1
P
r
oduct
Family
Data
Sheet
Re
v.
1.0
2015.
1
2.30
LED Module
Modular Platform Engine Series
T-Type Gen2
SL-PGR2W51SBGL
SL-PGR2W52SBGL
SL-PGR2W57SBGL
Samsung outdoor modules enable flexible modular
design,
providing better solution for outdoor application
Featur
es & Benefits
High lumen density of 2500 lm
Seamless combination by modular design
Lens-type module, that makes fixtures easily designed
IP66 for durability and robustness
Applications
Outdoor Lighting:
Roadway
Street Light
Parking Lot
Tunnel Light
2
Table of Contents
1. Product Code Information ----------------------- 3
2. Characteristics ----------------------- 4
3. Structure & Assembly ----------------------- 6
4. Certification & Declaration ----------------------- 12
5. Label Structure ----------------------- 13
6. Packing Structure ----------------------- 15
7. Precautions in Handling & Use ----------------------- 16
3
1. Product Code Information
Light Distribution (Optical
Lens Type)
Nominal CCT
(K) Product Code
Remark
IESNA Type I Short 5000 SL-PGR2W51SBGL
IESNA Type II
Short 5000 SL-PGR2W52SBGL
IESNA Type II
Very Short 5000 SL-PGR2W57SBGL
Other Available
Types:
IESNA Type I
Medium (I)
4000 SL-P7T2W51MBGL
5000 SL-P7R2W51MBGL
IESNA Type II
Medium (I)
4000 SL-P7T2W52MBGL
5000 SL-P7R2W52MBGL
IESNA Type II
Medium (L)
4000 SL-P7T2W57MBGL
5000 SL-P7R2W57MBGL
IESNA Type III
Medium (I)
4000 SL-P7T2W53MBGL
5000 SL-P7R2W53MBGL
IESNA Type III Long
4000 SL-P7T2W53LBGL
5000 SL-P7R2W53LBGL
IESNA Type IV
Medium (I)
4000 SL-P7T2W54MBGL
5000 SL-P7R2W54MBGL
IESNA Type V
Short (I)
4000 SL-P7T2W55SBGL
5000 SL-P7R2W55SBGL
Beam Angle 85°
4000 SL-P7T2W585BGL
5000 SL-P7R2W585BGL
Notes:
1) (I) : optimized for Illuminance uniformity
2) (L) : optimized for Luminance uniformity
3) Luminous flux of IESNA Type IV Medium (I) type is lower than other types
4
2. Characteristics
a) Maximum Rating
Item Rating Unit Remark
Rated Lifetime >50,000 hour L80B50 @ tp, 50 = 105 ºC
Ingress Protection (IP) IP66 - For Damp Location (UL marking)
Operating Temperature (Tc) 10 ~ 92 ºC
Storage Temperature (Ta) -30 ~ +70 ºC
ESD ±8 kV (contact) / ±15 kV (air) kV
Working Voltage for Insulation 50 V
Ta : Ambient Temperature
b) Electro-optical Characteristics (IF = 700 mA, tp = 58 °C)
Item Unit Nom. CCT
(K) Min. Typ. Max. Remark
Luminous Flux (Φv) lm 5000 2300 2500 -
Luminous Efficacy lm/W 5000 - 119 -
CCT K 5000 4700 5000 5300
Color Rendering Index (Ra) - 76
Operating Current (IF) mA - 700 1000
per module
Operating Voltage (VF) Vdc 26 30.0 33.0
Power Consumption (P) W - 21 25 @ 30 V, 700mA in a module
Notes:
1) TC: Case temperature, measured at “Tc point” and at the rated typical DC current
2) Samsung maintains measurement tolerance of
: luminous flux = ±7 %, CRI = ±1, voltage = ±5%, CCT = ±5%, Current = ±5%
3) The maximum operating current means the highest limit in any operating condition
4) Voltage difference between modules is tightly controlled to be less than 1.0 V so that the maximum current of any module can be limited close to the value
stated on above table (voltage bin of the module is printed at the labels on each module and on outer box)
5) The power consumption for a specific module is dependent on the operating voltage distribution across the modules in parallel connection
5
3. Structure & Assembly
a) Appearance
[SL-PGR2W51SBGL]
[SL-PGR2W52SBGL]
6
Note:
The appearance will be different for various optical solutions depending on the combination of the available core lenses.
Critical dimensions are the same for all optical solutions, except for thickness difference at the core lens cross-section.
[SL-PGR2W57SBGL]
7
b) Dimension
Model Dimension Specification Tolerance Unit Remark
SL-PGR2W51SBWW
Module Length 150 ±0.5 mm
IESNA Type I
Short
Module Width 60 ±0.5 mm
Module Height 43.4 ±0.5 mm
PCB Thickness 1.2 ±0.12 mm
Module Weight 295 ±20 g
SL-PGR2W52SBWW
Module Length 150 ±0.5 mm
IESNA Type II
Short
Module Width 60 ±0.5 mm
Module Height 43.7 ±0.5 mm
PCB Thickness 1.2 ±0.12 mm
Module Weight 295 ±20 g
SL-PGR2W57SBWW
Module Length 150 ±0.5 mm
IESNA Type II
Very Short
Module Width 60 ±0.5 mm
Module Height 43.2 ±0.5 mm
PCB Thickness 1.2 ±0.12 mm
Module Weight 295 ±20 g
8
c) Structure
[SL-PGR2W51SBGL]
No.
Parts Specifications
1. Lens cover screws
(8 pcs)
Material: Stainless steel with teflon washer
Location: Between array lens cover and base plate heat sink
. Array lens cover
Lens type: IESNA Type I Short
Material: Polycarbonate
Thickness: 2.0 mm
UL-94 Flammability: V-2
3. Rubber seal Material: Molded silicone
4. LED board
LED: LH351B Ceramic high flux rank (10 pcs)
Material: MC-PCB, aluminum
Thickness: 1.2 mm
Screws: Stainless steel (3 pcs)
5. Side inlet harness
Material: Molded PVC coated with silicone sealant, 105 °C rating
Wires: 24 AWG, 105 °C rating, without end connector
Length (wires): 550 mm
6. Thermal pad Between PCB and base plate heat sink
7. Base plate heat sink Material: Extrusion aluminum
[SL-PGR2W52SBGL]
No.
Parts Specifications
1. Lens cover screws
(8 pcs)
Material: Stainless steel with teflon washer
Location: Between array lens cover and base plate heat sink
. Array lens cover
Lens type : IESNA Type II Short
Material: Polycarbonate
Thickness: 2.0 mm
UL-94 Flammability: V-2
3. Rubber seal Material: Molded silicone
4. LED board
LED: LH351B Ceramic high flux rank (10 pcs)
Material: MC-PCB, aluminum
Thickness: 1.2 mm
Screws: Stainless steel (3 pcs)
5. Side inlet harness
Material: Molded PVC coated with silicone sealant, 105 °C rating
Wires: 24 AWG, 105 °C rating, without end connector
Length (wires): 550 mm
6. Thermal pad Between PCB and base plate heat sink
7. Base plate heat sink Material: Extrusion aluminum
9
[SL-PGR2W57SBGL]
No.
Parts Specifications
1. Lens cover screws
(8 pcs)
Material: Stainless steel with teflon washer
Location: Between array lens cover and base plate heat sink
. Array lens cover
Lens type : IESNA Type II Very Short
Material: Polycarbonate
Thickness: 2.0 mm
UL-94 Flammability: V-2
3. Rubber seal Material: Molded silicone
4. LED board
LED: LH351B Ceramic high flux rank (10 pcs)
Material: MC-PCB, aluminum
Thickness: 1.2 mm
Screws: Stainless steel (3 pcs)
5. Side inlet harness
Material: Molded PVC coated with silicone sealant, 105 °C rating
Wires: 24 AWG, 105 °C rating, without end connector
Length (wires): 550 mm
6. Thermal pad Between PCB and base plate heat sink
7. Base plate heat sink Material: Extrusion aluminum
10
d) Light Distribution
IESNA Type I Short Lens Type
IESNA Type II Short Lens Type
IESNA Type II Very Short Lens Type
11
e) Thermal Management
Performance temperatures are measured onTc point” as indicated below (located at long side-center of the Module):
g) Schematic Circuit
4. Certification & Declaration
Item Compliant to Remark
Declaration RoHS Hazardous Substance & Material
Certification
UL
CE DoC No. : DOC13-SW001-1601M01
Tc : case temperature
Tc Point
12
5. Label Structure
a) LED Board Label
Number Item Description
Model Number (Product Code) Refer to page 3
SMT Date Code -
SMT Line -
Serial Number 00001 ~ 99999
LED Binning Code -
CCT 5000 K
LED Maker S : Samsung
Tc max 92
b) Module Label
Number Item Description
Model Number (Product Code) Refer to page 3
Production Date Code -
Manufacturing Location KO (Country / Korea) + INC (Factory)
Vf Binning Code -
Luminous Flux -
Operating Wattage -
SL-PGR2W5xxBGL
150827
10000937
5000K-S
Tc max : 92℃
SL-PGR2W5xxBGL
150827
KOINC V4
2500lm / 21.8W
13
c) Outer Box Label
Number Item Description
Model Number (Product Code) Refer to page 3
Lot No. Factory Code (2) + Production Date (4) + Serial No. (4) + Suffix (2)
Packing Quantity 12 pc
Production Date (year.month.date) yyyy.mm.dd
Country of Origin KOREA
Vf Binning Code -
Eye Safety Label IEC62741 Risk Group 2
14
6. Packing Structure
Packing Process
Step 1: 6 Modules of the same voltage bin are placed inside one inner box:
Step 2: Two stacks of inner boxes (totaling 12 Modules, all having same voltage bin) are placed inside one outer box:
Step 3: 32 boxes (384 modules) are placed on one pallet:
Packing Quantity (modules)
Dimension (mm)
Length Width Height Tolerance
Inner Box 6 400 227 83 ±3
Outer Box 12 (2 inner boxes) 419 240 171 ±5
Pallet 384 (32 outer boxes) 1000 1000 130 ±10
15
7. Precautions in Handling & Use
7.1. The LED Lighting Modules for white light are devices which are materialized by combining white LEDs. The color of white light
can differ a little unusually to diffuser plate (sign-board panel). Also when the LEDs are illuminating, operating current should be
decided after considering the ambient maximum temperature.
7.2. Handling
To prevent the LED Lighting Modules from making any defectives, please handle the LED Lighting modules with care as follows.
(1) Don’t drop the unit and don’t give the unit any shocks.
(2) Don’t bend the PCB and don’t touch the LED Resin.
(3) Don’t storage the Module in a dusty place or room.
(4) Don’t take the product apart.
(5) Don’t touch the LED and also PCB and other circuit parts of Module with your naked fingers or sharpness things.
(6) Take care so that do not pull wire with hand in case of carries or moves LED Lighting Modules.
(7) *VOCs can be generated from adhesives, flux, hardener or organic additives used in luminaires. This phenomenon can cause a
significant loss of light emitted from the luminaires. In order to prevent these problems, we recommend users to know the
physical properties of the materials used in luminaires, and they must be selected carefully.
(*VOCs: Volatile Organic Compounds)
7.3. Cleaning
The LED Lighting Modules should not be used in any type of fluid such as water, oil, organic solvent, etc.
It is recommended that IPA (Isopropyl Alcohol) be used as a solvent for cleaning the LED Lighting Modules.
When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not.
Freon solvents should not be used to clean the LEDs because of worldwide regulations. Do not clean the LED Lighting Modules by
the ultrasonic. Before cleaning, a pre-test should be done to confirm whether any damage to the LED Lighting modules will occur.
7.4. Static Electricity
Static electricity or surge voltage damages the LED Lighting Modules. Please keep the working process anti-static electricity
condition to prevent the Lighting from destroying, as following.
(1) Anyone who handles the unit should be well grounded.(earth ring or anti-static glove)
(2) Anyone who handles the unit should wear anti-electrostatic working clothes.
(3) All kinds of device and instruments, such as working table, measuring instruments and assembly jigs in your production lines
should be well grounded.
7.5. Storage
The LED Lighting Modules must be stored to insert a package of a moisture absorbent material(silica gel) in a box.
7.6. Others
If over voltage which exceeds the absolute maximum rating is applied to LED Lighting Modules.
It will cause damage Circuits(that LED is included) and result in destruction.
Do not directly look into lighted LED with naked eyes.
Please use this product within 5 months, which is kept in its original packaging unopened when stocked.
Legal and additional information.
About Samsung Electronics Co., Ltd.
Samsung Electronics Co., Ltd. is a
global leader in technology,
opening new possibilities for people
everywhere. Through relentless
innovation and discovery, we are
transforming the worlds of
TVs, smartphones, tablets, PCs,
cameras, home appliances, printers,
LTE systems, medical devices,
semiconductors and LED solutions.
We employ 286,000 people across
80 countries with annual sales of
US$216.7 billion. To discover more,
please visit www.samsungled.com.
Copyright © 2015 Samsung
Electronics Co., Ltd. All rights
reserved.
Samsung is a registered trademark
of Samsung Electronics Co., Ltd.
Specifications and designs are
subject to change without notice.
Non-metric
weights and measurements are
approximate. All data were deemed
correct
at time of creation. Samsung is not
liable for errors or omissions. All
brand, product,
service names and logos are
trademarks and/or registered
trademarks of their
respective owners and are hereby
recognized and acknowledged.
Samsung Electronics Co., Ltd.
95, Samsung 2-ro
Giheung-gu
Yongin-si, Gyeonggi-do, 446-711
KOREA
www.samsungled.com