PL IA N T Features CO M Superior circuit protection *R oH S Overcurrent and overvoltage protection Blocks surges up to rated limits The Model TBU-KE Series is obsolete and not recommended for new designs. The Model TBU-DT Series is the recommended alternative but is not pin-to-pin compatible. High-speed performance E 0072550 2 Small SMT package RoHS compliant* Agency recognition: TBU-KE Series - TBU(R) High-Speed Protectors General Information Agency Approval The TBU-KE Series of Bourns(R) TBU(R) Line Side (Transient Blocking Unit) products are very low capacitance unidirectional high-speed surge protection components designed to protect against faults caused by short circuits, AC power cross, induction and lightning surges. 1 2 Load Side UL Description File Number: E315805 TBU(R) Device The TBU-KE is a unidirectional TBU(R) device: the TBU(R) protector will trip in less than 1 s when the current reaches the maximum value in one direction only, that is when Pin 1 is positive in voltage with respect to Pin 2. No current limiting exists in the opposite polarity, and the TBU(R) protector appears as resistive in nature. The reverse current should not exceed the maximum trigger current level of the TBU(R) device. An external diode may be used to prevent reverse current in DC biased applications. E T E L O S B O The TBU(R) protector blocks surges and provides an effective barrier behind which sensitive electronics will not be exposed to large voltages or currents during surge events. After the surge, the TBU(R) device resets when the voltage across the TBU(R) device falls to the Vreset level. The TBU(R) device will automatically reset on lines which have no DC bias or have DC bias below Vreset (such as unpowered signal lines). The TBU(R) device is provided in a surface mount DFN package and meets industry standard requirements such as RoHS and Pb Free solder reflow profiles. Absolute Maximum Ratings (@ TA = 25 C Unless Otherwise Noted) Symbol Parameter Vimp Peak impulse voltage withstand with duration less than 10 ms Vrms Continuous A.C. RMS voltage Top Tstg Operating temperature range Storage temperature range Part Number TBU-KE025-xxx-WH TBU-KE040-xxx-WH TBU-KE050-xxx-WH TBU-KE025-xxx-WH TBU-KE040-xxx-WH TBU-KE050-xxx-WH Value 250 400 500 100 200 250 -40 to +125 -65 to +150 Asia-Pacific: Tel: +886-2 2562-4117 * Fax: +886-2 2562-4116 EMEA: Tel: +36 88 520 390 * Fax: +36 88 520 211 The Americas: Tel: +1-951 781-5500 * Fax: +1-951 781-5700 www.bourns.com *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. Unit V V C C Applications Set top box LNB ports Protection modules and dongles Process control equipment Test and measurement equipment General electronics TBU-KE Series - TBU(R) High-Speed Protectors Electrical Characteristics (@ TA = 25 C Unless Otherwise Noted) Symbol Itrigger Rdevice Parameter Part Number Min. Typ. Max. Unit Current required for the device to go from operating state to protected state TBU-KExxx-050-WH TBU-KExxx-100-WH TBU-KExxx-200-WH TBU-KExxx-300-WH TBU-KExxx-500-WH 50 100 200 300 500 75 150 300 450 750 100 200 400 600 1000 mA Series resistance of the TBU(R) device Vimp = 250 V Vimp = 250 V Vimp = 250 V Vimp = 250 V Vimp = 250 V Itrigger (min.) = Itrigger (min.) = Itrigger (min.) = Itrigger (min.) = Itrigger (min.) = 50 mA 100 mA 200 mA 300 mA 500 mA TBU-KE025-050-WH TBU-KE025-100-WH TBU-KE025-200-WH TBU-KE025-300-WH TBU-KE025-500-WH 12.5 6.3 3.4 2.4 1.8 14.6 7.5 4.1 3.1 2.3 Vimp = 400 V Vimp = 400 V Vimp = 400 V Vimp = 400 V Vimp = 400 V Itrigger (min.) = Itrigger (min.) = Itrigger (min.) = Itrigger (min.) = Itrigger (min.) = 50 mA 100 mA 200 mA 300 mA 500 mA TBU-KE040-050-WH TBU-KE040-100-WH TBU-KE040-200-WH TBU-KE040-300-WH TBU-KE040-500-WH 13.0 6.8 3.9 3.0 2.3 15.2 8.1 4.7 3.7 2.9 Vimp = 500 V Vimp = 500 V Vimp = 500 V Vimp = 500 V Vimp = 500 V Itrigger (min.) = Itrigger (min.) = Itrigger (min.) = Itrigger (min.) = Itrigger (min.) = 50 mA 100 mA 200 mA 300 mA 500 mA TBU-KE050-050-WH TBU-KE050-100-WH TBU-KE050-200-WH TBU-KE050-300-WH TBU-KE050-500-WH 13.7 7.5 4.6 3.6 3.0 16.0 8.9 5.5 4.5 3.6 E T E L O S B O tblock Time for the device to go from normal operating state to protected state 1 s IQ Current through the triggered TBU(R) device with 50 Vdc circuit voltage Vreset Voltage below which the triggered TBU(R) device will transition to normal operating state Rth(j-l) Junction to package pads - FR4 using recommended pad layout 116 C/W Rth(j-l) Junction to package pads - FR4 using heat sink on board (6 cm2) 96 C/W 0.25 0.50 1.00 mA 10 14 18 V Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. TBU-KE Series - TBU(R) High-Speed Protectors Reference Application Basic TBU Operation (R) The TBU device can be used to protect against excessive voltage surges in DC biased equipment, as shown in the figure below. Diode D1 prevents reverse voltage surges from damaging the equipment, and the TBU(R) protector prevents any positive surges from causing damage. An overvoltage protection device, such as an MOV, may be used to provide additional overvoltage protection if the surge voltage is likely to be above the maximum rating of the TBU(R) device. D1 reverse voltage rating should be greater than that of the OVP device at the maximum surge current level. Typically, a 1N4007 is a suitable choice. D2 should be chosen to be above the normal working voltage of the protected device, but below its absolute maximum rating. D1 Line Side 1 OVP After the surge, the TBU(R) device resets when the voltage across the TBU(R) device falls to the Vreset level. The TBU(R) device will automatically reset on lines which have no DC bias or have DC bias below Vreset (such as unpowered signal lines). E T E L O S B O 2 Equip. D2 TBU(R) Device Performance Graphs The TBU(R) device is a silicon-based, solid-state, resettable device which is placed in series with a signal path. The TBU(R) device operates in approximately 1 s - once line current exceeds the TBU(R) device's trigger current Itrigger. When operated, the TBU(R) device restricts line current to less than 1 mA typically. When operated, the TBU(R) device will block all system voltages and any other voltages including the surge up to rated limits. V-I Characteristic - TBU-KE050-300-WH (Pin 2-1) If the line has a normal DC bias above Vreset, the voltage across the TBU(R) device may not fall below Vreset after the surge. In such cases, special care needs to be taken to ensure that the TBU(R) device will reset, otherwise an automatic or manual power down will be required. Bourns application engineers can provide further assistance. Typical Trigger Current vs. Temperature 1.8 CURRENT (100 mA/div.) VRESET VOLTAGE (5 v/div.) Normalized Trip Current (A) ITRIGGER 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -75 -50 -25 0 25 50 75 100 125 150 Junction Temperature (C) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. TBU-KE Series - TBU(R) High-Speed Protectors Performance Graphs (Continued) Typical Resistance vs. Temperature Power Derating Curve 2.2 No additional PCB Cu 0.5 sq. in. additional PCB CU 2.5 Total Max. Power (W) Normalized Resistance () 3.0 2.0 1.5 1.0 0.5 0.0 20 40 60 1.6 1.4 1.2 1.0 0.8 0.6 E T E L O S B O 80 100 120 140 Junction Temperature (C) Reflow Profile 2.0 1.8 Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat - Temperature Min. (Tsmin) - Temperature Max. (Tsmax) - Time (tsmin to tsmax) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5 C of Actual Peak Temp. (tp) Ramp-Down Rate Time 25 C to Peak Temperature 0.4 0.2 0.0 -75 -50 -25 0 25 50 75 100 125 150 Junction Temperature (C) Pb-Free Assembly 3 C/sec. max. 150 C 200 C 60-180 sec. 217 C 60-150 sec. 260 C 20-40 sec. 6 C/sec. max. 8 min. max. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. TBU-KE Series - TBU(R) High-Speed Protectors Product Dimensions 0.60 (.024) 0.85 0.05 (.033 .002) 5.00 0.10 (.197 .004) 0.30 (.012) 0.75 (.030) 0.30 (.012) 3.05 (.120) 1.90 (.075) 2.50 0.10 (.098 .004) E T E L O S B O 0.30 (.012) PIN 1 & BACKSIDE CHAMFER DIMENSIONS: 0.25 PIN 1 (.010) MM (INCHES) 0.00 - 0.05 (.000 - .002) 1.00 (.039) Recommended Pad Layout C TBU(R) High-Speed Protectors have a 100 % matte-tin termination finish. For improved thermal dissipation, the recommended layout uses PCB copper areas which extend beyond the exposed solder pad. The exposed solder pads should be defined by a solder mask which matches the pad layout of the TBU(R) device in size and spacing. It is recommended that they should be the same dimension as the TBU(R) pads but if smaller solder pads are used, they should be centered on the TBU(R) package terminal pads and not more than 0.10-0.12 mm (0.004-0.005 in.) smaller in overall width or length. Solder pad areas should not be larger than the TBU(R) pad sizes to ensure adequate clearance is maintained. The recommended stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a stencil opening size 0.025 mm (0.0010 in.) less than the solder pad size. Extended copper areas beyond the solder pad significantly improve the junction to ambient thermal resistance, resulting in operation at lower junction temperatures with a corresponding benefit of reliability. All pads should soldered to the PCB, including pads marked as NC or NU but no electrical connection should be made to these pads. For minimum parasitic capacitance, it is recommended that signal, ground or power signals are not routed beneath any pad. Thermal Resistance vs. Additional PCB Cu Area Pad Designation 1 Pin Out 1 Line Side 2 Load Side Dark grey areas show added PCB copper area for better thermal resistance. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 100 Thermal Resistance to Ambient (C/W) 2 Pad # 90 80 70 60 50 40 30 20 10 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 Added Cu Area (Sq. In.) 1.6 1.8 2.0 TBU-KE Series - TBU(R) High-Speed Protectors How to Order Typical Part Marking TBU - KE 025 - 500 - WH MANUFACTURER'S TRADEMARK (R) TBU Product PRODUCT CODE - 1ST DIGIT INDICATES PRODUCT FAMILY: E = TBU-KE SERIES - 2ND & 3RD DIGITS INDICATE IMPULSE VOLTAGE: 25 = 250 V 40 = 400 V 50 = 500 V Series KE = Uni-Series - 4TH & 5TH DIGITS INDICATE TRIGGER CURRENT: 05 = 50 mA 10 = 100 mA 20 = 200 mA 30 = 300 mA 50 = 500 mA Impulse Voltage Rating 025 = 250 V 040 = 400 V 050 = 500 V PIN 1 Trigger Current 050 = 50 mA 100 = 100 mA 200 = 200 mA 300 = 300 mA 500 = 500 mA MANUFACTURING DATE CODE - 1ST DIGIT INDICATES THE YEAR'S 6-MONTH PERIOD. - 2ND DIGIT INDICATES THE WEEK NUMBER IN THE 6-MONTH PERIOD. - 3RD & 4TH DIGITS INDICATE SPECIFIC LOT FOR THE WEEK. E T E L O S B O 6-MONTH PERIOD CODES: A = JAN-JUN 2009 C = JAN-JUN 2010 B = JUL-DEC 2009 D = JUL-DEC 2010 Hold to Trip Ratio Suffix W = Hold to Trip Ratio Package Suffix H = DFN Package Packaging Specifications E = JAN-JUN 2011 F = JUL-DEC 2011 P0 B A D t E P2 TOP COVER TAPE N F W C D B0 K0 CENTER LINES OF CAVITY A0 P D1 EMBOSSMENT G (MEASURED AT HUB) USER DIRECTION OF FEED QUANTITY: 3000 PIECES PER REEL A Min. 176 (6.929) B Max. 178 (7.008) Min. 1.5 (.059) A0 Min. 2.8 (.110) B0 Max. 3.0 (.118) Min. 5.4 (.212) Max. 1.3 (.051) Min. 3.8 (.150) K0 Min. 1.1 (.043) C Max. 2.5 (.098) Min. 12.8 (.504) D Max. 13.5 (.531) D Max. 5.6 (.220) Min. 1.5 (.059) Max. 4.2 (.165) Min. 3.8 (.150) P Min. 20.2 (.795) - D1 Max. 1.6 (.063) Min. 1.5 (.059) Max. 4.2 (.165) Min. 1.95 (.077) P0 G Ref. 16.5 (.650) Max. E Max. - Min. 1.65 (.065) P2 F Max. 1.85 (.073) Min. 5.45 (.214) Max. 0.35 (.014) Min. 11.7 (.461) t Max. 2.05 (.081) Min. 0.25 (.010) N Ref. 102 (4.016) max. 5.55 (.218) W REV. 04/15 "TBU" is a registered trademark of Bourns, Inc. in the United States and other countries. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. DIMENSIONS: Max. 12.3 (.484) MM (INCHES)