ADVANCED - INTERCONNECTIONS. Ball Grid Array Socketing System 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850 / 401-823-5200 . Fax 401-823-8723 - Email advintcorp@aol.com - Internet http:/Ayww.advintcorp.com BGA Adapter Sockets Terminal Type -636 Shown - Patent Pending Features: * Surface Mount socket uses standard BGA footprint. - Low insertion force socket for ease of insertion and withdrawal. Closed bottom socket terminal for 100% anti-wicking of solder. Gold plated contacts will allow gold/gold plated interconnections to male adapter pins. * Multi-fingered high reliability Beryllium Copper contacts. Terminals and Contacts: Terminals: Brass - Copper Alloy 360, ASTM-B-16 Contacts: Beryllium Copper Copper Alloy 172, ASTM-B-194 Plating: Terminal TL: Tin Lead over Nickel Terminal G: Gold over Nickel Body Material: FR-4 Glass Epoxy, U.L. Rated 94V-O Solder: 63Sn/37Pb Solder Ball Available With Heat Sink Retention Features Consult Factory Page 156 Rev. 14-A Ball Grid Array BGA > Adapter BGA OVE BGA - BGA Solder Joints Adapter Adapter Socket i Before Soldering Socket After Soldering Terminals Type -551 al Type -636 Molded Only M17 095 (2.97) (2.41) .030 Z. (0.76) Dia. Eutectic Solder Ball How To Order 1 F G S$ XXX XXX X X Footprint Dash# _ ty Contact Plating If Applicable G - Gold T -Tin Body Type Terminal Plating F - FR-4 G - Gold M - Molded T-Tin Pitch Terminal Type B = .059 (1.5mm) Pitch See Above G = .050 (1.27mm) Pitch S= Standard Socket (Same as BGA Body) 96 - 736 SB= Extraction Slot & See BGA Fooiprint pages 164- 166 Guide Box Socket (BGA Body + .079 (2.00)) Number of Pins inch/(mm)