4. Supplementary Information 4-1 Current Transfer Ratio (CTR), LED Trigger Current (IFT) Ranking and Marking Unit: mm Standard rank classifications are applied for the CTR of transistor-type photocouplers and for the IFT of MOSFET, SCR, Triac-type photocouplers. Indicative product markings corresponding to rank names are as shown below. Also, note that the applied rank classifications depend on product types. 1) CTR Rank Name and Rank Marking Available CTR Rank Selection ( : Available, : Call Toshiba) Rank Marking BL GRL GRH Group Rank Name Product No. -3A1 10G1 A or YG GB None Y GR 1 1 1 2 1 2 1 2 1 1 2 TLP180 TLP181 TLP280 TLP280-4 TLP281 TLP281-4 TLP321 TLP321-2/-3/-4 TLP421/421F TLP521-1 TLP521-2 Rank Marking BL GRL GRH Group Rank Name Product No. A or YG GB None Y GR 2 1 2 2 2 1 2 2 2 1 1 1 TLP521-4 TLP531/532 TLP620 TLP620-2 TLP620-4 TLP621 TLP621-2 TLP621-4 TLP630 TLP631/632 TLP731/732 TLP733F/734F i ) Marking for Group 1 Rank Name A or None CTR 50 % to 600 % YG 50 % to 300 % GB 100 % to 600 % CTR Rank Marking Blank,Y,Y ,G,G ,B,B ,GB Marking Example i ) 4pin Type & Mini Flat 1ch Type Y,Y ,G,G or GB,G,G ,B,B Y 50 % to 150 % Y,Y GR 100 % to 300 % G,G BL 200 % to 600 % B,B GRL 100 % to 200 % G GRH 150 % to 300 % G Lot No. Type Name without "TL" * CTR or IFT Rank Marking P Pin No. 1 *: : Ex : TLP626 : P626 TLP521-1 : P521 ii ) Others or ii ) Marking for Group 2 Rank Name CTR A or None 50 % to 600 % Lot No CTR Rank Marking Blank,YG,GB,GR,BL GB 100 % to 600 % GB,GR,BL GR 100 % to 300 % GR BL 200 % to 600 % BL Type Name * TLP CTR or IFT Rank Marking Pin No. 1 *: 2) IFT Rank Name and Rank Marking Rank Name IFT None IFT Max IFT7 7 mA Max T7,T5 IFT5 5 mA Max T5 Ex : TLP624-4 : TLP624-4 TLP3042 : TLP3042 iii ) TLP421 Pin No. 1 IFT Rank Marking Monthly Lot No. Blank,T7,T5 P421 Device Name Lot No. CTR Rank Marking 3) Safety Standard Certification Use Toshiba standard product number for safety standard certificate application. Example : TLP621 (GR) TLP621 Label example TYPE ADD.C TLP421 (D4-GR) Q'TY PCS. NOTE 27 4-2 Optional Lead Formed Products 1) Surface-Mount Lead Form Options (LF1) (LF4) (LF5) Package Dimensions (LF1) 4pin (DIP4) (LF4) 8pin (DIP8) 4 3 8 5 1 2 1 4 6pin (DIP6) 16pin (DIP16) 6 5 4 16 9 1 2 3 1 8 (LF5) A The photocoupler product line with lead forming is available for surface mounting. B Features * Surface mountable * Available for all 4, 6, 8 & 16pin DIP * All electrical parameters remain unchanged from standard package Ordering Information To order any standard photocoupler with a surface mount lead form, add : (LF1), (LF4) or (LF5) to the standard part number, depending on the lead form desired. Example : Standard product number : TLP731 (GR) Surface-mount type product number : TLP731 (GR-LF1), TLP731 (GR-LF4) or TLP731 (GR-LF5) Safety Standards Certification Use TOSHIBA standard part number for safety standards certificate application. Example : TLP731 (GR-LF1) TLP731 28 C Unit: mm Version Dimension (LF1) (LF4) (LF5) Min Max Min Max Min Max A -- 10.0 -- 12.0 -- 10.0 B (0.35 typ.) -- 0.2 6.4 -- C 6.4 -- (0.25 typ.) 8.0 -- All other package dimensions are the same as for each standard package specifications. 2) Wide Clearance Lead Form Option (LF2) Package Dimensions 4pin (DIP4) LF2 8pin (DIP8) 4 3 8 5 1 2 1 4 6pin (DIP6) The photocoupler line is available with lead forming for insertion mounting with wider clearance. Features * High board clearance * Available for all 4, 6, 8 & 16pin DIP * All electrical parameters remain unchanged from standard package Ordering Information To order any standard photocoupler with an wide clearance lead form, add : (LF2) to the standard part number. ax 0.0 .2 -- ch Example : Standard product number : TLP731 (GR) wide clearance product number : TlP731 (GR-LF2) 16pin (DIP16) 6 5 4 16 9 1 2 3 1 8 10.16 10 ~ 12 Unit: mm All other package dimensions are the same as for each stadard package specifications. Safety Standards Certification Use TOSHIBA standard part number for safety standards certificate application. Example : TLP731 (GR-LF2) TLP731 29 4-3 Photocoupler Magazine Packing Specifications DIP LF1, LF2, LF4 and LF5 Dimensions of Magazine Dimensions of Magazine Unit: mm 6.7 4.4 2.7 10.3 9.3 4.5 4.3 1.4 Unit: mm 9.5 DIP Standard Lead Forming 5.5 5.5 10.3 11.3 14 Length = 525 Thickness = 0.5 Length = 525 Thickness = 0.5 Quantities of Devices per Magazine Number of Pins 4 6 8 12 16 Quantity (pcs) 100 50 50 25 25 Packing Dimensions Unit: mm Packing Dimensins Y B Unit: mm Y B X X C C A 30 A Quantity of Magazines Dimensions (A x B x C) Label Position Quantity of Magazines Dimensions (A x B x C) Label Position 4 50 x 12 x 531 Y 4 60 x 13 x 531 Y 20 67 x 51 x 559 Y 40 135 x 58 x 568 X 60 123 x 76 x 568 X Dimensions SOP (SOP4, SOP16, 2.54 SOP) Unit: mm Dimensions Unit: mm (0.8) 10.5 4.2 1.6 6.2 2.8 6.2 1.5 3.9 3.4 4.9 2.3 mm MFSOP (Mini-Flat Coupler) 5.2 10.5 4.7 Length = 555 Thickness = 0.5 Length = 555 Thickness = 0.5 Quatities of Devices per Magazine Package Type MFSOP6 Package Type SOP4 SOP16 Quantity (pcs) 150 Quantity (pcs) 150 50 Packing Dimensions 2.54 SOP 4pin 6pin 8pin 100 75 50 Unit: mm m on Y B X C Quantity of Magazines per Box Dimensions (A x B x C) Label Position 4 29 x 13 x 563 Y 24 77 x 31 x 586 X 40 67 x 55 x 586 X A Photocoupler Package Type MFC (MFSOP6) SOP-1ch (SOP4) SOP-4ch (SOP16) SOP (2.54SOP4) SOP (2.54SOP6) SOP (2.54SOP8) Typical Devices TLP180, TLP114A, TLP160J, TLP3110 TLP280, TLP281 TLP280-4, TLP281-4, TLP270D, TLP270G TLP197G, TLP176G, TLP206G TLP197G TLP206G, TLP206A 31 4-4 Photocoupler Tape and Reel Specifications 3) 1) Type (Surface-mount photocouplers are available on tape and reel as described below). Photocoupler Package Types Tape Option Symbol MFSOP6 (TPL) or (TPR) Typical Devices TLP114A, TLP160J, TLP181, TLP190B SOP4 (TP) TLP280, TLP281 SOP16 (TP) TLP280-4, TLP281-4, TLP270G, TLP270D 2.54SOP (TP) DIP(LF1, LF5) (TP1) or (TP5) TLP550, TLP560G, TLP621 DIP(LF4) (TP4) TLP251, TLP560G, TLP621 TLP176G, TLP197G, TLP206G 2) Tape Dimensions Unit: mm 2.0 0.1 J F G E t KO Symbol B C D Photoc A K Unit: mm MFSOP6 SOP4 SOP16 2.54SOP4 2.54SOP6 Tape Option : (TPL), (TPR) (TP) (TP) 4pin 6pin A 4.2 0.1 3.1 0.1 7.5 0.1 B 7.6 0.1 7.5 0.1 10.5 0.1 4.3 0.1 2.54SOP8 DIP(LF1, LF5) 8pin 7.5 0.1 7.5 0.1 6.7 0.1 (TP4) 10.4 0.1 12.3 0.1 1 1 10.5 0.1 12.0 0.3 16.0 0.3 12.0 0.3 16.0 0.3 D 5.5 0.1 7.5 0.1 5.5 0.1 7.5 0.1 E F G 1.75 0.1 8.0 0.1 12.0 0.1 8.0 0.1 12.0 0.1 16.0 0.1 4.0 0.1 J +0.1 1.5 -0 K 3.15 0.2 2.5 0.2 2.4 0.2 2.6 0.2 2.5 0.2 2.4 0.2 K0 2.8 0.1 2.3 0.1 2.2 0.1 2.4 0.1 2.3 0.1 2.2 0.1 t 0.3 0.05 4.55 0.2 4.1 0.1 0.4 0.05 1: Typical devices 32 DIP(LF4) (TP1), (TP5) C Dimension Dimension symbol (See Figure) Photocoupler Package Type DIP 4pin TLP620, TLP621, TLP721 5.1 0.1 DIP 6pin (short package) TLP631, TLP734, TLP747G, TLP3022 (S) 7.6 0.1 DIP 6pin (long package) TLP598G, TLP3052 DIP 8pin TLP250, TLP555, TLP2601 10.1 0.1 (TP4) is not available. 4) A C U B 3) Reel Dimensions E W1 W2 Unit in mm Photocoupler Package Type Tape Options : SOP16 (TPL), (TPR) (TP) (TP) 2.54SOP4 2.54SOP6 2.54SOP8 DIP(LF1, LF5) (TP) 80 1 C 13 0.5 U DIP(LF4) (TP4) 380 2 B E (TP1), (TP5) 330 2 Dimensions Symbol SOP4 380 2 A nit: mm MFSOP 2.0 0.5 4.0 0.5 W1 13.5 0.5 17.5 0.5 13.5 0.5 17.5 0.5 W2 17.5 1.0 21.5 1.0 17.5 1.0 21.5 1.0 F4) 4) 0.1 4) Other Packing Information a) Device orientation on tape, by combinations of photocoupler package type and tape options. Tape orientation 0.1 Photocoupler Package Type Tape Option MFSOP6 TPR Photocoupler Package Type Tape Option MFSOP6 TPL SOP4, 2.54SOP4 TP Photocoupler Package Type Tape Option SOP16 TP 2.54SOP6/8 TP DIP (LF1, LF5) TP1, TP5 DIP (LF4) TP4 33 4-4 Photocoupler Tape and Reel Specifications (continued) 4- b) Details of Tape Quantities per Reel 1 MFSOP6 SOP4 SOP16 2.54SOP4/6/8 DIP (LF1, LF5) DIP (LF4) Quantities (pcs) 3000 2500 2500 2500 1500 1000 1.2 Photocoupler Package Type Empty Cavities : Item Specification Note Consecutive empty cavities Zero Any 40 mm portion of tape except leader and trailer. Nonconsecutive empty cavities 0.2% max/reel 2 Except leader and trailer. 2 : 6pcs max/reel for DIP types c) Packing boxes 2 types : One-reel box or five-reel box. d) Label The reel label includes the following information. 1. Product number 2. Tape type 3. Quantity 4. Lot number M e) Purchase order Specify the product number, tape and quantity as follows. ex. TLP181 (GB - TPR) 2 3000pcs Quantity ( ) Symbol of taping option CTR rank Photocoupler product number Per reel must be a multiple of quantity 34 4-5 Recommended Footprint Dimensions Below are the recommended footprint (mount pad) dimensions for surface-mount packages. (Units in mm) 1) Mini-Flat Coupler (MFSOP, 2.54SOP, SOP) LF4) 0.8 0.8 0.8 0.8 1.27 1.2 1.2 1.2 1.2 0 1.27 2.54 2.54 MFSOP6 (4 pin) [TLP181 etc.] 2.54SOP4 [TLP197G etc.] MFSOP6 (5 pin) [TLP131 etc.] 6.3 6.3 6.3 6.3 ailer. 1.27 2.54 SOP4 [TLP281 etc.] 2.54SOP6 [TLP197G] 2) SMD Lead Forming of 6-pin DIP Coupler 2.54 10.4 8.7 1.6 1.5 1.6 1.5 2.54 2.54 (LF1) & (LF5) [TLP731 (LF1) etc.] 2.54 (LF4) [TLP731 (LF4) etc.] 35 4-6 Precautions for Assembly Using Mini Flat Coupler 1) Soldering Avoid rise in the device temperature as much as possible by observing the following conditions. a) Soldering lead directly (by solder header) 260C max, 10 second max, for once. b) Reflow soldering (1) Complete the reflow process for once within 30 second at a package surface temperature above 210C. (2) Atmospheric temperature close to mold body surface : 240C max, 10 second max (3) Recommended temperature profile (C) 240 210 150 60 to 90 30 times (s) c) Precautions for heating (1) Soldering time has to be kept as short as possible. (2) When using a halogen lamp or infrared heater, please do not irradiate the mold body surface directly. d) Dip soldering (Flow soldering) Reflow soldering is recommended, because thermal stress is much less than in other soldering methodes. Contact Toshiba when you plan to use dip soldering. 2) Cleaning 2-1) The following types of solvents are recommended for cleaning the flux. Toshiba Technocare (FRW-1, FRW-17, FRW-100) Kao Cleanthru 750H Asahi Clean AK-225AES Pine-alpha ST-100S 2-2) Cleaning Conditions Cleaning conditions and precautions may differ depending on the product specifications. When cleaning the flux, reactive ions such as Cl and Na must be removed. a) General precautions on dip cleaning Dipping time may differ depending on the solvent used. However, as a general reference, it is recommended to limit the dip 3 minutes. b) General precautions on ultrasonic cleaning When ultrasonic cleaning is conducted for excessively long times, contact between product resin and metal leads may lessen. Also, excessive ultrasonic stress may cause cracks in the pellet. It is recommended to apply a minimum of stress. Recommended condidtions for standard ultrasonic cleaning Frequency : 27 to 29kHz Time : 30 seconds or less Temperature : 50C (may differ depending on the solvent used) Output : 0.25 W/ cm2 or less Cleaning must be conducted in a condition in which the printed circuit board or device should be floating on the solvent used in order to avoid direct contact with the ultrasonic vibrator. 2-3) Handling Precautions During cleaning, or when cleaning liquid is being applied to a device, do not touch the device-marking surface with hand or brush. Device markings may be erased. It is necessary to confirm the safety of the solvent used for cleaning, as well as cleaning conditions, so as not to harm the device package. 36 4-7 Safety Standard Approved Photocouplers and VDE0884-Approved Photocouplers (as of September 2000) TLP521-1 TLP531/532 TLP541G/545J TLP550/551 TLP560G/561G TLP620/-2/-4 TLP621/-2/-4 TLP750/751 TLP631/632 TLP641G/641J TLP651 TLP30xx(S) Series TLP731/732 TLP741G TLP741J TLP3022 TLP3052 TLP3042 TLP3062 TLP733/734 TLP747G TLP747J TLP762J TLP763J TLP121 TLP131 TLP112A TLP115A TLP180 TLP181 TLP280 TLP281 TLP127 TLP160G TLP141G TLP190B TLP197G TLP176G TLP206G TLP227G TLP227G-2 TLP250 TLP251 TLP597G TLP620/-2/-4 TLP621/-2/-4 TLP627/-2/-4 TLP750/751/759 TLP30xx(S) Series TLP731/732 TLP741G TLP741J TLP733/734 TLP747G TLP747J TLP762J TLP165J TLP166J TLP127 TLP176G TLP197G TLP206G TLP227G TLP227G-2 TLP597G TLP620/-2/-4 TLP621/-2/-4 TLP624/-2/-4 TLP626/-2/-4 TLP627/-2/-4 TLP750/751 TLP731/732 TLP741G TLP741J TLP798G TLP733/734 TLP747G TLP747J TLP762J TLP763J TLP180 TLP181 TLP280 TLP281 TLP127 TLP176G TLP197G TLP206G TLP227G TLP227G-2 TLP597G TLP798G TLP620/-2 TLP621/-2 TLP627/-2 TLP750/751/759 TLP30xx(S) Series TLP733/734 TLP747G TLP747J TLP762J TLP763J TLP180 TLP181 TLP280 TLP281 TLP176G TLP197G TLP206G Safety Standard 2 4 4.58 4 3 6.4 4.58 4 3 1 2 2 7.12 6 5 4 3 5 7.12 6 5 4 2 1 3 4 2 1 4 6.4 6.4 9.66 8 7 6 5 1 4 3 0.6 4 1 2 3 1 2 3 9.66 1 2 3 4 3 TLP181/TLP281 8 7 6 5 g on 1 4.58 2 3 1 2 7.12 8.64 1 2 3 2 4 6.4 7.12 1 4 1 2 6 5 4 (Unit: mm) 3 5 6.4 Package Dimensions 1 2.6 6 5 4 6 5 4 1 2 3 3.6 6.3 4.4 4 3 4.4 1 4.4 2 1.5 3 6.4 Construction (Cross-section) Body Window Detector LED Film 6.4 odes. 6.4 ctly. TLP181 TLP280 TLP281 6.4 V DE TLP3022 TLP3052 TLP3042 TLP3062 TLP668JF TLP798G 6.4 10C. 1 2 3 1 2 3 4 king s, 37 4-7 Safety Standard Approved Photocouplers and VDE0884-Approved Photocouplers TLP181**/ TLP180 -- -- Transistor Output -- TLP131 -- Thyristor Output -- -- Triac Output -- IC Output Photorelay 4pin and Multichannel Device Type -- -- -- -- -- -- -- TLP141G -- -- TLP165J/ TLP166J -- TLP160J/ TLP161J -- -- TLP114A -- -- -- -- -- -- -- -- TLP176G TLP206G MFSOP 2.54SOP Package -- MFSOP -- SOP Isolation Creepage Path (mm) 4.0 4.0 4.0 Isolation Clearance (mm) 4.0 4.0 4.0 Isolation Thickness (mm) Construction Mechanical Ratings (min) TLP280/TLP281 0.4 Internal Creepage Path (mm) -- Isolation Voltage (kVrms) Internal Construction (Cross Section) Body Window Detector LED Film 0.4 -- 3.75 2.5 1 4 2 3 3 2 4 4 -- -- 2.5 1.5 1 1 2 -- -- 3 3 2 4 1 3 2 1 4 Parts Specifica- tions UL1577 (File No. E67349) Double Protection V DE B G E Approved AUART T Safety Standard DIN VDE 0884/08.87 Parts Specifications DIN IEC65/ VDE 0860/08.81 Home Appliances DIN IEC380/ VDE 0806/08.81 Office Equipment DIN IEC435/ VDE 0805/08.79 Data processing Equipment Data processing Equipment DIN57 804 VDE 0804/01.83 ** (Note 1) (Note 1) P R UF Home DIN57 700T1/ VDE 0700T1/2.81 Appliances Medical DIN IEC601T1/ VDE 0750T1/05.82 Equipment SELV satisfied ELV satisfied Home BS EN60065: 1994 Appliances Office BS EN60950: 1992 Equipment BS6301: 1989 Telecommunications Networks SEMKO SS-EN60950 Office Equipment -- -- -- **: Only applied for TLP181 Note 1 : VDE0884 standards for MFSOP and SOP photocouplers are different from those of standard DIP photocouplers because MFSOP and SOP are compact and small packages. 38 rs -- 4pin and Multichannel TLP621*/ TLP624/626 620/627 -- -- -- -- TLP421 Transistor Output -- -- TLP733/734 -- TLP731/732 -- -- Thyristor Output -- -- TLP747G/ TLP747J -- TLP741G/ TLP747J -- -- -- Triac Output -- -- -- TLP762J/ TLP763J -- TLP3022F/3052F TLP3042F/3062F -- -- IC Output -- TLP750/ TLP751 -- -- -- -- -- 176G 206G Photorelay -- -- -- -- -- -- -- -- -- Device Type 4SOP Package DIP DIP DIP DIP 4.0 Isolation Creepage Path (mm) 6.4 4.0 7.0 8.0 (Note 2) 7.0 8.0 (Note 2) Isolation Clearance (mm) 6.4 7.0 8.0 (Note 2) Isolation Thickness (mm) 0.4 0.5 0.4 Internal Creepage Path (mm) -- 4.0 -- -- Isolation Voltage (kVrms) 5.0 4.0 -- Construction Mechanical Ratings (min) -- .5 2 1 Internal Construction (Cross Section) 4 TLP181 P and 3 2 4 3 1 2 4.0 1 4 5 5.0 5.0 3 2 4 1 1 5 4 2 3 Parts Specifications UL1577 (File No. E67349) Double Protection Safety Standard V DE B E SELV satisfied ELV satisfied AUART DIN VDE 0884/08.87 Parts Specifications DIN IEC65/ VDE 0860/08.81 Home Appliances DIN IEC380/ VDE 0806/08.81 Office Equipment DIN IEC435/ VDE 0805/08.79 Data processing Equipment Data processing Equipment DIN57 804 VDE 0804/01.83 T Approved G -- Body Window Detector LED Film 0.4 0.5 P R UF * (Note 3) (Note 3) (Note 3) (TUV) (Note 3) Home DIN57 700T1/ VDE 0700T1/2.81 Appliances Medical DIN IEC601T1/ VDE 0750T1/05.82 Equipment Home BS EN60065: 1994 Appliances Office BS EN60950: 1992 Equipment BS6301: 1989 Telecommunications Networks SEMKO SS-EN60950 Office Equipment (Note 4) *: Only applied for TLP621 Note 2: 8.0 for (LF2) or F type. Note 3: VDE0884-approved with option (D4). Note 4: TLP621 / 620 / 627 / 750 / 751 are approved. TOSHIBA recommend TLP621 rather than TLP721 for your new designing. 39