10-01-C84-YSC-AAS2T2DH-AM - Everlight International Corp.

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3mm Advanced Super Flux LEDs

10-01-C84-YSC-AAS2T2DH-AM

Lead (Pb) Free Product- RoHS Compliant

Feature

‧Piranha package.

‧Colorless clear resin.

‧Low thermal resistance.

‧Packaged in tubes for Automatic Insertion Equipment.

‧Total Flux: 5650 to 11250 mlm at 70mA.

‧Qualification according to AEC-Q101.

Applications

‧Automotive Lighting

‧Electronic signs and signals

‧General lighting application

‧

Device Selection Guide

Chip

Material Emitted Color Resin Color

AlGaInP Yellow Water Clear

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DATASHEET

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10-01-C84-YSC-AAS2T2DH-AM

Product Nomenclature

10 - 01 - C8 4 - YS C - AA S2T2 D H AM

1 2 3 4 5 6 7 8 9 10 11

The product name is designated as below:

1. Product type

2. Lead-frame type

3. Angle

4. Product pasted without Zener

5. Chip code

6. Resin color

7. Wavelength

8. Power &Luminous Intensity

9. Range of Forward Voltage specification

10. Operation current

11 Application

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10-01-C84-YSC-AAS2T2DH-AM

Table of Content Page

Product Nomenclature 3

Absolute Maximum Ratings (Ta=25℃)4

Electro-Optical Characteristics (Ta=25℃)5

Bin Range of Dominant Wavelength (Ta=25℃)6

Bin Range of Forward Voltage (Ta=25℃)7

Bin Range of Total Flux (Ta=25℃)8

Typical Electro-Optical Characteristics Curves 9

Package Dimensions 11

Lable Explanation 12

Antistatic Packing Materials Tube and Standard Boxes 12

Precautions 13

Revision History 16

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Absolute Maximum Ratings (Ta=25 )℃

Parameter Symbol Rating Unit

Reverse Voltage VR5V

Continuous Forward Current IF70 mA

Peak Forward Current

(Duty 1/10 @1KHz) IFP 100 mA

Power Dissipation Pd200 mW

Junction Temperature Tj115 ℃

Operating Temperature Topr -40 ~ +100 ℃

Storage Temperature Tstg -40 ~ +100 ℃

Thermal Resistance Rth J-A 165 K/W

ESD

(Classification acc. AEC Q101)

ESDHBM

ESDMM

2000

200

Soldering Temperature(T=5

sec) Tsol 260 ± 5 ℃

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Electro-Optical Characteristics (Ta=25 )℃

Parameter Symbol Min. Typ. Max. Unit Condition

Total Flux Φv 5650 --- 11250 mlm IF =70mA

Peak Wavelength λp----- 594 ----- nm IF =70mA

Dominant Wavelength λd589 --- 598 nm IF =70mA

Spectrum Radiation

Bandwidth Δλ ----- 15 ----- nm IF =70mA

Viewing Angle 2θ1/2 ----- 130 ----- deg IF =70mA

Forward Voltage VF1.9 --- 2.9 V IF=70mA

Reverse Current IR----- ----- 10 μA VR =5V

Note:

1. Tolerance of Total Flux: ±11%

2. Tolerance of Dominant Wavelength: ±1nm

3. Tolerance of Forward Voltage: ±0.1V

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Bin Range of Forward Voltage

Bin Min. Max. Unit Condition

1 1.9 2.1

2 2.1 2.3

3 2.3 2.5

4 2.5 2.7

5 2.7 2.9

V IF =70mA

Note:

Tolerance of Forward Voltage: ±0.1V

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Bin Range of Dominant Wavelength

Note:

Tolerance of Dominant Wavelength: ±1nm

Bin Min. Max. Unit Condition

2589 592

3592 595

4595 598

nm IF =70mA

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Bin Range of Total Flux

Bin Min. Max. Unit Condition

S2 5650 7150

T1 7150 9000

T2 9000 11250

mlm IF =70mA

Note:

Tolerance of Total Flux: ±11%

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10-01-C84-YSC-AAS2T2DH-AM

Typical Electro-Optical Characteristics Curves

Typical Curve of Spectral Distribution

Relative Intensity(％)

W(nm)

Note: V(λ)=Standard eye response curve; IF=20mA

Diagram Characteristics of Radiation

0.0

0.2

0.4

0.6

0.8

1.0

View ing angle (degree)

Relative Intensity (a.u.)

-900-700-5 00-30 0-100

900

80 0

60 0

700

400

500

300

200

10 0

5 0

1 0 0

4 0 0 4 5 0 5 0 0 5 5 0 6 0 0 6 5 0 7 0 0

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Forward Current vs. Forward Voltage

(Ta=25℃)Dominant Wavelength vs. Forward Current

(Ta=25 )℃

Forward Current (mA)

Dominant Wavelength (nm)

Forward Voltage (V) Forward Current (mA)

Relative Luminous Intensity vs.

Forward Current (Ta=25 )℃Max. Permissible Forward Current vs.

Ambient Temperature

Relative Luminous Intensity

0.0

0.2

0.4

0.6

0.8

1.0

0 10 20 30 40 50 60 70

Relative Intensity

Forward Current (mA)

0.0

10.0

20.0

30.0

40.0

50.0

60.0

70.0

80.0

90.0

100.0

0.0 20.0 40.0 60.0 80.0 100.0

Forward Current (mA) Ambient Temperature ( )℃

100

1.7 1.9 2.1 2.3 2.5 2.7

587

588

589

590

591

592

593

0 10 20 30 40 50 60 70 80 90 100

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Package Dimension

Note: 1.Tolerances unless mentioned ±0.25mm. Unit = mm

2.An epoxy meniscus may extend about 1.5mm(0.059") down the leads

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Antistic Packing Materials

Tube

Tube Label Explanation

‧QTY: Packing Quantity

‧LOT No: Lot Number

‧CAT: Rank of (VF)(Note*1)( Note*2)

Note1: λd/CIE/Color temperature

Note2: Luminous Intensity/ Total Flux

Note: Tolerances unless mentioned ±2.0mm. Unit = mm

Standard Box

Outer Label Explanation

‧CPN: Customer’s Product Number

‧P/N: Product Number

‧QTY: Packing Quantity

‧CAT: Rank of (VF)(Note*1)( Note*2)

Note1: λd/CIE/Color temperature

Note2: Luminous Intensity/ Total Flux

‧HUE/REF: Reference

‧LOT No: Lot Number

Note: Tolerances unless mentioned ±3.0mm. Unit = mm

Label area

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Packing Quantity

Packing material Length × Width × height (mm) Tube Quantity (Pcs)

LED Quantity (Pcs)

Tube height 485 x 9.5 x12 1 60

Standard box 510 x 100 x 45 30 1800

Large box 510 x 150 x 90 105 6300

Note:

1. Normal packing specification is use standard box, unless already defined initially.

2. Vacuum packing with anti-static bag after packing in standard box.

3. Specifications are subject to change without prior notice.

Notes

1. Lead Forming

During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy

bulb.

Lead forming should be done before soldering.

Avoid stressing the LED package during leads forming. The stress to the base may damage the

LED’s characteristics or it may break the LEDs.

Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may

cause failure of the LEDs.

When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead

position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the

epoxy resin and this will degrade the LEDs.

2. Storage

The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight

and the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be

stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material.

Please avoid rapid transitions in ambient temperature, especially, in high humidity environments

where condensation can occur.

3. Soldering

Careful attention should be paid during soldering. Solder the LED no lower than 1.6mm from the

base of stopper is recommended.

Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly

when soldering.

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Recommended soldering conditions:

Hand Soldering DIP Soldering

Temp. at tip of iron 300 Max.℃(30W Max.) Preheat temp. 100 Max.℃(60 sec Max.)

Soldering time 3 sec Max. Bath temp. 260 Max.

Distance No lower than 1.6mm from

the base of stopper

Bath time. 5 sec Max.

Distance No lower than 1.6mm from

the base of stopper

Dip and hand soldering should not be done more than one time.

After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration

until the LEDs return to room temperature.

A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.

Although the recommended soldering conditions are specified in the above table, dip or

handsoldering at the lowest possible temperature is desirable for the LEDs.

Wave soldering parameter must be set and maintain according to recommended temperature and

dwell time in the solder wave.

4. Cleaning

When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a

duration of no more than one minute. Dry at room temperature before use.

Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of

ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled

condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not cause damage to the

LED

5. Heat Management

Heat management of LEDs must be taken into consideration during the design stage of LED

application. The current should be de-rated appropriately by referring to the de-rating curve found

in each product specification.

The temperature surrounding the LED in the application should be controlled. Please refer

to the data sheet de-rating curve.

6. ESD (Electrostatic Discharge)

Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs.

An ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling LEDs.

All devices, equipment and machinery must be properly grounded.

Use ion blower to neutralize the static charge which might have built up on surface of the LEDs

plastic lens as a result of friction between LEDs during storage and handing.

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7. Other

Above specification may be changed without notice. EVERLIGHT will reserve authority on

material change for above specification.

When using this product, please observe the absolute maximum ratings and the instructions for

using outlined in these specification sheets. EVERLIGHT assumes no responsibility for any

damage resulting from use of the product which does not comply with the absolute maximum

ratings and the instructions included in these specification sheets.

These specification sheets include materials protected under copyright of EVERLIGHT

corporation. Please don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s

consent.

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Revision History

Rev. Modified date File modified contents

2 2013/5/25 Change the form of datasheet