TLP2098 TOSHIBA PHOTOCOUPLER GaAAs IRED & PHOTO-IC TLP2098 Unit in mm Programmable controllers High-speed digital interfaces Data transmission between circuits with different voltage potential The Toshiba TLP2098 consists of two GaAAs infrared light emitting diode optically coupled to a high-gain, high-speed photodetector. The TLP2098 is housed in a 6-pin MFSOP. The TLP2098 has an internal Faraday shield, which provides a guaranteed common-mode transient immunity of 15 kV/s. The TLP2098 has an inverting output. A non-inverting output version, the TLP2095, is also available. z Inverter logic type (totem-pole output) z Guaranteed Performance over temperature: -40 to 100C z Power Supply Voltage: 3.0 to 20 V z Input Threshold Current: IFHL = 3 mA (max) z Switching Time (tpLH/tpHL): 250 ns (max) z Common mode transient immunity: 15 kV/s z Isolation Voltage: 3750 Vrms JEDEC JEITA TOSHIBA Weight: 0.09 g (typ.) Pin Configuration (top view) 1 VCC 3 GND SHIELD Truth Table Input H L LED ON OFF Tr1 OFF ON Tr2 ON OFF 11-4C2 Output L H 1 : Anode Cathode 3 : Cathode 5 Anode 4 : GND 4 5 : Output 6 : VCC 6 Schematic ICC 6 IF1 VCC Tr1 1 IO VF Tr2 3 5 VO IF2 SHIELD 4 GND 0.1 F bypass capacitor must be connected between pin 6 and 4 1 2009-09-10 TLP2098 Recommended Operating Conditions CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT Input Current , ON IF(ON) 5 Input Voltage , OFF VF(OFF) 0 15 mA 0.8 V Supply Voltage* VCC 3.0 20 V Operating Temperature Topr -40 100 C * This item denotes operating range, not meaning of recommended operating conditions. Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. Absolute Maximum Ratings (Ta = 25C) CHARACTERISTIC SYMBOL LED UNIT IF 20 mA IF / C -0.48 mA/C IFPT 1 A Output Current 1 (Ta 25) IO1 25/-15 mA Output Current 2 (Ta 100) IO2 5/-5 mA Output Voltage VO -0.5 to 20 V Supply Voltage VCC -0.5 to 20 V Forward Current Forward Current Derating (Ta 83) Peak Transient Forward Current DETECTOR RATING (Note1) Operating Temperature Range Topr -40 to 100 C Storage Temperature Range Tstg -55 to 125 C Lead Solder Temperature (10s) Tsol 260 C BVs 3750 Vrms Isolation Voltage (AC,1min.,R.H. 60%,Ta=25C) (Note 2) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Pulse width 1s, 300pps. Note 2: Device considered a two terminal device: pins 1 and 3 shorted together and pins 4, 5 and 6 shorted together. 2 2009-09-10 TLP2098 Electrical Characteristics (Unless otherwise specified, Ta = -40 to 100C,VCC = 3.0 to 20 V) CHARACTERISTIC SYMBOL TEST CIRCUIT CONDITION MIN TYP. MAX UNIT 1.45 1.57 1.75 V VF IF = 10 mA , Ta = 25C VF/Ta IF = 10 mA -2.0 mV/C CT V = 0, f = 1 MHz , Ta = 25C 190 pF Logic Low Output Voltage VOL 1 IOL = 0.02 mA, IF = 5 mA 0.2 0.6 V Logic High Output Voltage VOH 2 IOH = -0.02 mA, VCC = 3.0 V 2.0 2.5 VF =0.8 V 17.4 19.5 Logic Low Supply Current ICCL 3 IF = 5 mA 3.0 mA Logic High Supply Current ICCH 4 VF = 0 V 3.0 mA IOSL 5 IF = 5 mA IOSH 6 IFHL VFLH IHYS Input Forward Voltage Temperature Coefficient of Forward Voltage Input Capacitance Logic Low Short Circuit Output Current (Note3) Logic High Short Circuit Output Current (Note3) Input Current Logic Low Output Input Voltage Logic High Output Input Current Hysteresis VCC = 20 V V VCC=VO=4.5 V 15 80 VCC=VO=20 V 20 90 VF = 0 V VCC=4.5 V -5 -12 VO = GND VCC=20 V -10 -20 IO = 0.02 mA, VO < 0.6 V 1.0 3.0 mA IO = -0.02 mA, VO > 2.0 V 0.8 V VCC = 5 V 0.05 mA mA mA * All typical values are at VCC=5V, Ta=25C Note 3: Duration of output short circuit time should not exceed 10 ms. Note 4: A ceramic capacitor (0.1A) should be connected from pin 6 to pin 4 to stabilize the operation of the high gain linear amplifier. Failure to provide the bypassing may impair the switching property. The total lead length between capacitor and coupler should not exceed 1 cm. Isolation Characteristics (Ta = 25C) Characteristic Capacitance input to output Isolation resistance Symbol CS RS Test Condition VS = 0, f = 1 MHz R.H. 60%, VS = 500 V AC,1 minute Isolation voltage BVS (Note 2) MIN TYP. MAX UNIT 0.8 pF 12 (Note 2) 1x10 10 14 3750 AC,1 second,in oil 10000 DC,1 minute,in oil 10000 3 Vrms Vdc 2009-09-10 TLP2098 Switching Characteristics (Unless otherwise specified, Ta = -40 to 100C,VCC = 3.0 to 20 V) CHARACTERISTIC TEST CIRCUIT SYMBOL Propagation Delay Time tpLH to Logic High output Propagation Delay Time tpHL to Logic Low output 7, 8 CONDITION MIN TYP. MAX UNIT IF = 50mA 30 150 250 ns IF = 05mA 30 150 250 ns 220 ns (Note5) Switching Time Dispersion |tpHL- between ON and OFF tpLH| Rise Time (10 - 90 %) tr IF = 50 mA , VCC = 5 V 30 75 ns Fall Time (90 - 10 %) tf IF = 05 mA , VCC = 5 V 30 75 ns -15 kV/s 15 kV/s Common Mode transient VCM = 1000Vp-p, IF = 0 A, CMH Immunity at High Level Output VCC = 20 V, Ta = 25 C 9 Common Mode transient VCM = 1000Vp-p, IF =5 mA, CML Immunity at Low Level Output VCC = 20 V, Ta = 25 C *All typical values are at Ta = 25 C Note5. VCC=4.5 to 20V at test circuit 7. TEST CIRCUIT 1: VOL TEST CIRCUIT 2: VOH 6 IF 1 VCC 0.1F 5 5 VOL IOL GND 4 3 6 1 VCC VCC 3 V SHIELD GND 4 SHIELD V VO IOH VCC 0.1F *VOH= VCC-VO TEST CIRCUIT 3: ICCL IF 1 6 TEST CIRCUIT 4: ICCH ICCL VCC 1 A 5 3 GND SHIELD 4 VCC 0.1F 3 3 A GND 4 SHIELD VCC 0.1F TEST CIRCUIT 6: IOSH 1 6 6 VCC 5 ICCH 5 VCC TEST CIRCUIT 5: IOSL IF 1 VCC 6 GND 4 SHIELD 0.1F 5 A 0.1F A IOSL VCC 3 VO 4 GND 4 SHIELD IOSH VO VCC 2009-09-10 TLP2098 TEST CIRCUIT 7: Switching Time Test Circuit IF=5mA (P.G) (f=50 kHz , duty=50%, less than tr=tf=5ns) IF VCC VO 5V IF 6 1 VCC I 5 3 GND SHIELD 50% 620 0.1F tpHL tpLH VOH 4 VO 5k CL 90% 1.3V 10% VOL tf tr CL is approximately 15 pF which includes probe and stray wiring capacitance. P.G.: Pulse generator TEST CIRCUIT 8: Switching Time Test Circuit IF=5mA (P.G) (f=50 kHz , duty=50%, less than tr=tf=5ns) IF 6 1 IF VCC 5 3 GND SHIELD 50% 0.1F VO tpHL VCC 4 tpLH VOH CL 90% VO 1.3V 10% VOL tf tr CL is approximately 15 pF which includes probe and stray wiring capacitance. P.G.: Pulse generator TEST CIRCUIT 9: Common Mode Transient Immunity Test Circuit IF SW A 6 1 90% 1000 VCC B 5 3 GND SHIELD VCM 4 0.1F 10% tr VCM VO tf VCC CMH SW B : IF=0mA 17V VO 1V SW A : IF=5mA CM 5 H = 800(V ) t f ( s) CM L = CML 800(V ) t r ( s) 2009-09-10 TLP2098 Soldering and Storage 1. Soldering 1.1 Soldering When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as much as possible by observing the following conditions. 1) Using solder reflow *Temperature profile example of lead (Pb) solder (C) This profile is based on the device's maximum heat resistance guaranteed value. Set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile. Package surface temperature 240 210 160 140 less than 30s 60 to 120s Time (s) *Temperature profile example of using lead (Pb)-free solder (C) Package surface temperature 260 This profile is based on the device's maximum heat resistance guaranteed value. Set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile. 230 190 180 60 to 120s 30 to 50s Time (s) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. 2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder) Please preheat it at 150C between 60 and 120 seconds. Complete soldering within 10 seconds below 260C. Each pin may be heated at most once. 3) Using a soldering iron Complete soldering within 10 seconds below 260C, or within 3 seconds at 350C. Each pin may be heated at most once. 6 2009-09-10 TLP2098 2. Storage 1) Avoid storage locations where devices may be exposed to moisture or direct sunlight. 2) Follow the precautions printed on the packing label of the device for transportation and storage. 3) Keep the storage location temperature and humidity within a range of 5C to 35C and 45% to 75% respectively. 4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. 5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. 6) When restoring devices after removal from their packing, use anti-static containers. 7) Do not allow loads to be applied directly to devices while they are in storage. 8) If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. 7 2009-09-10 TLP2098 Specification for Embossed-Tape Packing (TPL)(TPR) for Mini-flat Coupler 1. Applicable Package Package Product Type MFSOP Mini-flat coupler 2. Product Naming System Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as below. (Example) TLP2098 (TPL, F) [[G]]/RoHS COMPATIBLE (Note6) Tape type Device name 3. Tape Dimensions 3.1 Specification Classification are as shown in Table 1 Table 1 Tape Type Classification Tape type Classification Quantity (pcs / reel) TPL L direction 3000 TPR R direction 3000 3.2 Orientation of Device in Relation to Direction of Tape Movement Device orientation in the recesses is as shown in Figure 1. Direction of Tape L direction R direction Figure 1 Device Orientation 8 2009-09-10 TLP2098 3.3 Empty Device Recesses are as shown in Table 2. Table 2 Empty Device Recesses Standard Remarks 0 Within any given 40-mm section of tape, not including leader and trailer Occurrences of 2 or more successive empty device recesses Single empty device recesses 6 devices (max) per reel Not including leader and trailer 3.4 Start and End of Tape The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two empty turns only for a cover tape. 3.5 Tape Specification (1) Tape material: Plastic (protection against electrostatics) (2) Dimensions: The tape dimensions are as shown in Figure 2 and Table 3. +0.1 1.5 -0 A G K0 12.0 0.3 B D E 0.3 0.05 F 1.6 0.1 3.15 0.2 Figure 2 Tape Forms Table 3 Tape Dimensions Unit: mm Unless otherwise specified: 0.1 Symbol Dimension Remark A 4.2 B 7.6 D 5.5 Centre line of indented square hole and sprocket hole E 1.75 F 8.0 G 4.0 K0 2.8 Distance between tape edge and hole center +0.1 Cumulative error -0.3 (max) per 10 feed holes Cumulative error +0.1 (max) per 10 feed holes -0.3 Internal space 9 2009-09-10 TLP2098 3.6 Reel (1) Material: Plastic (2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 4. Table 4 Reel Dimensions Symbol Dimension A 3802 B 801 C 130.5 E 2.00.5 U 4.00.5 W1 13.50.5 W2 17.51.0 A C U B Unit: mm E W1 Figure 3 Reel Form W2 4. Packing Either one reel or five reels of photocoupler are packed in a shipping carton. 5. Label Indication The carton bears a label indicating the product number, the symbol representing classification of standard, the quantity, the lot number and the Toshiba company name. 6. Ordering Method When placing an order, please specify the product number, the tape type and the quantity as shown in the following example. (Example) (Example) TLP2098 (TPL, F) 3000 pcs Quantity (must be a multiple of 3000) [[G]]/RoHS COMPATIBLE (Note 6) Tape type Device name Note 6 : Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronics equipment. 10 2009-09-10 TLP2098 RESTRICTIONS ON PRODUCT USE * Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. * Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact ("Unintended Use"). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. * Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. * Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. * The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. * ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. * GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. * Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. * Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 11 2009-09-10