PL IA NT Features CO M Concave terminals *R oH S RoHS compliant* 8 bit multiple applications Smallest bussed chip array E 24 Series from 10 ohms to 1 megohm CAT25 - Thick Film Chip Resistor Arrays How To Order Electrical Characteristics Parameters Number of Resistors Resistance Range E24 Resistance Tolerance Power Rating/Resistor Rating Temperature T.C.R. Maximum Operating Voltage Operating Temperature CAT25 8 10 ohms to 1 megohm 5% 62.5 mW +70 C 200 ppm/C 25 V -55 C to +125 C Test Method JIS-C-5202.5.1 Pin Style T = Concave Model JIS-C-5202.5.2 Resistance Value 103 = 10K ohms Tolerance J=5% Electrical Circuit A = 8 Resistors, Bussed Type Environmental Characteristics Specification Short Time Overload Load Life Humidity Load Life Resistance to Soldering Heat Terminal Strength Temperature Cycle Vibration Insulation Resistance Dielectric Withstanding Voltage Lead Solderability CA T 25 - 103 J A LF Product CA = Chip Array Characteristics (3 % +0.1 ohm) (5 % +0.1 ohm) (3 % +0.1 ohm) (1 % +0.1 ohm) (1 % +0.1 ohm) (2 % +0.1 ohm) (1 % +0.1 ohm) 1000 megohms minimum 50 VRMS >95 % Outline Drawing Test Method JIS-C-5202.5.5 JIS-C-5202.7.10 JIS-C-5202.7.9 JIS-C-5202.6.4 JIS-C-5202.6. JIS-C-5202.7.4 JIS-C-5202.6.3 JIS-C-5202.5.6 JIS-C-5202.5.7 JIS-C-5202.6.5 Terminations LF = Tin-plated (RoHS compliant) For Standard Values Used in Capacitors, Inductors, and Resistors, click here. Land Pattern 4.8 - 5.2 (.190 - .205) 2.10 0.20 (.083 .008) 2.8 - 3.0 (.110 - .118) 0.25 0.20 (.010 .008) 0.30 0.20 (.012 .008) 4.00 0.20 (.157 .008) 0.35 0.20 (.014 .008) DIMENSIONS: 3.2 - 3.5 (.125 - .138) 3.3 - 3.4 (.130 - .133) 0.55 0.10 (.022 .004) 0.80 0.10 (.032 .004) 0.9 - 1.1 (.035 - .043) MM (INCHES) 0.50 0.20 (.020 .008) DIA. 0.30 +0.10/-0.20 (.012 +.004/-.008) 0.40 0.20 (.016 .008) *RoHS Directive 2002/95/EC Jan 27, 2003 including Annex. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications 0.4 - 0.5 (.016 - .020) Electrical Circuit 0.80 (.032) CAT25 - Thick Film Chip Resistor Arrays Soldering Profile for RoHS Compliant Chip Resistors and Arrays 275 <1> Maximum of 20 seconds between 260 C peak +255 C and +260 C <1> 255 C 225 Temperature (C) 220 C 190 C 175 60 - 90 seconds Ramp Down 6 C/second 150 C 125 60 - 120 seconds 10 seconds minimum 75 Ramp Up 3 C/second maximum 25 0 50 100 Packaging Material 12 (.472) embossed tape 4,000 pcs. per reel Substrate 150 Time (seconds) 200 250 300 Alumina 96 Element Ruthenium Oxide Coating Glass Terminal Plated Ni+Sn REV. 06/11 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications