PACKAGE INFORMATION
Page
Index
DBS 1816
DIP 1818
HDIP 1822
LQFP 1823
PLCC 1827
QFP 1830
SDIP 1836
SIL 1839
SO 1841
SSOP 1849
SQFP 1851
Soldering 1852
1996 Nov 05 2
Philips Semiconductors
Package information Package outlines
INDEX
NAME DESCRIPTION VERSION PAGE
DBS (DIL-bent-SIL)
DBS9P plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm) SOT157-2
DBS13P plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6
DIP (dual in-line package)
DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1
DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1
DIP28 plastic dual in-line package; 28 leads (600 mil) SOT117-1
HDIP (heat-dissipating dual in-line package)
HDIP18 plastic heat-dissipating dual in-line package; 18 leads SOT398-1
LQFP (low profile quad flat package)
LQFP48 plastic low profile quad flat package; 48 leads; body 7 ×7×1.4 mm SOT313-2
LQFP64 plastic low profile quad flat package; 64 leads; body 10 ×10 ×1.4 mm SOT314-2
LQFP100 plastic low profile quad flat package; 100 leads; body 14 ×14 ×1.4 mm SOT407-1
LQFP128 plastic low profile quad flat package; 128 leads; body 14 ×20 ×1.4 mm SOT425-1
PLCC (plastic leaded chip carrier)
PLCC44 plastic leaded chip carrier; 44 leads SOT187-2
PLCC68 plastic leaded chip carrier; 68 leads SOT188-2
PLCC84 plastic leaded chip carrier; 84 leads SOT189-2
QFP (quad flat package)
QFP44 plastic quad flat package; 44 leads (lead length 2.35 mm);
body 14 ×14 ×2.2 mm SOT205-1
QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm);
body 10 ×10 ×1.75 mm SOT307-2
QFP64 plastic quad flat package; 64 leads (lead length 1.6 mm);
body 14 ×14 ×2.7 mm SOT393-1
QFP80 plastic quad flat package; 80 leads (lead length 1.95 mm);
body 14 ×20 ×2.8 mm SOT318-2
QFP80 plastic quad flat package; 80 leads (lead length 2.35 mm);
body 14 ×20 ×2.8 mm SOT318-3
QFP100 plastic quad flat package; 100 leads (lead length 1.95 mm);
body 14 ×20 ×2.7 mm; high stand-off height SOT317-1
SDIP (shrink dual in-line package)
SDIP32 plastic shrink dual in-line package; 32 leads (400 mil) SOT232-1
SDIP42 plastic shrink dual in-line package; 42 leads (600 mil) SOT270-1
SDIP52 plastic shrink dual in-line package; 52 leads (600 mil) SOT247-1
SIL (single in-line)
SIL9MPF plastic single in-line medium power package with fin; 9 leads SOT110-1
SIL9P plastic single in-line power package; 9 leads SOT131-2
1996 Nov 05 3
Philips Semiconductors
Package information Package outlines
SO (small outline)
SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
SO8 plastic small outline package; 8 leads (straight); body width 3.9 mm SOT96-2
SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1
SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1
SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1
SO32 plastic small outline package; 32 leads; body width 7.5 mm SOT287-1
SSOP (shrink small outline package)
SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1
SSOP28 plastic shrink small outline package; 28 leads; body width 5.3 mm SOT341-1
SQFP (shrink quad flat package)
SQFP208 plastic shrink quad flat package; 208 leads (lead length 1.95 mm);
body 28 ×28 ×3.4 mm SOT316-1
NAME DESCRIPTION VERSION PAGE
1996 Nov 05 4
Philips Semiconductors
Package information Package outlines
DBS
UNIT A A e12 bpcD
(1) E(1) Z(1)
deD
hLL
3m
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 17.0
15.5 4.6
4.2 0.75
0.60 0.48
0.38 24.0
23.6 20.0
19.6 10 5.08
12.2
11.8 2.54
e2
5.08 2.4
1.6
Eh
62.00
1.45
0.8
3.4
3.1 4.3
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
12.4
11.0
SOT157-2
0 5 10 mm
scale
v
2.1
1.8
Qj
0.25
w
0.03
x
D
L
E
A
c
A2
L3
Q
wM
bp
1
d
D
Ze
e
xh
19
j
E
h
non-concave
95-03-11
97-12-16
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm) SOT157-2
B
view B: mounting base side
m2
e
vM
1996 Nov 05 5
Philips Semiconductors
Package information Package outlines
UNIT A e1
A2bpcD
(1) E(1) Z(1)
deD
hLL
3m
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 17.0
15.5 4.6
4.2 0.75
0.60 0.48
0.38 24.0
23.6 20.0
19.6 10 3.4
v
0.8
12.2
11.8 1.7
e2
5.08 2.4
1.6
Eh
62.00
1.45
2.1
1.8
3.4
3.1 4.3
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
12.4
11.0
SOT141-6
0 5 10 mm
scale
Qj
0.25
w
0.03
x
D
L
E
A
c
A2
m
L3
Q
wM
bp
1
d
D
Ze2
e
e
xh
113
j
E
h
non-concave
view B: mounting base side
95-03-11
97-12-16
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6
vM
B
1996 Nov 05 6
Philips Semiconductors
Package information Package outlines
DIP
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT97-1 92-11-17
95-02-04
UNIT A
max. 12 b
1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A
max. bmax.
w
ME
e1
1.73
1.14 0.53
0.38 0.36
0.23 9.8
9.2 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 1.154.2 0.51 3.2
inches 0.068
0.045 0.021
0.015 0.014
0.009
1.07
0.89
0.042
0.035 0.39
0.36 0.26
0.24 0.14
0.12 0.010.10 0.30 0.32
0.31 0.39
0.33 0.0450.17 0.020 0.13
b2
050G01 MO-001AN
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
8
1
5
4
b
E
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
pin 1 index
DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1
1996 Nov 05 7
Philips Semiconductors
Package information Package outlines
UNIT A
max. 1 2 b1cEe M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT38-1 92-10-02
95-01-19
A
min. A
max. bmax.
w
ME
e1
1.40
1.14
0.055
0.045
0.53
0.38 0.32
0.23 21.8
21.4
0.86
0.84
6.48
6.20
0.26
0.24
3.9
3.4
0.15
0.13
0.2542.54 7.62
0.30
8.25
7.80
0.32
0.31
9.5
8.3
0.37
0.33
2.2
0.087
4.7 0.51 3.7
0.15 0.021
0.015 0.013
0.009 0.010.100.0200.19
050G09 MO-001AE
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
16
1
9
8
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1) (1)
D(1)
Z
DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1
1996 Nov 05 8
Philips Semiconductors
Package information Package outlines
UNIT A
max. 1 2 b1cD E e M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT146-1 92-11-17
95-05-24
A
min. A
max. bZ
max.
w
ME
e1
1.73
1.30 0.53
0.38 0.36
0.23 26.92
26.54 6.40
6.22 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 2.04.2 0.51 3.2
0.068
0.051 0.021
0.015 0.014
0.009 1.060
1.045 0.25
0.24 0.14
0.12 0.010.10 0.30 0.32
0.31 0.39
0.33 0.0780.17 0.020 0.13
SC603
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
20
1
11
10
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1)
(1) (1)
DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1
1996 Nov 05 9
Philips Semiconductors
Package information Package outlines
UNIT A
max. 1 2 b1(1)
(1) (1)
cD E weM
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT117-1 92-11-17
95-01-14
A
min. A
max. bZ
max.
ME
e1
1.7
1.3 0.53
0.38 0.32
0.23 36.0
35.0 14.1
13.7 3.9
3.4 0.252.54 15.24 15.80
15.24 17.15
15.90 1.75.1 0.51 4.0
0.066
0.051 0.020
0.014 0.013
0.009 1.41
1.34 0.56
0.54 0.15
0.13 0.010.10 0.60 0.62
0.60 0.68
0.63 0.0670.20 0.020 0.16
051G05 MO-015AH
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
28
1
15
14
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
handbook, full pagewidth
DIP28: plastic dual in-line package; 28 leads (600 mil) SOT117-1
1996 Nov 05 10
Philips Semiconductors
Package information Package outlines
HDIP
UNIT A
max. 12 b
1(1) (1) (1)
b2cD E e M Z
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT398-1 94-04-13
95-01-25
A
min. A
max. bmax.
w
ME
e1
1.40
1.14 0.67
0.50 0.47
0.38 21.85
21.35 6.5
6.2 3.9
3.1 0.252.54 7.62 8.32
8.02 8.7
7.7 1.04.7 0.51 3.7
inches 0.06
0.04 0.03
0.02 0.02
0.01
1.05
0.75
0.04
0.03 0.87
0.84 0.26
0.24 0.15
0.12 0.010.10 0.30 0.33
0.32 0.34
0.30 0.040.19 0.02 0.15
MH
c
(e )
1
ME
wM
b1
b2
e
A
A1
A2
L
seating plane
Z
D
E
18
1
10
9
b
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
HDIP18: plastic heat-dissipating dual in-line package; 18 leads SOT398-1
1996 Nov 05 11
Philips Semiconductors
Package information Package outlines
LQFP
UNIT A
max. A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 1.60 0.20
0.05 1.45
1.35 0.25 0.27
0.17 0.18
0.12 7.1
6.9 0.5 9.15
8.85 0.95
0.55 7
0
o
o
0.12 0.10.21.0
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT313-2 94-12-19
97-08-01
D(1) (1)(1)
7.1
6.9
HD
9.15
8.85
E
Z
0.95
0.55
D
bp
e
E
B
12
D
H
bp
E
H
vMB
D
ZD
A
ZE
e
vMA
1
48
37
36 25
24
13
θ
A1
A
Lp
detail X
L
(A )
3
A2
X
y
c
wM
wM
0 2.5 5 mm
scale
pin 1 index
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2
1996 Nov 05 12
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 1.60 0.20
0.05 1.45
1.35 0.25 0.27
0.17 0.18
0.12 10.1
9.9 0.5 12.15
11.85 1.45
1.05 7
0
o
o
0.12 0.11.0 0.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT314-2 95-12-19
97-08-01
D(1) (1)(1)
10.1
9.9
HD
12.15
11.85
E
Z
1.45
1.05
D
bp
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
16
c
D
H
bp
E
HA2
vMB
D
ZD
A
ZE
e
vMA
X
1
64
49
48 33
32
17
y
pin 1 index
wM
wM
0 2.5 5 mm
scale
LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm SOT314-2
1996 Nov 05 13
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 1.6 0.20
0.05 1.5
1.3 0.25 0.28
0.16 0.18
0.12 14.1
13.9 0.5 16.25
15.75 1.15
0.85 7
0
o
o
0.12 0.10.21.0
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT407-1 95-12-19
97-08-04
D(1) (1)(1)
14.1
13.9
HD
16.25
15.75
E
Z
1.15
0.85
D
bp
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
25
c
D
H
bp
E
HA2
vMB
D
ZD
A
ZE
e
vMA
X
1
100
7675 5150
26
y
pin 1 index
wM
wM
0 5 10 mm
scale
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1
1996 Nov 05 14
Philips Semiconductors
Package information Package outlines
UNIT A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.15
0.05 1.45
1.35 0.25 0.27
0.17 0.20
0.09 14.1
13.9 0.5 16.15
15.85 0.81
0.59 7
0
o
o
0.120.2 0.11.0
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT425-1 96-04-02
97-08-04
D(1) (1)(1)
20.1
19.9
HD
22.15
21.85
E
Z
0.81
0.59
D
0 5 10 mm
scale
bp
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
c
bp
E
HA2
D
HvMB
D
ZD
A
ZE
e
vMA
X
102
103
y
wM
wM
A
max.
1.6
LQFP128: plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm SOT425-1
6564
38
39
1
128
pin 1 index
1996 Nov 05 15
Philips Semiconductors
Package information Package outlines
PLCC
UNIT A A
min. max. max. max. max.
1A4bpE(1) (1) (1)
eH
EZ
ywv β
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 4.57
4.19 0.51 3.05 0.53
0.33
0.021
0.013
16.66
16.51 1.27 17.65
17.40 0.51 2.16 45o
0.18 0.100.18
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
Note
1. Plastic or metal protrusions of 0.01 inches maximum per side are not included.
SOT187-2
D(1)
16.66
16.51
HD
17.65
17.40
E
Z
2.16
D
b1
0.81
0.66
k
1.22
1.07
k1
0.180
0.165 0.020 0.12
A3
0.25
0.01 0.656
0.650 0.05 0.695
0.685 0.020 0.085
0.007 0.0040.007
Lp
1.44
1.02
0.057
0.040
0.656
0.650 0.695
0.685
eE
eD
16.00
14.99
0.630
0.590
16.00
14.99
0.630
0.590 0.085
0.032
0.026 0.048
0.042
2939
44
1
6
717
28
18
40
detail X
(A )
3
bp
wM
A1
AA4
Lp
b1
βk1
k
X
y
e
E
B
D
H
E
e
E
H
vMB
D
ZD
A
ZE
e
vMA
pin 1 index
112E10 MO-047AC
0 5 10 mm
scale
95-02-25
97-12-16
inches
PLCC44: plastic leaded chip carrier; 44 leads SOT187-2
D
e
1996 Nov 05 16
Philips Semiconductors
Package information Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
Note
1. Plastic or metal protrusions of 0.01 inches maximum per side are not included.
SOT188-2
4460
68
1
9
10 26
43
27
61
detail X
(A )
3
bp
wM
A1
AA4
Lp
b1
βk1
k
X
y
e
E
B
D
H
E
H
vMB
D
ZD
A
ZE
e
vMA
pin 1 index
112E10 MO-047AC
0 5 10 mm
scale
92-11-17
95-03-11
PLCC68: plastic leaded chip carrier; 68 leads SOT188-2
UNIT A A
min. max. max. max. max.
1A4bpE(1) (1) (1)
eH
EZ
ywv β
mm 4.57
4.19 0.51 3.30 0.53
0.33
0.021
0.013
1.27 0.51 2.16 45o
0.18 0.100.18
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
D(1)
24.33
24.13
HD
25.27
25.02
E
Z
2.16
D
b1
0.81
0.66
k
1.22
1.07
k1
0.180
0.165 0.020 0.13
A3
0.25
0.01 0.05 0.020 0.085
0.007 0.0040.007
Lp
1.44
1.02
0.057
0.040
0.958
0.950
24.33
24.13
0.958
0.950 0.995
0.985
25.27
25.02
0.995
0.985
eE
eD
23.62
22.61
0.930
0.890
23.62
22.61
0.930
0.890 0.085
0.032
0.026 0.048
0.042
E
e
inches
D
e
1996 Nov 05 17
Philips Semiconductors
Package information Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
Note
1. Plastic or metal protrusions of 0.01 inches maximum per side are not included.
SOT189-2
5474
84
1
11
12 32
53
33
75
detail X
(A )
3
bp
wM
A1
AA4
Lp
b1
βk1
k
X
y
e
E
B
D
H
E
H
vMB
D
ZD
A
ZE
e
vMA
pin 1 index
0 5 10 mm
scale
92-11-17
95-03-11
PLCC84: plastic leaded chip carrier; 84 leads SOT189-2
UNIT A A
min. max. max. max. max.
1A4bpE(1) (1) (1)
eH
EZ
ywv β
mm 4.57
4.19 0.51 3.30 0.53
0.33
0.021
0.013
1.27 0.51 2.16 45o
0.18 0.100.18
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
D(1)
29.41
29.21
HD
30.35
30.10
E
Z
2.16
D
b1
0.81
0.66
k
1.22
1.07
k1
0.180
0.165 0.020 0.13
A3
0.25
0.01 0.05 0.020 0.085
0.007 0.0040.007
Lp
1.44
1.02
0.057
0.040
1.158
1.150
29.41
29.21
1.158
1.150 1.195
1.185
30.35
30.10
1.195
1.185
eE
eD
28.70
27.69
1.130
1.090
28.70
27.69
1.130
1.090 0.085
0.032
0.026 0.048
0.042
E
e
inches
D
e
1996 Nov 05 18
Philips Semiconductors
Package information Package outlines
QFP
UNIT A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.25
0.05 2.3
2.1 0.25 0.50
0.35 0.25
0.14 14.1
13.9 119.2
18.2 2.4
1.8 7
0
o
o
0.152.35 0.10.3
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2.0
1.2
SOT205-1 95-02-04
97-08-01
D(1) (1)(1)
14.1
13.9
HD
19.2
18.2
E
Z
2.4
1.8
D
bp
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
11
y
c
D
H
bp
E
HA2
vMB
D
ZD
A
ZE
e
vMA
X
1
44
34
33 23
22
12
133E01A
pin 1 index
wM
wM
0 5 10 mm
scale
QFP44: plastic quad flat package; 44 leads (lead length 2.35 mm); body 14 x 14 x 2.2 mm SOT205-1
A
max.
2.60
1996 Nov 05 19
Philips Semiconductors
Package information Package outlines
UNIT A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.25
0.05 1.85
1.65 0.25 0.40
0.20 0.25
0.14 10.1
9.9 0.8 1.3
12.9
12.3 1.2
0.8 10
0
o
o
0.15 0.10.15
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.95
0.55
SOT307-2 95-02-04
97-08-01
D(1) (1)(1)
10.1
9.9
HD
12.9
12.3
E
Z
1.2
0.8
D
e
E
B
11
c
E
H
D
ZD
A
ZE
e
vMA
X
1
44
34 33 23 22
12
y
θ
A1
A
Lp
detail X
L
(A )
3
A2
pin 1 index
D
HvMB
bp
bp
wM
wM
0 2.5 5 mm
scale
QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm SOT307-2
A
max.
2.10
1996 Nov 05 20
Philips Semiconductors
Package information Package outlines
UNIT A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.25
0.10 2.75
2.55 0.25 0.45
0.30 0.23
0.13 14.1
13.9 0.8 17.45
16.95 1.2
0.8 7
0
o
o
0.16 0.100.161.60
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.03
0.73
SOT393-1 MS-022 96-05-21
97-08-04
D(1) (1)(1)
14.1
13.9
HD
17.45
16.95
E
Z
1.2
0.8
D
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
16
y
c
E
HA2
D
ZD
A
ZE
e
vMA
1
64
49 48 3332
17
X
bp
D
H
bp
vMB
wM
wM
0 5 10 mm
scale
pin 1 index
QFP64: plastic quad flat package; 64 leads (lead length 1.6 mm); body 14 x 14 x 2.7 mm SOT393-1
A
max.
3.00
1996 Nov 05 21
Philips Semiconductors
Package information Package outlines
UNIT A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.25
0.05 2.90
2.65 0.25 0.45
0.30 0.25
0.14 14.1
13.9 0.8 1.95
18.2
17.6 1.2
0.8 7
0
o
o
0.20.2 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.6
SOT318-2
D(1) (1)(1)
20.1
19.9
HD
24.2
23.6
E
Z
1.0
0.6
D
bp
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
24
c
bp
E
HA2
D
ZD
A
ZE
e
vMA
1
80
6564 41 40
25
pin 1 index
X
y
D
HvMB
wM
wM
95-02-04
97-08-01
0 5 10 mm
scale
QFP80: plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm SOT318-2
A
max.
3.2
1996 Nov 05 22
Philips Semiconductors
Package information Package outlines
UNIT A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.30
0.10 2.90
2.65 0.25 0.45
0.30 0.25
0.14 14.1
13.9 0.8 0.2
19.0
18.4 1.2
0.8 7
0
o
o
0.2 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.4
1.0
SOT318-3 95-04-25
97-08-01
D(1) (1)(1)
20.1
19.9
HD
25.0
24.4
E
Z
1.0
0.6
D
bp
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
24
y
c
D
H
bp
E
HA2
vMB
D
ZD
A
ZE
e
vMA
1
80
65
64 41
40
25
pin 1 index
2.35
X
wM
wM
0 5 10 mm
scale
QFP80: plastic quad flat package; 80 leads (lead length 2.35 mm); body 14 x 20 x 2.8 mm SOT318-3
A
max.
3.25
1996 Nov 05 23
Philips Semiconductors
Package information Package outlines
UNIT A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.36
0.10 2.87
2.57 0.25 0.40
0.25 0.25
0.13 14.1
13.9 0.65 18.2
17.6 1.0
0.6 7
0
o
o
0.151.95 0.10.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.6
SOT317-1 95-02-04
97-08-01
D(1) (1)(1)
20.1
19.9
HD
24.2
23.6
E
Z
0.8
0.4
D
bp
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
30
c
D
H
bp
E
HA2
vMB
D
ZD
A
ZE
e
vMA
1
100
8180 51 50
31
pin 1 index
X
y
wM
wM
0 5 10 mm
scale
A
max.
3.3
100 leads (lead length 1.95 mm); body 14 x 20 x 2.7 mm; high stand-off height
QFP100: plastic quad flat package; SOT317-1
1996 Nov 05 24
Philips Semiconductors
Package information Package outlines
SDIP
UNIT b1cEe M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
DIMENSIONS (mm are the original dimensions)
SOT232-1 92-11-17
95-02-04
bmax.
w
ME
e1
1.3
0.8 0.53
0.40 0.32
0.23 29.4
28.5 9.1
8.7 3.2
2.8 0.181.778 10.16 10.7
10.2 12.2
10.5 1.6
4.7 0.51 3.8
MH
c(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
32
1
17
16
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1) (1)
D(1)
Z
A
max. 12
A
min. A
max.
SDIP32: plastic shrink dual in-line package; 32 leads (400 mil) SOT232-1
1996 Nov 05 25
Philips Semiconductors
Package information Package outlines
UNIT b1cEe M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
DIMENSIONS (mm are the original dimensions)
SOT270-1 90-02-13
95-02-04
bmax.
w
ME
e1
1.3
0.8 0.53
0.40 0.32
0.23 38.9
38.4 14.0
13.7 3.2
2.9 0.181.778 15.24 15.80
15.24 17.15
15.90 1.73
5.08 0.51 4.0
MH
c(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
42
1
22
21
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1) (1)
D(1)
Z
A
max. 12
A
min. A
max.
SDIP42: plastic shrink dual in-line package; 42 leads (600 mil) SOT270-1
1996 Nov 05 26
Philips Semiconductors
Package information Package outlines
UNIT b1cEe M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
DIMENSIONS (mm are the original dimensions)
SOT247-1 90-01-22
95-03-11
bmax.
w
ME
e1
1.3
0.8 0.53
0.40 0.32
0.23 47.9
47.1 14.0
13.7 3.2
2.8 0.181.778 15.24 15.80
15.24 17.15
15.90 1.73
5.08 0.51 4.0
MH
c(e )
1
ME
A
L
seating plane
A1
wM
b1
D
A2
Z
52
1
27
26
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1) (1)
D(1)
Z
e
A
max. 12
A
min. A
max.
SDIP52: plastic shrink dual in-line package; 52 leads (600 mil) SOT247-1
1996 Nov 05 27
Philips Semiconductors
Package information Package outlines
SIL
UNIT AA
max.
2A3b1D1
b2
bcD
(1) E(1) Z
max.
(1)
eLPP
1q
1
q
2
q
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 18.5
17.8 3.7 8.7
8.0
A4
15.8
15.4 1.40
1.14 0.67
0.50 1.40
1.14 0.48
0.38 21.8
21.4 21.4
20.7 6.48
6.20 3.4
3.2
2.54 1.0
5.9
5.7
4.4
4.2
3.9
3.4 15.1
14.9
Q
1.75
1.55
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2.75
2.50
SOT110-1 92-11-17
95-02-25
0 5 10 mm
scale
0.25
w
D
E
A
A
c
A2
3
A4
q1q2
L
Q
wM
b
b1
b2
D1
P
q
1
Ze
19
P
seating plane
pin 1 index
SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1
1996 Nov 05 28
Philips Semiconductors
Package information Package outlines
UNIT A b
max. bp2 cD
(1) E(1) Z(1)
deD
hLj
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 4.6
4.2 1.1 0.75
0.60 0.48
0.38 24.0
23.6 20.0
19.6 10 2.54
12.2
11.8 3.4
3.1
A
max.
1
2.0
Eh
62.00
1.45
2.1
1.8
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
17.2
16.5
SOT131-2 92-11-17
95-03-11
0 5 10 mm
scale
Q
0.25
w
0.03
x
D
L
A
E
c
A2
Q
wM
bp
d
D
Ze
xh
19
E
h
non-concave
seating plane
1
b
j
SIL9P: plastic single in-line power package; 9 leads SOT131-2
view B: mounting base side
B
1996 Nov 05 29
Philips Semiconductors
Package information Package outlines
SO
UNIT A
max. A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 5.0
4.8 4.0
3.8 1.27 6.2
5.8 1.05 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.10.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.4
SOT96-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
4
5
pin 1 index
1
8
y
076E03S MS-012AA
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.20
0.19 0.16
0.15 0.050 0.244
0.228 0.028
0.024 0.028
0.012
0.010.010.041 0.004
0.039
0.016
0 2.5 5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
95-02-04
97-05-22
1996 Nov 05 30
Philips Semiconductors
Package information Package outlines
UNIT A bpcD
(1)
2E(2) (1)
eH
ELQ Zwv
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
1.45
1.25 0.49
0.36 0.25
0.19 5.0
4.8 4.0
3.8 1.27 6.4
6.2 1.2 0.7
0.6 0.7
0.3
0.250.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT96-2
X
wM
bp
D
HE
Q
detail X
E
Z
e
c
L
vMA
A
4
5
1
8
pin 1 index
0.057
0.049 0.019
0.014 0.0100
0.0075 0.20
0.19 0.16
0.15 0.050 0.252
0.244 0.028
0.024 0.028
0.012
0.010.010.047
0 2.5 5 mm
scale
SO8: plastic small outline package; 8 leads (straight); body width 3.9 mm SOT96-2
A2
95-02-04
97-05-22
1996 Nov 05 31
Philips Semiconductors
Package information Package outlines
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
8
9
1
16
y
pin 1 index
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 10.0
9.8 4.0
3.8 1.27 6.2
5.8 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.0
0.4
SOT109-1 95-01-23
97-05-22
076E07S MS-012AC
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.39
0.38 0.16
0.15 0.050
1.05
0.041
0.244
0.228 0.028
0.020 0.028
0.012
0.01
0.25
0.01 0.004
0.039
0.016
0 2.5 5 mm
scale
SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
1996 Nov 05 32
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 10.5
10.1 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT162-1
8
16
wM
bp
D
detail X
Z
e
9
1
y
0.25
075E03 MS-013AA
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.41
0.40 0.30
0.29 0.050
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
X
θ
A
A1
A2
HE
Lp
Q
E
c
L
vMA
(A )
3
A
0 5 10 mm
scale
SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1
95-01-24
97-05-22
1996 Nov 05 33
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 13.0
12.6 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT163-1
10
20
wM
bp
detail X
Z
e
11
1
D
y
0.25
075E04 MS-013AC
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.51
0.49 0.30
0.29 0.050
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
0 5 10 mm
scale
X
θ
A
A1
A2
HE
Lp
Q
E
c
L
vMA
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
95-01-24
97-05-22
1996 Nov 05 34
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 15.6
15.2 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT137-1
X
12
24
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
c
L
vMA
13
(A )
3
A
y
0.25
075E05 MS-013AD
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.61
0.60 0.30
0.29 0.050
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
e
1
0 5 10 mm
scale
SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1
95-01-24
97-05-22
1996 Nov 05 35
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 18.1
17.7 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT136-1
X
14
28
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
c
L
vMA
e
15
1
(A )
3
A
y
0.25
075E06 MS-013AE
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.71
0.69 0.30
0.29 0.050
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
0 5 10 mm
scale
SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1
95-01-24
97-05-22
1996 Nov 05 36
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65
0.10
0.25
0.01
1.4
0.055
0.3
0.1 2.45
2.25 0.49
0.36 0.27
0.18 20.7
20.3 7.6
7.4 1.27 10.65
10.00 1.2
1.0 0.95
0.55 8
0
o
o
0.25 0.1
0.004
0.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT287-1
(1)
0.012
0.004 0.096
0.086 0.02
0.01 0.050 0.047
0.039
0.419
0.394
0.30
0.29
0.81
0.80
0.011
0.007 0.037
0.022
0.010.01
0.043
0.016
wM
bp
D
HE
Z
e
c
vMA
X
A
y
32 17
16
1
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
E
pin 1 index
0 5 10 mm
scale
SO32: plastic small outline package; 32 leads; body width 7.5 mm SOT287-1
95-01-25
97-05-22
1996 Nov 05 37
Philips Semiconductors
Package information Package outlines
SSOP
UNIT A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.15
01.4
1.2 0.32
0.20 0.20
0.13 6.6
6.4 4.5
4.3 0.65 1.0 0.2
6.6
6.2 0.65
0.45 0.48
0.18 10
0
o
o
0.13 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
0.75
0.45
SOT266-1 90-04-05
95-02-25
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
X
(A )
3
A
y
0.25
110
20 11
pin 1 index
0 2.5 5 mm
scale
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1
A
max.
1.5
1996 Nov 05 38
Philips Semiconductors
Package information Package outlines
UNIT A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.21
0.05 1.80
1.65 0.38
0.25 0.20
0.09 10.4
10.0 5.4
5.2 0.65 1.25
7.9
7.6 0.9
0.7 1.1
0.7 8
0
o
o
0.13 0.10.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
1.03
0.63
SOT341-1 MO-150AH 93-09-08
95-02-04
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
114
28 15
0.25
y
pin 1 index
0 2.5 5 mm
scale
SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm SOT341-1
A
max.
2.0
1996 Nov 05 39
Philips Semiconductors
Package information Package outlines
SQFP
UNIT A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.40
0.25 3.70
3.15 0.25 0.25
0.13 0.23
0.13 28.1
27.9 0.5 30.9
30.3 1.45
1.05 8
0
o
o
0.10.11.3 0.075
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.70
0.45
SOT316-1 97-04-08
97-08-01
D(1) (1)(1)
28.1
27.9
HD
30.9
30.3
E
Z
1.45
1.05
D
pin 1 index
bp
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
52
c
D
H
bp
E
HA2
vMB
D
ZD
A
ZE
e
vMA
X
1
208
157
156 105
104
53
y
wM
wM
0 5 10 mm
scale
208 leads (lead length 1.3 mm); body 28 x 28 x 3.4 mm
SQFP208: plastic shrink quad flat package; SOT316-1
A
max.
4.10