TLP2098
2009-09-10
1
TOSHIBA PHOTOCOUPLER GaAℓAs IRED & PHOTO-IC
TLP2098
Programmable controllers
High-speed digital interfaces
Data transmission between circuits
with different voltage potential
The Toshiba TLP2098 consists of two GaAℓAs infrared light emitting
diode optically coupled to a high-gain, high-speed photodetector.
The TLP2098 is housed in a 6-pin MFSOP.
The TLP2098 has an internal Faraday shield, which provides a
guaranteed common-mode transient immunity of ±15 kV/μs.
The TLP2098 has an inverting output. A non-inverting output version,
the TLP2095, is also available.
z Inverter logic type (totem-pole output)
z Guaranteed Performance over temperature: -40 to 100°C
z Power Supply Voltage: 3.0 to 20 V
z Input Threshold Current: IFHL = ±3 mA (max)
z Switching Time (tpLH/tpHL): 250 ns (max)
z Common mode transient immunity: ±15 kV/μs
z Isolation Voltage: 3750 Vrms
Truth Table
Input LED Tr1 Tr2 Output
H ON OFF ON L
L OFF ON OFF H
JEDEC ―
JEITA ―
TOSHIBA 11-4C2
Weight: 0.09 g (typ.)
Unit in mm
VCC
GND
SHIELD
1
34
5
6
VCC
VO
GND
ICC
IO
6
5
4
SHIELD
3
1
IF1
Tr1
Tr2
VF
IF2
Pin Configuration (top view)
1 : Anode
Cathode
3 : Cathode
Anode
4 : GND
5 : Output
6 : VCC
Schematic
0.1 μF bypass capacitor must be
connected between pin 6 and 4
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Recommended Operating Conditions
CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT
Input Current , ON ±IF(ON) 5 ― 15 mA
Input Voltage , OFF ±VF(OFF) 0 ― 0.8 V
Supply Voltage* VCC 3.0 ― 20 V
Operating Temperature Topr -40 ― 100 °C
* This item denotes operating range, not meaning of recommended operating conditions.
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
Absolute Maximum Ratings (Ta = 25°C)
CHARACTERISTIC SYMBOL RATING UNIT
Forward Current IF ±20 mA
Forward Current Derating (Ta ≤ 83℃) ∆IF / ˚C-0.48 mA/˚C
LED
Peak Transient Forward Current (Note1) IFPT ±1 A
Output Current 1 (Ta ≤ 25℃) IO1 25/-15 mA
Output Current 2 (Ta ≤ 100℃) IO2 5/-5 mA
Output Voltage VO -0.5 to 20 V
DETECTOR
Supply Voltage VCC -0.5 to 20 V
Operating Temperature Range Topr -40 to 100 °C
Storage Temperature Range Tstg -55 to 125 °C
Lead Solder Temperature (10s) Tsol 260 °C
Isolation Voltage (AC,1min.,R.H. ≤ 60%,Ta=25°C) (Note 2) BV
s 3750 Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width ≤ 1μs, 300pps.
Note 2: Device considered a two terminal device: pins 1 and 3 shorted together and pins 4, 5 and 6 shorted together.
TLP2098
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Electrical Characteristics
(Unless otherwise specified, Ta = -40 to 100°C,VCC = 3.0 to 20 V)
CHARACTERISTIC SYMBOL
TEST
CIRCUIT CONDITION MIN TYP. MAX UNIT
Input Forward Voltage VF ― I
F = 10 mA , Ta = 25°C 1.45 1.57 1.75 V
Temperature Coefficient
of Forward Voltage
ΔVF/ΔTa ― I
F = 10 mA ― -2.0 ― mV/°C
Input Capacitance CT ― V = 0, f = 1 MHz , Ta = 25°C ― 190 ― pF
Logic Low Output Voltage VOL 1 IOL = 0.02 mA, IF = 5 mA ― 0.2 0.6 V
VCC = 3.0 V 2.0 2.5 ―
Logic High Output Voltage VOH 2
IOH = -0.02 mA,
VF =0.8 V VCC = 20 V 17.4 19.5 ― V
Logic Low Supply Current ICCL 3 IF = 5 mA ― ― 3.0 mA
Logic High Supply Current ICCH 4 VF = 0 V ― ― 3.0 mA
VCC=VO=4.5 V 15 80 ―
Logic Low Short Circuit
Output Current (Note3) IOSL 5 IF = 5 mA
VCC=VO=20 V 20 90 ―
mA
VCC=4.5 V -5 -12 ―
Logic High Short Circuit
Output Current (Note3) IOSH 6
VF = 0 V
VO = GND VCC=20 V -10 -20 ―
mA
Input Current Logic Low
Output IFHL ― I
O = 0.02 mA, VO < 0.6 V ― 1.0 3.0 mA
Input Voltage Logic High
Output VFLH ― I
O = -0.02 mA, VO > 2.0 V 0.8 ― ― V
Input Current Hysteresis IHYS ― V
CC = 5 V ― 0.05 ― mA
* All typical values are at VCC=5V, Ta=25°C
Note 3: Duration of output short circuit time should not exceed 10 ms.
Note 4: A ceramic capacitor (0.1μA) should be connected from pin 6 to pin 4 to stabilize the operation of the high gain
linear amplifier. Failure to provide the bypassing may impair the switching property. The total lead length
between capacitor and coupler should not exceed 1 cm.
Isolation Characteristics (Ta = 25°C)
Characteristic Symbol Test Condition MIN TYP. MAX UNIT
Capacitance input to output CS V
S = 0, f = 1 MHz (Note 2) ― 0.8 ― pF
Isolation resistance RS R.H. ≤ 60%, VS = 500 V (Note 2) 1×1012 1014 ― Ω
AC,1 minute 3750 ― ―
AC,1 second,in oil ― 10000 ―
Vrms
Isolation voltage BVS
DC,1 minute,in oil ― 10000 ― V
dc
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Switching Characteristics
(Unless otherwise specified, Ta = -40 to 100°C,VCC = 3.0 to 20 V)
CHARACTERISTIC SYMBOL
TEST
CIRCUIT CONDITION MIN TYP. MAX UNIT
Propagation Delay Time
to Logic High output tpLH I
F = 5→0mA 30 150 250 ns
Propagation Delay Time
to Logic Low output tpHL I
F = 0→5mA 30 150 250 ns
Switching Time Dispersion
between ON and OFF
|tpHL-
tpLH|
― ― ― 220 ns
Rise Time (10 – 90 %) tr I
F = 5→0 mA , VCC = 5 V ― 30 75 ns
Fall Time (90 – 10 %) tf
7, 8
(Note5)
IF = 0→5 mA , VCC = 5 V ― 30 75 ns
Common Mode transient
Immunity at High Level Output CMH VCM = 1000Vp-p, IF = 0 A,
VCC = 20 V, Ta = 25 °C -15 ― ― kV/μs
Common Mode transient
Immunity at Low Level Output CML
9
VCM = 1000Vp-p, IF =5 mA,
VCC = 20 V, Ta = 25 °C 15 ― ― kV/μs
*All typical values are at Ta = 25 °C
Note5. VCC=4.5 to 20V at test circuit 7.
TEST CI RCUI T 1:
V
OL TEST CI RCUI T 2:
V
OH
TEST CIRCUI T 3: ICCL TEST CI RCUIT 4: ICCH
TEST CIRCUI T 5: IOSL TEST CI RCUI T 6: IOSH
0.1μF
VOL
VCC
6
5
4 V
IOL
↑
VCC
GND
SHIELD
3
1
4
0.1μF
VO
6
5 V IOH
↑
→
IF
VCC
VCC
GND
SHIELD
3
1
VCC
1 6
5
4
ICCL
A
0.1μF
VCC
GND
SHIELD
3
VCC
6
5
4
ICCH
A
↑
→
IF
0.1μF
1 VCC
GND
SHIELD
3
1 6
0.1μF
VO
VCC
3
5
4
IOSL
A
VCC
GND
SHIELD
VCC
0.1μF
IF 1
3
6
5
4
→
IOSH
↑ A VO
VCC
GND
SHIELD
*VOH= VCC-VO
↑
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TEST CIRCUIT 7: Switching Time Test Circuit
TEST CIRCUIT 8: Switching Time Test Circuit
TEST CIRCUIT 9: Common Mode Transient Immunity Test Circuit
)(
)(800
s
tf
V
H
CM
μ
=)(
)(800
s
t
r
V
L
CM
μ
=
CL is approximately 15 pF which includes
probe and stray wiring capacitance.
P.G.: Pulse generator
IF
VO
VOH
VOL
tpLH
tpHL
1.3V
50%
tr tf
90%
10%
IF=5mA (P.G)
VCC
GND
SHIELD
VO
0.1μF
CL
VCC
IF
I
5V
620Ω
5kΩ
1
3
6
5
4
IF=5mA (P.G)
VCC
IF
VO
0.1μF
CL
1
3
6
5
4
VCC
GND
SHIELD
IF
VO
VOH
VOL
tpLH
tpHL
1.3V
50%
tr tf
90%
10%
CL is approximately 15 pF which includes
probe and stray wiring capacitance.
P.G.: Pulse generator
・SW B : IF=0mA
0.1μF
VO
VCC
SW IF 1
3
6
5
4
VCM
A B
→
VCM
10%
90% 1000Ｖ
CML
・SW A : IF=5mA
17V
VO
tr tf
VCC
GND
SHIELD CMH
1V
(f=50 kHz , duty=50%,
less than tr=tf=5ns)
(f=50 kHz , duty=50%,
less than tr=tf=5ns)
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Soldering and Storage
1. Soldering
1.1 Soldering
When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as
much as possible by observing the following conditions.
1) Using solder reflow
·Temperature profile example of lead (Pb) solder
·Temperature profile example of using lead (Pb)-free solder
・Reflow soldering must be performed once or twice.
・The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)
・Please preheat it at 150°C between 60 and 120 seconds.
・Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.
3) Using a soldering iron
Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may
be heated at most once.
Time (s)
(°C)
240
210
160
60 to 120s less than 30s
Package surface temperature
140
Time (s)
(°C)
260
230
190
60 to 120s
30 to 50s
180
Package surface temperature
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste type
used by the customer within the
described profile.
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste type
used by the customer within the
described profile.
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2. Storage
1) Avoid storage locations where devices may be exposed to moisture or direct sunlight.
2) Follow the precautions printed on the packing label of the device for transportation and storage.
3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%
respectively.
4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
6) When restoring devices after removal from their packing, use anti-static containers.
7) Do not allow loads to be applied directly to devices while they are in storage.
8) If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
TLP2098
2009-09-10
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Specification for Embossed–Tape Packing
(TPL)(TPR) for Mini-flat Coupler
1. Applicable Package
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of
classification is as below.
(Example) TLP2098 (TPL, F)
[[G]]/RoHS COMPATIBLE (Note6)
Tape type
Device name
3. Tape Dimensions
3.1 Specification Classification are as shown in Table 1
Table 1 Tape Type Classification
Tape type Classification Quantity
(pcs / reel)
TPL L direction 3000
TPR R direction 3000
3.2 Orientation of Device in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Figure 1 Device Orientation
Package Product Type
MFSOP Mini-flat coupler
Direction of Tape
L direction R direction
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3.3 Empty Device Recesses are as shown in Table 2.
Table 2 Empty Device Recesses
3.4 Start and End of Tape
The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two empty
turns only for a cover tape.
3.5 Tape Specification
(1) Tape material: Plastic (protection against electrostatics)
(2) Dimensions: The tape dimensions are as shown in Figure 2 and Table 3.
Figure 2 Tape Forms
Table 3 Tape Dimensions
Unit: mm
Unless otherwise specified: ±0.1
Symbol Dimension Remark
A 4.2 ―
B 7.6 ―
D 5.5 Centre line of indented square hole and sprocket hole
E 1.75 Distance between tape edge and hole center
F 8.0 Cumulative error (max) per 10 feed holes
G 4.0 Cumulative error (max) per 10 feed holes
K0 2.8 Internal space
Standard Remarks
Occurrences of 2 or more successive
empty device recesses 0
Within any given 40-mm section
of tape, not including leader
and trailer
Single empty device recesses 6 devices (max) per reel Not including leader and trailer
0.3 ± 0.05
3.15 ± 0.2
K0
G
F
φ1.6 ± 0.1
A
E D
B
12.0 ± 0.3
φ1.5
+0.1
−0
+0.1
-0.3
+0.1
-0.3
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3.6 Reel
(1) Material: Plastic
(2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 4.
Table 4 Reel Dimensions
Unit: mm
Figure 3 Reel Form
4. Packing
Either one reel or five reels of photocoupler are packed in a shipping carton.
5. Label Indication
The carton bears a label indicating the product number, the symbol representing classification of
standard, the quantity, the lot number and the Toshiba company name.
6. Ordering Method
When placing an order, please specify the product number, the tape type and the quantity as shown in the
following example.
(Example)
(Example) TLP2098 (TPL, F) 3000 pcs
Quantity (must be a multiple of 3000)
[[G]]/RoHS COMPATIBLE (Note 6)
Tape type
Device name
Note 6 : Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS
compatibility of Product.
RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the
restriction of the use of certain hazardous substances in electrical and electronics equipment.
Symbol Dimension
A Φ380±2
B Φ80±1
C Φ13±0.5
E 2.0±0.5
U 4.0±0.5
W1 13.5±0.5
W2 17.5±1.0
E
W1
W2
A
B
C
U
TLP2098
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RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
