The mA733M is obsolete and no longer supplied. SLFS027B - NOVEMBER 1970 - REVISED MAY 2004 D 200-MHz Bandwidth D 250-k Input Resistance D Selectable Nominal Amplification of 10, D mA733C . . . D, N, OR NS PACKAGE mA733M . . . J PACKAGE (TOP VIEW) IN+ NC GAIN ADJ 2A GAIN ADJ 1A VCC- NC OUT+ 1 14 2 13 3 4 m m 12 11 5 10 6 9 7 8 100, or 400 No Frequency Compensation Required mA733M . . . U PACKAGE (TOP VIEW) IN+ GAIN ADJ 2A GAIN ADJ 1A VCC - OUT+ IN- NC GAIN ADJ 2B GAIN ADJ 1B VCC+ NC OUT- 1 10 2 9 3 8 4 7 5 6 IN - GAIN ADJ 2B GAIN ADJ 1B VCC+ OUT- NC No internal connection description/ordering information The A733 is a monolithic two-stage video amplifier with differential inputs and differential outputs. Internal series-shunt feedback provides wide bandwidth, low phase distortion, and excellent gain stability. Emitter-follower outputs enable the device to drive capacitive loads, and all stages are current-source biased to obtain high common-mode and supply-voltage rejection ratios. Fixed differential amplification of 10 V/ V, 100 V/ V, or 400 V/ V may be selected without external components, or amplification may be adjusted from 10 V/ V to 400 V/ V by the use of a single external resistor connected between 1A and 1B. No external frequency-compensating components are required for any gain option. The device is particularly useful in magnetic-tape or disc-file systems using phase or NRZ encoding and in high-speed thin-film or plated-wire memories. Other applications include general-purpose video and pulse amplifiers where wide bandwidth, low phase shift, and excellent gain stability are required. The A733C is characterized for operation from 0C to 70C; the A733M is characterized for operation over the full military temperature range of -55C to 125C. ORDERING INFORMATION P-DIP (N) 0C to 70C ORDERABLE PART NUMBER PACKAGE TA SOIC (D) Tube of 25 UA733CN Tube of 50 UA733CD Reel of 2500 UA733CDR TOP-SIDE MARKING UA733CN UA733C SOP (NS) Reel of 2000 UA733CNSR UA733 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated !"# $% $ ! ! & ' $$ ()% $ !* $ #) #$ * ## !% POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 m m The mA733M is obsolete and no longer supplied. SLFS027B - NOVEMBER 1970 - REVISED MAY 2004 symbol GAIN ADJ 1A GAIN ADJ 2A IN + OUT+ + _ IN - OUT- GAIN ADJ 1B GAIN ADJ 2B schematic VCC+ 2.4 k 2.4 k 10 k 1.1 k 1.1 k OUT+ IN + 7 k IN - 1A GAIN ADJ 50 7 k 1B OUT - GAIN ADJ 50 2B 2A 590 590 300 1.4 k 300 400 400 VCC - Component values shown are nominal. 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 m m The mA733M is obsolete and no longer supplied. SLFS027B - NOVEMBER 1970 - REVISED MAY 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) mA733C mA733M UNIT Supply voltage VCC+ (see Note 1) 8 8 V Supply voltage VCC- (see Note 1) -8 -8 V Differential input voltage 5 5 V Common-mode input voltage 6 6 V Output current 10 10 mA Continuous total power dissipation See Dissipation Rating Table Package thermal impedance, qJA (see Notes 2 and 3) D package 86 N package 80 NS package C/W C/W 76 Maximum junction temperature, TJ C 150 Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds J or U package 300 C Storage temperature range, Tstg - 65 to 150 - 65 to 150 C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions beyond those indicated in the recommended operating conditions section of this specification is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential input voltages, are with respect to the midpoint between VCC+ and VCC-. 2. Maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) - TA)/qJA. Operating at the absolute maximum TJ of 150C can affect reliability. 3. The package thermal impedance is calculated in accordance with JESD 51-7. DISSIPATION RATING TABLE PACKAGE TA 25C POWER RATING DERATING FACTOR DERATE ABOVE TA TA = 70C POWER RATING TA = 125C POWER RATING J (A733M) 500 mW 11.0 mW/C 104C 500 mW 269 mW POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 m m The mA733M is obsolete and no longer supplied. SLFS027B - NOVEMBER 1970 - REVISED MAY 2004 electrical characteristics, VCC = 6 V, TA = 25C PARAMETER AVD BW Large-signal differential voltage amplification Bandwidth FIGURE 1 2 TEST CONDITIONS VOD = 1 V RS = 50 mA733C mA733M GAIN OPTION MIN TYP MAX MIN TYP MAX 1 250 400 600 300 400 500 2 80 100 120 90 100 110 3 8 10 12 9 10 11 1 50 50 2 90 90 3 200 200 UNIT V/ V MHz IIO Input offset current Any 0.4 5 0.4 3 A IIB Input bias current Any 9 30 9 20 A VICR Common-mode input voltage range 1 Any 1 VOC Common-mode output voltage 1 Any 2.4 VOO Output offset voltage 1 VOPP Maximum peakto-peak output voltage swing 1 2.9 3.4 1 0.6 2&3 0.35 Any 3 4.7 10 24 1 ri Input resistance 3 VOD 1 V 2 Output resistance Ci Input capacitance 3 CMRR Common-mode rejection ration 4 kSVR Supply voltage rejection ratio (VCC/(VIO) Vn tpd VOD 1 V VIC = 1 V, f 100 kHz 2 2 2 1 VCC = 0.5 V 2 Broadband equivalent input noise voltage 5 BW = 1 kHz to 10 MHz Propagation delay time 2 Rise time Isink(max) Maximum output sink current ICC Supply current 2 60 1.5 0.6 1.5 1.5 0.35 1 3 4.7 20 24 V V V 4 k 250 20 20 2 2 pF 86 50 60 86 RS = 50 , Output voltage step = 1 V 1 7.5 2 6.0 3 3.6 RS = 50 , Output voltage step = 1 V 1 10.5 2 4.5 3 2.5 Any 2.5 Any * DALLAS, TEXAS 75265 70 70 12 POST OFFICE BOX 655303 3.4 70 The gain option is selected as follows: Gain Option 1: Gain-adjust pin 1A is connected to pin 1B, and pins 2A and 2B are open. Gain Option 2: Gain-adjust pin 1A and pin 1B are open, pin 2A is connected to pin 2B. Gain Option 3: All four gain-adjust pins are open. 4 2.9 250 Any No load, No signal V dB VIC = 1 V, f = 5 MHz tr 2.4 4 3 ro 1 50 dB 12 V 7.5 10 6.0 10 ns 10 ns 3.6 10.5 12 4.5 2.5 3.6 16 70 2.5 24 3.6 16 mA 24 mA m m The mA733M is obsolete and no longer supplied. SLFS027B - NOVEMBER 1970 - REVISED MAY 2004 electrical characteristics, VCC = 6 V, TA = 0C to 70C for mA733C, - 55C to 125C for mA733M PARAMETER AVD IIO IIB Large-signal differential voltage amplification FIGURE 1 TEST CONDITIONS mA733C mA733M GAIN OPTION MIN MAX MIN MAX 1 250 600 200 600 2 80 120 80 120 3 8 12 8 12 VOD = 1 V UNIT V/ V Input offset current Any 6 5 A Input bias current Any 40 40 A VICR Common-mode input voltage range 1 VOO Output offset voltage 1 VOPP Maximum peak-to-peak output voltage swing 1 ri Input resistance 3 CMRR Common-mode rejection ratio 4 kSVR Supply voltage rejection ratio (VCC /(VIO) 1 Isink(max) Maximum output sink current ICC Supply current Any 1 1 V 1 1.5 1.5 2&3 1.5 1.2 Any V 2.8 2.5 V VOD 1 V VIC = +1 V, f 100 kHz 2 8 8 k 2 50 50 dB VCC = 0.5 V 2 50 50 dB Any 2.5 2.2 mA No load, No signal Any 27 27 mA The gain option is selected as follows: Gain Option 1: Gain-adjust pin 1A is connected to pin 1B, and pins 2A and 2B are open. Gain Option 2: Gain-adjust pin 1A and pin 1B are open, pin 2A is connected to pin 2B. Gain Option 3: All four gain-adjust pins are open. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 m m The mA733M is obsolete and no longer supplied. SLFS027B - NOVEMBER 1970 - REVISED MAY 2004 PARAMETER MEASUREMENT INFORMATION test circuits 0.2 F + + VOD VID VID 2 k 0.2 F - - 50 50 50 50 1 k 1 k Figure 2 Figure 1 0.2 F 50 + + VOD 0.2 F 50 2 k - - VIC 1 k Figure 3 1 k Figure 4 2B 1B 0.2 F + 0.2 F + - VOD 2 k - 50 50 1 k Radj 2A 1A VOLTAGE AMPLIFICATION ADJUSTMENT Figure 5 6 Figure 6 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 k m m The mA733M is obsolete and no longer supplied. SLFS027B - NOVEMBER 1970 - REVISED MAY 2004 TYPICAL CHARACTERISTICS PHASE SHIFT vs FREQUENCY PHASE SHIFT vs FREQUENCY 5 50 VCC = 6 V TA = 25C 0 - 50 Phase Shift - Degrees Phase Shift - Degrees VCC = 6 V TA = 25C 0 -5 GAIN 2 -10 -15 GAIN 2 -100 -150 -200 -250 -300 -350 -400 -20 0 1 2 3 4 5 6 7 8 9 -450 10 1 4 f - Frequency - MHz 1.2 VCC = 6 V GAIN 1 1.1 mA733C GAIN 2 GAIN 3 1.0 GAIN 2 GAIN 3 0.9 GAIN 1 - 50 - 25 0 25 50 75 TA - Free-Air Temperature - C 100 125 Voltage Amplification Relative to Value at VCC +_ = +_ 6 V VOLTAGE AMPLIFICATION (SINGLE-ENDED OR DIFFERENTIAL) vs TEMPERATURE Voltage Amplification Relative to Value at TA = 25o C 40 100 400 Figure 8 Figure 7 0.8 -75 10 f - Frequency - MHz VOLTAGE AMPLIFICATION (SINGLE-ENDED OR DIFFERENTIAL) vs SUPPLY VOLTAGE 1.4 TA = 25C 1.2 GAIN 3 1.0 0.8 GAIN 2 0.6 GAIN 1 0.4 3 Figure 9 4 5 6 7 |VCC| - Supply Voltage - V 8 Figure 10 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 7 m m The mA733M is obsolete and no longer supplied. SLFS027B - NOVEMBER 1970 - REVISED MAY 2004 TYPICAL CHARACTERISTICS SINGLE-ENDED VOLTAGE AMPLIFICATION vs FREQUENCY DIFFERENTIAL VOLTAGE AMPLIFICATION vs RESISTANCE BETWEEN G1A AND G1B VCC = 6 V VOD = 1 V TA = 25C See Figure 6 700 AVD - Differential Voltage Amplification AVS - Single-ended Voltage Amplification - dB 1000 400 200 100 70 40 20 10 50 GAIN 1 40 GAIN 2 30 20 GAIN 3 10 VCC = 6 V TA = 25C 0 10 40 100 400 1k 4k 1 10 k 4 Figure 11 24 No Load No Signal TA = 25C 20 16 I CC - Supply Current - mA I CC - Supply Current - mA 18 14 mA733C 12 10 8 6 VCC = 6 V No Load No Signal - 50 - 25 16 12 8 4 0 25 50 75 100 125 TA - Free-Air Temperature - C 0 3 4 5 Figure 14 POST OFFICE BOX 655303 6 7 |VCC| - Supply Voltage - V Figure 13 8 400 SUPPLY CURRENT vs SUPPLY VOLTAGE 20 0 -75 100 Figure 12 SUPPLY CURRENT vs FREE-AIR TEMPERATURE 2 40 f - Frequency - MHz Radj - Resistance Between G1A and G1B - 4 10 * DALLAS, TEXAS 75265 8 m m The mA733M is obsolete and no longer supplied. SLFS027B - NOVEMBER 1970 - REVISED MAY 2004 TYPICAL CHARACTERISTICS 5 VCC = 6 V TA = 25C 4 3 2 1 0 10 40 MAXIMUM PEAK-TO-PEAK OUTPUT VOLTAGE vs SUPPLY VOLTAGE VOPP - Maximum Peak-to-Peak Output Voltage - V VOPP - Maximum Peak-to-Peak Output Voltage - V MAXIMUM PEAK-TO-PEAK OUTPUT VOLTAGE vs LOAD RESISTANCE 100 400 1k RL - Load Resistance - 4k 8 TA = 25C 7 6 5 4 3 2 1 0 10 k 3 4 5 6 7 |VCC| - Supply Voltage - V Figure 15 Figure 16 MAXIMUM PEAK-TO-PEAK OUTPUT VOLTAGE vs FREQUENCY INPUT RESISTANCE vs FREE-AIR TEMPERATURE 6 40 VCC = 6 V TA = 25C 35 5 r i - Input Resistance - k VOPP - Maximum Peak-to-Peak Output Voltage - V 8 4 3 2 VCC = 6 V 30 25 GAIN 2 20 mA733C 15 10 1 5 0 1 2 4 7 10 20 40 70 100 200 400 0 - 60 - 40 -20 f - Frequency - MHz 0 20 40 60 80 100 120 140 TA - Free-Air Temperature - C Figure 18 Figure 17 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 9 PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 84185012A OBSOLETE LCCC FK 20 TBD Call TI UA733CD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UA733CDE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UA733CDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UA733CDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UA733CDRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UA733CDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UA733CN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type UA733CNE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type UA733CNSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UA733CNSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UA733CNSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) Call TI UA733MJ OBSOLETE CDIP J 14 TBD Call TI Call TI UA733MJB OBSOLETE CDIP J 14 TBD Call TI Call TI UA733MUB OBSOLETE CFP U 10 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant UA733CDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 UA733CNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UA733CDR UA733CNSR SOIC D 14 2500 367.0 367.0 38.0 SO NS 14 2000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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