Application Specification
AMPMODU*
Mod II and Mod IV Printed 114-25018
LOC B
1
of 13
E
2008 Tyco Electronics Corporation, Harrisburg, PA
All International Rights Reserved
TE logo and Tyco Electronics are trademarks.
*Trademark. Other products, logos, and company names used are the property of their respective owners.
TOOLING ASSISTANCE CENTER 1-800-722-1111
PRODUCT INFORMATION 1-800-522-6752 This controlled document is subject to change.
For latest revision and Regional Customer Service,
visit our website at
www.tycoelectronics.com
Circuit Board Connectors
19 MAY 08 Rev E
All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless
otherwise specified, dimensions have a tolerance of +0.13 and angles have a tolerance of +2
_
. Figures and
illustrations are for identification only and are not drawn to scale.
1. INTRODUCTION
This specification covers the requirements for application of AMPMODU Mod II and Mod IV Printed Circuit
(PC) Board Connectors for through hole and Surface Mount Technology (SMT). The connectors are available
with double beam receptacle contacts designed to accept 0.64 mm square posts. There are connectors in 2
through 80 positions for top and bottom entry applications as well as pass through applications with 2.54 mm
contact centerline spacing. All side entry connectors are available in 4 through 130 positions for double rows
and 2 through 65 positions for single row. The double beam contact connectors are available with single and
double rows of contacts. There are various solder lead configurations to meet a variety of system
requirements.
There are surface mount connectors available with and without hold–downs. The hold–downs help position the
connector on the pc board and hold it in place during soldering. Through hole connectors are available with and
without retentive contact leads. The retentive contact leads help stabilize and hold the connector in place
during soldering. Connectors without hold–down or retentive contact lead stabilizing features are available to
accommodate alternate system requirements.
When corresponding with Tyco Electronics Personnel, use the terminology provided on this specification to
help facilitate your inquiry for information. Basic terms and features of components are provided in Figure 1.
Mating
Face
Double Beam Contact
Connectors (Typ)
Double Row
Connector
Single Row
Connector
Right-Angle
Horizontal
Connector
Top Entry
Dual Entry
Contact
Cavity
Figure 1
Double Row
Connector
Dual
Entry
Single Row
Connector
Dual Entry Right-Angle Surface
Mount (Horizontal)
NOTE
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2. REFERENCE MATERIAL
2.1. Revision Summary
This paragraph is reserved for a revision summary of changes and additions made to this specification. The
following changes have been made to this revision.
S
Updated document to corporate requirements
S
New format
2.2. Customer Assistance
Reference Part Number 534998 and Product Code 5008 are representative numbers of AMPMODU PC Board
Connectors. Use of these numbers will identify the product line and expedite your inquiries through a service
network established to help you obtain product information. Such information can be obtained through a local
Tyco Electronics Representative or, after purchase, by calling the Tooling Assistance Center or the Product
Information Center number at the bottom of page 1.
2.3. Drawings
Customer drawings for each connector are available from the service network. The information contained in
customer drawings takes priority if there is a conflict with this specification or with any technical documentation
supplied by Tyco Electronics.
2.4. Manuals
Manual 402–40 is available upon request and can be used as a guide in soldering. This manual provides
information on various flux types and characteristics along with the commercial designation and flux removal
procedures. A checklist is included in the manual as a guide for information on soldering problems.
2.5. Specifications
Product Specifications provide product performance requirements and test information. See Product
Specifications 108–25022 and 108–25026 for double beam contacts.
3. REQUIREMENTS
3.1. Storage
A. Ultraviolet Light
Prolonged exposure to ultraviolet light may deteriorate the chemical composition used in the connector
housing material.
B. Shelf Life
The connectors should remain in the shipping containers until ready for use to prevent deformation of the
contact solder leads or other damage to the connectors. The connectors should be used on a first in, first
out basis to avoid storage contamination.
C. Chemical Exposure
Do not store connectors near any chemical listed below as they may cause stress, corrosion, cracks in the
contacts.
Alkalies Ammonia Citrates Phosphates Citrates Sulfur Compounds
Amines Carbonates Nitrites Sulfur Nitrites Tartrates
3.2. Special Characteristics
AMPMODU PC Board Connectors with double beam contacts have an operating temperature range of –65
_
C
to 105
_
C [–85
_
F to 221
_
F], and the connectors consist of a black polyester housing and phosphor bronze
contacts with one of two types of plating. The contact plating may be overall nickel with gold on the mating
surface and matte tin on the solder leads, or it may be overall nickel and matte tin plated.
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The housing contact cavities on the mating face of the connectors have a tapered lead–in to facilitate mating
with contact posts. Through hole connectors are available as: (1) top entry with pinched solder leads; (2) dual
entry with in–line and extended outrigger solder leads; and (3) right–angle horizontal connectors. Vertical
surface mount connectors are available with and without hold–downs. Horizontal surface mount connectors are
also available. See Figure 2.
Figure 2
THROUGH HOLE CONNECTOR CONFIGURATIONS
Horizontal Connector
Horizontal Connector
PC Board
(Ref)
PC Board
(Ref)
Double Beam ConnectorsDouble Row Housings
Single Row Housings
Double Beam Contact
PC Board (Ref)
Dual Entry
Connector
Extended
Outrigger
Double Solder Leads
Pinched Single Solder Lead
Single Solder
Leads
3.3. Printed Circuit Boards
A. Material and Thickness
The pc board material shall be glass epoxy (IPC 4101/26/83 or equivalent). The connectors are designed
to accommodate a pc board thickness range of 1.40 mm to 2.40 mm. Call the Product Information number
listed at the bottom of page 1 for suitability of other board materials or other board thickness applications
not specified on this specification.
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B. Tolerance
The maximum bow of the pc board shall be 0.03 mm over the length of the connector.
C. Layout for Surface Mount Connectors
Connectors with hold-downs can be used with pc boards with 1.02 mm minimum thickness.
All surface mount connectors can be used for top or bottom entry applications. When a top mounted
application is to be used, no post entry holes will be required in the pc board. A stencil is recommended for
soldering of the connector to the circuit lands. We recommend liquid photo imageable and dry film for the
solder mask material. The layouts for the circuit lands and solder mask are provided in Figure 3.
1.02 +0.08 Dia Typ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
2.54
Typ 26.67 -A-
1.27Surface Mount Land
0.25 MASBS
1.52Surface Mount Land 0.25 M ASBS
∅
1.91 Solder Mask Aperture
2.37 Solder Mask
1.77 Solder Mask
∅
0.99
6.05
1.75
0.25 Trace
Width
O 0.74 Land
Size
0.76 Trace Width
Circuit Land Layout
Solder Mask Land Layout
Spaces Times 2.54
1.65 +0.12 Dia Typ2.54 +0.07 Typ
2.16 Min Typ
2.54 +0.13 Typ 6.05 +0.13 Typ
1.52 Min Typ
Figure 3
D. Layout for Through Hole Top Entry Applications
Top entry connectors with and without retention contact solder leads have the same centerline and hole
diameter requirement. They use the identical pc board layout as indicated in Figure 4.
NOTE
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Figure 4
Top Entry Only Bottom and Top Entry
2.54
"
0.07 Typ
2.54
"
0.07 Typ
0.89
"
0.07 Dia Typ
3.81
"
0.07 Typ 2.54
"
0.07 Typ
1.90
)
0.13
*
0.00 Dia Typ
E. Layout for Bottom Entry Applications
Since these connectors have been designed for bottom entry applications, they have either in–line or
extended contact solder leads. The holes through which the mating posts enter are identical in size;
however, two additional rows of holes are required for the extended outrigger contact solder leads. See the
layout dimensions in Figure 5.
Figure 5
2.54
"
0.07 Typ
Spaces Times 2.54
2.54
"
0.07 Typ 0.89
"
0.07 Dia Typ
(Plated Through Holes)
1.90
)
0.13
*
0.00 Dia Typ
(Non-Plated Through Holes)
2.54
"
0.07
F. Layout for Right-Angle Horizontal Connectors
Right–angle connectors are designed to be mounted near the edge of a pc board to engage the mating
contact posts without interference. The distance from the edge of the pc board and the hole layout
dimensions are provided in Figure 6.
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Figure 6
7.87
Edge of PC Board
1.52 +0.13
0.89
"
0.07 Dia Typ
2.54
"
0.07 Typ
Spaces Times 2.54
G. Through Hole Preparation
The holes in the pc board must be precisely located to ensure proper placement and optimum
performance of the connector, and must be prepared to the requirements provided in Figure 7.
Figure 7
1.40 Land
Diameter
Copper Plating
(As Required)
(Maximum Hardness
of Copper to be 150
Knoop)
Tin/Lead Plated
(As Required)
1.05 +0.05 Drilled
Hole Diameter
0.89 +0.08 Dia of Finished
Hole After Plating
1.40 Board
Thickness
(Min)
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÏÏ
ÏÏ
ÏÏ
ÏÏ
ÏÏ
ÏÏ
ÏÏ
ÌÌ
ÌÌ
ÌÌ
ÌÌ
ÌÌ
ÌÌ
ÌÌ
ÏÏ
ÏÏ
ÏÏ
ÏÏ
ÏÏ
ÏÏ
ÏÏ
Ì
Ì
Ì
Ì
Ì
Ì
Ì
ÉÉÉÉÉ
ÉÉÉÉÉ
ÉÉÉÉÉ
ÉÉÉÉÉ
ÉÉÉÉÉ
ÉÉÉÉÉ
ÉÉÉÉÉ
3.4. Connector Placement
Connector should be handled only by the housing to avoid deformation, contamination, or damage to contact leads.
Connector placement may be done either manually or with robotic equipment. The robotic equipment must be
adjusted to feed, pick up, and place the connectors on the pc board with an accuracy of 0.25 mm.
A. Through Hole Connectors
When placing through hole connector on the pc board, make sure the contact solder leads are aligned and
started into the matching holes before seating the housing on the pc board. To help hold through hole, top
entry, single beam connectors on the pc board prior to soldering, we recommend bending the contact
solder leads outward (away from center) to hold the connector in place during soldering. The solder leads
must be bottomed on the pc board as shown in Figure 8. Product may also be ordered with retentive
solder leads.
CAUTION
!
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When clinching contact solder leads, make sure the housing remains seated on the pc board and the connector
housing and pc board are supported. Also, do not apply in-line pressure on the contact leads as this could cause the
contacts to dislodge from their seat in the housing.
Figure 8
Solder Leads
Formed Outward
B. Surface Mount Connectors
On connectors so equipped the hold–down feature is a press fit design to hold the connector on the pc
board. All connector housings must be seated on the pc board to ensure proper placement. Also, solder
leads must penetrate the solder flux and be aligned within the limits shown in Figure 9.
Optimally, the connector solder leads should be aligned on the pc board lands. However, misregistration is permissible
for certain performance classifications as specified in J-STD-001 as indicated below.
Connector
Solder Lead
PC Board Lands
PC Board
Lead Centered on
PC Board Land is
Preferable
Lead Overhang is
Acceptable For
Some Performance
Classifications
Per J-STD-001
Figure 9
3.5. Mechanical Support
A. Hold-Down
We recommend that a hold–down be used to keep the connectors in place until the soldering is
completed. Tyco Electronics does not manufacture or market hold–downs for general sale.
CAUTION
!
NOTE
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B. PC Board Support
The system design must provide support for the pc boards to minimize stress on the solder leads. This
process is of special concern for surface mount connectors.
3.6. Surface Mount Connector Preparations
The pc board lands must be solderable in accordance with Test Specification 109–11.
A. Typical Solder Paste Characteristics
1. Alloy type shall be 99.8 Sn lead–free.
2. Flux shall be RMA type.
3. Solids by weight shall be 85% minimum.
4. Mesh designation –200 to +325 (74 to 44 square micron openings, respectively).
5. Minimum viscosity of screen print shall be 5 x 10% cp (centipoise).
6. Minimum viscosity of stencil print shall be 7.5 x 10% cp (centipoise).
B. Solder Volume
Solder volume for each connector shall be 0.18 mm3 per contact solder lead.
Solder volume may vary depending on solder paste composition.
C. Solder Paste Thickness
Solder paste thickness for the solder leads shall be 0.20 mm.
D. Stencil
Stencil aperture will be determined by the thickness of the stencil being used. Generally, the thinner
stencils will have a larger aperture to maintain a given volume of solder paste. Solder deposition should be
within the land area of the contact solder leads.
All traces must be covered by solder mask in the solder deposit area. Exposed traces could cause bridging and create
a short, or wick solder away from the solder leads, producing a weak solder joint.
If a hold-down aperture is required other than that specified, the design must ensure that the connector housing will
not sit on the solder deposit.
E. Solder Mask
Solder mask is recommended between all lands. If a trace is run between adjacent lands on the solder
side of the pc board, a solder mask must be applied over the trace to prevent bridging and wicking of
solder away from the contact solder leads. Additionally, there should be solder mask covering any traces
in the area of the hold–down solder deposit. Liquid photo imageable or dry film solder masks are
recommended (reference Figure 3).
3.7. Through Hole Connectors Preparations
Three items are essential when wave soldering through hole connectors: (1) preventing solder bridging across
solder leads, (2) preventing wicking of flux/solder into receptacle contacts, and (3) removing flux from the
contact after soldering.
A. Bridging
Solder bridging across solder leads can be prevented by interrupting copper land between leads by
etching, plugging, tapping, or masking area between solder leads. Typical configurations are shown in
Figure 10.
NOTE
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CAUTION
!
CAUTION
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Etching is not recommended if reduction of copper would be detrimental to current carrying capability of the circuit
land.
Figure 10
Masking Plug Tape
Circuit Leads
Circuit Lands
Contact Solder
Leads
Receptacle Contact Receptacle Contact
B. Wicking
Flux that is splashed or driven by heat into the receptacle could cause open or intermittent circuits and can
be prevented by using any one of the following: (1) masking plugs, (2) liquid solder mask, and (3) tape.
Tyco Electronics has obtained favorable test results using the products and manufacturers listed below:
S
Liquid Solder Mask No.110, or equivalent (Alphametals Inc., Santa Ana. CA) )
S
Masking Tape No. 213 or equivalent (3M Company, Minneapolis, MN )
Our test results have produced the following recommendations.
1. Masking Plug
The masking plug must be inserted between the solder leads and firmly seated on the pc board. After
soldering, the plug must be pulled out. If no damage is apparent, the masking plug may be used again.
2. Liquid Solder Mask
The liquid solder mask must be applied with a brush between the contact solder leads on the bottom
side of the pc board. It is water soluble and can easily be removed with clean water.
3. Tape
The width of the tape must be comparable to the space between the contact solder leads after the
contact solder leads are clinched in place. Mod lI contacts will require a 3.18 mm [1/8 in.] wide strip of
tape and the Mod IV contacts will require a 1.59 mm [1/16 in.] wide strip of tape. The tape must be firmly
applied to the bottom of the pc board between the contact solder leads. It
must not
be re–used after it is
removed.
C. Flux Removal
If application requirements and equipment permit, fluxing and soldering can be done without the special
precautions for bridging and wicking of solder. Flux and flux residue must be removed to prevent the
possibility of intermittent and open circuits. We recommend using any of the cleaners listed in Figure 13
and a clean air supply with pressure suitable for components you are soldering with (see section 3.9, B).
3.8. Soldering Technique
A. Soldering Equipment
It is recommended that the connectors be soldered using vapor phase reflow (VPR), double sided Batch
Vapor Phase (Model VVP 10 BU) and Vitronics
}
IR (Model SMD 718) equipment, non–focused infrared
(IR), or equivalent solderin
g
technique. Tyco Electronics has had success using Corpane
{
equipment
.
{
Manufactured by Corpane Industries Incorporated, Louisville, KY
}
Manufactured by Vitronics Corporation, Newburyport, MA
CAUTION
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B. Connector Capacity
The connectors will withstand temperatures of 215
_
C [419
_
F] for a maximum of three minutes. Higher
temperatures can be withstood for short periods of time as indicated in Figure 11 for the IR reflow.
TEMPERATURE TIME
CELSIUS FAHRENHEIT (At Max Temp)
WAVE SOLDERING 260
D
500
D
5 Seconds
VAPOR PHASE SOLDERING 215 419 5 Minutes
INFRARED REFLOW SOLDERING 230 446 5 Minutes
D
W ave Temperature
Figure 11
C. Reflow Parameters
Due to many variables involved with the reflow process (eg, component density, orientation, etc), it is
recommended that the user conduct trial runs under actual manufacturing conditions to ensure product
and process compatibility. Recommended reflow parameters are provided in Figure 12. For additional
suggestions, contact one of the phone numbers provided at the bottom of page 1.
VPR: Primary vapor temperature 215
_
C [419
_
F]. . . . . . .
Preheat time 30 seconds (in secondary vapor). . . . . . . . . . . . . . . . . . . .
Dwell time 60 seconds (in primary vapor). . . . . . . . . . . . . . . . . . . . . .
Cool down time 30 seconds (in secondary vapor). . . . . . . . . . . . . . . . .
IR: Conveyor speed 635 mm, or 381 mm per minute for bigger boards
PREHEAT 350
_
C [662
_
F] ZONE 1 ZONE 2 ZONE 3
SURFACE-MOUNT 240
_
C [464
_
F] 260
_
C [500
_
F] 265
_
C [509
_
F]
THROUGH-HOLE 240
_
C [464
_
F] 260
_
C [500
_
F] 265
_
C [509
_
F]
Figure 12
3.9. Cleaning
After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the solder
and flux for recommended cleaning solvents. Figure 13 provides a list of common cleaning solvents that will
not affect the connectors for the times and temperatures provided without any adverse effects on the
connector.
Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer.
If you have a particular solvent that is not listed, contact Tyco Electronics through one of the telephone numbers at the
bottom of page 1.
A. Through Hole Connectors
Flux and flux residue can be removed from through hole contacts by directing a narrow stream of solvent
through the receptacle followed by a burst of pressurized, clean air.
Compressed air used for cleaning must be reduced to less than 207 kPa [30 psi], and effective chip guarding and
personal protective equipment(including eye protection) must be used.
DANGER
NOTE
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DANGER
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CLEANER TIME
(Mi )
TEMPERATURES (Maximum)
NAME TYPE (Minutes) CELSIUS FAHRENHEIT
Alpha 2110
H
Aqueous 1 132 270
Bioact EC-7
z
Solvent 5 100 212
Butyl Carbitol
D
Solvent 1 Room Ambient
Isopropyl Alcohol Solvent 5 100 212
Kester 5778
s
Aqueous 5 100 212
Kester 5779
s
Aqueous 5 100 212
Loncoterge 520
D
Aqueous 5 100 212
Loncoterge 530
D
Aqueous 5 100 212
Terpene Solvent Solvent 5 100 212
H
Product of Fry’s Metals, Inc.
z
Product of Petroferm, Inc.
D
Product of Union Carbide Corp.
s
Product of Litton Systems, Inc.
Figure 13
B. Drying
Excessive temperatures may cause housing degradation.
Connectors can withstand a temperature of –65 to 100
_
C [–85 to 212
_
F]. Values may vary with different
automatic cleaning equipment (see equipment manufacturer’ s recommendations).
3.10. Checking Installed Connector
All solder joints should conform to those specified in Workmanship Specification 101–21 and all other
requirements specified on this document. The housing must seat on the pc board to within the tolerance shown
in Figure 14.
Figure 14
0.50
Through Hole Connector
Surface Mount Connector
0.50
Housing Standoffs Must Be
Seated on Surface of PC Board
CAUTION
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3.11. Keying
The connectors can be keyed with keying plug 86286–1 to prevent inadvertent mating of similar connectors in
the same area. The mating assembly of a keyed connector must have the mating post removed. The keying
plug must be inserted with the small end in the cavity. See Figure 15.
Figure 15
Pointed End
Keying Plug
3.12. Repair
All connectors will require the desoldering of all contact solder leads, removing and discarding the damaged
connector, and replacing it with a new one.
4. QUALIFICATION
The AMPMODU PC Board Connectors are Recognized by Underwriters’ Laboratories, Inc. (UL) in File
E28476, and Certified to CSA International in File LR7189.
5. TOOLING
No special tooling is required when handling connectors for manual placement; however, it is recommended
that a support plate be used for through hole applications for both manual and robotic equipment placement to
prevent deformation of the solder leads. See Figure 16.
5.1. PC Board Support
A pc board support should be used to prevent bowing of the pc board during the placement of a connector
on the board and to allow the contact solder leads to go through the pc board without deforming the lead.
5.2. Robotic Equipment
The robotic equipment must have a true position accuracy tolerance of 0.25 mm to properly locate the
connectors for insertion. This includes gripper and fixture tolerances as well as equipment repeatability. If
used, the robotic equipment must use the connector datum surfaces detailed on the customer drawing to
ensure reliable connector placement.
Figure 16
PC Board Support
(Customer Supplied)
Robotic Equipment
Holes
(Ref)
Channel
(Ref)
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6. VISUAL AID
Figure 17 shows a typical application of an AMPMODU PC Board Connector. This illustration should be used
by production personnel to ensure a correctly applied product. Applications which DO NOT appear correct
should be inspected using the information in the preceding pages of this specification and in the instructional
material shipped with the product.
FIGURE 17. VISUAL AID
SURFACE MOUNTED SOLDER
LEADS CENTERED ON LANDS
HOUSING MUST BE
SEATED ON PC BOARD
SOLDER FILLETS EVENLY
FORMED OVER SOLDER LEADS
NO SOLDER, FLUX, OR FLUX RESIDUE
SHALL BE IN RECEPTACLE AREA