CPC1961 Dual AC Solid State Relays INTEGRATED CIRCUITS DIVISION Parameters Blocking Voltage AC Operating Voltage Load Current 1 On State Voltage Drop 1 Ratings 600 260 250 3 One Pole Operating Features * * * * * * * * * Load Current up to 250 mArms 600VP Blocking Voltage 5mA Sensitivity Zero-Crossing Detection DC Control, AC Output Optically Isolated Low EMI and RFI Generation High Noise Immunity Flammability Rating UL 94 V-0 Units VP Vrms mArms Vrms (at IL = 250mArms) Description The CPC1961 is a dual single-pole AC solid state relay that uses optical coupling with dual monolithic SCR outputs to produce an alternative to optocoupler and Triac circuits. The CPC1961 switches are robust enough to provide up to a 600VP blocking voltage. In addition, tightly controlled zero cross circuitry ensures switching of AC loads without the generation of transients. The input and output circuits are optically coupled to provide 3750Vrms of isolation and noise immunity between control and load circuits. As a result the CPC1961 is well suited for industrial environments where electromagnetic interference would disrupt the operation of electromechanical relays. The CPC1961 is offered in a space saving 8-pin DIP package with two independent switches. Applications * * * * * * * * * * Programmable Control Process Control Power Control Panels Remote Switching Gas Pump Electronics Contactors Large Relays Solenoids Motors Heaters Approvals * UL Recognized Component: File 69938 * CSA Certified Component: File 043639 Ordering Information Part # CPC1961G CPC1961GS CPC1961GSTR Description 8-Pin Dip (50/Tube) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1000/Reel) Pin Configuration 8 AC Load + LED 1 ZC 7 AC Load - LED 2 6 AC Load + LED 3 ZC - LED 4 DS-CPC1961-R09 www.ixysic.com 5 AC Load 1 INTEGRATED CIRCUITS DIVISION CPC1961 Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Package Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Ratings Units 600 VP 5 VP 50 mA 1 A 150 mW 800 mW 3750 Vrms -40 to +85 C -40 to +125 C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / C Derate linearly 6.67 mW / C 2 Electrical Characteristics @ 25C Parameters Output Characteristics Operating Voltage Range Load Current 1, Continuous Non-repetitive Single Cycle Surge Current Off State Leakage Current On-State Voltage Drop Critical Rate of Rise 2 Holding Current Switching Speeds Turn-on Turn-off Zero-Cross Turn-On Voltage 3 Operating Frequency Load Power Factor for Guaranteed Turn-On 4 Input Characteristics Input Control Current to Activate 5 Input Voltage Drop Input Drop-out Voltage Reverse Input Current Common Characteristics Input to Output Capacitance Conditions Symbol Min Typ Max Units VL - 20 - 260 Vrms VL=120-240Vrms t < 10ms VL=600V IL=250 mArms IF=5 mA IL 0.005 500 - 300 250 1 1 3 - mArms A A Vrms V/s A 20 0.25 5 - 0.5 0.5 20 5 500 - 1.2 1.2 - 5 1.5 10 mA V V A 3 - pF IF=5 mA 1st half-cycle Subsequent half-cycles - ITSM ILEAK dV/dt IH ton toff PF IF=5mA VR=5V IF VF IR 0.9 0.8 - VIO=0V, f=1MHz CIO - cycles V V Hz - 1 Maximum continuous load current of a single pole or the sum of the load currents with both poles operating simultaneously. 2 Tested in accordance with EIA/NARM standard RS-443. 3 Zero Cross 1st half-cycle @ <100Hz 4 Snubber circuits may be required at low power factors. 5 For high noise environment use at least 10mA LED drive current. 2 www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION CPC1961 PERFORMANCE DATA* Device Count (N) Device Count (N) 30 25 20 15 10 5 0 Typical Blocking Voltage Distribution (IF=0mA, TA=25C) 25 25 20 20 Device Count (N) 35 Typical On-State Output Forward Voltage Distribution (IF=5mA, IL=250mA, TA=25C) Typical LED Forward Voltage Drop (IF=5mA, TA=25C) 15 10 5 1.24 1.25 1.26 1.27 LED Forward Voltage Drop (V) 10 5 0 0 1.23 15 2.1 2.2 2.3 2.4 On-State Voltage (V) 735 2.5 740 745 750 Blocking Voltage (VP) 755 Typical IF for Switch Operation (IL=250mA, TA=25C) Device Count (N) 20 15 10 5 0 1.10 LED Forward Voltage vs. Temperature 2.4 IF=50mA IF=20mA IF=10mA 1.8 1.3 1.2 IF=5mA 1.4 1.8 1.6 1.4 -20 0 20 40 60 Temperature (C) 80 100 1.0 0.6 1.0 0.8 -40 1.2 0.8 1.2 1.1 Typical IF for Switch Dropout vs. Temperature (IL=250mA) 1.6 2.0 1.4 1.0 -40 Typical IF for Switch Operation vs. Temperature (IL=250mA) IF Off (mA) 1.5 1.30 2.2 IF On (mA) LED Forward Voltage (V) 1.6 1.15 1.20 1.25 LED Forward Current (mA) -20 0 20 40 60 Temperature (C) 80 100 0.4 -40 -20 0 20 40 60 Temperature (C) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. R09 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1961 PERFORMANCE DATA* 300 2.30 2.25 2.20 2.15 100 0 -100 2.10 -200 2.05 -40 -300 -20 0 20 40 60 Temperature (C) 80 100 140 780 770 760 750 740 730 720 710 -40 -20 0 20 40 60 Temperature (C) 80 100 Maximum Concurrent Total Load Current vs. Temperature (IF=5mA) 250 200 150 100 50 0 -3 Typical Blocking Voltage vs. Temperature (IF=0mA) 300 200 Load Current (mArms) 2.35 Leakage Current (nA) Blocking Voltage (VP) Output Current (mA) On-State Voltage (V) 2.40 790 Typical Output Voltage vs. Output Current (IF=5mA, TA=25C) -2 -1 0 1 Output Voltage (V) 2 -40 3 Typical Leakage vs. Temperature Measured Between Pins 5&6 and 7&8 (IF=0mA, VL=600V) 120 100 80 60 40 20 0 -40 -20 0 20 40 60 Temperature (C) 80 100 -20 0 20 40 60 Temperature (C) 80 100 Maximum Non-Repetitive Surge Current (TA=25C) Current (A) 2.45 Typical On-State Voltage vs. Temperature (IF=5mA, IL=250mA) 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.001 0.01 0.1 1 Time (s) 10 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION CPC1961 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1961G / CPC1961GS MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)C or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles CPC1961G CPC1961GS 250C 250C 30 seconds 30 seconds 1 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R09 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1961 MECHANICAL DIMENSIONS CPC1961G 2.540 0.127 (0.100 0.005) 9.652 0.381 (0.380 0.015) 8-0.800 DIA. (8-0.031 DIA.) 2.540 0.127 (0.100 0.005) 9.144 0.508 (0.360 0.020) 6.350 0.127 (0.250 0.005) Pin 1 PCB Hole Pattern 7.620 0.254 (0.300 0.010) 0.457 0.076 (0.018 0.003) 3.302 0.051 (0.130 0.002) 7.620 0.127 (0.300 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 0.254 0.0127 (0.010 0.0005) 7.620 0.127 (0.300 0.005) Dimensions mm (inches) 0.813 0.102 (0.032 0.004) CPC1961GS 9.652 0.381 (0.380 0.015) 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) Pin 1 0.635 0.127 (0.025 0.005) 3.302 0.051 (0.130 0.002) 9.525 0.254 (0.375 0.010) 0.457 0.076 (0.018 0.003) PCB Land Pattern 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 0.254 (0.300 0.010) 0.254 0.0127 (0.010 0.0005) 0.65 (0.0255) 4.445 0.127 (0.175 0.005) Dimensions mm (inches) 0.813 0.102 (0.032 0.004) 6 www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION CPC1961 CPC1961GSTR Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) K0 =4.90 (0.193) K1 =4.20 (0.165) Embossed Carrier Embossment W=16.00 (0.63) Bo=10.30 (0.406) Ao=10.30 (0.406) P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all "Notes" for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-CPC1961-R09 (c)Copyright 2018, IXYS Integrated Circuits All rights reserved. Printed in USA. 6/20/2018