Application Specification AMPMODU* 114-25018 Mod II and Mod IV Printed Circuit Board Connectors NOTE i 19 MAY 08 Rev E All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless otherwise specified, dimensions have a tolerance of +0.13 and angles have a tolerance of +2 . Figures and illustrations are for identification only and are not drawn to scale. _ 1. INTRODUCTION This specification covers the requirements for application of AMPMODU Mod II and Mod IV Printed Circuit (PC) Board Connectors for through hole and Surface Mount Technology (SMT). The connectors are available with double beam receptacle contacts designed to accept 0.64 mm square posts. There are connectors in 2 through 80 positions for top and bottom entry applications as well as pass through applications with 2.54 mm contact centerline spacing. All side entry connectors are available in 4 through 130 positions for double rows and 2 through 65 positions for single row. The double beam contact connectors are available with single and double rows of contacts. There are various solder lead configurations to meet a variety of system requirements. There are surface mount connectors available with and without hold-downs. The hold-downs help position the connector on the pc board and hold it in place during soldering. Through hole connectors are available with and without retentive contact leads. The retentive contact leads help stabilize and hold the connector in place during soldering. Connectors without hold-down or retentive contact lead stabilizing features are available to accommodate alternate system requirements. When corresponding with Tyco Electronics Personnel, use the terminology provided on this specification to help facilitate your inquiry for information. Basic terms and features of components are provided in Figure 1. Double Beam Contact Double Row Connectors (Typ) Connector Single Row Dual Entry Connector Mating Face Double Row Dual Connector Entry Right-Angle Horizontal Contact Top Entry Connector Cavity Dual Entry Right-Angle Surface Mount (Horizontal) Single Row Connector Figure 1 E 2008 Tyco Electronics Corporation, Harrisburg, PA All International Rights Reserved TOOLING ASSISTANCE CENTER 1-800-722-1111 This controlled document is subject to change. PRODUCT INFORMATION 1-800-522-6752 For latest revision and Regional Customer Service, TE logo and Tyco Electronics are trademarks. *Trademark. Other products, logos, and company names used are the property of their respective owners. visit our website at www.tycoelectronics.com 1 of 13 LOC B AMPMODU Mod II and Mod IV PC Board Connectors 114-25018 2. REFERENCE MATERIAL 2.1. Revision Summary This paragraph is reserved for a revision summary of changes and additions made to this specification. The following changes have been made to this revision. S Updated document to corporate requirements S New format 2.2. Customer Assistance Reference Part Number 534998 and Product Code 5008 are representative numbers of AMPMODU PC Board Connectors. Use of these numbers will identify the product line and expedite your inquiries through a service network established to help you obtain product information. Such information can be obtained through a local Tyco Electronics Representative or, after purchase, by calling the Tooling Assistance Center or the Product Information Center number at the bottom of page 1. 2.3. Drawings Customer drawings for each connector are available from the service network. The information contained in customer drawings takes priority if there is a conflict with this specification or with any technical documentation supplied by Tyco Electronics. 2.4. Manuals Manual 402-40 is available upon request and can be used as a guide in soldering. This manual provides information on various flux types and characteristics along with the commercial designation and flux removal procedures. A checklist is included in the manual as a guide for information on soldering problems. 2.5. Specifications Product Specifications provide product performance requirements and test information. See Product Specifications 108-25022 and 108-25026 for double beam contacts. 3. REQUIREMENTS 3.1. Storage A. Ultraviolet Light Prolonged exposure to ultraviolet light may deteriorate the chemical composition used in the connector housing material. B. Shelf Life The connectors should remain in the shipping containers until ready for use to prevent deformation of the contact solder leads or other damage to the connectors. The connectors should be used on a first in, first out basis to avoid storage contamination. C. Chemical Exposure Do not store connectors near any chemical listed below as they may cause stress, corrosion, cracks in the contacts. Alkalies Amines Ammonia Carbonates Citrates Nitrites Phosphates Citrates Sulfur Nitrites Sulfur Compounds Tartrates 3.2. Special Characteristics AMPMODU PC Board Connectors with double beam contacts have an operating temperature range of -65_C to 105_C [-85_F to 221_F], and the connectors consist of a black polyester housing and phosphor bronze contacts with one of two types of plating. The contact plating may be overall nickel with gold on the mating surface and matte tin on the solder leads, or it may be overall nickel and matte tin plated. 2 of 13 Tyco Electronics Corporation Rev E AMPMODU Mod II and Mod IV PC Board Connectors 114-25018 The housing contact cavities on the mating face of the connectors have a tapered lead-in to facilitate mating with contact posts. Through hole connectors are available as: (1) top entry with pinched solder leads; (2) dual entry with in-line and extended outrigger solder leads; and (3) right-angle horizontal connectors. Vertical surface mount connectors are available with and without hold-downs. Horizontal surface mount connectors are also available. See Figure 2. THROUGH HOLE CONNECTOR CONFIGURATIONS Double Row Housings Double Beam Connectors Double Beam Contact Extended Dual Entry Outrigger Connector PC Board (Ref) Single Row Housings Single Solder Lead Pinched Horizontal Connector Double Solder Leads Horizontal Connector PC Board Single Solder PC Board (Ref) Leads (Ref) Figure 2 3.3. Printed Circuit Boards A. Material and Thickness The pc board material shall be glass epoxy (IPC 4101/26/83 or equivalent). The connectors are designed to accommodate a pc board thickness range of 1.40 mm to 2.40 mm. Call the Product Information number listed at the bottom of page 1 for suitability of other board materials or other board thickness applications not specified on this specification. Rev E Tyco Electronics Corporation 3 of 13 AMPMODU Mod II and Mod IV PC Board Connectors 114-25018 B. Tolerance The maximum bow of the pc board shall be 0.03 mm over the length of the connector. C. Layout for Surface Mount Connectors NOTE Connectors with hold-downs can be used with pc boards with 1.02 mm minimum thickness. i All surface mount connectors can be used for top or bottom entry applications. When a top mounted application is to be used, no post entry holes will be required in the pc board. A stencil is recommended for soldering of the connector to the circuit lands. We recommend liquid photo imageable and dry film for the solder mask material. The layouts for the circuit lands and solder mask are provided in Figure 3. Spaces Times 2.54 1.65 +0.12 Dia Typ 2.54 +0.07 Typ 1.02 +0.08 Dia Typ 2.54 +0.13 Typ 2.16 Min Typ Circuit Land Layout O 0.74 Land Size 0.25 Trace Width 1.75 6.05 0.99 6.05 +0.13 Typ 1.52 Min Typ 0.76 Trace Width 2.54 Typ EEEEEE EEEEEE CC CC CC EECC EECC EE CC EEEEEE Solder Mask Land Layout 26.67 -A- 1.27 Surface Mount Land 0.25 M A S B S 1.52 Surface Mount Land 0.25 M A S B S 1.91 Solder Mask Aperture 2.37 Solder Mask 1.77 Solder Mask Figure 3 D. Layout for Through Hole Top Entry Applications Top entry connectors with and without retention contact solder leads have the same centerline and hole diameter requirement. They use the identical pc board layout as indicated in Figure 4. 4 of 13 Tyco Electronics Corporation Rev E AMPMODU Mod II and Mod IV PC Board Connectors 2.54 " 0.07 Typ 0.89 114-25018 " 0.07 Dia Typ 2.54 3.81 " 1.90 0.07 Typ ) * 0.13 0.00 Dia Typ " 0.07 Typ 2.54 Top Entry Only " 0.07 Typ Bottom and Top Entry Figure 4 E. Layout for Bottom Entry Applications Since these connectors have been designed for bottom entry applications, they have either in-line or extended contact solder leads. The holes through which the mating posts enter are identical in size; however, two additional rows of holes are required for the extended outrigger contact solder leads. See the layout dimensions in Figure 5. Spaces Times 2.54 2.54 " 0.07 Typ 0.89 " 0.07 Dia Typ (Plated Through Holes) 1.90 ) * 0.13 0.00 Dia Typ (Non-Plated Through Holes) 2.54 " 0.07 2.54 " 0.07 Typ Figure 5 F. Layout for Right-Angle Horizontal Connectors Right-angle connectors are designed to be mounted near the edge of a pc board to engage the mating contact posts without interference. The distance from the edge of the pc board and the hole layout dimensions are provided in Figure 6. Rev E Tyco Electronics Corporation 5 of 13 AMPMODU Mod II and Mod IV PC Board Connectors 2.54 114-25018 0.89 Spaces Times 2.54 " 0.07 Typ " 0.07 Dia Typ 7.87 1.52 +0.13 Edge of PC Board Figure 6 G. Through Hole Preparation The holes in the pc board must be precisely located to ensure proper placement and optimum performance of the connector, and must be prepared to the requirements provided in Figure 7. 1.40 Board Thickness (Min) 0.89 +0.08 Dia of Finished Hole After Plating EEEE II II EEEE II II EEEE II II EEEE II II EEEE II II EEEE II II EEEE II II Tin/Lead Plated (As Required) 1.05 +0.05 Drilled Hole Diameter II I EEEEE II I EEEEE II I EEEEE II I EEEEE II I EEEEE II I EEEEE II I EEEEE 1.40 Land Diameter Copper Plating (As Required) (Maximum Hardness of Copper to be 150 Knoop) Figure 7 3.4. Connector Placement CAUTION Connector should be handled only by the housing to avoid deformation, contamination, or damage to contact leads. ! Connector placement may be done either manually or with robotic equipment. The robotic equipment must be adjusted to feed, pick up, and place the connectors on the pc board with an accuracy of 0.25 mm. A. Through Hole Connectors When placing through hole connector on the pc board, make sure the contact solder leads are aligned and started into the matching holes before seating the housing on the pc board. To help hold through hole, top entry, single beam connectors on the pc board prior to soldering, we recommend bending the contact solder leads outward (away from center) to hold the connector in place during soldering. The solder leads must be bottomed on the pc board as shown in Figure 8. Product may also be ordered with retentive solder leads. 6 of 13 Tyco Electronics Corporation Rev E AMPMODU Mod II and Mod IV PC Board Connectors CAUTION 114-25018 When clinching contact solder leads, make sure the housing remains seated on the pc board and the connector housing and pc board are supported. Also, do not apply in-line pressure on the contact leads as this could cause the contacts to dislodge from their seat in the housing. ! Solder Leads Formed Outward Figure 8 B. Surface Mount Connectors On connectors so equipped the hold-down feature is a press fit design to hold the connector on the pc board. All connector housings must be seated on the pc board to ensure proper placement. Also, solder leads must penetrate the solder flux and be aligned within the limits shown in Figure 9. NOTE Optimally, the connector solder leads should be aligned on the pc board lands. However, misregistration is permissible for certain performance classifications as specified in J-STD-001 as indicated below. i Connector Lead Centered on PC Board Land is Preferable Solder Lead Lead Overhang is Acceptable For Some Performance Classifications Per J-STD-001 PC Board Lands PC Board Figure 9 3.5. Mechanical Support A. Hold-Down We recommend that a hold-down be used to keep the connectors in place until the soldering is completed. Tyco Electronics does not manufacture or market hold-downs for general sale. Rev E Tyco Electronics Corporation 7 of 13 AMPMODU Mod II and Mod IV PC Board Connectors 114-25018 B. PC Board Support The system design must provide support for the pc boards to minimize stress on the solder leads. This process is of special concern for surface mount connectors. 3.6. Surface Mount Connector Preparations The pc board lands must be solderable in accordance with Test Specification 109-11. A. Typical Solder Paste Characteristics 1. Alloy type shall be 99.8 Sn lead-free. 2. Flux shall be RMA type. 3. Solids by weight shall be 85% minimum. 4. Mesh designation -200 to +325 (74 to 44 square micron openings, respectively). 5. Minimum viscosity of screen print shall be 5 x 10% cp (centipoise). 6. Minimum viscosity of stencil print shall be 7.5 x 10% cp (centipoise). B. Solder Volume Solder volume for each connector shall be 0.18 mm3 per contact solder lead. NOTE Solder volume may vary depending on solder paste composition. i C. Solder Paste Thickness Solder paste thickness for the solder leads shall be 0.20 mm. D. Stencil Stencil aperture will be determined by the thickness of the stencil being used. Generally, the thinner stencils will have a larger aperture to maintain a given volume of solder paste. Solder deposition should be within the land area of the contact solder leads. CAUTION All traces must be covered by solder mask in the solder deposit area. Exposed traces could cause bridging and create a short, or wick solder away from the solder leads, producing a weak solder joint. ! CAUTION If a hold-down aperture is required other than that specified, the design must ensure that the connector housing will not sit on the solder deposit. ! E. Solder Mask Solder mask is recommended between all lands. If a trace is run between adjacent lands on the solder side of the pc board, a solder mask must be applied over the trace to prevent bridging and wicking of solder away from the contact solder leads. Additionally, there should be solder mask covering any traces in the area of the hold-down solder deposit. Liquid photo imageable or dry film solder masks are recommended (reference Figure 3). 3.7. Through Hole Connectors Preparations Three items are essential when wave soldering through hole connectors: (1) preventing solder bridging across solder leads, (2) preventing wicking of flux/solder into receptacle contacts, and (3) removing flux from the contact after soldering. A. Bridging Solder bridging across solder leads can be prevented by interrupting copper land between leads by etching, plugging, tapping, or masking area between solder leads. Typical configurations are shown in Figure 10. 8 of 13 Tyco Electronics Corporation Rev E AMPMODU Mod II and Mod IV PC Board Connectors CAUTION 114-25018 Etching is not recommended if reduction of copper would be detrimental to current carrying capability of the circuit land. ! Contact Solder Leads Masking Plug Circuit Lands Tape Circuit Leads Receptacle Contact Receptacle Contact Figure 10 B. Wicking Flux that is splashed or driven by heat into the receptacle could cause open or intermittent circuits and can be prevented by using any one of the following: (1) masking plugs, (2) liquid solder mask, and (3) tape. Tyco Electronics has obtained favorable test results using the products and manufacturers listed below: S Liquid Solder Mask No.110, or equivalent (Alphametals Inc., Santa Ana. CA) ) S Masking Tape No. 213 or equivalent (3M Company, Minneapolis, MN ) Our test results have produced the following recommendations. 1. Masking Plug The masking plug must be inserted between the solder leads and firmly seated on the pc board. After soldering, the plug must be pulled out. If no damage is apparent, the masking plug may be used again. 2. Liquid Solder Mask The liquid solder mask must be applied with a brush between the contact solder leads on the bottom side of the pc board. It is water soluble and can easily be removed with clean water. 3. Tape The width of the tape must be comparable to the space between the contact solder leads after the contact solder leads are clinched in place. Mod lI contacts will require a 3.18 mm [1/8 in.] wide strip of tape and the Mod IV contacts will require a 1.59 mm [1/16 in.] wide strip of tape. The tape must be firmly applied to the bottom of the pc board between the contact solder leads. It must not be re-used after it is removed. C. Flux Removal If application requirements and equipment permit, fluxing and soldering can be done without the special precautions for bridging and wicking of solder. Flux and flux residue must be removed to prevent the possibility of intermittent and open circuits. We recommend using any of the cleaners listed in Figure 13 and a clean air supply with pressure suitable for components you are soldering with (see section 3.9, B). 3.8. Soldering Technique A. Soldering Equipment It is recommended that the connectors be soldered using vapor phase reflow (VPR), double sided Batch Vapor Phase (Model VVP 10 BU) and Vitronics} IR (Model SMD 718) equipment, non-focused infrared (IR), or equivalent soldering technique. Tyco Electronics has had success using Corpane{ equipment. { } Manufactured by Corpane Industries Incorporated, Louisville, KY Manufactured by Vitronics Corporation, Newburyport, MA Rev E Tyco Electronics Corporation 9 of 13 AMPMODU Mod II and Mod IV PC Board Connectors 114-25018 B. Connector Capacity The connectors will withstand temperatures of 215_C [419_F] for a maximum of three minutes. Higher temperatures can be withstood for short periods of time as indicated in Figure 11 for the IR reflow. TEMPERATURE TIME SOLDERING PROCESS (At Max Temp) CELSIUS FAHRENHEIT WAVE SOLDERING 260D 500D 5 Seconds VAPOR PHASE SOLDERING 215 419 5 Minutes INFRARED REFLOW SOLDERING 230 446 5 Minutes D Wave Temperature Figure 11 C. Reflow Parameters Due to many variables involved with the reflow process (eg, component density, orientation, etc), it is recommended that the user conduct trial runs under actual manufacturing conditions to ensure product and process compatibility. Recommended reflow parameters are provided in Figure 12. For additional suggestions, contact one of the phone numbers provided at the bottom of page 1. 215_C [419_F] 30 seconds (in secondary vapor) 60 seconds (in primary vapor) 30 seconds (in secondary vapor) VPR: Primary vapor temperature . . . . . . . Preheat time . . . . . . . . . . . . . . . . . . . . Dwell time . . . . . . . . . . . . . . . . . . . . . . Cool down time . . . . . . . . . . . . . . . . . IR: Conveyor speed 635 mm, or 381 mm per minute for bigger boards _ _ PREHEAT 350 C [662 F] ZONE 1 ZONE 2 ZONE 3 SURFACE-MOUNT 240_C [464_F] 260_C [500_F] 265_C [509_F] THROUGH-HOLE 240_C [464_F] 260_C [500_F] 265_C [509_F] Figure 12 3.9. Cleaning After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the solder and flux for recommended cleaning solvents. Figure 13 provides a list of common cleaning solvents that will not affect the connectors for the times and temperatures provided without any adverse effects on the connector. DANGER NOTE Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer. If you have a particular solvent that is not listed, contact Tyco Electronics through one of the telephone numbers at the bottom of page 1. i A. Through Hole Connectors Flux and flux residue can be removed from through hole contacts by directing a narrow stream of solvent through the receptacle followed by a burst of pressurized, clean air. DANGER Compressed air used for cleaning must be reduced to less than 207 kPa [30 psi], and effective chip guarding and personal protective equipment(including eye protection) must be used. 10 of 13 Tyco Electronics Corporation Rev E AMPMODU Mod II and Mod IV PC Board Connectors 114-25018 CLEANER NAME TEMPERATURES (Maximum) TIME (Mi (Minutes) ) TYPE CELSIUS FAHRENHEIT Alpha 2110H Aqueous 1 132 270 Bioact EC-7z 100 212 Solvent 5 Butyl CarbitolD Solvent 1 Isopropyl Alcohol Solvent 5 100 212 Kester 5778s Aqueous 5 100 212 Aqueous 5 100 212 Aqueous 5 100 212 Loncoterge 530D Aqueous 5 100 212 Terpene Solvent Solvent 5 100 212 Kester 5779s Loncoterge 520D H Product of Fry's Metals, Inc. z Product of Petroferm, Inc. Room Ambient D Product of Union Carbide Corp. s Product of Litton Systems, Inc. Figure 13 B. Drying CAUTION Excessive temperatures may cause housing degradation. ! Connectors can withstand a temperature of -65 to 100_C [-85 to 212_F]. Values may vary with different automatic cleaning equipment (see equipment manufacturer's recommendations). 3.10. Checking Installed Connector All solder joints should conform to those specified in Workmanship Specification 101-21 and all other requirements specified on this document. The housing must seat on the pc board to within the tolerance shown in Figure 14. Surface Mount Connector 0.50 0.50 Through Hole Connector Housing Standoffs Must Be Seated on Surface of PC Board Figure 14 Rev E Tyco Electronics Corporation 11 of 13 AMPMODU Mod II and Mod IV PC Board Connectors 114-25018 3.11. Keying The connectors can be keyed with keying plug 86286-1 to prevent inadvertent mating of similar connectors in the same area. The mating assembly of a keyed connector must have the mating post removed. The keying plug must be inserted with the small end in the cavity. See Figure 15. Keying Plug Pointed End Figure 15 3.12. Repair All connectors will require the desoldering of all contact solder leads, removing and discarding the damaged connector, and replacing it with a new one. 4. QUALIFICATION The AMPMODU PC Board Connectors are Recognized by Underwriters' Laboratories, Inc. (UL) in File E28476, and Certified to CSA International in File LR7189. 5. TOOLING No special tooling is required when handling connectors for manual placement; however, it is recommended that a support plate be used for through hole applications for both manual and robotic equipment placement to prevent deformation of the solder leads. See Figure 16. 5.1. PC Board Support A pc board support should be used to prevent bowing of the pc board during the placement of a connector on the board and to allow the contact solder leads to go through the pc board without deforming the lead. 5.2. Robotic Equipment The robotic equipment must have a true position accuracy tolerance of 0.25 mm to properly locate the connectors for insertion. This includes gripper and fixture tolerances as well as equipment repeatability. If used, the robotic equipment must use the connector datum surfaces detailed on the customer drawing to ensure reliable connector placement. PC Board Support (Customer Supplied) Robotic Equipment Holes (Ref) Channel (Ref) 12 of 13 Figure 16 Tyco Electronics Corporation Rev E AMPMODU Mod II and Mod IV PC Board Connectors 114-25018 6. VISUAL AID Figure 17 shows a typical application of an AMPMODU PC Board Connector. This illustration should be used by production personnel to ensure a correctly applied product. Applications which DO NOT appear correct should be inspected using the information in the preceding pages of this specification and in the instructional material shipped with the product. SURFACE MOUNTED SOLDER LEADS CENTERED ON LANDS SOLDER FILLETS EVENLY FORMED OVER SOLDER LEADS NO SOLDER, FLUX, OR FLUX RESIDUE SHALL BE IN RECEPTACLE AREA HOUSING MUST BE SEATED ON PC BOARD FIGURE 17. VISUAL AID Rev E Tyco Electronics Corporation 13 of 13