLR is asserted in INTOSC or RC mode, the internal clock oscillator is disabled. DS41302D-page 108 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 REGISTER 12-2: U-1 U-1 -- -- R/P-1 CONFIG - CONFIGURATION WORD (ADDRESS: 2007h) FOR PIC12F617 ONLY R/P-1 R/P-1 R/P-1 R/P-1 WRT1 WRT0 BOREN1 BOREN0 IOSCFS R/P-1 R/P-1 R/P-1 CP MCLRE PWRTE R/P-1 R/P-1 R/P-1 R/P-1 WDTE FOSC2 F0SC1 F0SC0 bit 13 bit 0 bit 13-12 Unimplemented: Read as `1' bit 11-10 WRT<1:0>: Flash Program Memory Self Write Enable bits 11 = Write protection off 10 = 000h to 1FFh write protected, 200h to 7FFh may be modified by PMCON1 control 01 = 000h to 3FFh write protected, 400h to 7FFh may be modified by PMCON1 control 00 = 000h to 7FFh write protected, entire program memory is write protected. bit 9-8 BOREN<1:0>: Brown-out Reset Enable bits 11 = BOR enabled 10 = BOR disabled during Sleep and enabled during operation 0X = BOR disabled bit 7 IOSCFS: Internal Oscillator Frequency Select 1 = 8 MHz 0 = 4 MHz bit 6 CP: Code Protection 1 = Program memory is not code protected 0 = Program memory is external read and write protected bit 5 MCLRE: MCLR Pin Function Select 1 = MCLR pin is MCLR function and weak internal pull-up is enabled 0 = MCLR pin is alternate function, MCLR function is internally disabled bit 4 PWRTE: Power-up Timer Enable bit(1) 1 = PWRT disabled 0 = PWRT enabled bit 3 WDTE: Watchdog Timer Enable bit 1 = WDT enabled 0 = WDT disabled bit 2-0 FOSC<2:0>: Oscillator Selection bits 000 =LP oscillator: Low-power crystal on RA5/T1CKI/OSC1/CLKIN and RA4/AN3/T1G/OSC2/CLKOUT 001 =XT oscillator: Crystal/resonator on RA5/T1CKI/OSC1/CLKIN and RA4/AN3/T1G/OSC2/CLKOUT 010 =HS oscillator: High-speed crystal/resonator on RA5/T1CKI/OSC1/CLKIN and RA4/AN3/T1G/OSC2/CLKOUT 011 =EC: I/O function on RA4/AN3/T1G/OSC2/CLKOUT, CLKIN on RA5/T1CKI/OSC1/CLKIN 100 =INTOSCIO oscillator: I/O function on RA4/AN3/T1G/OSC2/CLKOUT, I/O function on RA5/T1CKI/OSC1/CLKIN 101 =INTOSC oscillator: CLKOUT function on RA4/AN3/T1G/OSC2/CLKOUT, I/O function on RA5/T1CKI/OSC1/ CLKIN 110 =EXTRCIO oscillator: I/O function on RA4/AN3/T1G/OSC2/CLKOUT, RC on RA5/T1CKI/OSC1/CLKIN 111 =EXTRC oscillator: CLKOUT function on RA4/AN3/T1G/OSC2/CLKOUT, RC on RA5/T1CKI/OSC1/CLKIN Note 1:Enabling Brown-out Reset does not automatically enable the Power-up Timer (PWRT). Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `1' P = Programmable -n = Value at POR 1 = bit is set 0 = bit is cleared x = bit is unknown 2010 Microchip Technology Inc. DS41302D-page 109 PIC12F609/615/617/12HV609/615 12.2 Calibration Bits The 8 MHz internal oscillator is factory calibrated. These calibration values are stored in fuses located in the Calibration Word (2008h). The Calibration Word is not erased when using the specified bulk erase sequence in the Memory Programming Specification (DS41204) and thus, does not require reprogramming. 12.3 Reset The PIC12F609/615/617/12HV609/615 device differentiates between various kinds of Reset: a) b) c) d) e) f) Power-on Reset (POR) WDT Reset during normal operation WDT Reset during Sleep MCLR Reset during normal operation MCLR Reset during Sleep Brown-out Reset (BOR) Some registers are not affected in any Reset condition; their status is unknown on POR and unchanged in any other Reset. Most other registers are reset to a "Reset state" on: * * * * * Power-on Reset MCLR Reset MCLR Reset during Sleep WDT Reset Brown-out Reset (BOR) WDT wake-up does not cause register resets in the same manner as a WDT Reset since wake-up is viewed as the resumption of normal operation. TO and PD bits are set or cleared differently in different Reset situations, as indicated in Table 12-2. Software can use these bits to determine the nature of the Reset. See Table 12-5 for a full description of Reset states of all registers. A simplified block diagram of the On-Chip Reset Circuit is shown in Figure 12-1. The MCLR Reset path has a noise filter to detect and ignore small pulses. See Section 16.0 "Electrical Specifications" for pulse-width specifications. FIGURE 12-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT External Reset MCLR/VPP pin Sleep WDT Module WDT Time-out Reset VDD Rise Detect Power-on Reset VDD Brown-out(1) Reset BOREN S OST/PWRT OST Chip_Reset 10-bit Ripple Counter R Q OSC1/ CLKIN pin PWRT On-Chip RC OSC 11-bit Ripple Counter Enable PWRT Enable OST Note 1: Refer to the Configuration Word register (Register 12-1). DS41302D-page 110 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 12.3.1 POWER-ON RESET (POR) The on-chip POR circuit holds the chip in Reset until VDD has reached a high enough level for proper operation. To take advantage of the POR, simply connect the MCLR pin through a resistor to VDD. This will eliminate external RC components usually needed to create Power-on Reset. A maximum rise time for VDD is required. See Section 16.0 "Electrical Specifications" for details. If the BOR is enabled, the maximum rise time specification does not apply. The BOR circuitry will keep the device in Reset until VDD reaches VBOR (see Section 12.3.4 "Brown-out Reset (BOR)"). Note: FIGURE 12-2: VDD PIC(R) MCU R1 1 kor greater) R2 MCLR SW1 (optional) 100 needed with capacitor) C1 0.1 F (optional, not critical) The POR circuit does not produce an internal Reset when VDD declines. To reenable the POR, VDD must reach Vss for a minimum of 100 s. When the device starts normal operation (exits the Reset condition), device operating parameters (i.e., voltage, frequency, temperature, etc.) must be met to ensure proper operation. If these conditions are not met, the device must be held in Reset until the operating conditions are met. RECOMMENDED MCLR CIRCUIT 12.3.3 POWER-UP TIMER (PWRT) PIC12F609/615/617/12HV609/615 has a noise filter in the MCLR Reset path. The filter will detect and ignore small pulses. The Power-up Timer provides a fixed 64 ms (nominal) time-out on power-up only, from POR or Brown-out Reset. The Power-up Timer operates from an internal RC oscillator. For more information, see Section 4.4 "Internal Clock Modes". The chip is kept in Reset as long as PWRT is active. The PWRT delay allows the VDD to rise to an acceptable level. A Configuration bit, PWRTE, can disable (if set) or enable (if cleared or programmed) the Power-up Timer. The Power-up Timer should be enabled when Brown-out Reset is enabled, although it is not required. It should be noted that a WDT Reset does not drive MCLR pin low. The Power-up Timer delay will vary from chip-to-chip due to: Voltages applied to the MCLR pin that exceed its specification can result in both MCLR Resets and excessive current beyond the device specification during the ESD event. For this reason, Microchip recommends that the MCLR pin no longer be tied directly to VDD. The use of an RC network, as shown in Figure 12-2, is suggested. * VDD variation * Temperature variation * Process variation For additional information, refer to Application Note AN607, "Power-up Trouble Shooting" (DS00607). 12.3.2 MCLR An internal MCLR option is enabled by clearing the MCLRE bit in the Configuration Word register. When MCLRE = 0, the Reset signal to the chip is generated internally. When the MCLRE = 1, the GP3/MCLR pin becomes an external Reset input. In this mode, the GP3/MCLR pin has a weak pull-up to VDD. 2010 Microchip Technology Inc. See DC parameters for details "Electrical Specifications"). Note: (Section 16.0 Voltage spikes below VSS at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up. Thus, a series resistor of 50-100 should be used when applying a "low" level to the MCLR pin, rather than pulling this pin directly to VSS. DS41302D-page 111 PIC12F609/615/617/12HV609/615 12.3.4 BROWN-OUT RESET (BOR) On any Reset (Power-on, Brown-out Reset, Watchdog timer, etc.), the chip will remain in Reset until VDD rises above VBOR (see Figure 12-3). If enabled, the Powerup Timer will be invoked by the Reset and keep the chip in Reset an additional 64 ms. The BOREN0 and BOREN1 bits in the Configuration Word register select one of three BOR modes. One mode has been added to allow control of the BOR enable for lower current during Sleep. By selecting BOREN<1:0> = 10, the BOR is automatically disabled in Sleep to conserve power and enabled on wake-up. See Register 12-1 for the Configuration Word definition. Note: If VDD drops below VBOR while the Power-up Timer is running, the chip will go back into a Brown-out Reset and the Power-up Timer will be re-initialized. Once VDD rises above VBOR, the Power-up Timer will execute a 64 ms Reset. A brown-out occurs when VDD falls below VBOR for greater than parameter TBOR (see Section 16.0 "Electrical Specifications"). The brown-out condition will reset the device. This will occur regardless of VDD slew rate. A Brown-out Reset may not occur if VDD falls below VBOR for less than parameter TBOR. FIGURE 12-3: BROWN-OUT SITUATIONS VDD Internal Reset VBOR 64 ms(1) VDD Internal Reset VBOR < 64 ms 64 ms(1) VDD Internal Reset Note 1: The Power-up Timer is enabled by the PWRTE bit in the Configuration Word register. VBOR 64 ms(1) 64 ms delay only if PWRTE bit is programmed to `0'. DS41302D-page 112 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 12.3.5 TIME-OUT SEQUENCE 12.3.6 On power-up, the time-out sequence is as follows: The Power Control register PCON (address 8Eh) has two Status bits to indicate what type of Reset occurred last. * PWRT time-out is invoked after POR has expired. * OST is activated after the PWRT time-out has expired. Bit 0 is BOR (Brown-out). BOR is unknown on Poweron Reset. It must then be set by the user and checked on subsequent Resets to see if BOR = 0, indicating that a Brown-out has occurred. The BOR Status bit is a "don't care" and is not necessarily predictable if the brown-out circuit is disabled (BOREN<1:0> = 00 in the Configuration Word register). The total time-out will vary based on oscillator configuration and PWRTE bit status. For example, in EC mode with PWRTE bit erased (PWRT disabled), there will be no time-out at all. Figure 12-4, Figure 12-5 and Figure 12-6 depict time-out sequences. Since the time-outs occur from the POR pulse, if MCLR is kept low long enough, the time-outs will expire. Then, bringing MCLR high will begin execution immediately (see Figure 12-5). This is useful for testing purposes or to synchronize more than one PIC12F609/615/617/ 12HV609/615 device operating in parallel. Bit 1 is POR (Power-on Reset). It is a `0' on Power-on Reset and unaffected otherwise. The user must write a `1' to this bit following a Power-on Reset. On a subsequent Reset, if POR is `0', it will indicate that a Poweron Reset has occurred (i.e., VDD may have gone too low). Table 12-6 shows the Reset conditions for some special registers, while Table 12-5 shows the Reset conditions for all the registers. TABLE 12-1: POWER CONTROL (PCON) REGISTER For more information, see Section 12.3.4 "Brown-out Reset (BOR)". TIME-OUT IN VARIOUS SITUATIONS Power-up Brown-out Reset PWRTE = 0 PWRTE = 1 PWRTE = 0 PWRTE = 1 Wake-up from Sleep TPWRT + 1024 * TOSC 1024 * TOSC TPWRT + 1024 * TOSC 1024 * TOSC 1024 * TOSC TPWRT -- TPWRT -- -- Oscillator Configuration XT, HS, LP RC, EC, INTOSC TABLE 12-2: STATUS/PCON BITS AND THEIR SIGNIFICANCE POR BOR TO PD Condition 0 x 1 1 Power-on Reset u 0 1 1 Brown-out Reset u u 0 u WDT Reset u u 0 0 WDT Wake-up u u u u MCLR Reset during normal operation u u 1 0 MCLR Reset during Sleep Legend: u = unchanged, x = unknown TABLE 12-3: Name PCON STATUS SUMMARY OF REGISTERS ASSOCIATED WITH BROWN-OUT RESET Value on all other Resets(1) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR -- -- -- -- -- -- POR BOR ---- --qq ---- --uu IRP RP1 RP0 TO PD Z DC C 0001 1xxx 000q quuu Legend: u = unchanged, x = unknown, - = unimplemented bit, reads as `0', q = value depends on condition. Shaded cells are not used by BOR. Note 1: Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation. 2010 Microchip Technology Inc. DS41302D-page 113 PIC12F609/615/617/12HV609/615 FIGURE 12-4: TIME-OUT SEQUENCE ON POWER-UP (DELAYED MCLR): CASE 1 VDD MCLR Internal POR TPWRT PWRT Time-out TOST OST Time-out Internal Reset TIME-OUT SEQUENCE ON POWER-UP (DELAYED MCLR): CASE 2 FIGURE 12-5: VDD MCLR Internal POR TPWRT PWRT Time-out TOST OST Time-out Internal Reset FIGURE 12-6: TIME-OUT SEQUENCE ON POWER-UP (MCLR WITH VDD) VDD MCLR Internal POR TPWRT PWRT Time-out TOST OST Time-out Internal Reset DS41302D-page 114 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 TABLE 12-4: Register W INDF TMR0 INITIALIZATION CONDITION FOR REGISTERS (PIC12F609/HV609) Address Power-on Reset MCLR Reset WDT Reset Brown-out Reset(1) Wake-up from Sleep through Interrupt Wake-up from Sleep through WDT Time-out -- xxxx xxxx uuuu uuuu uuuu uuuu 00h/80h xxxx xxxx xxxx xxxx uuuu uuuu 01h xxxx xxxx uuuu uuuu uuuu uuuu PCL 02h/82h 0000 0000 0000 0000 PC + 1(3) STATUS 03h/83h 0001 1xxx 000q quuu(4) uuuq quuu(4) FSR 04h/84h xxxx xxxx uuuu uuuu uuuu uuuu GPIO 05h --x0 x000 --u0 u000 --uu uuuu PCLATH 0Ah/8Ah ---0 0000 ---0 0000 ---u uuuu INTCON 0Bh/8Bh 0000 0000 0000 0000 uuuu uuuu(2) PIR1 0Ch ----- 0--0 ---- 0--0 ---- u--u(2) TMR1L 0Eh xxxx xxxx uuuu uuuu uuuu uuuu TMR1H 0Fh xxxx xxxx uuuu uuuu uuuu uuuu T1CON 10h 0000 0000 uuuu uuuu -uuu uuuu VRCON 19h 0-00 0000 0-00 0000 u-uu uuuu CMCON0 1Ah 0000 -0-0 0000 -0-0 uuuu -u-u CMCON1 1Ch ---0 0-10 ---0 0-10 ---u u-qu OPTION_REG 81h 1111 1111 1111 1111 uuuu uuuu TRISIO 85h --11 1111 --11 1111 --uu uuuu PIE1 8Ch ----- 0--0 ---- 0--0 ---- u--u PCON 8Eh ---- --0x ---- --uu(1, 5) ---- --uu OSCTUNE 90h ---0 0000 ---u uuuu ---u uuuu WPU 95h --11 -111 --11 -111 --uu -uuu IOC 96h --00 0000 --00 0000 --uu uuuu ANSEL 9Fh ---- 1-11 ---- 1-11 ---- q-qq Legend: Note 1: 2: 3: 4: 5: u = unchanged, x = unknown, - = unimplemented bit, reads as `0', q = value depends on condition. If VDD goes too low, Power-on Reset will be activated and registers will be affected differently. One or more bits in INTCON and/or PIR1 will be affected (to cause wake-up). When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h). See Table 12-6 for Reset value for specific condition. If Reset was due to brown-out, then bit 0 = 0. All other Resets will cause bit 0 = u. 2010 Microchip Technology Inc. DS41302D-page 115 PIC12F609/615/617/12HV609/615 TABLE 12-5: Register INITIALIZATION CONDITION FOR REGISTERS (PIC12F615/617/HV615) Address Power-on Reset MCLR Reset WDT Reset Brown-out Reset(1) W INDF TMR0 Wake-up from Sleep through Interrupt Wake-up from Sleep through WDT Time-out -- xxxx xxxx uuuu uuuu uuuu uuuu 00h/80h xxxx xxxx xxxx xxxx uuuu uuuu 01h xxxx xxxx uuuu uuuu uuuu uuuu PCL 02h/82h 0000 0000 0000 0000 PC + 1(3) STATUS 03h/83h 0001 1xxx 000q quuu(4) uuuq quuu(4) FSR 04h/84h xxxx xxxx uuuu uuuu uuuu uuuu GPIO 05h --x0 x000 --u0 u000 --uu uuuu PCLATH 0Ah/8Ah ---0 0000 ---0 0000 ---u uuuu INTCON 0Bh/8Bh 0000 0000 0000 0000 uuuu uuuu(2) PIR1 0Ch -000 0-00 -000 0-00 -uuu u-uu(2) TMR1L 0Eh xxxx xxxx uuuu uuuu uuuu uuuu TMR1H 0Fh xxxx xxxx uuuu uuuu uuuu uuuu T1CON 10h 0000 0000 uuuu uuuu -uuu uuuu (1) 11h 0000 0000 0000 0000 uuuu uuuu 12h -000 0000 -000 0000 -uuu uuuu (1) 13h xxxx xxxx uuuu uuuu uuuu uuuu CCPR1H(1) 14h xxxx xxxx uuuu uuuu uuuu uuuu CCP1CON(1) 15h 0-00 0000 0-00 0000 u-uu uuuu PWM1CON(1) 16h 0000 0000 0000 0000 uuuu uuuu ECCPAS(1) 17h 0000 0000 0000 0000 uuuu uuuu VRCON 19h 0-00 0000 0-00 0000 u-uu uuuu CMCON0 1Ah 0000 -0-0 0000 -0-0 uuuu -u-u CMCON1 1Ch ---0 0-10 ---0 0-10 ---u u-qu (1) 1Eh xxxx xxxx uuuu uuuu uuuu uuuu ADCON0(1) 1Fh 00-0 0000 00-0 0000 uu-u uuuu OPTION_REG 81h 1111 1111 1111 1111 uuuu uuuu TRISIO 85h --11 1111 --11 1111 --uu uuuu PIE1 8Ch -00- 0-00 -00- 0-00 -uu- u-uu PCON 8Eh ---- --0x OSCTUNE 90h ---0 0000 ---u uuuu ---u uuuu PR2 92h 1111 1111 1111 1111 1111 1111 APFCON 93h ---0 --00 ---0 --00 ---u --uu WPU 95h --11 -111 --11 -111 --uu -uuu IOC 96h --00 0000 --00 0000 --uu uuuu (6) 98h ---- -000 ---- -000 ---- -uuu PMCON2(6) 99h ---- ---- ---- ---- ---- ---- PMADRL(6) 9Ah 0000 0000 0000 0000 uuuu uuuu TMR2 T2CON(1) CCPR1L ADRESH PMCON1 Legend: Note 1: 2: 3: 4: 5: 6: ---- --uu(1, 5) ---- --uu u = unchanged, x = unknown, - = unimplemented bit, reads as `0', q = value depends on condition. If VDD goes too low, Power-on Reset will be activated and registers will be affected differently. One or more bits in INTCON and/or PIR1 will be affected (to cause wake-up). When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h). See Table 12-6 for Reset value for specific condition. If Reset was due to brown-out, then bit 0 = 0. All other Resets will cause bit 0 = u. For PIC12F617 only. DS41302D-page 116 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 TABLE 12-5: INITIALIZATION CONDITION FOR REGISTERS (CONTINUED)(PIC12F615/617/HV615) Register PMADRH(6) Address Power-on Reset MCLR Reset WDT Reset (Continued) Brown-out Reset(1) Wake-up from Sleep through Interrupt Wake-up from Sleep through WDT Time-out (Continued) 9Bh ---- -000 ---- -000 ---- -uuu (6) 9Ch 0000 0000 0000 0000 uuuu uuuu PMDATH(6) 9Dh --00 0000 --00 0000 --uu uuuu ADRESL(1) 9Eh xxxx xxxx uuuu uuuu uuuu uuuu 9Fh -000 1111 -000 1111 -uuu qqqq PMDATL ANSEL Legend: Note 1: 2: 3: 4: 5: 6: u = unchanged, x = unknown, - = unimplemented bit, reads as `0', q = value depends on condition. If VDD goes too low, Power-on Reset will be activated and registers will be affected differently. One or more bits in INTCON and/or PIR1 will be affected (to cause wake-up). When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h). See Table 12-6 for Reset value for specific condition. If Reset was due to brown-out, then bit 0 = 0. All other Resets will cause bit 0 = u. For PIC12F617 only. TABLE 12-6: INITIALIZATION CONDITION FOR SPECIAL REGISTERS Program Counter Status Register PCON Register Power-on Reset 000h 0001 1xxx ---- --0x MCLR Reset during normal operation 000h 000u uuuu ---- --uu MCLR Reset during Sleep 000h 0001 0uuu ---- --uu WDT Reset 000h 0000 uuuu ---- --uu PC + 1 uuu0 0uuu ---- --uu 000h 0001 1uuu ---- --10 uuu1 0uuu ---- --uu Condition WDT Wake-up Brown-out Reset Interrupt Wake-up from Sleep PC + 1 (1) Legend: u = unchanged, x = unknown, - = unimplemented bit, reads as `0'. Note 1: When the wake-up is due to an interrupt and Global Interrupt Enable bit, GIE, is set, the PC is loaded with the interrupt vector (0004h) after execution of PC + 1. 2010 Microchip Technology Inc. DS41302D-page 117 PIC12F609/615/617/12HV609/615 12.4 Interrupts The PIC12F609/615/617/12HV609/615 has 8 sources of interrupt: * * * * * * * External Interrupt GP2/INT Timer0 Overflow Interrupt GPIO Change Interrupts Comparator Interrupt A/D Interrupt (PIC12F615/617/HV615 only) Timer1 Overflow Interrupt Timer2 Match Interrupt (PIC12F615/617/HV615 only) * Enhanced CCP Interrupt (PIC12F615/617/HV615 only) * Flash Memory Self Write (PIC12F617 only) The Interrupt Control register (INTCON) and Peripheral Interrupt Request Register 1 (PIR1) record individual interrupt requests in flag bits. The INTCON register also has individual and global interrupt enable bits. The Global Interrupt Enable bit, GIE of the INTCON register, enables (if set) all unmasked interrupts, or disables (if cleared) all interrupts. Individual interrupts can be disabled through their corresponding enable bits in the INTCON register and PIE1 register. GIE is cleared on Reset. When an interrupt is serviced, the following actions occur automatically: * The GIE is cleared to disable any further interrupt. * The return address is pushed onto the stack. * The PC is loaded with 0004h. The Return from Interrupt instruction, RETFIE, exits the interrupt routine, as well as sets the GIE bit, which re-enables unmasked interrupts. The following interrupt flags are contained in the INTCON register: * INT Pin Interrupt * GPIO Change Interrupt * Timer0 Overflow Interrupt Figure 12-8). The latency is the same for one or twocycle instructions. Once in the Interrupt Service Routine, the source(s) of the interrupt can be determined by polling the interrupt flag bits. The interrupt flag bit(s) must be cleared in software before re-enabling interrupts to avoid multiple interrupt requests. Note 1: Individual interrupt flag bits are set, regardless of the status of their corresponding mask bit or the GIE bit. 2: When an instruction that clears the GIE bit is executed, any interrupts that were pending for execution in the next cycle are ignored. The interrupts, which were ignored, are still pending to be serviced when the GIE bit is set again. For additional information on Timer1, Timer2, comparators, ADC, Enhanced CCP modules, refer to the respective peripheral section. 12.4.1 GP2/INT INTERRUPT The external interrupt on the GP2/INT pin is edgetriggered; either on the rising edge if the INTEDG bit of the OPTION register is set, or the falling edge, if the INTEDG bit is clear. When a valid edge appears on the GP2/INT pin, the INTF bit of the INTCON register is set. This interrupt can be disabled by clearing the INTE control bit of the INTCON register. The INTF bit must be cleared by software in the Interrupt Service Routine before re-enabling this interrupt. The GP2/INT interrupt can wake-up the processor from Sleep, if the INTE bit was set prior to going into Sleep. See Section 12.7 "Power-Down Mode (Sleep)" for details on Sleep and Figure 12-9 for timing of wake-up from Sleep through GP2/INT interrupt. Note: The ANSEL register must be initialized to configure an analog channel as a digital input. Pins configured as analog inputs will read `0' and cannot generate an interrupt. The peripheral interrupt flags are contained in the special register, PIR1. The corresponding interrupt enable bit is contained in special register, PIE1. The following interrupt flags are contained in the PIR1 register: * * * * * A/D Interrupt Comparator Interrupt Timer1 Overflow Interrupt Timer2 Match Interrupt Enhanced CCP Interrupt For external interrupt events, such as the INT pin or GPIO change interrupt, the interrupt latency will be three or four instruction cycles. The exact latency depends upon when the interrupt event occurs (see DS41302D-page 118 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 12.4.2 TIMER0 INTERRUPT 12.4.3 An overflow (FFh 00h) in the TMR0 register will set the T0IF bit of the INTCON register. The interrupt can be enabled/disabled by setting/clearing T0IE bit of the INTCON register. See Section 6.0 "Timer0 Module" for operation of the Timer0 module. An input change on GPIO sets the GPIF bit of the INTCON register. The interrupt can be enabled/ disabled by setting/clearing the GPIE bit of the INTCON register. Plus, individual pins can be configured through the IOC register. Note: FIGURE 12-7: GPIO INTERRUPT-ON-CHANGE If a change on the I/O pin should occur when any GPIO operation is being executed, then the GPIF interrupt flag may not get set. INTERRUPT LOGIC IOC-GP0 IOC0 IOC-GP1 IOC1 IOC-GP2 IOC2 IOC-GP3 IOC3 IOC-GP4 IOC4 IOC-GP5 IOC5 T0IF T0IE (615/617 only) TMR2IF TMR2IE INTF INTE GPIF GPIE TMR1IF TMR1IE CMIF CMIE Wake-up (If in Sleep mode)(1) Interrupt to CPU PEIE GIE (615/617 only) ADIF ADIE (615/617 only) CCP1IF CCP1IE Note 1: 2010 Microchip Technology Inc. Some peripherals depend upon the system clock for operation. Since the system clock is suspended during Sleep, only those peripherals which do not depend upon the system clock will wake the part from Sleep. See Section 12.7.1 "Wake-up from Sleep". DS41302D-page 119 PIC12F609/615/617/12HV609/615 FIGURE 12-8: INT PIN INTERRUPT TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 CLKOUT (3) (4) INT pin (1) (1) INTF flag (INTCON reg.) Interrupt Latency (2) (5) GIE bit (INTCON reg.) INSTRUCTION FLOW PC Instruction Fetched PC + 1 Inst (PC - 1) 0004h PC + 1 -- Inst (PC + 1) Inst (PC) Instruction Executed Note 1: PC Dummy Cycle Inst (PC) 0005h Inst (0004h) Inst (0005h) Dummy Cycle Inst (0004h) INTF flag is sampled here (every Q1). 2: Asynchronous interrupt latency = 3-4 TCY. Synchronous latency = 3 TCY, where TCY = instruction cycle time. Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction. 3: CLKOUT is available only in INTOSC and RC Oscillator modes. 4: For minimum width of INT pulse, refer to AC specifications in Section 16.0 "Electrical Specifications". 5: INTF is enabled to be set any time during the Q4-Q1 cycles. TABLE 12-7: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPTS Name Bit 7 Bit 6 INTCON Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000 IOC -- -- IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 --00 0000 --00 0000 PIR1 -- ADIF(1) CCP1IF(1) -- CMIF -- TMR2IF(1) TMR1IF -00- 0-00 -000 0-00 -- ADIE(1) -- CMIE -- TMR2IE(1) TMR1IE -00- 0-00 -000 0-00 PIE1 CCP1IE(1) Legend: x = unknown, u = unchanged, - = unimplemented read as `0', q = value depends upon condition. Shaded cells are not used by the interrupt module. Note 1: PIC12F615/617/HV615 only. DS41302D-page 120 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 12.5 Context Saving During Interrupts During an interrupt, only the return PC value is saved on the stack. Typically, users may wish to save key registers during an interrupt (e.g., W and STATUS registers). This must be implemented in software. Temporary holding registers W_TEMP and STATUS_TEMP should be placed in the last 16 bytes of GPR (see Figure 2-3). These 16 locations are common to all banks and do not require banking. This makes context save and restore operations simpler. The code shown in Example 12-1 can be used to: * * * * * Store the W register Store the STATUS register Execute the ISR code Restore the Status (and Bank Select Bit register) Restore the W register Note: The PIC12F609/615/617/12HV609/615 does not require saving the PCLATH. However, if computed GOTOs are used in both the ISR and the main code, the PCLATH must be saved and restored in the ISR. EXAMPLE 12-1: MOVWF SWAPF SAVING STATUS AND W REGISTERS IN RAM W_TEMP STATUS,W MOVWF STATUS_TEMP : :(ISR) : SWAPF STATUS_TEMP,W MOVWF SWAPF SWAPF 12.6 STATUS W_TEMP,F W_TEMP,W ;Copy W to TEMP ;Swap status to ;Swaps are used ;Save status to ;Insert user code here ;Swap STATUS_TEMP register into W ;(sets bank to original state) ;Move W into STATUS register ;Swap W_TEMP ;Swap W_TEMP into W Watchdog Timer (WDT) The Watchdog Timer is a free running, on-chip RC oscillator, which requires no external components. This RC oscillator is separate from the external RC oscillator of the CLKIN pin and INTOSC. That means that the WDT will run, even if the clock on the OSC1 and OSC2 pins of the device has been stopped (for example, by execution of a SLEEP instruction). During normal operation, a WDT time out generates a device Reset. If the device is in Sleep mode, a WDT time out causes the device to wake-up and continue with normal operation. The WDT can be permanently disabled by programming the Configuration bit, WDTE, as clear (Section 12.1 "Configuration Bits"). 2010 Microchip Technology Inc. register be saved into W because they do not affect the status bits bank zero STATUS_TEMP register 12.6.1 WDT PERIOD The WDT has a nominal time-out period of 18 ms (with no prescaler). The time-out periods vary with temperature, VDD and process variations from part to part (see DC specs). If longer time-out periods are desired, a prescaler with a division ratio of up to 1:128 can be assigned to the WDT under software control by writing to the OPTION register. Thus, time-out periods up to 2.3 seconds can be realized. The CLRWDT and SLEEP instructions clear the WDT and the prescaler, if assigned to the WDT, and prevent it from timing out and generating a device Reset. The TO bit in the STATUS register will be cleared upon a Watchdog Timer time out. DS41302D-page 121 PIC12F609/615/617/12HV609/615 12.6.2 WDT PROGRAMMING CONSIDERATIONS It should also be taken in account that under worstcase conditions (i.e., VDD = Min., Temperature = Max., Max. WDT prescaler) it may take several seconds before a WDT time out occurs. FIGURE 12-2: WATCHDOG TIMER BLOCK DIAGRAM CLKOUT (= FOSC/4) Data Bus 0 8 1 SYNC 2 Cycles 1 T0CKI pin TMR0 0 0 T0CS T0SE Set Flag bit T0IF on Overflow 8-bit Prescaler PSA 1 8 PSA 3 1 PS<2:0> WDT Time-Out Watchdog Timer 0 PSA WDTE Note 1: T0SE, T0CS, PSA, PS<2:0> are bits in the OPTION register. TABLE 12-8: WDT STATUS Conditions WDT WDTE = 0 CLRWDT Command Cleared Oscillator Fail Detected Exit Sleep + System Clock = T1OSC, EXTRC, INTRC, EXTCLK Exit Sleep + System Clock = XT, HS, LP TABLE 12-9: Cleared until the end of OST SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets OPTION_REG GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 IOSCFS CP MCLRE PWRTE WDTE FOSC2 FOSC1 FOSC0 -- -- CONFIG Legend: Note 1: Shaded cells are not used by the Watchdog Timer. See Register 12-1 for operation of all Configuration Word register bits. DS41302D-page 122 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 12.7 Power-Down Mode (Sleep) The Power-Down mode is entered by executing a SLEEP instruction. If the Watchdog Timer is enabled: * * * * * WDT will be cleared but keeps running. PD bit in the STATUS register is cleared. TO bit is set. Oscillator driver is turned off. I/O ports maintain the status they had before SLEEP was executed (driving high, low or high-impedance). For lowest current consumption in this mode, all I/O pins should be either at VDD or VSS, with no external circuitry drawing current from the I/O pin and the comparators and CVREF should be disabled. I/O pins that are highimpedance inputs should be pulled high or low externally to avoid switching currents caused by floating inputs. The T0CKI input should also be at VDD or VSS for lowest current consumption. The contribution from on-chip pullups on GPIO should be considered. The MCLR pin must be at a logic high level. Note: 12.7.1 It should be noted that a Reset generated by a WDT time-out does not drive MCLR pin low. WAKE-UP FROM SLEEP The device can wake-up from Sleep through one of the following events: 1. 2. 3. External Reset input on MCLR pin. Watchdog Timer wake-up (if WDT was enabled). Interrupt from GP2/INT pin, GPIO change or a peripheral interrupt. The first event will cause a device Reset. The two latter events are considered a continuation of program execution. The TO and PD bits in the STATUS register can be used to determine the cause of device Reset. The PD bit, which is set on power-up, is cleared when Sleep is invoked. TO bit is cleared if WDT wake-up occurred. The following peripheral interrupts can wake the device from Sleep: 1. 2. 3. 4. 5. 6. Timer1 interrupt. Timer1 must be operating as an asynchronous counter. ECCP Capture mode interrupt. A/D conversion (when A/D clock source is RC). Comparator output changes state. Interrupt-on-change. External Interrupt from INT pin. When the SLEEP instruction is being executed, the next instruction (PC + 1) is prefetched. For the device to wake-up through an interrupt event, the corresponding interrupt enable bit must be set (enabled). Wake-up is regardless of the state of the GIE bit. If the GIE bit is clear (disabled), the device continues execution at the instruction after the SLEEP instruction. If the GIE bit is set (enabled), the device executes the instruction after the SLEEP instruction, then branches to the interrupt address (0004h). In cases where the execution of the instruction following SLEEP is not desirable, the user should have a NOP after the SLEEP instruction. Note: If the global interrupts are disabled (GIE is cleared) and any interrupt source has both its interrupt enable bit and the corresponding interrupt flag bits set, the device will immediately wake-up from Sleep. The WDT is cleared when the device wakes up from Sleep, regardless of the source of wake-up. 12.7.2 WAKE-UP USING INTERRUPTS When global interrupts are disabled (GIE cleared) and any interrupt source has both its interrupt enable bit and interrupt flag bit set, one of the following will occur: * If the interrupt occurs before the execution of a SLEEP instruction, the SLEEP instruction will complete as a NOP. Therefore, the WDT and WDT prescaler and postscaler (if enabled) will not be cleared, the TO bit will not be set and the PD bit will not be cleared. * If the interrupt occurs during or after the execution of a SLEEP instruction, the device will Immediately wake-up from Sleep. The SLEEP instruction is executed. Therefore, the WDT and WDT prescaler and postscaler (if enabled) will be cleared, the TO bit will be set and the PD bit will be cleared. Even if the flag bits were checked before executing a SLEEP instruction, it may be possible for flag bits to become set before the SLEEP instruction completes. To determine whether a SLEEP instruction executed, test the PD bit. If the PD bit is set, the SLEEP instruction was executed as a NOP. To ensure that the WDT is cleared, a CLRWDT instruction should be executed before a SLEEP instruction. See Figure 12-9 for more details. Other peripherals cannot generate interrupts since during Sleep, no on-chip clocks are present. 2010 Microchip Technology Inc. DS41302D-page 123 PIC12F609/615/617/12HV609/615 FIGURE 12-9: WAKE-UP FROM SLEEP THROUGH INTERRUPT Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 TOST(2) CLKOUT(4) INT pin INTF flag (INTCON reg.) Interrupt Latency (3) GIE bit (INTCON reg.) Processor in Sleep Instruction Flow PC Instruction Fetched Instruction Executed Note 12.8 PC Inst(PC) = Sleep Inst(PC - 1) PC + 1 PC + 2 PC + 2 Inst(PC + 1) Inst(PC + 2) Sleep Inst(PC + 1) PC + 2 Dummy Cycle 0004h 0005h Inst(0004h) Inst(0005h) Dummy Cycle Inst(0004h) 1: XT, HS or LP Oscillator mode assumed. 2: TOST = 1024 TOSC (drawing not to scale). This delay does not apply to EC, INTOSC and RC Oscillator modes. 3: GIE = `1' assumed. In this case after wake-up, the processor jumps to 0004h. If GIE = `0', execution will continue in-line. 4: CLKOUT is not available in XT, HS, LP or EC Oscillator modes, but shown here for timing reference. Code Protection If the code protection bit(s) have not been programmed, the on-chip program memory can be read out using ICSPTM for verification purposes. Note: 12.9 The entire Flash program memory will be erased when the code protection is turned off. See the MemoryProgramming Specification (DS41204) for more information. ID Locations Four memory locations (2000h-2003h) are designated as ID locations where the user can store checksum or other code identification numbers. These locations are not accessible during normal execution but are readable and writable during Program/Verify mode. Only the Least Significant 7 bits of the ID locations are used. DS41302D-page 124 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 12.10 In-Circuit Serial ProgrammingTM 12.11 In-Circuit Debugger ThePIC12F609/615/617/12HV609/615 microcontrollers can be serially programmed while in the end application circuit. This is simply done with five connections for: Since in-circuit debugging requires access to three pins, MPLAB(R) ICD 2 development with an 14-pin device is not practical. A special 28-pin PIC12F609/615/617/ 12HV609/615 ICD device is used with MPLAB ICD 2 to provide separate clock, data and MCLR pins and frees all normally available pins to the user. clock data power ground programming voltage A special debugging adapter allows the ICD device to be used in place of a PIC12F609/615/617/12HV609/ 615 device. The debugging adapter is the only source of the ICD device. This allows customers to manufacture boards with unprogrammed devices and then program the microcontroller just before shipping the product. This also allows the most recent firmware or a custom firmware to be programmed. The device is placed into a Program/Verify mode by holding the GP0 and GP1 pins low, while raising the MCLR (VPP) pin from VIL to VIHH. See the Memory Programming Specification (DS41284) for more information. GP0 becomes the programming data and GP1 becomes the programming clock. Both GP0 and GP1 are Schmitt Trigger inputs in Program/Verify mode. A typical In-Circuit Serial Programming connection is shown in Figure 12-10. FIGURE 12-10: TYPICAL IN-CIRCUIT SERIAL PROGRAMMING CONNECTION To Normal Connections External Connector Signals +5V VSS 0V VPP MCLR/VPP/GP3/RA3 CLK GP1 Data I/O GP0 * * * To Normal Connections * Isolation devices (as required) Note: TABLE 12-10: DEBUGGER RESOURCES Resource Description I/O pins ICDCLK, ICDDATA Stack 1 level Program Memory Address 0h must be NOP 700h-7FFh For more information, see "MPLAB(R) ICD 2 In-Circuit Debugger User's Guide" (DS51331), available on Microchip's web site (www.microchip.com). FIGURE 12-11: PIC12F617/ PIC12F615/12HV615 PIC12F609/12HV609 VDD * When the ICD pin on the PIC12F609/615/617/ 12HV609/615 ICD device is held low, the In-Circuit Debugger functionality is enabled. This function allows simple debugging functions when used with MPLAB ICD 2. When the microcontroller has this feature enabled, some of the resources are not available for general use. Table 12-10 shows which features are consumed by the background debugger. 28 PIN ICD PINOUT 28-Pin PDIP In-Circuit Debug Device VDD CS0 CS1 CS2 RA5 RA4 RA3 RC5 RC4 RC3 NC ICDCLK ICDMCLR ICDDATA 1 2 3 28 27 26 4 5 25 24 6 7 8 9 10 11 PIC16F616-ICD * * * * * 23 22 21 20 19 18 12 17 13 14 16 15 GND RA0 RA1 SHUNTEN RA2 RC0 RC1 RC2 NC NC NC NC NC ICD To erase the device VDD must be above the Bulk Erase VDD minimum given in the Memory Programming Specification (DS41284) 2010 Microchip Technology Inc. DS41302D-page 125 PIC12F609/615/617/12HV609/615 NOTES: DS41302D-page 126 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 13.0 VOLTAGE REGULATOR The PIC12HV609/HV615 devices include a permanent internal 5 volt (nominal) shunt regulator in parallel with the VDD pin. This eliminates the need for an external voltage regulator in systems sourced by an unregulated supply. All external devices connected directly to the VDD pin will share the regulated supply voltage and contribute to the total VDD supply current (ILOAD). 13.1 An external current limiting resistor, RSER, located between the unregulated supply, VUNREG, and the VDD pin, drops the difference in voltage between VUNREG and VDD. RSER must be between RMAX and RMIN as defined by Equation 13-1. EQUATION 13-1: RMAX = RSER LIMITING RESISTOR (VUMIN - 5V) 1.05 * (4 MA + ILOAD) Regulator Operation A shunt regulator generates a specific supply voltage by creating a voltage drop across a pass resistor RSER. The voltage at the VDD pin of the microcontroller is monitored and compared to an internal voltage reference. The current through the resistor is then adjusted, based on the result of the comparison, to produce a voltage drop equal to the difference between the supply voltage VUNREG and the VDD of the microcontroller. See Figure 13-1 for voltage regulator schematic. FIGURE 13-1: VOLTAGE REGULATOR RSER ILOAD VDD CBYPASS ISHUNT Feedback Where: RMAX = maximum value of RSER (ohms) RMIN = minimum value of RSER (ohms) VUMIN = minimum value of VUNREG VUMAX = maximum value of VUNREG VDD = regulated voltage (5V nominal) 1.05 = compensation for +5% tolerance of RSER 0.95 = compensation for -5% tolerance of RSER 13.2 VSS Device (VUMAX - 5V) 0.95 * (50 MA) ILOAD = maximum expected load current in mA including I/O pin currents and external circuits connected to VDD. VUNREG ISUPPLY RMIN = Regulator Considerations The supply voltage VUNREG and load current are not constant. Therefore, the current range of the regulator is limited. Selecting a value for RSER must take these three factors into consideration. Since the regulator uses the band gap voltage as the regulated voltage reference, this voltage reference is permanently enabled in the PIC12HV609/HV615 devices. The shunt regulator will still consume current when below operating voltage range for the shunt regulator. 13.3 Design Considerations For more information on using the shunt regulator and managing current load, see Application Note AN1035, "Designing with HV Microcontrollers" (DS01035). 2010 Microchip Technology Inc. DS41302D-page 127 PIC12F609/615/617/12HV609/615 NOTES: DS41302D-page 128 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 14.0 INSTRUCTION SET SUMMARY The PIC12F609/615/617/12HV609/615 instruction set is highly orthogonal and is comprised of three basic categories: TABLE 14-1: OPCODE FIELD DESCRIPTIONS Field Description Register file address (0x00 to 0x7F) f * Byte-oriented operations * Bit-oriented operations * Literal and control operations W Working register (accumulator) b Bit address within an 8-bit file register k Literal field, constant data or label Each PIC16 instruction is a 14-bit word divided into an opcode, which specifies the instruction type and one or more operands, which further specify the operation of the instruction. The formats for each of the categories is presented in Figure 14-1, while the various opcode fields are summarized in Table 14-1. x Don't care location (= 0 or 1). The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. d Destination select; d = 0: store result in W, d = 1: store result in file register f. Default is d = 1. Table 14-2 lists the instructions recognized by the MPASMTM assembler. For byte-oriented instructions, `f' represents a file register designator and `d' represents a destination designator. The file register designator specifies which file register is to be used by the instruction. The destination designator specifies where the result of the operation is to be placed. If `d' is zero, the result is placed in the W register. If `d' is one, the result is placed in the file register specified in the instruction. For bit-oriented instructions, `b' represents a bit field designator, which selects the bit affected by the operation, while `f' represents the address of the file in which the bit is located. For literal and control operations, `k' represents an 8-bit or 11-bit constant, or literal value. One instruction cycle consists of four oscillator periods; for an oscillator frequency of 4 MHz, this gives a normal instruction execution time of 1 s. All instructions are executed within a single instruction cycle, unless a conditional test is true, or the program counter is changed as a result of an instruction. When this occurs, the execution takes two instruction cycles, with the second cycle executed as a NOP. All instruction examples use the format `0xhh' to represent a hexadecimal number, where `h' signifies a hexadecimal digit. PC Program Counter TO Time-out bit Carry bit C DC Digit carry bit Zero bit Z PD Power-down bit FIGURE 14-1: GENERAL FORMAT FOR INSTRUCTIONS Byte-oriented file register operations 13 8 7 6 OPCODE d f (FILE #) d = 0 for destination W d = 1 for destination f f = 7-bit file register address Bit-oriented file register operations 13 10 9 7 6 OPCODE b (BIT #) f (FILE #) Literal and control operations General 8 7 OPCODE Read-Modify-Write Operations Any instruction that specifies a file register as part of the instruction performs a Read-Modify-Write (RMW) operation. The register is read, the data is modified, and the result is stored according to either the instruction or the destination designator `d'. A read operation is performed on a register even if the instruction writes to that register. 0 b = 3-bit bit address f = 7-bit file register address 13 14.1 0 0 k (literal) k = 8-bit immediate value CALL and GOTO instructions only 13 11 OPCODE 10 0 k (literal) k = 11-bit immediate value For example, a CLRF GPIO instruction will read GPIO, clear all the data bits, then write the result back to GPIO. This example would have the unintended consequence of clearing the condition that set the GPIF flag. 2010 Microchip Technology Inc. DS41302D-page 129 PIC12F609/615/617/12HV609/615 TABLE 14-2: PIC12F609/615/617/12HV609/615 INSTRUCTION SET Mnemonic, Operands 14-Bit Opcode Description Cycles MSb LSb Status Affected Notes BYTE-ORIENTED FILE REGISTER OPERATIONS ADDWF ANDWF CLRF CLRW COMF DECF DECFSZ INCF INCFSZ IORWF MOVF MOVWF NOP RLF RRF SUBWF SWAPF XORWF f, d f, d f - f, d f, d f, d f, d f, d f, d f, d f - f, d f, d f, d f, d f, d Add W and f AND W with f Clear f Clear W Complement f Decrement f Decrement f, Skip if 0 Increment f Increment f, Skip if 0 Inclusive OR W with f Move f Move W to f No Operation Rotate Left f through Carry Rotate Right f through Carry Subtract W from f Swap nibbles in f Exclusive OR W with f BCF BSF BTFSC BTFSS f, b f, b f, b f, b Bit Clear f Bit Set f Bit Test f, Skip if Clear Bit Test f, Skip if Set 1 1 1 1 1 1 1(2) 1 1(2) 1 1 1 1 1 1 1 1 1 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 dfff dfff lfff 0xxx dfff dfff dfff dfff dfff dfff dfff lfff 0xx0 dfff dfff dfff dfff dfff ffff ffff ffff xxxx ffff ffff ffff ffff ffff ffff ffff ffff 0000 ffff ffff ffff ffff ffff 00bb 01bb 10bb 11bb bfff bfff bfff bfff ffff ffff ffff ffff 111x 1001 0kkk 0000 1kkk 1000 00xx 0000 01xx 0000 0000 110x 1010 kkkk kkkk kkkk 0110 kkkk kkkk kkkk 0000 kkkk 0000 0110 kkkk kkkk kkkk kkkk kkkk 0100 kkkk kkkk kkkk 1001 kkkk 1000 0011 kkkk kkkk 0111 0101 0001 0001 1001 0011 1011 1010 1111 0100 1000 0000 0000 1101 1100 0010 1110 0110 C, DC, Z Z Z Z Z Z Z Z Z C C C, DC, Z Z 1, 2 1, 2 2 1, 2 1, 2 1, 2, 3 1, 2 1, 2, 3 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2 BIT-ORIENTED FILE REGISTER OPERATIONS 1 1 1 (2) 1 (2) 01 01 01 01 1, 2 1, 2 3 3 LITERAL AND CONTROL OPERATIONS ADDLW ANDLW CALL CLRWDT GOTO IORLW MOVLW RETFIE RETLW RETURN SLEEP SUBLW XORLW Note 1: 2: 3: k k k - k k k - k - - k k Add literal and W AND literal with W Call Subroutine Clear Watchdog Timer Go to address Inclusive OR literal with W Move literal to W Return from interrupt Return with literal in W Return from Subroutine Go into Standby mode Subtract W from literal Exclusive OR literal with W 1 1 2 1 2 1 1 2 2 2 1 1 1 11 11 10 00 10 11 11 00 11 00 00 11 11 C, DC, Z Z TO, PD Z TO, PD C, DC, Z Z When an I/O register is modified as a function of itself (e.g., MOVF GPIO, 1), the value used will be that value present on the pins themselves. For example, if the data latch is `1' for a pin configured as input and is driven low by an external device, the data will be written back with a `0'. If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be cleared if assigned to the Timer0 module. If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. DS41302D-page 130 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 14.2 Instruction Descriptions ADDLW Add literal and W Syntax: [ label ] ADDLW Operands: 0 k 255 Operation: (W) + k (W) Status Affected: C, DC, Z Description: The contents of the W register are added to the eight-bit literal `k' and the result is placed in the W register. k BCF Bit Clear f Syntax: [ label ] BCF Operands: 0 f 127 0b7 Operation: 0 (f<b>) Status Affected: None Description: Bit `b' in register `f' is cleared. BSF Bit Set f Syntax: [ label ] BSF f,b ADDWF Add W and f Syntax: [ label ] ADDWF Operands: 0 f 127 d 0,1 Operands: 0 f 127 0b7 Operation: (W) + (f) (destination) Operation: 1 (f<b>) Status Affected: C, DC, Z Status Affected: None Description: Add the contents of the W register with register `f'. If `d' is `0', the result is stored in the W register. If `d' is `1', the result is stored back in register `f'. Description: Bit `b' in register `f' is set. ANDLW AND literal with W BTFSC Bit Test f, Skip if Clear Syntax: [ label ] ANDLW Syntax: [ label ] BTFSC f,b Operands: 0 k 255 Operands: Operation: (W) .AND. (k) (W) 0 f 127 0b7 Status Affected: Z Operation: skip if (f<b>) = 0 Description: The contents of W register are AND'ed with the eight-bit literal `k'. The result is placed in the W register. Status Affected: None Description: If bit `b' in register `f' is `1', the next instruction is executed. If bit `b' in register `f' is `0', the next instruction is discarded, and a NOP is executed instead, making this a two-cycle instruction. ANDWF f,d k AND W with f Syntax: [ label ] ANDWF Operands: 0 f 127 d 0,1 Operation: (W) .AND. (f) (destination) f,d Status Affected: Z Description: AND the W register with register `f'. If `d' is `0', the result is stored in the W register. If `d' is `1', the result is stored back in register `f'. 2010 Microchip Technology Inc. f,b DS41302D-page 131 PIC12F609/615/617/12HV609/615 BTFSS Bit Test f, Skip if Set CLRWDT Clear Watchdog Timer Syntax: [ label ] BTFSS f,b Syntax: [ label ] CLRWDT Operands: 0 f 127 0b<7 Operands: None Operation: 00h WDT 0 WDT prescaler, 1 TO 1 PD Status Affected: TO, PD Description: CLRWDT instruction resets the Watchdog Timer. It also resets the prescaler of the WDT. Status bits TO and PD are set. Operation: skip if (f<b>) = 1 Status Affected: None Description: If bit `b' in register `f' is `0', the next instruction is executed. If bit `b' is `1', then the next instruction is discarded and a NOP is executed instead, making this a two-cycle instruction. CALL Call Subroutine COMF Complement f Syntax: [ label ] CALL k Syntax: [ label ] COMF Operands: 0 k 2047 Operands: Operation: (PC)+ 1 TOS, k PC<10:0>, (PCLATH<4:3>) PC<12:11> 0 f 127 d [0,1] f,d Operation: (f) (destination) Status Affected: Z Description: The contents of register `f' are complemented. If `d' is `0', the result is stored in W. If `d' is `1', the result is stored back in register `f'. DECF Decrement f Syntax: [ label ] DECF f,d Status Affected: None Description: Call Subroutine. First, return address (PC + 1) is pushed onto the stack. The eleven-bit immediate address is loaded into PC bits <10:0>. The upper bits of the PC are loaded from PCLATH. CALL is a two-cycle instruction. CLRF Clear f Syntax: [ label ] CLRF Operands: 0 f 127 Operands: Operation: 00h (f) 1Z 0 f 127 d [0,1] Operation: (f) - 1 (destination) Status Affected: Z Status Affected: Z Description: The contents of register `f' are cleared and the Z bit is set. Description: Decrement register `f'. If `d' is `0', the result is stored in the W register. If `d' is `1', the result is stored back in register `f'. CLRW Clear W Syntax: [ label ] CLRW f Operands: None Operation: 00h (W) 1Z Status Affected: Z Description: W register is cleared. Zero bit (Z) is set. DS41302D-page 132 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 DECFSZ Decrement f, Skip if 0 INCFSZ Increment f, Skip if 0 Syntax: [ label ] DECFSZ f,d Syntax: [ label ] Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: (f) - 1 (destination); skip if result = 0 Operation: (f) + 1 (destination), skip if result = 0 Status Affected: None Status Affected: None Description: The contents of register `f' are decremented. If `d' is `0', the result is placed in the W register. If `d' is `1', the result is placed back in register `f'. If the result is `1', the next instruction is executed. If the result is `0', then a NOP is executed instead, making it a two-cycle instruction. Description: The contents of register `f' are incremented. If `d' is `0', the result is placed in the W register. If `d' is `1', the result is placed back in register `f'. If the result is `1', the next instruction is executed. If the result is `0', a NOP is executed instead, making it a two-cycle instruction. GOTO Unconditional Branch IORLW Syntax: [ label ] Syntax: [ label ] Operands: 0 k 2047 Operands: 0 k 255 Operation: k PC<10:0> PCLATH<4:3> PC<12:11> Operation: (W) .OR. k (W) Status Affected: Z Status Affected: None Description: Description: GOTO is an unconditional branch. The eleven-bit immediate value is loaded into PC bits <10:0>. The upper bits of PC are loaded from PCLATH<4:3>. GOTO is a two-cycle instruction. The contents of the W register are OR'ed with the eight-bit literal `k'. The result is placed in the W register. INCF Increment f IORWF Inclusive OR W with f Syntax: [ label ] Syntax: [ label ] Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: (f) + 1 (destination) Operation: (W) .OR. (f) (destination) Status Affected: Z Status Affected: Z Description: The contents of register `f' are incremented. If `d' is `0', the result is placed in the W register. If `d' is `1', the result is placed back in register `f'. Description: Inclusive OR the W register with register `f'. If `d' is `0', the result is placed in the W register. If `d' is `1', the result is placed back in register `f'. GOTO k INCF f,d 2010 Microchip Technology Inc. INCFSZ f,d Inclusive OR literal with W IORLW k IORWF f,d DS41302D-page 133 PIC12F609/615/617/12HV609/615 MOVF Move f Syntax: [ label ] Operands: 0 f 127 d [0,1] MOVF f,d MOVWF Move W to f Syntax: [ label ] MOVWF Operands: 0 f 127 Operation: (W) (f) f Operation: (f) (dest) Status Affected: None Status Affected: Z Description: Description: The contents of register `f' is moved to a destination dependent upon the status of `d'. If d = 0, destination is W register. If d = 1, the destination is file register `f' itself. d = 1 is useful to test a file register since Status flag Z is affected. Move data from W register to register `f'. Words: 1 Cycles: 1 Words: 1 Cycles: 1 Example: MOVF Example: MOVW F OPTION Before Instruction OPTION = W = After Instruction OPTION = W = FSR, 0 0xFF 0x4F 0x4F 0x4F After Instruction W = value in FSR register Z = 1 MOVLW Move literal to W NOP No Operation Syntax: [ label ] Syntax: [ label ] Operands: 0 k 255 Operands: None Operation: k (W) Operation: No operation Status Affected: None Status Affected: None Description: The eight-bit literal `k' is loaded into W register. The "don't cares" will assemble as `0's. Description: No operation. Words: 1 Cycles: 1 Words: 1 Cycles: 1 Example: MOVLW k Example: MOVLW NOP 0x5A After Instruction W = DS41302D-page 134 NOP 0x5A 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 RETFIE Return from Interrupt RETLW Return with literal in W Syntax: [ label ] Syntax: [ label ] Operands: None Operands: 0 k 255 Operation: TOS PC, 1 GIE Operation: k (W); TOS PC Status Affected: None Status Affected: None Description: Return from Interrupt. Stack is POPed and Top-of-Stack (TOS) is loaded in the PC. Interrupts are enabled by setting Global Interrupt Enable bit, GIE (INTCON<7>). This is a two-cycle instruction. Description: The W register is loaded with the eight-bit literal `k'. The program counter is loaded from the top of the stack (the return address). This is a two-cycle instruction. Words: 1 Cycles: 2 Example: RETFIE Words: 1 Cycles: 2 Example: RETFIE After Interrupt PC = GIE = TOS 1 TABLE RETLW k CALL TABLE;W contains ;table offset ;value GOTO DONE * * ADDWF PC ;W = offset RETLW k1 ;Begin table RETLW k2 ; * * * RETLW kn ;End of table DONE Before Instruction W = 0x07 After Instruction W = value of k8 2010 Microchip Technology Inc. RETURN Return from Subroutine Syntax: [ label ] Operands: None Operation: TOS PC Status Affected: None Description: Return from subroutine. The stack is POPed and the top of the stack (TOS) is loaded into the program counter. This is a two-cycle instruction. RETURN DS41302D-page 135 PIC12F609/615/617/12HV609/615 RLF Rotate Left f through Carry SLEEP Enter Sleep mode Syntax: [ label ] Syntax: [ label ] SLEEP Operands: 0 f 127 d [0,1] Operands: None Operation: Operation: See description below Status Affected: C Description: The contents of register `f' are rotated one bit to the left through the Carry flag. If `d' is `0', the result is placed in the W register. If `d' is `1', the result is stored back in register `f'. 00h WDT, 0 WDT prescaler, 1 TO, 0 PD RLF f,d C Words: 1 Cycles: 1 Example: Status Affected: TO, PD Description: The power-down Status bit, PD is cleared. Time-out Status bit, TO is set. Watchdog Timer and its prescaler are cleared. The processor is put into Sleep mode with the oscillator stopped. Register f RLF REG1,0 Before Instruction REG1 C = = 1110 0110 0 = = = 1110 0110 1100 1100 1 After Instruction REG1 W C RRF Rotate Right f through Carry SUBLW Syntax: [ label ] Syntax: [ label ] SUBLW k Operands: 0 f 127 d [0,1] Operands: 0 k 255 Operation: k - (W) W) Operation: See description below Status Affected: C, DC, Z Status Affected: C Description: Description: The contents of register `f' are rotated one bit to the right through the Carry flag. If `d' is `0', the result is placed in the W register. If `d' is `1', the result is placed back in register `f'. RRF f,d C DS41302D-page 136 Register f Subtract W from literal The W register is subtracted (2's complement method) from the eight-bit literal `k'. The result is placed in the W register. Result Condition C=0 Wk C=1 Wk DC = 0 W<3:0> k<3:0> DC = 1 W<3:0> k<3:0> 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 SUBWF Subtract W from f XORWF Exclusive OR W with f Syntax: [ label ] SUBWF f,d Syntax: [ label ] XORWF Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: (f) - (W) destination) Operation: (W) .XOR. (f) destination) Status Affected: C, DC, Z Status Affected: Z Description: Description: Exclusive OR the contents of the W register with register `f'. If `d' is `0', the result is stored in the W register. If `d' is `1', the result is stored back in register `f'. Subtract (2's complement method) W register from register `f'. If `d' is `0', the result is stored in the W register. If `d' is `1', the result is stored back in register `f'. C=0 Wf C=1 Wf DC = 0 W<3:0> f<3:0> DC = 1 W<3:0> f<3:0> SWAPF Swap Nibbles in f Syntax: [ label ] SWAPF f,d Operands: 0 f 127 d [0,1] Operation: (f<3:0>) (destination<7:4>), (f<7:4>) (destination<3:0>) Status Affected: None Description: The upper and lower nibbles of register `f' are exchanged. If `d' is `0', the result is placed in the W register. If `d' is `1', the result is placed in register `f'. XORLW f,d Exclusive OR literal with W Syntax: [ label ] XORLW k Operands: 0 k 255 Operation: (W) .XOR. k W) Status Affected: Z Description: The contents of the W register are XOR'ed with the eight-bit literal `k'. The result is placed in the W register. 2010 Microchip Technology Inc. DS41302D-page 137 PIC12F609/615/617/12HV609/615 NOTES: DS41302D-page 138 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 15.0 DEVELOPMENT SUPPORT The PIC(R) microcontrollers and dsPIC(R) digital signal controllers are supported with a full range of software and hardware development tools: * Integrated Development Environment - MPLAB(R) IDE Software * Compilers/Assemblers/Linkers - MPLAB C Compiler for Various Device Families - HI-TECH C for Various Device Families - MPASMTM Assembler - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB Assembler/Linker/Librarian for Various Device Families * Simulators - MPLAB SIM Software Simulator * Emulators - MPLAB REAL ICETM In-Circuit Emulator * In-Circuit Debuggers - MPLAB ICD 3 - PICkitTM 3 Debug Express * Device Programmers - PICkitTM 2 Programmer - MPLAB PM3 Device Programmer * Low-Cost Demonstration/Development Boards, Evaluation Kits, and Starter Kits 15.1 MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16/32-bit microcontroller market. The MPLAB IDE is a Windows(R) operating system-based application that contains: * A single graphical interface to all debugging tools - Simulator - Programmer (sold separately) - In-Circuit Emulator (sold separately) - In-Circuit Debugger (sold separately) * A full-featured editor with color-coded context * A multiple project manager * Customizable data windows with direct edit of contents * High-level source code debugging * Mouse over variable inspection * Drag and drop variables from source to watch windows * Extensive on-line help * Integration of select third party tools, such as IAR C Compilers The MPLAB IDE allows you to: * Edit your source files (either C or assembly) * One-touch compile or assemble, and download to emulator and simulator tools (automatically updates all project information) * Debug using: - Source files (C or assembly) - Mixed C and assembly - Machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost-effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increased flexibility and power. 2010 Microchip Technology Inc. DS41302D-page 139 PIC12F609/615/617/12HV609/615 15.2 MPLAB C Compilers for Various Device Families The MPLAB C Compiler code development systems are complete ANSI C compilers for Microchip's PIC18, PIC24 and PIC32 families of microcontrollers and the dsPIC30 and dsPIC33 families of digital signal controllers. These compilers provide powerful integration capabilities, superior code optimization and ease of use. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 15.3 HI-TECH C for Various Device Families The HI-TECH C Compiler code development systems are complete ANSI C compilers for Microchip's PIC family of microcontrollers and the dsPIC family of digital signal controllers. These compilers provide powerful integration capabilities, omniscient code generation and ease of use. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. The compilers include a macro assembler, linker, preprocessor, and one-step driver, and can run on multiple platforms. 15.4 MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for PIC10/12/16/18 MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel(R) standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM Assembler features include: 15.5 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler and the MPLAB C18 C Compiler. It can link relocatable objects from precompiled libraries, using directives from a linker script. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: * Efficient linking of single libraries instead of many smaller files * Enhanced code maintainability by grouping related modules together * Flexible creation of libraries with easy module listing, replacement, deletion and extraction 15.6 MPLAB Assembler, Linker and Librarian for Various Device Families MPLAB Assembler produces relocatable machine code from symbolic assembly language for PIC24, PIC32 and dsPIC devices. MPLAB C Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: * * * * * * Support for the entire device instruction set Support for fixed-point and floating-point data Command line interface Rich directive set Flexible macro language MPLAB IDE compatibility * Integration into MPLAB IDE projects * User-defined macros to streamline assembly code * Conditional assembly for multi-purpose source files * Directives that allow complete control over the assembly process DS41302D-page 140 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 15.7 MPLAB SIM Software Simulator The MPLAB SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC(R) DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB SIM Software Simulator fully supports symbolic debugging using the MPLAB C Compilers, and the MPASM and MPLAB Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool. 15.8 MPLAB REAL ICE In-Circuit Emulator System MPLAB REAL ICE In-Circuit Emulator System is Microchip's next generation high-speed emulator for Microchip Flash DSC and MCU devices. It debugs and programs PIC(R) Flash MCUs and dsPIC(R) Flash DSCs with the easy-to-use, powerful graphical user interface of the MPLAB Integrated Development Environment (IDE), included with each kit. The emulator is connected to the design engineer's PC using a high-speed USB 2.0 interface and is connected to the target with either a connector compatible with incircuit debugger systems (RJ11) or with the new highspeed, noise tolerant, Low-Voltage Differential Signal (LVDS) interconnection (CAT5). The emulator is field upgradable through future firmware downloads in MPLAB IDE. In upcoming releases of MPLAB IDE, new devices will be supported, and new features will be added. MPLAB REAL ICE offers significant advantages over competitive emulators including low-cost, full-speed emulation, run-time variable watches, trace analysis, complex breakpoints, a ruggedized probe interface and long (up to three meters) interconnection cables. 2010 Microchip Technology Inc. 15.9 MPLAB ICD 3 In-Circuit Debugger System MPLAB ICD 3 In-Circuit Debugger System is Microchip's most cost effective high-speed hardware debugger/programmer for Microchip Flash Digital Signal Controller (DSC) and microcontroller (MCU) devices. It debugs and programs PIC(R) Flash microcontrollers and dsPIC(R) DSCs with the powerful, yet easyto-use graphical user interface of MPLAB Integrated Development Environment (IDE). The MPLAB ICD 3 In-Circuit Debugger probe is connected to the design engineer's PC using a high-speed USB 2.0 interface and is connected to the target with a connector compatible with the MPLAB ICD 2 or MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3 supports all MPLAB ICD 2 headers. 15.10 PICkit 3 In-Circuit Debugger/ Programmer and PICkit 3 Debug Express The MPLAB PICkit 3 allows debugging and programming of PIC(R) and dsPIC(R) Flash microcontrollers at a most affordable price point using the powerful graphical user interface of the MPLAB Integrated Development Environment (IDE). The MPLAB PICkit 3 is connected to the design engineer's PC using a full speed USB interface and can be connected to the target via an Microchip debug (RJ-11) connector (compatible with MPLAB ICD 3 and MPLAB REAL ICE). The connector uses two device I/O pins and the reset line to implement in-circuit debugging and In-Circuit Serial ProgrammingTM. The PICkit 3 Debug Express include the PICkit 3, demo board and microcontroller, hookup cables and CDROM with user's guide, lessons, tutorial, compiler and MPLAB IDE software. DS41302D-page 141 PIC12F609/615/617/12HV609/615 15.11 PICkit 2 Development Programmer/Debugger and PICkit 2 Debug Express 15.13 Demonstration/Development Boards, Evaluation Kits, and Starter Kits The PICkitTM 2 Development Programmer/Debugger is a low-cost development tool with an easy to use interface for programming and debugging Microchip's Flash families of microcontrollers. The full featured Windows(R) programming interface supports baseline (PIC10F, PIC12F5xx, PIC16F5xx), midrange (PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30, dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit microcontrollers, and many Microchip Serial EEPROM products. With Microchip's powerful MPLAB Integrated Development Environment (IDE) the PICkitTM 2 enables in-circuit debugging on most PIC(R) microcontrollers. In-Circuit-Debugging runs, halts and single steps the program while the PIC microcontroller is embedded in the application. When halted at a breakpoint, the file registers can be examined and modified. A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. The PICkit 2 Debug Express include the PICkit 2, demo board and microcontroller, hookup cables and CDROM with user's guide, lessons, tutorial, compiler and MPLAB IDE software. 15.12 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages and a modular, detachable socket assembly to support various package types. The ICSPTM cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an MMC card for file storage and data applications. DS41302D-page 142 The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEMTM and dsPICDEMTM demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ(R) security ICs, CAN, IrDA(R), PowerSmart battery management, SEEVAL(R) evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Also available are starter kits that contain everything needed to experience the specified device. This usually includes a single application and debug capability, all on one board. Check the Microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits. 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 16.0 ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings() Ambient temperature under bias..........................................................................................................-40 to +125C Storage temperature ........................................................................................................................ -65C to +150C Voltage on VDD with respect to VSS ................................................................................................... -0.3V to +6.5V Voltage on MCLR with respect to Vss ............................................................................................... -0.3V to +13.5V Voltage on all other pins with respect to VSS ........................................................................... -0.3V to (VDD + 0.3V) Total power dissipation(1) ............................................................................................................................... 800 mW Maximum current out of VSS pin ...................................................................................................................... 95 mA Maximum current into VDD pin ......................................................................................................................... 95 mA Input clamp current, IIK (VI < 0 or VI > VDD)20 mA Output clamp current, IOK (Vo < 0 or Vo >VDD)20 mA Maximum output current sunk by any I/O pin.................................................................................................... 25 mA Maximum output current sourced by any I/O pin .............................................................................................. 25 mA Maximum current sunk by GPIO ...................................................................................................................... 90 mA Maximum current sourced GPIO...................................................................................................................... 90 mA Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD - IOH} + {(VDD - VOH) x IOH} + (VOl x IOL). NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended periods may affect device reliability. 2010 Microchip Technology Inc. DS41302D-page 143 PIC12F609/615/617/12HV609/615 FIGURE 16-1: PIC12F609/615/617 VOLTAGE-FREQUENCY GRAPH, -40C TA +125C 5.5 5.0 VDD (V) 4.5 4.0 3.5 3.0 2.5 2.0 0 8 10 20 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. FIGURE 16-2: PIC12HV609/615 VOLTAGE-FREQUENCY GRAPH, -40C TA +125C 5.0 VDD (V) 4.5 4.0 3.5 3.0 2.5 2.0 0 8 10 20 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. DS41302D-page 144 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 16.1 DC Characteristics: PIC12F609/615/617/12HV609/615-I (Industrial) PIC12F609/615/617/12HV609/615-E (Extended) DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial -40C TA +125C for extended Param No. Min Typ Max Units 2.0 -- 5.5 V Sym VDD D001 Characteristic Conditions Supply Voltage PIC12F609/615/617 (2) FOSC < = 4 MHz D001 PIC12HV609/615 2.0 -- -- V FOSC < = 4 MHz D001B PIC12F609/615/617 2.0 -- 5.5 V FOSC < = 8 MHz D001B PIC12HV609/615 2.0 -- --(2) V FOSC < = 8 MHz D001C PIC12F609/615/617 3.0 -- 5.5 V FOSC < = 10 MHz D001C PIC12HV609/615 3.0 -- --(2) V FOSC < = 10 MHz D001D PIC12F609/615/617 4.5 -- 5.5 V FOSC < = 20 MHz D001D PIC12HV609/615 4.5 -- --(2) V FOSC < = 20 MHz D002* VDR RAM Data Retention Voltage(1) 1.5 -- -- V Device in Sleep mode D003 VPOR VDD Start Voltage to ensure internal Power-on Reset signal -- VSS -- V See Section 12.3.1 "Power-on Reset (POR)" for details. D004* SVDD VDD Rise Rate to ensure internal Power-on Reset signal 0.05 -- -- V/ms See Section 12.3.1 "Power-on Reset (POR)" for details. * These parameters are characterized but not tested. Data in "Typ" column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data. 2: User defined. Voltage across the shunt regulator should not exceed 5V. 2010 Microchip Technology Inc. DS41302D-page 145 PIC12F609/615/617/12HV609/615 16.2 DC Characteristics: PIC12F609/615/617-I (Industrial) PIC12F609/615/617-E (Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial -40C TA +125C for extended DC CHARACTERISTICS Param No. D010 Conditions Device Characteristics PIC12F609/615/617 D011* D012 D013* D014 D016* D017 D018 D019 Note 1: 2: 3: Typ Max Units Note VDD Supply Current (IDD) * Min (1, 2) -- 13 25 A 2.0 -- 19 29 A 3.0 -- 32 51 A 5.0 -- 135 225 A 2.0 -- 185 285 A 3.0 -- 300 405 A 5.0 -- 240 360 A 2.0 -- 360 505 A 3.0 -- 0.66 1.0 mA 5.0 -- 75 110 A 2.0 -- 155 255 A 3.0 -- 345 530 A 5.0 -- 185 255 A 2.0 -- 325 475 A 3.0 -- 0.665 1.0 mA 5.0 -- 245 340 A 2.0 -- 360 485 A 3.0 -- 0.620 0.845 mA 5.0 -- 395 550 A 2.0 -- 0.620 0.850 mA 3.0 -- 1.2 1.6 mA 5.0 -- 175 235 A 2.0 -- 285 390 A 3.0 -- 530 750 A 5.0 -- 2.2 3.1 mA 4.5 -- 2.8 3.35 mA 5.0 FOSC = 32 kHz LP Oscillator mode FOSC = 1 MHz XT Oscillator mode FOSC = 4 MHz XT Oscillator mode FOSC = 1 MHz EC Oscillator mode FOSC = 4 MHz EC Oscillator mode FOSC = 4 MHz INTOSC mode FOSC = 8 MHz INTOSC mode FOSC = 4 MHz EXTRC mode(3) FOSC = 20 MHz HS Oscillator mode These parameters are characterized but not tested. Data in "Typ" column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-torail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended by the formula IR = VDD/2REXT (mA) with REXT in KOhms (K DS41302D-page 146 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 16.3 DC Characteristics: PIC12HV609/615-I (Industrial) PIC12HV609/615-E (Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial -40C TA +125C for extended DC CHARACTERISTICS Param No. D010 Conditions Device Characteristics Min Typ Max Units -- 160 230 A 2.0 -- 240 310 A 3.0 -- 280 400 A 4.5 -- 270 380 A 2.0 Note VDD Supply Current (IDD) PIC12HV609/615 D011* D012 D013* D014 D016* D017 D018 D019 (1, 2) -- 400 560 A 3.0 -- 520 780 A 4.5 -- 380 540 A 2.0 -- 575 810 A 3.0 -- 0.875 1.3 mA 4.5 -- 215 310 A 2.0 -- 375 565 A 3.0 -- 570 870 A 4.5 -- 330 475 A 2.0 -- 550 800 A 3.0 -- 0.85 1.2 mA 4.5 -- 310 435 A 2.0 -- 500 700 A 3.0 -- 0.74 1.1 mA 4.5 -- 460 650 A 2.0 -- 0.75 1.1 mA 3.0 -- 1.2 1.6 mA 4.5 -- 320 465 A 2.0 -- 510 750 A 3.0 -- 0.770 1.0 mA 4.5 -- 2.5 3.4 mA 4.5 FOSC = 32 kHz LP Oscillator mode FOSC = 1 MHz XT Oscillator mode FOSC = 4 MHz XT Oscillator mode FOSC = 1 MHz EC Oscillator mode FOSC = 4 MHz EC Oscillator mode FOSC = 4 MHz INTOSC mode FOSC = 8 MHz INTOSC mode FOSC = 4 MHz EXTRC mode(3) FOSC = 20 MHz HS Oscillator mode * These parameters are characterized but not tested. Data in "Typ" column is at 4.5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. 3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended by the formula IR = VDD/2REXT (mA) with REXT in k 2010 Microchip Technology Inc. DS41302D-page 147 PIC12F609/615/617/12HV609/615 16.4 DC Characteristics: PIC12F609/615/617 - I (Industrial) DC CHARACTERISTICS Param No. D020 Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial Conditions Device Characteristics Min Typ Max Units Note VDD 0.9 A 2.0 0.15 1.2 A 3.0 0.35 1.5 A 5.0 150 500 nA 3.0 -40C TA +25C for industrial -- 0.5 1.5 A 2.0 WDT Current(1) -- 2.5 4.0 A 3.0 Power-down Base Current (IPD)(2) -- -- PIC12F609/615/617 -- D021 0.05 -- 9.5 17 A 5.0 D022 -- 5.0 9 A 3.0 -- 6.0 12 A 5.0 D023 -- 50 60 A 2.0 D024 D025* D026 D027 -- 55 65 A 3.0 -- 60 75 A 5.0 -- 30 40 A 2.0 -- 45 60 A 3.0 -- 75 105 A 5.0 -- 39 50 A 2.0 -- 59 80 A 3.0 -- 98 130 A 5.0 -- 5.5 10 A 2.0 -- 7.0 12 A 3.0 -- 8.5 14 A 5.0 -- 0.2 1.6 A 3.0 -- 0.36 1.9 A 5.0 WDT, BOR, Comparator, VREF and T1OSC disabled BOR Current(1) Comparator Current(1), single comparator enabled CVREF Current(1) (high range) CVREF Current(1) (low range) T1OSC Current(1), 32.768 kHz A/D Current(1), no conversion in progress * These parameters are characterized but not tested. Data in "Typ" column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral current can be determined by subtracting the base IDD or IPD current from this limit. Max values should be used when calculating total current consumption. 2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD. DS41302D-page 148 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 16.5 DC Characteristics: PIC12F609/615/617 - E (Extended) DC CHARACTERISTICS Param No. D020E Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +125C for extended Conditions Device Characteristics Power-down Base Current (IPD)(2) PIC12F609/615/617 D021E D022E D023E D024E D025E* D026E D027E Min Typ Max Units VDD Note WDT, BOR, Comparator, VREF and T1OSC disabled -- 0.05 4.0 A 2.0 -- 0.15 5.0 A 3.0 -- 0.35 8.5 A 5.0 -- 0.5 5.0 A 2.0 -- 2.5 8.0 A 3.0 -- 9.5 19 A 5.0 -- 5.0 15 A 3.0 -- 6.0 19 A 5.0 -- 50 70 A 2.0 -- 55 75 A 3.0 -- 60 80 A 5.0 -- 30 40 A 2.0 -- 45 60 A 3.0 -- 75 105 A 5.0 -- 39 50 A 2.0 -- 59 80 A 3.0 -- 98 130 A 5.0 -- 5.5 16 A 2.0 -- 7.0 18 A 3.0 -- 8.5 22 A 5.0 -- 0.2 6.5 A 3.0 -- 0.36 10 A 5.0 WDT Current(1) BOR Current(1) Comparator Current(1), single comparator enabled CVREF Current(1) (high range) CVREF Current(1) (low range) T1OSC Current(1), 32.768 kHz A/D Current(1), no conversion in progress * These parameters are characterized but not tested. Data in "Typ" column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral current can be determined by subtracting the base IDD or IPD current from this limit. Max values should be used when calculating total current consumption. 2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD. 2010 Microchip Technology Inc. DS41302D-page 149 PIC12F609/615/617/12HV609/615 16.6 DC Characteristics: PIC12HV609/615 - I (Industrial) DC CHARACTERISTICS Param No. D020 Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial Conditions Device Characteristics Min Typ Max Units Power-down Base Current (IPD)(2,3) -- 135 200 A 2.0 -- 210 280 A 3.0 PIC12HV609/615 -- 260 350 A 4.5 -- 135 200 A 2.0 -- 210 285 A 3.0 Note VDD D021 -- 265 360 A 4.5 D022 -- 215 285 A 3.0 -- 265 360 A 4.5 D023 -- 185 270 A 2.0 D024 D025* D026 D027 -- 265 350 A 3.0 -- 320 430 A 4.5 -- 165 235 A 2.0 -- 255 330 A 3.0 -- 330 430 A 4.5 -- 175 245 A 2.0 -- 275 350 A 3.0 -- 355 450 A 4.5 -- 140 205 A 2.0 -- 220 290 A 3.0 -- 270 360 A 4.5 -- 210 280 A 3.0 -- 260 350 A 4.5 WDT, BOR, Comparator, VREF and T1OSC disabled WDT Current(1) BOR Current(1) Comparator Current(1), single comparator enabled CVREF Current(1) (high range) CVREF Current(1) (low range) T1OSC Current(1), 32.768 kHz A/D Current(1), no conversion in progress * These parameters are characterized but not tested. Data in "Typ" column is at 4.5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral current can be determined by subtracting the base IDD or IPD current from this limit. Max values should be used when calculating total current consumption. 2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD. 3: Shunt regulator is always on and always draws operating current. DS41302D-page 150 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 16.7 DC Characteristics: PIC12HV609/615-E (Extended) DC CHARACTERISTICS Param No. D020E Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +125C for extended Conditions Device Characteristics Min Typ Max Units VDD Power-down Base Current (IPD)(2,3) PIC12HV609/615 D021E -- 135 200 A 2.0 -- 210 280 A 3.0 -- 260 350 A 4.5 -- 135 200 A 2.0 -- 210 285 A 3.0 -- 265 360 A 4.5 D022E -- 215 285 A 3.0 -- 265 360 A 4.5 D023E -- 185 280 A 2.0 D024E D025E* D026E D027E -- 265 360 A 3.0 -- 320 430 A 4.5 -- 165 235 A 2.0 -- 255 330 A 3.0 -- 330 430 A 4.5 -- 175 245 A 2.0 -- 275 350 A 3.0 -- 355 450 A 4.5 -- 140 205 A 2.0 -- 220 290 A 3.0 -- 270 360 A 4.5 -- 210 280 A 3.0 -- 260 350 A 4.5 Note WDT, BOR, Comparator, VREF and T1OSC disabled WDT Current(1) BOR Current(1) Comparator Current(1), single comparator enabled CVREF Current(1) (high range) CVREF Current(1) (low range) T1OSC Current(1), 32.768 kHz A/D Current(1), no conversion in progress * These parameters are characterized but not tested. Data in "Typ" column is at 4.5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral current can be determined by subtracting the base IDD or IPD current from this limit. Max values should be used when calculating total current consumption. 2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD. 3: Shunt regulator is always on and always draws operating current. 2010 Microchip Technology Inc. DS41302D-page 151 PIC12F609/615/617/12HV609/615 16.8 DC Characteristics: PIC12F609/615/617/12HV609/615-I (Industrial) PIC12F609/615/617/12HV609/615-E (Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial -40C TA +125C for extended DC CHARACTERISTICS Param No. Sym VIL Characteristic Min Typ Max Units Vss Vss Conditions -- 0.8 V 4.5V VDD 5.5V -- 0.15 VDD V 2.0V VDD 4.5V Vss -- 0.2 VDD V 2.0V VDD 5.5V 0.2 VDD V (NOTE 1) Input Low Voltage I/O port: D030 with TTL buffer D030A D031 with Schmitt Trigger buffer D032 MCLR, OSC1 (RC mode) VSS -- D033 OSC1 (XT and LP modes) VSS -- 0.3 V D033A OSC1 (HS mode) VSS -- 0.3 VDD V VIH Input High Voltage I/O ports: D040 with TTL buffer D040A D041 with Schmitt Trigger buffer -- 2.0 -- VDD V 4.5V VDD 5.5V 0.25 VDD + 0.8 -- VDD V 2.0V VDD 4.5V 0.8 VDD -- VDD V 2.0V VDD 5.5V 0.8 VDD -- VDD V D042 MCLR D043 OSC1 (XT and LP modes) 1.6 -- VDD V D043A OSC1 (HS mode) 0.7 VDD -- VDD V D043B OSC1 (RC mode) 0.9 VDD -- VDD V (NOTE 1) Input Leakage Current(2,3) IIL D060 I/O ports -- 0.1 1 A VSS VPIN VDD, Pin at high-impedance D061 GP3/MCLR(3,4) -- 0.7 5 A VSS VPIN VDD D063 OSC1 -- 0.1 5 A VSS VPIN VDD, XT, HS and LP oscillator configuration IPUR GPIO Weak Pull-up Current(5) 50 250 400 A VDD = 5.0V, VPIN = VSS VOL Output Low Voltage -- -- 0.6 V IOL = 7.0 mA, VDD = 4.5V, -40C to +125C I/O ports -- -- 0.6 V IOL = 8.5 mA, VDD = 4.5V, -40C to +85C Output High Voltage VDD - 0.7 -- -- V IOH = -2.5mA, VDD = 4.5V, -40C to +125C I/O ports(2) VDD - 0.7 -- -- V IOH = -3.0 mA, VDD = 4.5V, -40C to +85C D070* D080 VOH D090 * Note 1: 2: 3: 4: 5: 6: These parameters are characterized but not tested. Data in "Typ" column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external clock in RC mode. Negative current is defined as current sourced by the pin. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. This specification applies to GP3/MCLR configured as GP3 with the internal weak pull-up disabled. This specification applies to all weak pull-up pins, including the weak pull-up found on GP3/MCLR. When GP3/MCLR is configured as MCLR reset pin, the weak pull-up is always enabled. Applies to PIC12F617 only. DS41302D-page 152 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 16.8 DC Characteristics: PIC12F609/615/617/12HV609/615-I (Industrial) PIC12F609/615/617/12HV609/615-E (Extended) (Continued) Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial -40C TA +125C for extended DC CHARACTERISTICS Param No. Sym D101* COSC2 D101A* CIO Characteristic Min Typ Max Units Capacitive Loading Specs on Output Pins OSC2 pin -- -- 15 pF All I/O pins -- -- 50 pF Conditions In XT, HS and LP modes when external clock is used to drive OSC1 Program Flash Memory D130 EP Cell Endurance 10K 100K -- E/W D130A ED Cell Endurance 1K 10K -- E/W D131 VPR VDD for Read VMIN -- 5.5 V V D132 VPEW VDD for Bulk Erase/Write D132A VPEW VDD for Row Erase/Write(6) D133 TPEW D134 TRETD * Note 1: 2: 3: 4: 5: 6: 4.5 -- 5.5 VMIN -- 5.5 V Erase/Write cycle time -- 2 2.5 ms Characteristic Retention 40 -- -- -40C TA +85C +85C TA +125C VMIN = Minimum operating voltage Year Provided no other specifications are violated These parameters are characterized but not tested. Data in "Typ" column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external clock in RC mode. Negative current is defined as current sourced by the pin. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. This specification applies to GP3/MCLR configured as GP3 with the internal weak pull-up disabled. This specification applies to all weak pull-up pins, including the weak pull-up found on GP3/MCLR. When GP3/MCLR is configured as MCLR reset pin, the weak pull-up is always enabled. Applies to PIC12F617 only. 2010 Microchip Technology Inc. DS41302D-page 153 PIC12F609/615/617/12HV609/615 16.9 Thermal Considerations Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +125C Param No. Sym Characteristic Typ Units 84.6* 149.5* 211* 60* 44* 41.2* 39.9* 39* 9* 3.0* 150* -- -- C/W C/W C/W C/W C/W C/W C/W C/W C/W C/W C W W Conditions TH01 JA Thermal Resistance Junction to Ambient TH02 JC Thermal Resistance Junction to Case TH03 TH04 TH05 TDIE Die Temperature PD Power Dissipation PINTERNAL Internal Power Dissipation TH06 PI/O I/O Power Dissipation -- W TH07 PDER Derated Power -- W * Note 1: 2: These parameters are characterized but not tested. IDD is current to run the chip alone without driving any load on the output pins. TA = Ambient temperature. DS41302D-page 154 8-pin PDIP package 8-pin SOIC package 8-pin MSOP package 8-pin DFN 3x3mm package 8-pin DFN 4x4mm package 8-pin PDIP package 8-pin SOIC package 8-pin MSOP package 8-pin DFN 3x3mm package 8-pin DFN 4x4mm package PD = PINTERNAL + PI/O PINTERNAL = IDD x VDD (NOTE 1) PI/O = (IOL * VOL) + (IOH * (VDD VOH)) PDER = PDMAX (TDIE - TA)/JA (NOTE 2) 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 16.10 Timing Parameter Symbology The timing parameter symbols have been created with one of the following formats: 1. TppS2ppS 2. TppS T F Frequency Lowercase letters (pp) and their meanings: pp cc CCP1 ck CLKOUT cs CS di SDI do SDO dt Data in io I/O Port mc MCLR Uppercase letters and their meanings: S F Fall H High I Invalid (High-impedance) L Low FIGURE 16-3: T Time osc rd rw sc ss t0 t1 wr OSC1 RD RD or WR SCK SS T0CKI T1CKI WR P R V Z Period Rise Valid High-impedance LOAD CONDITIONS Load Condition Pin CL VSS Legend: CL=50 pF for all pins 15 pF for OSC2 output 2010 Microchip Technology Inc. DS41302D-page 155 PIC12F609/615/617/12HV609/615 16.11 AC Characteristics: PIC12F609/615/617/12HV609/615 (Industrial, Extended) FIGURE 16-4: CLOCK TIMING Q4 Q1 Q2 Q3 Q4 Q1 OSC1/CLKIN OS02 OS04 OS04 OS03 OSC2/CLKOUT (LP,XT,HS Modes) OSC2/CLKOUT (CLKOUT Mode) TABLE 16-1: CLOCK OSCILLATOR TIMING REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +125C Param No. Sym OS01 FOSC Characteristic External CLKIN Frequency(1) (1) Oscillator Frequency OS02 TOSC External CLKIN Period(1) Oscillator Period(1) OS03 TCY Instruction Cycle Time(1) OS04* TOSH, TOSL External CLKIN High, External CLKIN Low TOSR, TOSF External CLKIN Rise, External CLKIN Fall OS05* * Note 1: Min Typ Max Units Conditions DC -- 37 kHz DC -- 4 MHz XT Oscillator mode DC -- 20 MHz HS Oscillator mode DC -- 20 MHz EC Oscillator mode LP Oscillator mode -- 32.768 -- kHz LP Oscillator mode 0.1 -- 4 MHz XT Oscillator mode 1 -- 20 MHz HS Oscillator mode DC -- 4 MHz RC Oscillator mode 27 -- s LP Oscillator mode 250 -- ns XT Oscillator mode 50 -- ns HS Oscillator mode 50 -- ns EC Oscillator mode -- 30.5 -- s LP Oscillator mode 250 -- 10,000 ns XT Oscillator mode 50 -- 1,000 ns HS Oscillator mode 250 -- -- ns RC Oscillator mode 200 TCY DC ns TCY = 4/FOSC 2 -- -- s LP oscillator 100 -- -- ns XT oscillator 20 -- -- ns HS oscillator 0 -- ns LP oscillator 0 -- ns XT oscillator 0 -- ns HS oscillator These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at "min" values with an external clock applied to OSC1 pin. When an external clock input is used, the "max" cycle time limit is "DC" (no clock) for all devices. DS41302D-page 156 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 TABLE 16-2: OSCILLATOR PARAMETERS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40C TA +125C Param No. Sym Characteristic OS06 TWARM Internal Oscillator Switch when running(3) OS07 INTOSC Internal Calibrated INTOSC Frequency(2) (4MHz) OS08 INTOSC OS10* Internal Calibrated INTOSC Frequency(2) (8MHz) TIOSC ST INTOSC Oscillator Wakeup from Sleep Start-up Time * Note 1: 2: 3: Freq. Tolerance Min Typ Max Units -- -- -- 2 TOSC Conditions Slowest clock 1% 3.96 4.0 4.04 MHz VDD = 3.5V, TA = 25C 2% 3.92 4.0 4.08 MHz 2.5V VDD 5.5V, 0C TA +85C 5% 3.80 4.0 4.2 MHz 2.0V VDD 5.5V, -40C TA +85C (Ind.), -40C TA +125C (Ext.) 1% 7.92 8.0 8.08 MHz VDD = 3.5V, TA = 25C 2% 7.84 8.0 8.16 MHz 2.5V VDD 5.5V, 0C TA +85C 5% 7.60 8.0 8.40 MHz 2.0V VDD 5.5V, -40C TA +85C (Ind.), -40C TA +125C (Ext.) -- 5.5 12 24 s VDD = 2.0V, -40C to +85C -- 3.5 7 14 s VDD = 3.0V, -40C to +85C -- 3 6 11 s VDD = 5.0V, -40C to +85C These parameters are characterized but not tested. Data in "Typ" column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at "min" values with an external clock applied to the OSC1 pin. When an external clock input is used, the "max" cycle time limit is "DC" (no clock) for all devices. To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1 F and 0.01 F values in parallel are recommended. By design. 2010 Microchip Technology Inc. DS41302D-page 157 PIC12F609/615/617/12HV609/615 FIGURE 16-5: CLKOUT AND I/O TIMING Cycle Write Fetch Read Execute Q4 Q1 Q2 Q3 FOSC OS12 OS11 OS20 OS21 CLKOUT OS19 OS18 OS16 OS13 OS17 I/O pin (Input) OS14 OS15 I/O pin (Output) New Value Old Value OS18, OS19 TABLE 16-3: CLKOUT AND I/O TIMING PARAMETERS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40C TA +125C Param No. Sym Characteristic Min Typ Max Units Conditions TOSH2CKL FOSC to CLKOUT (1) -- -- 70 ns VDD = 5.0V OS12 TOSH2CKH FOSC to CLKOUT -- -- 72 ns VDD = 5.0V OS13 TCKL2IOV CLKOUT to Port out valid(1) -- -- 20 ns OS14 TIOV2CKH Port input valid before CLKOUT(1) TOSC + 200 ns -- -- ns OS15 TOSH2IOV FOSC (Q1 cycle) to Port out valid -- 50 70* ns VDD = 5.0V OS16 TOSH2IOI FOSC (Q2 cycle) to Port input invalid (I/O in hold time) 50 -- -- ns VDD = 5.0V OS17 TIOV2OSH Port input valid to FOSC(Q2 cycle) (I/O in setup time) 20 -- -- ns OS18 TIOR Port output rise time(2) -- -- 15 40 72 32 ns VDD = 2.0V VDD = 5.0V OS19 TIOF Port output fall time(2) -- -- 28 15 55 30 ns VDD = 2.0V VDD = 5.0V OS20* TINP INT pin input high or low time 25 -- -- ns OS21* TRAP GPIO interrupt-on-change new input level time TCY -- -- ns OS11 * Note 1: 2: (1) These parameters are characterized but not tested. Data in "Typ" column is at 5.0V, 25C unless otherwise stated. Measurements are taken in RC mode where CLKOUT output is 4 x TOSC. Includes OSC2 in CLKOUT mode. DS41302D-page 158 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 FIGURE 16-6: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING VDD MCLR 30 Internal POR 33 PWRT Time-out 32 OSC Start-Up Time Internal Reset(1) Watchdog Timer Reset(1) 31 34 34 I/O pins Note 1: FIGURE 16-7: Asserted low. BROWN-OUT RESET TIMING AND CHARACTERISTICS VDD VBOR + VHYST VBOR (Device in Brown-out Reset) (Device not in Brown-out Reset) 37 Reset (due to BOR) * 33* 64 ms delay only if PWRTE bit in the Configuration Word register is programmed to `0'. 2010 Microchip Technology Inc. DS41302D-page 159 PIC12F609/615/617/12HV609/615 TABLE 16-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER AND BROWN-OUT RESET PARAMETERS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40C TA +125C Param No. Sym Characteristic Min Typ Max Units Conditions 30 TMCL MCLR Pulse Width (low) 2 5 -- -- -- -- s s VDD = 5V, -40C to +85C VDD = 5V, -40C to +125C 31* TWDT Watchdog Timer Time-out Period (No Prescaler) 10 10 20 20 30 35 ms ms VDD = 5V, -40C to +85C VDD = 5V, -40C to +125C 32 TOST Oscillation Start-up Timer Period(1, 2) -- 1024 -- 33* TPWRT Power-up Timer Period 40 65 140 ms 34* TIOZ I/O High-impedance from MCLR Low or Watchdog Timer Reset -- -- 2.0 s 35 VBOR Brown-out Reset Voltage 2.0 2.15 2.3 V 36* VHYST Brown-out Reset Hysteresis -- 100 -- mV 37* TBOR Brown-out Reset Minimum Detection Period 100 -- -- s TOSC (NOTE 3) (NOTE 4) VDD VBOR * These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at "min" values with an external clock applied to the OSC1 pin. When an external clock input is used, the "max" cycle time limit is "DC" (no clock) for all devices. 2: By design. 3: Period of the slower clock. 4: To ensure these voltage tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1 F and 0.01 F values in parallel are recommended. DS41302D-page 160 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 FIGURE 16-8: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS T0CKI 40 41 42 T1CKI 45 46 49 47 TMR0 or TMR1 TABLE 16-5: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40C TA +125C Param No. 40* Sym TT0H Characteristic T0CKI High Pulse Width No Prescaler With Prescaler 41* TT0L T0CKI Low Pulse Width No Prescaler With Prescaler 42* TT0P T0CKI Period 45* TT1H T1CKI High Synchronous, No Prescaler Time Synchronous, with Prescaler Asynchronous 46* TT1L T1CKI Low Time Synchronous, No Prescaler Synchronous, with Prescaler Asynchronous 47* TT1P T1CKI Input Synchronous Period 48 FT1 Timer1 Oscillator Input Frequency Range (oscillator enabled by setting bit T1OSCEN) 49* TCKEZTMR1 Delay from External Clock Edge to Timer Increment Asynchronous * Min Typ Max Units 0.5 TCY + 20 -- -- ns 10 -- -- ns 0.5 TCY + 20 -- -- ns 10 -- -- ns Greater of: 20 or TCY + 40 N -- -- ns 0.5 TCY + 20 -- -- ns 15 -- -- ns 30 -- -- ns 0.5 TCY + 20 -- -- ns 15 -- -- ns 30 -- -- ns Greater of: 30 or TCY + 40 N -- -- ns 60 -- -- ns -- 32.768 -- kHz 2 TOSC -- 7 TOSC -- Conditions N = prescale value (2, 4, ..., 256) N = prescale value (1, 2, 4, 8) Timers in Sync mode These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2010 Microchip Technology Inc. DS41302D-page 161 PIC12F609/615/617/12HV609/615 FIGURE 16-9: PIC12F615/617/HV615 CAPTURE/COMPARE/PWM TIMINGS (ECCP) CCP1 (Capture mode) CC01 CC02 CC03 Note: TABLE 16-6: Refer to Figure 16-3 for load conditions. PIC12F615/617/HV615 CAPTURE/COMPARE/PWM REQUIREMENTS (ECCP) Standard Operating Conditions (unless otherwise stated) Operating Temperature -40C TA +125C Param No. CC01* CC02* CC03* Sym TccL TccH TccP Characteristic CCP1 Input Low Time CCP1 Input High Time Min Typ Max Units No Prescaler 0.5TCY + 20 -- -- ns With Prescaler 20 -- -- ns No Prescaler 0.5TCY + 20 -- -- ns With Prescaler 20 -- -- ns 3TCY + 40 N -- -- ns CCP1 Input Period Conditions N = prescale value (1, 4 or 16) * These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. TABLE 16-7: COMPARATOR SPECIFICATIONS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40C TA +125C Param No. Sym Characteristics CM01 VOS Input Offset Voltage(2) CM02 VCM Input Common Mode Voltage CM03* CMRR Common Mode Rejection Ratio CM04* TRT Response Time(1) Input Hysteresis Voltage Typ Max Units -- 5.0 10 mV 0 -- VDD - 1.5 V +55 -- -- dB Falling -- 150 600 ns Rising -- 200 1000 ns -- -- 10 s -- 45 60 mV CM05* TMC2COV Comparator Mode Change to Output Valid CM06* VHYS Min Comments * These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Response time is measured with one comparator input at (VDD - 1.5)/2 - 100 mV to (VDD - 1.5)/2 + 20 mV. The other input is at (VDD -1.5)/2. 2: Input offset voltage is measured with one comparator input at (VDD - 1.5V)/2. DS41302D-page 162 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 TABLE 16-8: COMPARATOR VOLTAGE REFERENCE (CVREF) SPECIFICATIONS Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +125C Param No. Sym Characteristics Min Typ Max Units Comments CV01* CLSB Step Size(2) -- -- VDD/24 VDD/32 -- -- V V Low Range (VRR = 1) High Range (VRR = 0) CV02* CACC Absolute Accuracy(3) -- -- -- -- 1/2 1/2 LSb LSb Low Range (VRR = 1) High Range (VRR = 0) CV03* CR Unit Resistor Value (R) -- 2k -- CV04* CST Settling Time(1) -- -- 10 s * These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Settling time measured while VRR = 1 and VR<3:0> transitions from `0000' to `1111'. 2: See Section 9.10 "Comparator Voltage Reference" for more information. 3: Absolute Accuracy when CVREF output is (VDD -1.5). TABLE 16-9: VOLTAGE REFERENCE SPECIFICATIONS VR Voltage Reference Specifications Param No. Symbol Characteristics Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +125C Min Typ Max Units VR01 VP6OUT VP6 voltage output 0.5 0.6 0.7 V VR02 V1P2OUT V1P2 voltage output 1.05 1.20 1.35 V TSTABLE Settling Time -- 10 -- s VR03* * Comments These parameters are characterized but not tested. TABLE 16-10: SHUNT REGULATOR SPECIFICATIONS (PIC12HV609/615 only) SHUNT REGULATOR CHARACTERISTICS Param No. Symbol Characteristics SR01 VSHUNT Shunt Voltage SR02 ISHUNT SR03* TSETTLE Settling Time SR04 CLOAD Load Capacitance SR05 ISNT Regulator operating current * Shunt Current Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +125C Min Typ Max Units 4.75 5 5.4 V 4 -- 50 mA Comments -- -- 150 ns To 1% of final value 0.01 -- 10 F Bypass capacitor on VDD pin -- 180 -- A Includes band gap reference current These parameters are characterized but not tested. 2010 Microchip Technology Inc. DS41302D-page 163 PIC12F609/615/617/12HV609/615 TABLE 16-11: PIC12F615/617/HV615 A/D CONVERTER (ADC) CHARACTERISTICS: Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +125C Param Sym No. Characteristic Min Typ Max Units Conditions AD01 NR Resolution -- -- 10 bits AD02 EIL Integral Error -- -- 1 LSb VREF = 5.12V(5) AD03 EDL Differential Error -- -- 1 LSb No missing codes to 10 bits VREF = 5.12V(5) AD04 EOFF Offset Error -- +1.5 +2.0 LSb VREF = 5.12V(5) AD07 EGN Gain Error -- -- 1 LSb VREF = 5.12V(5) 2.2 2.5 -- -- VDD V (3) bit AD06 VREF AD06A Reference Voltage AD07 VAIN Full-Scale Range VSS -- VREF V AD08 ZAIN Recommended Impedance of Analog Voltage Source -- -- 10 k AD09* IREF VREF Input Current(3) 10 -- 1000 A During VAIN acquisition. Based on differential of VHOLD to VAIN. -- -- 50 A During A/D conversion cycle. Absolute minimum to ensure 1 LSb accuracy * These parameters are characterized but not tested. Data in "Typ" column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Total Absolute Error includes integral, differential, offset and gain errors. 2: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes. 3: ADC VREF is from external VREF or VDD pin, whichever is selected as reference input. 4: When ADC is off, it will not consume any current other than leakage current. The power-down current specification includes any such leakage from the ADC module. 5: VREF = 5V for PIC12HV615. DS41302D-page 164 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 TABLE 16-12: PIC12F615/617/HV615 A/D CONVERSION REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +125C Param No. Sym Characteristic A/D Clock Period AD130* TAD A/D Internal RC Oscillator Period AD131 TCNV Conversion Time (not including Acquisition Time)(1) Min Typ 1.6 -- 9.0 s TOSC-based, VREF 3.0V 3.0 -- 9.0 s TOSC-based, VREF full range(3) 3.0 6.0 9.0 s ADCS<1:0> = 11 (ADRC mode) At VDD = 2.5V 1.6 4.0 6.0 s At VDD = 5.0V -- 11 -- TAD Set GO/DONE bit to new data in A/D Result register 11.5 -- s Amplifier Settling Time -- -- 5 s Q4 to A/D Clock Start -- TOSC/2 -- -- -- TOSC/2 + TCY -- -- AD132* TACQ Acquisition Time AD133* TAMP AD134 TGO Max Units Conditions If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. * These parameters are characterized but not tested. Data in "Typ" column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: ADRESH and ADRESL registers may be read on the following TCY cycle. 2: See Section 10.3 "A/D Acquisition Requirements" for minimum conditions. 3: Full range for PIC12HV609/HV615 powered by the shunt regulator is the 5V regulated voltage. FIGURE 16-10: PIC12F615/617/HV615 A/D CONVERSION TIMING (NORMAL MODE) BSF ADCON0, GO AD134 1 TCY (TOSC/2(1)) AD131 Q4 AD130 A/D CLK 9 A/D Data 8 7 6 3 OLD_DATA ADRES GO Note 1: 1 0 NEW_DATA 1 TCY ADIF Sample 2 DONE AD132 Sampling Stopped If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. 2010 Microchip Technology Inc. DS41302D-page 165 PIC12F609/615/617/12HV609/615 FIGURE 16-11: PIC12F615/617/HV615 A/D CONVERSION TIMING (SLEEP MODE) BSF ADCON0, GO AD134 (TOSC/2 + TCY(1)) 1 TCY AD131 Q4 AD130 A/D CLK 9 A/D Data 8 7 6 OLD_DATA ADRES 3 2 1 0 NEW_DATA ADIF 1 TCY GO DONE Sample Note 1: AD132 Sampling Stopped If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. DS41302D-page 166 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 16.12 High Temperature Operation This section outlines the specifications for the PIC12F615 device operating in a temperature range between -40C and 150C.(4) The specifications between -40C and 150C(4) are identical to those shown in DS41288 and DS80329. Note 1: Writes are not allowed for Program Memory above 125C. Flash 2: All AC timing specifications are increased by 30%. This derating factor will include parameters such as TPWRT. 3: The temperature range indicator in the part number is "H" for -40C to 150C.(4) Example: PIC12F615T-H/ST indicates the device is shipped in a TAPE and reel configuration, in the MSOP package, and is rated for operation from -40C to 150C.(4) 4: AEC-Q100 reliability testing for devices intended to operate at 150C is 1,000 hours. Any design in which the total operating time from 125C to 150C will be greater than 1,000 hours is not warranted without prior written approval from Microchip Technology Inc. TABLE 16-13: ABSOLUTE MAXIMUM RATINGS Parameter Source/Sink Value Units Max. Current: VDD Source 20 mA Max. Current: VSS Sink 50 mA Max. Current: PIN Source 5 mA Max. Current: PIN Sink 10 mA Pin Current: at VOH Source 3 mA Pin Current: at VOL Sink 8.5 mA Port Current: GPIO Source 20 mA Port Current: GPIO Sink 50 mA 155 C Maximum Junction Temperature Note: Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended periods may affect device reliability. 2010 Microchip Technology Inc. DS41302D-page 167 PIC12F609/615/617/12HV609/615 TABLE 16-14: DC CHARACTERISTICS FOR IDD SPECIFICATIONS FOR PIC12F615-H (High Temp.) Param No. Device Characteristics Condition Units A D011 A D012 58 2.0 19 67 3.0 -- 32 92 5.0 -- 135 316 2.0 -- 185 400 3.0 -- 300 537 5.0 495 2.0 360 680 3.0 -- 0.660 1.20 5.0 -- 75 158 2.0 -- 155 338 3.0 -- 345 792 5.0 A -- 185 357 2.0 -- 325 625 3.0 mA -- 0.665 1.30 5.0 -- 245 476 2.0 -- 360 672 3.0 -- 620 1.10 5.0 D016 A A mA D018 A DS41302D-page 168 13 -- 240 A D019 -- -- mA D017 Max -- A D013 D014 Typ VDD D010 Supply Current (IDD) Min mA -- 395 757 2.0 -- 0.620 1.20 3.0 -- 1.20 2.20 5.0 -- 175 332 2.0 -- 285 518 3.0 -- 530 972 5.0 -- 2.20 4.10 4.5 -- 2.80 4.80 5.0 Note IDD LP OSC (32 kHz) IDD XT OSC (1 MHz) IDD XT OSC (4 MHz) IDD EC OSC (1 MHz) IDD EC OSC (4 MHz) IDD INTOSC (4 MHz) IDD INTOSC (8 MHz) IDD EXTRC (4 MHz) IDD HS OSC (20 MHz) 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 TABLE 16-15: DC CHARACTERISTICS FOR IPD SPECIFICATIONS FOR PIC12F615-H (High Temp.) Param No. D020E Condition Device Characteristics Units Power Down Base Current A A A D023E A A D024E A D025E A D026E A D027E Typ Max VDD D021E D022E Min A -- 0.05 12 2.0 -- 0.15 13 3.0 -- 0.35 14 5.0 -- 0.5 20 2.0 -- 2.5 25 3.0 -- 9.5 36 5.0 -- 5.0 28 3.0 -- 6.0 36 5.0 -- 105 195 2.0 -- 110 210 3.0 -- 116 220 5.0 -- 50 105 2.0 -- 55 110 3.0 -- 60 125 5.0 -- 30 58 2.0 -- 45 85 3.0 -- 75 142 5.0 -- 39 76 2.0 -- 59 114 3.0 -- 98 190 5.0 -- 5.5 30 2.0 -- 7.0 35 3.0 -- 8.5 45 5.0 -- 0.2 12 3.0 -- 0.3 15 5.0 Note IPD Base WDT Current BOR Current IPD Current (Both Comparators Enabled) IPD Current (One Comparator Enabled) IPD (CVREF, High Range) IPD (CVREF, Low Range) IPD (T1 OSC, 32 kHz) IPD (A2D on, not converting) TABLE 16-16: WATCHDOG TIMER SPECIFICATIONS FOR PIC12F615-H (High Temp.) Param No. 31 Sym TWDT Characteristic Watchdog Timer Time-out Period (No Prescaler) Units Min Typ Max Conditions ms 6 20 70 150C Temperature TABLE 16-17: LEAKAGE CURRENT SPECIFICATIONS FOR PIC12F615-H (High Temp.) Param No. Sym Characteristic Units Min Typ Max Conditions D061 IIL Input Leakage Current(1) (GP3/RA3/MCLR) A -- 0.5 5.0 VSS VPIN VDD D062 IIL Input Leakage Current(2) (GP3/RA3/MCLR) A 50 250 400 VDD = 5.0V Note 1: 2: This specification applies when GP3/RA3/MCLR is configured as an input with the pull-up disabled. The leakage current for the GP3/RA3/MCLR pin is higher than for the standard I/O port pins. This specification applies when GP3/RA3/MCLR is configured as the MCLR reset pin function with the weak pull-up enabled. 2010 Microchip Technology Inc. DS41302D-page 169 PIC12F609/615/617/12HV609/615 TABLE 16-18: OSCILLATOR PARAMETERS FOR PIC12F615-H (High Temp.) Param No. OS08 Note 1: Sym Characteristic INTOSC Int. Calibrated INTOSC Freq.(1) Frequency Tolerance Units Min Typ Max Conditions 10% MHz 7.2 8.0 8.8 2.0V VDD 5.5V -40C TA 150C To ensure these oscillator frequency tolerances, Vdd and Vss must be capacitively decoupled as close to the device as possible. 0.1 F and 0.01 F values in parallel are recommended. TABLE 16-19: COMPARATOR SPECIFICATIONS FOR PIC12F615-H (High Temp.) Param No. CM01 Sym VOS Characteristic Input Offset Voltage DS41302D-page 170 Units Min Typ Max Conditions mV -- 5 20 (VDD - 1.5)/2 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 17.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore, outside the warranted range. "Typical" represents the mean of the distribution at 25C. "Maximum" or "minimum" represents (mean + 3) or (mean 3) respectively, where s is a standard deviation, over each temperature range. FIGURE 17-1: PIC12F609/615/617 IDD LP (32 kHz) vs. VDD 60 Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) 50 Maximum 40 IDD LP (A) Typical 30 20 10 0 2 1 4 3 6 5 VDD (V) FIGURE 17-2: PIC12F609/615/617 IDD EC (1 MHz) vs. VDD 600 Maximum Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) IDD EC (A) 500 400 Typical 300 200 100 0 1 2 4 3 5 6 VDD (V) 2010 Microchip Technology Inc. DS41302D-page 171 PIC12F609/615/617/12HV609/615 FIGURE 17-3: PIC12F609/615/617 IDD EC (4 MHz) vs. VDD 1200 Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) 1000 Maximum IDD EC (A) 800 Typical 600 400 200 0 2 1 FIGURE 17-4: 3 VDD (V) 4 6 5 PIC12F609/615/617 IDD XT (1 MHz) vs. VDD 1200 Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) 1000 IDD XT (A) 800 600 Maximum 400 Typical 200 0 1 FIGURE 17-5: 2 3 VDD (V) 4 6 5 PIC12F609/615/617 IDD XT (4 MHz) vs. VDD 1200 800 IDD XT (A) Maximum Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) 1000 Typical 600 400 200 0 1 2 3 4 5 6 VDD (V) DS41302D-page 172 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 FIGURE 17-6: PIC12F609/615/617 IDD INTOSC (4 MHz) vs. VDD 900 Maximum 800 Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) IDD INTOSC (A) 700 Typical 600 500 400 300 200 100 0 2 1 FIGURE 17-7: 3 VDD (V) 4 6 5 PIC12F609/615/617 IDD INTOSC (8 MHz) vs. VDD 1800 Maximum Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) 1600 1400 IDD INTOSC (A) Typical 1200 1000 800 600 400 200 0 1 2010 Microchip Technology Inc. 2 3 4 VDD (V) 5 6 DS41302D-page 173 PIC12F609/615/617/12HV609/615 FIGURE 17-8: PIC12F609/615617 IDD EXTRC (4 MHz) vs. VDD 800 Maximum Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) 700 600 IDD EXTRC (A) Typical 500 400 300 200 100 0 1 FIGURE 17-9: 2 4 3 5 VDD (V) 6 PIC12F609/615/617 IDD HS (20 MHz) vs. VDD 4 Maximum 3 Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) IDD HS (mA) Typical 2 1 0 4 6 5 VDD (V) DS41302D-page 174 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 FIGURE 17-10: PIC12F609/615/617 IPD BASE vs. VDD 9 Extended Typical: Statistical Mean @25C 8 Industrial: Mean (Worst-Case Temp) + 3 (-40C to 85C) Extended: Mean (Worst-Case Temp) + 3 (-40C to 125C) 7 IPD BASE (A) 6 5 4 3 2 Industrial 1 Typical 0 2 1 FIGURE 17-11: 3 4 VDD (V) 6 5 PIC12F609/615/617 IPD COMPARATOR (SINGLE ON) vs. VDD 90 Extended 80 IPD CMP (A) Industrial 70 Typical 60 50 Typical: Statistical Mean @25C Industrial: Mean (Worst-Case Temp) + 3 (-40C to 85C) Extended: Mean (Worst-Case Temp) + 3 (-40C to 125C) 40 30 1 2 4 3 5 6 VDD (V) 2010 Microchip Technology Inc. DS41302D-page 175 PIC12F609/615/617/12HV609/615 FIGURE 17-12: PIC12F609/615/617 IPD WDT vs. VDD IPD WDT (A) 20 Extended 18 Typical: Statistical Mean @25C 16 Industrial: Mean (Worst-Case Temp) + 3 (-40C to 85C) Extended: Mean (Worst-Case Temp) + 3 (-40C to 125C) 14 12 Industrial 10 Typical 8 6 4 2 0 2 1 4 3 6 5 VDD (V) FIGURE 17-13: PIC12F609/615/617 IPD BOR vs. VDD 20 Typical: Statistical Mean @25C Extended Industrial: Mean (Worst-Case Temp) + 3 (-40C to 85C) 18 Extended: Mean (Worst-Case Temp) + 3 (-40C to 125C) 16 IPD BOR (A) 14 Industrial 12 10 8 Typical 6 4 2 0 1 2 4 3 5 6 VDD (V) DS41302D-page 176 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 FIGURE 17-14: PIC12F609/615/617 IPD CVREF (LOW RANGE) vs. VDD 140 Typical: Statistical Mean @25C Maximum Industrial: Mean (Worst-Case Temp) + 3 (-40C to 85C) 120 Extended: Mean (Worst-Case Temp) + 3 (-40C to 125C) Typical 100 IPD CVREF (A) 80 60 40 20 0 2 1 4 3 6 5 VDD (V) FIGURE 17-15: PIC12F609/615/617 IPD CVREF (HI RANGE) vs. VDD 120 Typical: Statistical Mean @25C IPD CVREF (A) Maximum Industrial: Mean (Worst-Case Temp) + 3 (-40C to 85C) Extended: Mean (Worst-Case Temp) + 3 (-40C to 125C) 100 80 Typical 60 40 20 0 1 2 3 4 5 6 VDD (V) 2010 Microchip Technology Inc. DS41302D-page 177 PIC12F609/615/617/12HV609/615 FIGURE 17-16: PIC12F609/615/617 IPD T1OSC vs. VDD 25 Typical: Statistical Mean @25C Industrial: Mean (Worst-Case Temp) + 3 (-40C to 85C) Extended: Mean (Worst-Case Temp) + 3 (-40C to 125C) IPD T1OSC (A) 20 Extended 15 Industrial 10 Typical 5 0 2 1 4 3 6 5 VDD (V) FIGURE 17-17: PIC12F615/617 IPD A/D vs. VDD 14 Typical: Statistical Mean @25C 12 10 IPD A2D (A) Extended Industrial: Mean (Worst-Case Temp) + 3 (-40C to 85C) Extended: Mean (Worst-Case Temp) + 3 (-40C to 125C) 8 6 4 Industrial 2 Typical 0 1 2 4 3 5 6 VDD (V) DS41302D-page 178 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 FIGURE 17-18: PIC12HV609/615 IDD LP (32 kHz) vs. VDD 450 Maximum Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) 400 350 IDD LP (A) 300 Typical 250 200 150 100 50 0 2 1 3 5 4 VDD (V) FIGURE 17-19: PIC12HV609/615 IDD EC (1 MHz) vs. VDD 1000 Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) 900 IDD EC (A) 800 Maximum 700 600 Typical 500 400 300 200 100 2 1 3 5 4 VDD (V) FIGURE 17-20: PIC12HV609/615 IDD EC (4 MHz) vs. VDD 1400 IDD EC (A) Maximum Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) 1200 1000 Typical 800 600 400 200 0 1 2 3 4 5 VDD (V) 2010 Microchip Technology Inc. DS41302D-page 179 PIC12F609/615/617/12HV609/615 FIGURE 17-21: PIC12HV609/615 IDD XT (1 MHz) vs. VDD 900 800 IDD XT (A) Maximum Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) 700 600 Typical 500 400 300 200 100 0 2 1 3 5 4 VDD (V) FIGURE 17-22: PIC12HV609/615 IDD XT (4 MHz) vs. VDD 1400 Maximum Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) 1200 IDD XT (A) 1000 Typical 800 600 400 200 0 2 1 3 5 4 VDD (V) FIGURE 17-23: PIC12HV609/615 IDD INTOSC (4 MHz) vs. VDD 1200 Maximum Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) IDD INTOSC (A) 1000 800 Typical 600 400 200 0 1 2 3 4 5 VDD (V) DS41302D-page 180 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 FIGURE 17-24: PIC12HV609/615 IDD INTOSC (8 MHz) vs. VDD IDD INTOSC (A) 2000 Maximum Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) 1500 Typical 1000 500 0 1 2 3 5 4 VDD (V) FIGURE 17-25: PIC12HV609/615 IDD EXTRC (4 MHz) vs. VDD 1200 IDD EXTRC (A) Maximum Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) 1000 800 Typical 600 400 200 0 2 1 3 5 4 VDD (V) FIGURE 17-26: PIC12HV609/615 IPD BASE vs. VDD 400 IPD BASE (A) Maximum Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) 350 300 Typical 250 200 150 100 50 0 1 2 3 4 5 VDD (V) 2010 Microchip Technology Inc. DS41302D-page 181 PIC12F609/615/617/12HV609/615 FIGURE 17-27: PIC12HV609/615 IPD COMPARATOR (SINGLE ON) vs. VDD Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) 500 Maximum 400 IPD CMP (A) Typical 300 200 100 0 2 1 3 5 4 VDD (V) FIGURE 17-28: PIC12HV609/615 IPD WDT vs. VDD 400 IPD WDT (A) Maximum Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) 350 300 Typical 250 200 150 100 50 0 2 1 3 5 4 VDD (V) FIGURE 17-29: PIC12HV609/615 IPD BOR vs. VDD 400 Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) IPD BOR (A) 350 Maximum 300 Typical 250 200 150 100 2 3 4 5 VDD (V) DS41302D-page 182 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 FIGURE 17-30: PIC12HV609/615 IPD CVREF (LOW RANGE) vs. VDD 500 400 IPD CVREF (A) Maximum Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) Typical 300 200 100 0 2 1 3 5 4 VDD (V) FIGURE 17-31: PIC12HV609/615 IPD CVREF (HI RANGE) vs. VDD 500 Maximum Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) 400 IPD CVREF (A) Typical 300 200 100 0 2 1 3 5 4 VDD (V) FIGURE 17-32: PIC12HV609/615 IPD T1OSC vs. VDD Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) 400 350 Maximum IPD T1OSC (A) 300 Typical 250 200 150 100 50 0 1 2 3 4 5 VDD (V) 2010 Microchip Technology Inc. DS41302D-page 183 PIC12F609/615/617/12HV609/615 FIGURE 17-33: PIC12HV615 IPD A/D vs. VDD Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) 400 350 Maximum IPD A2D (A) 300 Typical 250 200 150 100 50 0 2 FIGURE 17-34: 3 4 VDD (V) 5 VOL vs. IOL OVER TEMPERATURE (VDD = 3.0V) 0.8 0.7 Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) Max. 125C 0.6 Max. 85C VOL (V) 0.5 0.4 Typical 25C 0.3 0.2 Min. -40C 0.1 0.0 5.0 DS41302D-page 184 5.5 6.0 6.5 7.0 7.5 IOL (mA) 8.0 8.5 9.0 9.5 10.0 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 FIGURE 17-35: VOL vs. IOL OVER TEMPERATURE (VDD = 5.0V) 0.45 Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) 0.40 Max. 125C 0.35 Max. 85C VOL (V) 0.30 0.25 Typ. 25C 0.20 Min. -40C 0.15 0.10 0.05 0.00 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 IOL (mA) FIGURE 17-36: VOH vs. IOH OVER TEMPERATURE (VDD = 3.0V) 3.5 3.0 Max. -40C Typ. 25C 2.5 Min. 125C VOH (V) 2.0 1.5 1.0 Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) 0.5 0.0 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -3.5 -4.0 IOH (mA) 2010 Microchip Technology Inc. DS41302D-page 185 PIC12F609/615/617/12HV609/615 FIGURE 17-37: VOH vs. IOH OVER TEMPERATURE (VDD = 5.0V) 5.5 5.0 Max. -40C Typ. 25C VOH (V) 4.5 Min. 125C 4.0 3.5 Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) 3.0 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -3.5 -4.0 -4.5 -5.0 IOH (mA) FIGURE 17-38: TTL INPUT THRESHOLD VIN vs. VDD OVER TEMPERATURE 1.7 1.5 Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) Max. -40C VIN (V) 1.3 Typ. 25C 1.1 Min. 125C 0.9 0.7 0.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) DS41302D-page 186 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 FIGURE 17-39: SCHMITT TRIGGER INPUT THRESHOLD VIN vs. VDD OVER TEMPERATURE 4.0 VIH Max. 125C Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) 3.5 VIH Min. -40C VIN (V) 3.0 2.5 2.0 VIL Max. -40C 1.5 VIL Min. 125C 1.0 0.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 17-40: TYPICAL HFINTOSC START-UP TIMES vs. VDD OVER TEMPERATURE 16 Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) 14 85C 12 25C Time (s) 10 -40C 8 6 4 2 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) 2010 Microchip Technology Inc. DS41302D-page 187 PIC12F609/615/617/12HV609/615 FIGURE 17-41: MAXIMUM HFINTOSC START-UP TIMES vs. VDD OVER TEMPERATURE 25 Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) Time (s) 20 15 85C 25C 10 -40C 5 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 17-42: MINIMUM HFINTOSC START-UP TIMES vs. VDD OVER TEMPERATURE 10 9 Typical: Statistical Mean @25C Maximum: Mean (Worst-Case Temp) + 3 (-40C to 125C) 8 7 Time (s) 85C 6 25C 5 -40C 4 3 2 1 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) DS41302D-page 188 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 FIGURE 17-43: TYPICAL HFINTOSC FREQUENCY CHANGE vs. VDD (25C) 5 4 Change from Calibration (%) 3 2 1 0 -1 -2 -3 -4 -5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 17-44: TYPICAL HFINTOSC FREQUENCY CHANGE vs. VDD (85C) 5 4 Change from Calibration (%) 3 2 1 0 -1 -2 -3 -4 -5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) 2010 Microchip Technology Inc. DS41302D-page 189 PIC12F609/615/617/12HV609/615 FIGURE 17-45: TYPICAL HFINTOSC FREQUENCY CHANGE vs. VDD (125C) 5 4 Change from Calibration (%) 3 2 1 0 -1 -2 -3 -4 -5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 17-46: TYPICAL HFINTOSC FREQUENCY CHANGE vs. VDD (-40C) 5 4 Change from Calibration (%) 3 2 1 0 -1 -2 -3 -4 -5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) DS41302D-page 190 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 FIGURE 17-47: 0.6V REFERENCE VOLTAGE vs. TEMP (TYPICAL) 0.61 2.5V Reference Voltage (V) 0.6 3V 4V 0.59 5V 0.58 5.5V 0.57 0.56 -60 -40 -20 0 20 40 60 80 100 120 140 Temp (C) FIGURE 17-48: 1.2V REFERENCE VOLTAGE vs. TEMP (TYPICAL) Reference Voltage (V) 1.26 2.5V 1.25 3V 1.24 4V 5V 1.23 5.5V 1.22 1.21 1.2 -60 -40 -20 0 20 40 60 80 100 120 140 Temp (C) FIGURE 17-49: SHUNT REGULATOR VOLTAGE vs. INPUT CURRENT (TYPICAL) 5.16 -40C 25C 85C Shunt Regulator Voltage (V) 5.14 5.12 5.1 125C 5.08 5.06 5.04 5.02 5 4.98 4.96 0 10 20 30 40 50 60 Input Current (mA) 2010 Microchip Technology Inc. DS41302D-page 191 PIC12F609/615/617/12HV609/615 FIGURE 17-50: SHUNT REGULATOR VOLTAGE vs. TEMP (TYPICAL) Shunt Regulator Voltage (V) 5.16 5.14 5.12 5.1 50 mA 5.08 40 mA 5.06 5.04 20 mA 5.02 15 mA 5 10 mA 4.98 4 mA 4.96 -60 -40 -20 0 20 40 60 80 100 120 140 Temp (C) FIGURE 17-51: COMPARATOR RESPONSE TIME (RISING EDGE) 1000 900 Max. 125C Response Time (nS) 800 700 600 500 Note: VCM = (VDD - 1.5V)/2 V+ input = VCM V- input = Transition from VCM + 100mV to VCM - 20mV Max. 85C 400 300 Typ. 25C Min. -40C 200 100 0 2.0 2.5 4.0 5.5 VDD (V) DS41302D-page 192 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 FIGURE 17-52: COMPARATOR RESPONSE TIME (FALLING EDGE) 1000 900 Max. 125C 800 Response Time (nS) 700 600 500 Note: VCM = (VDD - 1.5V)/2 V+ input = VCM V- input = Transition from VCM - 100mV to VCM + 20MV Max. 85C 400 300 Typ. 25C 200 Min. -40C 100 0 2.0 2.5 4.0 5.5 VDD (V) WDT TIME-OUT PERIOD vs. VDD OVER TEMPERATURE FIGURE 17-53: 55 50 45 40 Time (ms) 35 30 125C 25 85C 20 25C 15 -40C 10 5 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 VDD (V) 2010 Microchip Technology Inc. DS41302D-page 193 PIC12F609/615/617/12HV609/615 NOTES: DS41302D-page 194 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 18.0 PACKAGING INFORMATION 18.1 Package Marking Information 8-Lead PDIP (.300") Example XXFXXX/P 017 e3 0610 XXXXXXXX XXXXXNNN YYWW 8-Lead SOIC (.150") Example XXXXXXXX XXXXYYWW NNN PICXXCXX /SN0610 e3 017 8-Lead MSOP Example XXXXXX YWWNNN 602/MS 610017 8-Lead DFN (3x3 mm) Example XXXX YYWW NNN XXXX 0610 017 8-Lead DFN (4x4 mm) (for PIC12F609/615/HV609/615 devices only) XXXXXX XXXXXX YYWW NNN Legend: XXXXXX XXXX e3 0610 017 XX...X Y YY WW NNN e3 * Note: * Example Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( can be found on the outer packaging for this package. ) e3 In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Standard PIC device marking consists of Microchip part number, year code, week code, and traceability code. For PIC device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. 2010 Microchip Technology Inc. DS41302D-page 195 PIC12F609/615/617/12HV609/615 18.2 Package Details The following sections give the technical details of the packages. )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ N NOTE 1 E1 1 3 2 D E A2 A L A1 c e eB b1 b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page 196 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 ! 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PIC12F609/615/617/12HV609/615 ( " ! )*( ( ! )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D N E E1 NOTE 1 1 2 e b A2 A c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icrochip Technology Inc. DS41302D-page 199 PIC12F609/615/617/12HV609/615 + $ )*(+,,%&+ )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D e b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page 200 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 + $ )*(-,-,%&+ )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D e b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icrochip Technology Inc. DS41302D-page 201 PIC12F609/615/617/12HV609/615 + $ )*(D-,-,%&+ )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ DS41302D-page 202 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 APPENDIX A: DATA SHEET REVISION HISTORY APPENDIX B: Revision A MIGRATING FROM OTHER PIC(R) DEVICES This discusses some of the issues in migrating from other PIC devices to the PIC12F6XX Family of devices. This is a new data sheet. Revision B (05/2008) B.1 Added Graphs. Revised 28-Pin ICD Pinout, Electrical Specifications Section, Package Details. PIC12F675 to PIC12F609/615/ 12HV609/615 TABLE B-1: FEATURE COMPARISON Revision C (09/2009) Updated adding the PIC12F617 device throughout the entire data sheet; Added Figure 2-2 to Memory Organization section; Added section 3 "FLASH PROGRAM MEMORY SELF READ/SELF WRITE CONTROL (FOR PIC12F617 ONLY)"; Updated Register 12-1; Updated Table12-5 adding PMCON1, PMCON2, PMADRL, PMADRH, PMDATL, PMDATH; Added section 16-12 in the Electrical Specification section; Other minor edits. PIC12F675 PIC12F609/ 615/ 12HV609/615 Max Operating Speed 20 MHz 20 MHz 1024 1024 Max Program Memory (Words) SRAM (bytes) 64 64 A/D Resolution 10-bit 10-bit (615 only) 1/1 2/1 (615) 1/1 (609) Timers (8/16-bit) Revision D (01/2010) Updated Figure 17-50; Revised 16.8 Characteristics; Removed Preliminary Status. Feature DC Oscillator Modes 8 8 Brown-out Reset Y Y Internal Pull-ups RA0/1/2/4/5 GP0/1/2/4/5, MCLR Interrupt-on-change Comparator 1 1 ECCP N Y (615) 4 MHz 4/8 MHz N Y (PIC12HV609/ 615) INTOSC Frequencies Internal Shunt Regulator Note: 2010 Microchip Technology Inc. RA0/1/2/3/4/5 GP0/1/2/3/4/5 This device has been designed to perform to the parameters of its data sheet. It has been tested to an electrical specification designed to determine its conformance with these parameters. Due to process differences in the manufacture of this device, this device may have different performance characteristics than its earlier version. These differences may cause this device to perform differently in your application than the earlier version of this device. DS41302D-page 203 PIC12F609/615/617/12HV609/615 NOTES: DS41302D-page 204 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 INDEX A A/D Specifications.................................................... 164, 165 Absolute Maximum Ratings .............................................. 143 AC Characteristics Industrial and Extended ............................................ 156 Load Conditions ........................................................ 155 ADC Acquisition Requirements ........................................... 86 Associated registers.................................................... 88 Block Diagram............................................................. 79 Calculating Acquisition Time....................................... 86 Channel Selection....................................................... 80 Configuration............................................................... 80 Configuring Interrupt ................................................... 83 Conversion Clock........................................................ 80 Conversion Procedure ................................................ 83 Internal Sampling Switch (RSS) Impedance................ 86 Interrupts..................................................................... 81 Operation .................................................................... 82 Operation During Sleep .............................................. 82 Port Configuration ....................................................... 80 Reference Voltage (VREF)........................................... 80 Result Formatting........................................................ 82 Source Impedance...................................................... 86 Special Event Trigger.................................................. 82 Starting an A/D Conversion ........................................ 82 ADC (PIC12F615/617/HV615 Only) ................................... 79 ADCON0 Register............................................................... 84 ADRESH Register (ADFM = 0) ........................................... 85 ADRESH Register (ADFM = 1) ........................................... 85 ADRESL Register (ADFM = 0)............................................ 85 ADRESL Register (ADFM = 1)............................................ 85 Analog Input Connection Considerations............................ 68 Analog-to-Digital Converter. See ADC ANSEL Register (PIC12F609/HV609) ................................ 45 ANSEL Register (PIC12F615/617/HV615) ......................... 45 APFCON Register............................................................... 24 Assembler MPASM Assembler................................................... 140 B Block Diagrams (CCP) Capture Mode Operation ................................. 90 ADC ............................................................................ 79 ADC Transfer Function ............................................... 87 Analog Input Model ............................................... 68, 87 Auto-Shutdown ......................................................... 101 CCP PWM................................................................... 94 Clock Source............................................................... 37 Comparator ................................................................. 67 Compare ..................................................................... 92 Crystal Operation ........................................................ 39 External RC Mode....................................................... 40 GP0 and GP1 Pins...................................................... 47 GP2 Pins..................................................................... 48 GP3 Pin....................................................................... 49 GP4 Pin....................................................................... 50 GP5 Pin....................................................................... 51 In-Circuit Serial Programming Connections.............. 125 Interrupt Logic ........................................................... 119 MCLR Circuit............................................................. 111 On-Chip Reset Circuit ............................................... 110 2010 Microchip Technology Inc. PIC12F609/12HV609 ................................................... 7 PIC12F615/617/12HV615 ............................................ 8 PWM (Enhanced) ....................................................... 97 Resonator Operation .................................................. 39 Timer1 .................................................................. 57, 58 Timer2 ........................................................................ 65 TMR0/WDT Prescaler ................................................ 53 Watchdog Timer ....................................................... 122 Brown-out Reset (BOR).................................................... 112 Associated Registers................................................ 113 Specifications ........................................................... 160 Timing and Characteristics ....................................... 159 C C Compilers MPLAB C18.............................................................. 140 MPLAB C30.............................................................. 140 Calibration Bits.................................................................. 109 Capture Module. See Enhanced Capture/Compare/ PWM (ECCP) Capture/Compare/PWM (CCP) Associated registers w/ Capture................................. 91 Associated registers w/ Compare............................... 93 Associated registers w/ PWM................................... 105 Capture Mode............................................................. 90 CCP1 Pin Configuration ............................................. 90 Compare Mode........................................................... 92 CCP1 Pin Configuration ..................................... 92 Software Interrupt Mode ............................... 90, 92 Special Event Trigger ......................................... 92 Timer1 Mode Selection................................. 90, 92 Prescaler .................................................................... 90 PWM Mode................................................................. 94 Duty Cycle .......................................................... 95 Effects of Reset .................................................. 96 Example PWM Frequencies and Resolutions, 20 MHZ .................................. 95 Example PWM Frequencies and Resolutions, 8 MHz .................................... 95 Operation in Sleep Mode.................................... 96 Setup for Operation ............................................ 96 System Clock Frequency Changes .................... 96 PWM Period ............................................................... 95 Setup for PWM Operation .......................................... 96 CCP1CON (Enhanced) Register ........................................ 89 Clock Sources External Modes........................................................... 38 EC ...................................................................... 38 HS ...................................................................... 39 LP ....................................................................... 39 OST .................................................................... 38 RC ...................................................................... 40 XT ....................................................................... 39 Internal Modes............................................................ 40 INTOSC .............................................................. 40 INTOSCIO .......................................................... 40 CMCON0 Register.............................................................. 72 CMCON1 Register.............................................................. 73 Code Examples A/D Conversion .......................................................... 83 Assigning Prescaler to Timer0.................................... 54 Assigning Prescaler to WDT....................................... 54 Changing Between Capture Prescalers ..................... 90 Indirect Addressing..................................................... 25 DS41302D-page 205 PIC12F609/615/617/12HV609/615 Initializing GPIO .......................................................... 43 Saving Status and W Registers in RAM ................... 121 Writing to Flash Program Memory .............................. 34 Code Protection ................................................................ 124 Comparator ......................................................................... 67 Associated registers.................................................... 78 Control ........................................................................ 69 Gating Timer1 ............................................................. 73 Operation During Sleep .............................................. 71 Overview ..................................................................... 67 Response Time ........................................................... 69 Synchronizing COUT w/Timer1 .................................. 73 Comparator Hysteresis ....................................................... 77 Comparator Voltage Reference (CVREF) ............................ 74 Effects of a Reset........................................................ 71 Comparator Voltage Reference (CVREF) Response Time ........................................................... 69 Comparator Voltage Reference (CVREF) Specifications ............................................................ 163 Comparators C2OUT as T1 Gate ..................................................... 60 Effects of a Reset........................................................ 71 Specifications ............................................................ 162 Compare Module. See Enhanced Capture/Compare/ PWM (ECCP) (PIC12F615/617/HV615 only) CONFIG Register.............................................................. 108 Configuration Bits.............................................................. 107 CPU Features ................................................................... 107 Customer Change Notification Service ............................. 209 Customer Notification Service........................................... 209 Customer Support ............................................................. 209 Timer Resources ........................................................ 89 Enhanced Capture/Compare/PWM (PIC12F615/617/HV615 Only).................................... 89 Errata .................................................................................... 6 D I Data EEPROM Memory Associated Registers .................................................. 35 Data Memory....................................................................... 11 DC and AC Characteristics Graphs and Tables ................................................... 171 DC Characteristics Extended and Industrial ............................................ 152 Industrial and Extended ............................................ 145 Development Support ....................................................... 139 Device Overview ................................................................... 7 ID Locations...................................................................... 124 In-Circuit Debugger........................................................... 125 In-Circuit Serial Programming (ICSP)............................... 125 Indirect Addressing, INDF and FSR registers..................... 25 Instruction Format............................................................. 129 Instruction Set................................................................... 129 ADDLW..................................................................... 131 ADDWF..................................................................... 131 ANDLW..................................................................... 131 ANDWF..................................................................... 131 MOVF ....................................................................... 134 BCF .......................................................................... 131 BSF........................................................................... 131 BTFSC ...................................................................... 131 BTFSS ...................................................................... 132 CALL......................................................................... 132 CLRF ........................................................................ 132 CLRW ....................................................................... 132 CLRWDT .................................................................. 132 COMF ....................................................................... 132 DECF ........................................................................ 132 DECFSZ ................................................................... 133 GOTO ....................................................................... 133 INCF ......................................................................... 133 INCFSZ..................................................................... 133 IORLW ...................................................................... 133 IORWF...................................................................... 133 MOVLW .................................................................... 134 MOVWF .................................................................... 134 NOP .......................................................................... 134 RETFIE ..................................................................... 135 RETLW ..................................................................... 135 RETURN................................................................... 135 E ECCP. See Enhanced Capture/Compare/PWM ECCPAS Register ............................................................. 102 EEDAT Register.................................................................. 28 EEDATH Register ............................................................... 28 Effects of Reset PWM mode ................................................................. 96 Electrical Specifications .................................................... 143 Enhanced Capture/Compare/PWM (ECCP) Enhanced PWM Mode ................................................ 97 Auto-Restart...................................................... 103 Auto-shutdown .................................................. 101 Half-Bridge Application ....................................... 99 Half-Bridge Application Examples..................... 104 Half-Bridge Mode ................................................ 99 Output Relationships (Active-High and Active-Low) ................................................. 98 Output Relationships Diagram ............................ 98 Programmable Dead Band Delay ..................... 104 Shoot-through Current ...................................... 104 Start-up Considerations .................................... 100 Specifications ............................................................ 162 DS41302D-page 206 F Firmware Instructions ....................................................... 129 Flash Program Memory Self Read/Self Write Control (For PIC12F617 only)..................................... 27 Fuses. See Configuration Bits G General Purpose Register File ........................................... 12 GPIO................................................................................... 43 Additional Pin Functions ............................................. 44 ANSEL Register ................................................. 44 Interrupt-on-Change ........................................... 44 Weak Pull-Ups.................................................... 44 Associated registers ................................................... 52 GP0 ............................................................................ 47 GP1 ............................................................................ 47 GP2 ............................................................................ 48 GP3 ............................................................................ 49 GP4 ............................................................................ 50 GP5 ............................................................................ 51 Pin Descriptions and Diagrams .................................. 47 Specifications ........................................................... 158 GPIO Register .................................................................... 43 H High Temperature Operation ............................................ 167 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 RLF ........................................................................... 136 RRF........................................................................... 136 SLEEP ...................................................................... 136 SUBLW ..................................................................... 136 SUBWF ..................................................................... 137 SWAPF ..................................................................... 137 XORLW..................................................................... 137 XORWF..................................................................... 137 Summary Table......................................................... 130 INTCON Register ................................................................ 20 Internal Oscillator Block INTOSC Specifications............................................ 157, 158 Internal Sampling Switch (RSS) Impedance ........................ 86 Internet Address................................................................ 209 Interrupts ........................................................................... 118 ADC ............................................................................ 83 Associated Registers ................................................ 120 Context Saving.......................................................... 121 GP2/INT .................................................................... 118 GPIO Interrupt-on-Change........................................ 119 Interrupt-on-Change.................................................... 44 Timer0....................................................................... 119 TMR1 .......................................................................... 60 INTOSC Specifications ............................................. 157, 158 IOC Register ....................................................................... 46 L Load Conditions ................................................................ 155 M MCLR ................................................................................ 111 Internal ...................................................................... 111 Memory Organization.......................................................... 11 Data ............................................................................ 11 Program ...................................................................... 11 Microchip Internet Web Site .............................................. 209 Migrating from other PICmicro Devices ............................ 203 MPLAB ASM30 Assembler, Linker, Librarian ................... 140 MPLAB ICD 2 In-Circuit Debugger ................................... 141 MPLAB ICE 2000 High-Performance Universal In-Circuit Emulator .................................................... 141 MPLAB Integrated Development Environment Software .. 139 MPLAB PM3 Device Programmer .................................... 141 MPLAB REAL ICE In-Circuit Emulator System................. 141 MPLINK Object Linker/MPLIB Object Librarian ................ 140 O OPCODE Field Descriptions ............................................. 129 Operation During Code Protect........................................... 32 Operation During Write Protect ........................................... 32 Operational Amplifier (OPA) Module AC Specifications...................................................... 163 OPTION Register ................................................................ 19 OPTION_REG Register ...................................................... 55 Oscillator Associated registers.............................................. 41, 63 Oscillator Module .......................................................... 27, 37 EC ............................................................................... 37 HS ............................................................................... 37 INTOSC ...................................................................... 37 INTOSCIO................................................................... 37 LP................................................................................ 37 RC............................................................................... 37 RCIO ........................................................................... 37 XT ............................................................................... 37 2010 Microchip Technology Inc. Oscillator Parameters ....................................................... 157 Oscillator Specifications.................................................... 156 Oscillator Start-up Timer (OST) Specifications ........................................................... 160 OSCTUNE Register............................................................ 41 P P1A/P1B/P1C/P1D.See Enhanced Capture/Compare/ PWM (ECCP) ............................................................. 97 Packaging ......................................................................... 195 Marking..................................................................... 195 PDIP Details ............................................................. 196 PCL and PCLATH............................................................... 25 Stack........................................................................... 25 PCON Register ........................................................... 23, 113 PICSTART Plus Development Programmer..................... 142 PIE1 Register ..................................................................... 21 Pin Diagram PIC12F609/HV609 (PDIP, SOIC, MSOP, DFN)........... 4 PIC12F615/617/HV615 (PDIP, SOIC, MSOP, DFN) .... 5 Pinout Descriptions PIC12F609/12HV609 ................................................... 9 PIC12F615/617/12HV615 .......................................... 10 PIR1 Register ..................................................................... 22 PMADRH and PMADRL Registers ..................................... 27 PMCON1 and PMCON2 Registers..................................... 27 Power-Down Mode (Sleep)............................................... 123 Power-on Reset (POR)..................................................... 111 Power-up Timer (PWRT) .................................................. 111 Specifications ........................................................... 160 Precision Internal Oscillator Parameters .......................... 158 Prescaler Shared WDT/Timer0................................................... 54 Switching Prescaler Assignment ................................ 54 Program Memory ................................................................ 11 Map and Stack............................................................ 11 Programming, Device Instructions.................................... 129 Protection Against Spurious Write ...................................... 32 PWM Mode. See Enhanced Capture/Compare/PWM ........ 97 PWM1CON Register......................................................... 105 R Reader Response............................................................. 210 Reading the Flash Program Memory.................................. 30 Read-Modify-Write Operations ......................................... 129 Registers ADCON0 (ADC Control 0) .......................................... 84 ADRESH (ADC Result High) with ADFM = 0) ............ 85 ADRESH (ADC Result High) with ADFM = 1) ............ 85 ADRESL (ADC Result Low) with ADFM = 0).............. 85 ADRESL (ADC Result Low) with ADFM = 1).............. 85 ANSEL (Analog Select) .............................................. 45 APFCON (Alternate Pin Function Register) ............... 24 CCP1CON (Enhanced CCP1 Control) ....................... 89 CMCON0 (Comparator Control 0) .............................. 72 CMCON1 (Comparator Control 1) .............................. 73 CONFIG (Configuration Word) ................................. 108 Data Memory Map (PIC12F609/HV609) .................... 12 Data Memory Map (PIC12F615/617/HV615) ............. 13 ECCPAS (Enhanced CCP Auto-shutdown Control) . 102 EEDAT (EEPROM Data) ............................................ 28 EEDATH (EEPROM Data) ......................................... 28 GPIO........................................................................... 43 INTCON (Interrupt Control) ........................................ 20 IOC (Interrupt-on-Change GPIO) ............................... 46 OPTION_REG (OPTION)........................................... 19 DS41302D-page 207 PIC12F609/615/617/12HV609/615 OPTION_REG (Option) .............................................. 55 OSCTUNE (Oscillator Tuning) .................................... 41 PCON (Power Control Register) ................................. 23 PCON (Power Control) ............................................. 113 PIE1 (Peripheral Interrupt Enable 1) ........................... 21 PIR1 (Peripheral Interrupt Register 1) ........................ 22 PWM1CON (Enhanced PWM Control) ..................... 105 Reset Values (PIC12F609/HV609) ........................... 115 Reset Values (PIC12F615/617/HV615) .................... 116 Reset Values (special registers) ............................... 117 Special Function Registers ......................................... 12 Special Register Summary (PIC12F609/HV609) .. 14, 16 Special Register Summary (PIC12F615/617/HV615) .............................. 15, 17 STATUS ...................................................................... 18 T1CON ........................................................................ 62 T2CON ........................................................................ 66 TRISIO (Tri-State GPIO) ............................................. 44 VRCON (Voltage Reference Control) ......................... 76 WPU (Weak Pull-Up GPIO) ........................................ 46 Reset................................................................................. 110 Revision History ................................................................ 203 S Shoot-through Current ...................................................... 104 Sleep Power-Down Mode ................................................... 123 Wake-up.................................................................... 123 Wake-up using Interrupts .......................................... 123 Software Simulator (MPLAB SIM)..................................... 140 Special Event Trigger.......................................................... 82 Special Function Registers ................................................. 12 STATUS Register................................................................ 18 T T1CON Register.................................................................. 62 T2CON Register.................................................................. 66 Thermal Considerations .................................................... 154 Time-out Sequence........................................................... 113 Timer0 ................................................................................. 53 Associated Registers .................................................. 55 External Clock ............................................................. 54 Interrupt....................................................................... 55 Operation .............................................................. 53, 57 Specifications ............................................................ 161 T0CKI .......................................................................... 54 Timer1 ................................................................................. 57 Associated registers.................................................... 63 Asynchronous Counter Mode ..................................... 59 Reading and Writing ........................................... 59 Comparator Synchronization ...................................... 61 ECCP Special Event Trigger (PIC12F615/617/HV615 Only) ............................ 61 ECCP Time Base (PIC12F615/617/HV615 Only) ....... 60 Interrupt....................................................................... 60 Modes of Operation .................................................... 57 Operation During Sleep .............................................. 60 Oscillator ..................................................................... 59 Prescaler ..................................................................... 59 Specifications ............................................................ 161 Timer1 Gate Inverting Gate ..................................................... 60 Selecting Source........................................... 60, 73 Synchronizing COUT w/Timer1 .......................... 73 TMR1H Register ......................................................... 57 TMR1L Register .......................................................... 57 DS41302D-page 208 Timer2 (PIC12F615/617/HV615 Only) Associated registers ................................................... 66 Timers Timer1 T1CON ............................................................... 62 Timer2 T2CON ............................................................... 66 Timing Diagrams A/D Conversion......................................................... 165 A/D Conversion (Sleep Mode) .................................. 166 Brown-out Reset (BOR)............................................ 159 Brown-out Reset Situations ...................................... 112 CLKOUT and I/O ...................................................... 158 Clock Timing ............................................................. 156 Comparator Output ..................................................... 67 Enhanced Capture/Compare/PWM (ECCP)............. 162 Half-Bridge PWM Output .................................... 99, 104 INT Pin Interrupt ....................................................... 120 PWM Auto-shutdown Auto-restart Enabled......................................... 103 Firmware Restart .............................................. 103 PWM Output (Active-High) ......................................... 98 PWM Output (Active-Low) .......................................... 98 Reset, WDT, OST and Power-up Timer ................... 159 Time-out Sequence Case 1 .............................................................. 114 Case 2 .............................................................. 114 Case 3 .............................................................. 114 Timer0 and Timer1 External Clock ........................... 161 Timer1 Incrementing Edge ......................................... 61 Wake-up from Interrupt............................................. 124 Timing Parameter Symbology .......................................... 155 TRISIO ................................................................................ 43 TRISIO Register ................................................................. 44 V Voltage Reference (VR) Specifications ........................................................... 163 Voltage Reference. See Comparator Voltage Reference (CVREF) Voltage References Associated registers ................................................... 78 VP6 Stabilization ........................................................ 74 VREF. SEE ADC Reference Voltage W Wake-up Using Interrupts ................................................. 123 Watchdog Timer (WDT).................................................... 121 Associated registers ................................................. 122 Specifications ........................................................... 160 WPU Register ..................................................................... 46 Writing the Flash Program Memory .................................... 32 WWW Address ................................................................. 209 WWW, On-Line Support ....................................................... 6 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software * General Technical Support - Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing * Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives * * * * * Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com CUSTOMER CHANGE NOTIFICATION SERVICE Microchip's customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. 2010 Microchip Technology Inc. DS41302D-page 209 PIC12F609/615/617/12HV609/615 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Device: Y N PIC12F609/615/617/12HV609/615 Literature Number: DS41302D Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS41302D-page 210 2010 Microchip Technology Inc. PIC12F609/615/617/12HV609/615 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX XXX Device Temperature Range Package Pattern Examples: a) b) Device: PIC12F609, PIC12F609T(1), PIC12HV609, PIC12HV609T(1), PIC12F615, PIC12F615T(1), PIC12HV615, PIC12HV615T(1), PIC12F617, PIC12F617T(1) c) d) e) Temperature Range: H I E = -40C to +150C = -40C to +85C = -40C to +125C (High Temp)(3) (Industrial) (Extended) f) g) h) Package: Pattern: P SN MS MF MD = = = = = Plastic DIP (PDIP) 8-lead Small Outline (150 mil) (SOIC) Micro Small Outline (MSOP) 8-lead Plastic Dual Flat, No Lead (3x3) (DFN) 8-lead Plastic Dual Flat, No Lead (4x4)(DFN)(1,2) QTP, SQTP or ROM Code; Special Requirements (blank otherwise) 2010 Microchip Technology Inc. i) PIC12F615-E/P 301 = Extended Temp., PDIP package, 20 MHz, QTP pattern #301 PIC12F615-I/SN = Industrial Temp., SOIC package, 20 MHz PIC12F615T-E/MF = Tape and Reel, Extended Temp., 3x3 DFN, 20 MHz PIC12F609T-E/MF = Tape and Reel, Extended Temp., 3x3 DFN, 20 MHz PIC12HV615T-E/MF = Tape and Reel, Extended Temp., 3x3 DFN, 20 MHz PIC12HV609T-E/MF = Tape and Reel, Extended Temp., 3x3 DFN, 20 MHz PIC12F617T-E/MF = Tape and Reel, Extended Temp., 3x3 DFN, 20 MHz PIC12F617-I/P = Industrial Temp., PDIP package, 20 MHz PIC12F615-H/SN = High Temp., SOIC package, 20 MHz Note 1: 2: 3: T = in tape and reel for MSOP, SOIC and DFN packages only. Not available for PIC12F617. High Temp. available for PIC12F615 only. DS41302D-page 211 WORLDWIDE SALES AND SERVICE AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Taiwan - Hsin Chu Tel: 886-3-6578-300 Fax: 886-3-6578-370 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 01/05/10 DS41302D-page 212 2010 Microchip Technology Inc. Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Microchip: PIC12F609-E/MD PIC12F609-E/P PIC12F609-E/SN PIC12F609-I/MD PIC12F609-I/P PIC12F609-I/SN PIC12F609T-I/MD PIC12F609T-I/SN PIC12F615-E/MD PIC12F615-E/MS PIC12F615-E/P PIC12F615-E/SN PIC12F615-I/MD PIC12F615-I/MS PIC12F615-I/P PIC12F615-I/SN PIC12F615T-I/MD PIC12F615T-I/MS PIC12F615T-I/SN PIC12HV609-E/MD PIC12HV609-E/P PIC12HV609-E/SN PIC12HV609-I/MD PIC12HV609-I/P PIC12HV609-I/SN PIC12HV609T-I/MD PIC12HV609T-I/SN PIC12HV615-E/MD PIC12HV615-E/MS PIC12HV615E/P PIC12HV615-E/SN PIC12HV615-I/MD PIC12HV615-I/MS PIC12HV615-I/P PIC12HV615-I/SN PIC12HV615TI/MD PIC12HV615T-I/MS PIC12HV615T-I/SN PIC12F617-E/MF PIC12F617-E/MS PIC12F617-E/P PIC12F617E/SN PIC12F617-I/MF PIC12F617-I/MS PIC12F617-I/P PIC12F617-I/SN PIC12F617T-I/MF PIC12F617T-I/MS PIC12F617T-I/SN PIC12F609-E/MS PIC12F609-I/MS PIC12F609T-I/MS PIC12HV609-E/MS PIC12HV609-I/MS PIC12HV609T-I/MS PIC12HV609T-I/MF PIC12F609-I/MF PIC12HV615-I/MF PIC12HV609-I/MF PIC12HV615T-I/MF PIC12F609-E/MF PIC12HV609-E/MF PIC12F615T-I/MF PIC12F609T-I/MF PIC12F615-E/MF PIC12HV615-E/MF PIC12F615-I/MF PIC12F615-H/MD PIC12F615-H/MS PIC12F615-H/SN