PGA Sockets Interstitial PGA Sockets
Low Insertion Force .100/(2.54mm) Staggered Grid
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16 rev. Sept. 07
Products shown covered by patents issued and/or pending. Specifications subject to change without notice. inch/(mm)
Footprint Dash #
If Applicable*
1 RSX 503 - 234 M G
Contact Plating
Terminal Plating
Terminal Type
Body Type
RoHS Compliant Insulators:
KSX - Peel-A-Way
RSX - Hi-Temp Molded LCP
Number of Pins
004 to 2209
*Footprints available online See options on next page
RoHS Compliant:
G - Gold
M - Matte Tin
T - Tin/Lead
RoHS Compliant:
G - Gold
T - Tin/Lead
®
Options
How To Order
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
Quick-Turn delivery is not available on products with Matte Tin plating.
Features:
•Low insertion force (1 oz. average
per pin).
•Screw-machined terminals with
multi-finger contacts for reliability.
• Closed bottom terminal for 100%
anti-wicking of solder.
•Tapered entry for ease of
insertion.
• Custom designs available.
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per ASTM-B-488
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
Tape Seal - add 3M to end of part number
•Removable tape seal protects plated contact in harsh environments
•Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers
•Spray flux without contaminating contact area
Material
Silicone Backed Polyimide Film, -74°C to 260°C (-100°F to 500°F)
Intermittent to 371°C (700°F)
RSX replaces CSX.
Description: Peel-A-Way®(KSX)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
Description: Molded (RSX)
Mat’l: High Temp.Liquid Crystal Polymer (LCP)
Index: -40°C to 260°C (-40°F to 500°F)
.100
(2.54)
Molded
Body
Type -235
Shown
.005 Typ.
(.13)
Type -210
Shown
Table of Models
Interstitial PGA Sockets
Low Insertion Force .100/(2.54mm) Staggered Grid PGA Sockets
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16 rev. Sept. 07
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
.180
(4.57)
.165
(4.19)
.059 Dia.
(1.50)
.018 Dia.
(.46)
.209
(5.31)
.136
(3.45)
.059 Dia.
(1.50)
.018 Dia.
(.46)
Standard Quick-Turn Terminals
Solder Preform Terminals
Type -210 Type -176 Type -234 Type -82
Peel-A-Way® only
.058 Dia.
(1.47)
.034 Dia.
(.86)
.015
(.38) .155
(3.94)
.058 Dia.
(1.47)
.155
(3.95)
.031
(.79)
.034 Dia.
(.86)
.125
(3.18)
.165
(4.19)
.059 Dia.
(1.50)
.018 Dia.
(.46)
Type -235
Molded only Molded only
.250
(6.35)
.165
(4.19)
.056 Dia.
(1.42)
.018 Dia.
(.46)
2 Solder
Preforms
.180
(4.57)
.165
(4.19)
.059 Dia.
(1.50)
.018 Dia.
(.46)
Solder
Preform
Tin/Lead: Type -311
Lead-free: Type -813
Tin/Lead: Type -313
Lead-free: Type -814
Footprints:
•Full grid insulators loaded to your
specific footprint.
•Open centers available upon
request (consult factory).
•Hundreds of footprints available
online.
•Use our online Build-A-Part
feature or download a Footprints
Booklet in PDF format.
1.200 Sq.
(30.48)
.100/(2.54) Typ.
Available Online:
•Extraction Tools
•RoHS Qualification Test Report
•CAD Drawings
Molded only Molded only
Peel-A-Way® only
Molded only
4 standoffs per socket
Type -234 used in
remaining positions
180 Pins
Footprint Number 180
23 x 23 rows
Additional standard and custom terminals available.
See Terminals section or consult factory.
Solder
Preform
.031
(.79)
.058 Dia.
(1.47)
.038 Dia.
(.96)
.155
(3.94)
Tin/Lead: Type -432
Lead-free: Type -815
Peel-A-Way® only
Intrusive Reflow Application
5
D
A
Y
D
E
L
I
V
E
R
Y
Q
U
I
C
K
-
T
U
R
N
5
•Combines the labor of socket loading and solder
application into one operation.
•Eliminates the use of solder paste and screening
operation.
•Eliminates solder bridges and/or solder shorts
due to excess solder.
•Ensures a reliable solder joint with controlled
solder volume.
•Ideal for surface mount and mixed technology
applications.
• For custom solder preform terminal applications
consult factory.
Solder Preform Terminals
BEFORE REFLOW AFTER REFLOW
SOLDER
PREFORM
PLATED THRU
HOLE (PTH)
PCB PCB
