27
P
Pin No. 1
TLP
1
1
1
2
1
2
1
2
1
1
2
Rank
Marking
Group
YG
A or
None
GB Y GR BL
GRL GRH
TLP180
TLP181
TLP280
TLP280-4
TLP281
TLP281-4
TLP321
TLP321-2/-3/-4
TLP421/421F
TLP521-1
TLP521-2
Rank Name
Product No.
2
1
2
2
2
1
2
2
2
1
1
1
Rank
Marking
Group
YG
A or
None
GB Y GR BL
GRL GRH
TLP521-4
TLP531/532
TLP620
TLP620-2
TLP620-4
TLP621
TLP621-2
TLP621-4
TLP630
TLP631/632
TLP731/732
TLP733F/734F
Rank Name
Product No.
50 % to 600 % Blank,Y,Y ,G,G ,B,B ,GB
50 % to 300 % Y,Y ,G,G
100 % to 600 % GB,G,G ,B,B
50 % to 150 % Y,Y
100 % to 300 % G,G
200 % to 600 % B,B
100 % to 200 % G
150 % to 300 % G
Rank Name
A or None
YG
GB
Y
GR
BL
GRL
GRH
CTR CTR Rank Marking
50 % to 600 % Blank,YG,GB,GR,BL
100 % to 600 % GB,GR,BL
100 % to 300 % GR
200 % to 600 % BL
Rank Name
A or None
GB
GR
BL
CTR CTR Rank Marking
IFT Max Blank,T7,T5
7 mA Max T7,T5
5 mA Max T5
Rank Name
None
IFT7
IFT5
IFT Rank MarkingIFT
4–1
Current Transfer Ratio (CTR), LED Trigger Current (I
FT
) Ranking and Marking
1) CTR Rank Name and Rank Marking
2) I
FT
Rank Name and Rank Marking
3) Safety Standard Certification
Standard rank classifications are applied for the CTR of transistor-type photocouplers and for the IFT of MOSFET,
SCR, Triac-type photocouplers. Indicative product markings corresponding to rank names are as shown below.
Also, note that the applied rank classifications depend on product types.
Available CTR Rank Selection ( : Available, : Call Toshiba)
Use Toshiba standard product number for safety standard certificate
application.
Example : TLP621 (GR) TLP621
ii ) Marking for Group 2
i ) Marking for Group 1 Marking Example
i ) 4pin Type & Mini Flat 1ch Type
ii ) Others
iii ) TLP421
Lot No.
Type Name without "TL"
*
CTR or I
FT
Rank Marking
Type Name
*
CTR or I
FT
Rank Marking
Pin No. 1
or
Lot No
or
*
: : Ex : TLP626 : P626
TLP521–1 : P521
*
: Ex : TLP624-4 : TLP624-4
TLP3042 : TLP3042
P421
Lot No.
Device Name
Monthly Lot No.
CTR Rank Marking
Pin No. 1
Label example
TYPE
ADD.C (D4-GR) Q’TY PCS.
TLP421
NOTE
U
nit: mm
-3A1
1
0G1
4. Supplementary Information
28
4–2 Optional Lead Formed Products
1) Surface-Mount Lead Form Options
Version
Dimension
A—10.0 —12.0 —10.0
B (0.35 typ.) (0.25 typ.) —0.2
C 6.4 —8.0 —6.4 —
(LF1)
Min Max Min Max Min Max
(LF4) (LF5)
All other package dimensions are the same as for each
standard package specifications.
The photocoupler product line with lead
forming is available for surface mounting.
Features
• Surface mountable
• Available for all 4, 6, 8 & 16pin DIP
• All electrical parameters remain unchanged
from standard package
Ordering Information
To order any standard photocoupler with a
surface mount lead form, add : (LF1), (LF4)
or (LF5) to the standard part number,
depending on the lead form desired.
Example :
Standard product number : TLP731 (GR)
Surface-mount type product number :
TLP731 (GR-LF1), TLP731 (GR-LF4) or
TLP731 (GR-LF5)
Safety Standards Certification
Use TOSHIBA standard part number for safety
standards certificate application.
Example :
TLP731 (GR-LF1) TLP731
(LF1)
(LF4)
(LF5)
43
12
4pin (DIP4)
645
123
6pin (DIP6)
16
1
9
8
16pin (DIP16)
85
14
8pin (DIP8)
A
B
C
Package Dimensions
Unit: mm
(LF1)
(LF4)
(LF5)
29
0
.0
.2
—
ax
c
h
2) Wide Clearance Lead Form Option
All other package dimensions are the same as for each
stadard package specifications.
The photocoupler line is available with lead
forming for insertion mounting with wider
clearance.
Features
• High board clearance
• Available for all 4, 6, 8 & 16pin DIP
• All electrical parameters remain unchanged
from standard package
Ordering Information
To order any standard photocoupler with an
wide clearance lead form, add : (LF2) to the
standard part number.
Example :
Standard product number : TLP731 (GR)
wide clearance product number : TlP731
(GR-LF2)
Safety Standards Certification
Use TOSHIBA standard part number for safety
standards certificate application.
Example :
TLP731 (GR-LF2) TLP731
(LF2)
645
123
6pin (DIP6)
16
1
9
8
16pin (DIP16)
43
12
4pin (DIP4)
85
14
8pin (DIP8)
10.16
10 ~ 12
Package Dimensions
Unit: mm
LF2
30
4–3 Photocoupler Magazine Packing Specifications
DIP Standard Lead Forming DIP LF1, LF2, LF4 and LF5
Dimensions of Magazine
Quantities of Devices per Magazine
Dimensions of Magazine
Packing Dimensions Packing Dimensins
Unit: mm Unit: mm
Unit: mm Unit: mm
Length = 525
Thickness = 0.5 Length = 525
Thickness = 0.5
Number of Pins 4 6 8 12 16
Quantity (pcs) 100 50 50 25 25
Dimensions (A x B x C) Label Position
4 50 x 12 x 531 Y
20 67 x 51 x 559 Y
60 123 x 76 x 568 X
Dimensions (A x B x C) Label Position
4 60 x 13 x 531 Y
40 135 x 58 x 568 X
B
A
X
Y
CB
A
X
Y
C
11.3
10.3
5.5
10.3
9.3
4.5 4.3
Quantity of
Magazines
Quantity of
Magazines
14
5.5
6.7
2.7
4.4
9.5
1.4
31
m
m
m
o
n
MFSOP (Mini-Flat Coupler) SOP (SOP4, SOP16, 2.54 SOP)
Dimensions
Quatities of Devices per Magazine
Dimensions
Packing Dimensions
Unit: mm Unit: mm
Unit: mm
Length = 555
Thickness = 0.5 Length = 555
Thickness = 0.5
P ackage Type MFSOP6
Quantity (pcs) 150
4 29 x 13 x 563 Y
24 77 x 31 x 586 X
40 67 x 55 x 586 X
Photocoupler Package Type Typical Devices
MFC (MFSOP6) TLP180, TLP114A, TLP160J, TLP3110
SOP-1ch (SOP4) TLP280, TLP281
SOP-4ch (SOP16) TLP280-4, TLP281-4,
TLP270D,
TLP270G
SOP (2.54SOP4)
TLP197G, TLP176G, TLP206G
SOP (2.54SOP6) TLP197G
SOP (2.54SOP8) TLP206G, TLP206A
B
A
X
Y
C
10.5
4.9
4.7
2.3 3.9
6.2
1.5
10.5
4.2(0.8)
5.2
2.8 3.4
6.2
1.6
P ackage Type
Quantity (pcs)
SOP4
150
SOP16 2.54 SOP
50 100
4pin 6pin 8pin
75 50
Quantity of
Magazines
per Box Dimensions (A x B x C) Label Position
32
t
K
O
K
JF
A
G
DE
C
B
2.0 ± 0.1
Unit: mm
Unit: mm
MFSOP6 SOP4 SOP16 2.54SOP4 2.54SOP6 2.54SOP8 DIP(LF1, LF5) DIP(LF4)
Tape Option : (TPL), (TPR) (TP) (TP) 4pin 6pin 8pin (TP1), (TP5) (TP4)
A
B
C
D
E
F
G
J
K
K
0
t
1.5
+0.1
–0
4.2 ± 0.1 3.1 ± 0.1 7.5 ± 0.1 4.3 ± 0.1 7.5 ± 0.1 10.4 ± 0.1 12.3 ± 0.1
7.6 ± 0.1 7.5 ± 0.1 10.5 ± 0.1 7.5 ± 0.1 6.7 ± 0.1 10.5 ± 0.1 1 1
12.0 ± 0.3 16.0 ± 0.3 12.0 ± 0.3 16.0 ± 0.3
5.5 ± 0.1 7.5 ± 0.1 5.5 ± 0.1 7.5 ± 0.1
1.75 ± 0.1
8.0 ± 0.1 12.0 ± 0.1 8.0 ± 0.1 12.0 ± 0.1 16.0 ± 0.1
4.0 ± 0.1
3.15 ± 0.2 2.5 ± 0.2 2.4 ± 0.2 2.6 ± 0.2 2.5 ± 0.2 2.4 ± 0.2 4.55 ± 0.2
2.8 ± 0.1 2.3 ± 0.1 2.2 ± 0.1 2.4 ± 0.1 2.3 ± 0.1 2.2 ± 0.1 4.1 ± 0.1
0.3 ± 0.05 0.4 ± 0.05
1: Typical de vices
Dimension symbol (See Figure)
Dimension
Photocoupler Package Types Tape Option Symbol Typical Devices
MFSOP6 (TPL) or (TPR) TLP114A, TLP160J, TLP181, TLP190B
SOP4 (TP) TLP280, TLP281
SOP16 (TP) TLP280-4, TLP281-4, TLP270G, TLP270D
2.54SOP (TP) TLP176G, TLP197G, TLP206G
DIP(LF1, LF5) (TP1) or (TP5) TLP550, TLP560G, TLP621
DIP(LF4) (TP4) TLP251, TLP560G, TLP621
4–4 Photocoupler Tape and Reel Specifications
1)
Type (Surface-mount photocouplers are available on tape and reel as described below).
2) Tape Dimensions
DIP 4pin TLP620, TLP621, TLP721 5.1 ± 0.1
DIP 6pin (short package) TLP631, TLP734, TLP747G, TLP3022 (S) 7.6 ± 0.1
DIP 6pin (long package) TLP598G, TLP3052 10.1 ± 0.1
DIP 8pin TLP250, TLP555, TLP2601 (TP4) is not available.
Photocoupler Package Type
Symbol
Photo
c
3)
4)
33
n
it: mm
F
4)
4
)
0.1
0.1
Unit in mm
Symbol
Dimensions
MFSOP SOP4 SOP16 2.54SOP4 2.54SOP6 2.54SOP8 DIP(LF1, LF5) DIP(LF4)
Tape Options : (TPL), (TPR) (TP) (TP) (TP) (TP1), (TP5) (TP4)
A
B
C
E
U
W1
W2
380 ± 2 330 ± 2 380 ± 2
80 ± 1
13 ± 0.5
2.0 ± 0.5
4.0 ± 0.5
13.5 ± 0.5 17.5 ± 0.5 13.5 ± 0.5 17.5 ± 0.5
17.5 ± 1.0 21.5 ± 1.0 17.5 ± 1.0 21.5 ± 1.0
E
U
W2
W1
C
B
A
Photocoupler Package Type
Photocoupler Package Type Tape Option
MFSOP6 TPR
Photocoupler Package Type Tape Option
MFSOP6 TPL
SOP4, 2.54SOP4 TP
Photocoupler Package Type Tape Option
SOP16 TP
2.54SOP6/8 TP
DIP (LF1, LF5) TP1, TP5
DIP (LF4) TP4
3) Reel Dimensions
4) Other Packing Information
a) Device orientation on tape, by combinations of photocoupler package type and tape options.
Tape orientation
34
b) Details of Tape
c) Packing boxes
2 types : One-reel box or five-reel box.
d) Label
The reel label includes the following information.
1. Product number 2. Tape type 3. Quantity 4. Lot number
e) Purchase order
Specify the product number, tape and quantity as follows.
Photocoupler Package Type MFSOP6 SOP4 SOP16 2.54SOP4/6/8 DIP (LF1, LF5) DIP (LF4)
Quantities (pcs) 3000 2500 2500 2500 1500 1000
Quantities per Reel
Item Specification Note
Consecutive empty cavities Zero Any 40 mm portion of tape except leader and trailer.
Nonconsecutive empty cavities 0.2% max/reel 2 Except leader and trailer.
Empty Cavities :
2 : 6pcs max/reel for DIP types
Quantity ( )
Symbol of taping option
CTR rank
Photocoupler product number
ex. TLP181 (GB –TPR) 3000pcs
Per reel must be a multiple of quantity
4–4 Photocoupler Tape and Reel Specifications (continued)
4
–
1
2
1.2
M
35
L
F4)
0
a
iler.
4–5 Recommended Footprint Dimensions
1) Mini-Flat Coupler (MFSOP, 2.54SOP, SOP)
2) SMD Lead Forming of 6-pin DIP Coupler
Below are the recommended footprint (mount pad) dimensions for surface-mount packages.
(Units in mm)
2.54 2.54
1.5
1.6
8.7
2.54 2.54
1.5
1.6
10.4
(LF1) & (LF5) [TLP731 (LF1) etc.] (LF4) [TLP731 (LF4) etc.]
0.8
2.54
1.2
6.3
MFSOP6 (4 pin) [TLP181 etc.]
2.54SOP4 [TLP197G etc.]
0.8
2.54
1.2
6.3
2.54SOP6 [TLP197G]
0.8
1.27
1.2
6.3
SOP4 [TLP281 etc.]
0.8
1.27 1.27
2.54
1.2
6.3
MFSOP6 (5 pin) [TLP131 etc.]
36
4–6 Precautions for Assembly Using Mini Flat Coupler
1) Soldering
2) Cleaning
Avoid rise in the device temperature as much as possible by observing the following conditions.
a) Soldering lead directly (by solder header)
260˚C max, 10 second max, for once.
b) Reflow soldering
(1) Complete the reflow process for once within 30 second at a package surface temperature above 210°C.
(2) Atmospheric temperature close to mold body surface : 240˚C max, 10 second max
(3) Recommended temperature profile
c) Precautions for heating
(1) Soldering time has to be kept as short as possible.
(2) When using a halogen lamp or infrared heater, please do not irradiate the mold body surface directly.
d) Dip soldering (Flow soldering)
Reflow soldering is recommended, because thermal stress is much less than in other soldering methodes.
2–1) The following types of solvents are recommended for cleaning the flux.
Toshiba Technocare (FRW-1, FRW-17, FRW-100) Kao Cleanthru 750H
Asahi Clean AK-225AES Pine-alpha ST-100S
2–2) Cleaning Conditions
Cleaning conditions and precautions may differ depending on the product specifications.
When cleaning the flux, reactive ions such as Cl and Na must be removed.
a) General precautions on dip cleaning
Dipping time may differ depending on the solvent used.
However, as a general reference, it is recommended to limit the dip 3 minutes.
b) General precautions on ultrasonic cleaning
When ultrasonic cleaning is conducted for excessively long times, contact between product resin and
metal leads may lessen. Also, excessive ultrasonic stress may cause cracks in the pellet.
It is recommended to apply a minimum of stress.
Recommended condidtions for standard ultrasonic cleaning
Frequency : 27 to 29kHz Time : 30 seconds or less
Output : 0.25 W/ cm
2
or less Temperature : 50˚C (may differ depending on the solvent used)
Cleaning must be conducted in a condition in which the printed circuit board or device should be floating on
the solvent used in order to avoid direct contact with the ultrasonic vibrator.
2–3) Handling Precautions
During cleaning, or when cleaning liquid is being applied to a device, do not touch the device-marking
surface with hand or brush. Device markings may be erased.
It is necessary to confirm the safety of the solvent used for cleaning, as well as cleaning conditions,
so as not to harm the device package.
60 to 90 30
(°C)
times (s)
240
210
150
Contact Toshiba when you plan to use dip soldering.
37
1
0°C.
c
tly.
o
des.
g
on
k
ing
s
,
4–7
Safety Standard Approved Photocouplers and VDE0884-Approved Photocouplers
12
4
312
4
312
4
312
4
3 12
4
3
5
12
4
3
5
43
12
6.4
4.58
64
1
5
23
6.4
7.12
85
1
7
24
6
3
6.4
9.66
43
12
6.4
4.58
64
1
5
23
6.4
7.12
85
1
7
24
6
3
6.4
9.66 64
1
5
23
6.4
8.64
64
1
5
23
6.4
1.5
7.12
0.6 43
12
6.4
4.58
64
1
5
23
6.4
7.12 2.6
4.4
6.3
4.4
3.6
4.4
1
24 3
TLP181/TLP281
DE
V
Safety
Standard
Construction
(Cross-section)
Package
Dimensions
(Unit: mm)
TLP521-1
TLP531/532
TLP541G/545J
TLP550/551
TLP560G/561G
TLP620/-2/-4
TLP621/-2/-4
TLP750/751
TLP631/632
TLP641G/641J
TLP651
TLP30xx(S) Series
TLP731/732
TLP741G
TLP741J
TLP3022
TLP3052
TLP3042
TLP3062
TLP733/734
TLP747G
TLP747J
TLP762J
TLP763J
TLP121
TLP131
TLP112A
TLP115A
TLP180
TLP181
TLP280
TLP281
TLP127
TLP160G
TLP141G
TLP190B
TLP197G
TLP176G
TLP206G
TLP127
TLP176G
TLP197G
TLP206G
TLP227G
TLP227G-2
TLP250
TLP251
TLP597G
TLP227G
TLP227G-2
TLP597G
TLP176G
TLP197G
TLP206G
TLP620/-2/-4
TLP621/-2/-4
TLP627/-2/-4
TLP750/751/759
TLP30xx(S) Series
TLP731/732
TLP741G
TLP741J
TLP3022
TLP3052
TLP3042
TLP3062
TLP668JF
TLP798G
TLP733/734
TLP747G
TLP747J
TLP762J
TLP165J
TLP166J
TLP181
TLP280
TLP281
TLP620/-2/-4
TLP621/-2/-4
TLP624/-2/-4
TLP626/-2/-4
TLP627/-2/-4
TLP750/751
TLP731/732
TLP741G
TLP741J
TLP798G
TLP227G
TLP227G-2
TLP597G
TLP733/734
TLP747G
TLP747J
TLP762J
TLP763J
TLP180
TLP181
TLP280
TLP281
TLP180
TLP181
TLP280
TLP281
TLP127
TLP176G
TLP197G
TLP206G
TLP620/-2
TLP621/-2
TLP627/-2
TLP750/751/759
TLP30xx(S) Series
TLP733/734
TLP747G
TLP747J
TLP762J
TLP763J
(as of September 2000)
Body
Window
Detector
LED
Film
TLP798G
38
4–7
Safety Standard Approved Photocouplers and VDE0884-Approved Photocouplers
Note 1 : VDE0884 standards for MFSOP and SOP photocouplers are different from those of standard DIP photocouplers because MFSOP and
SOP are compact and small packages.
DE
V
G
E
P
R
U
F
T
B
A
U
A
R
T
12
4
312
4
3
12
4
3
1
24 3
1
24 3
4pin and Multichannel
Transistor Output
Thyristor Output
Triac Output
IC Output
Photorelay
Package
Isolation Creepage Path (mm)
Isolation Clearance (mm)
Isolation Thickness (mm)
Internal Creepage Path (mm)
Isolation V oltage (kVrms)
TLP181**/
TLP180
TLP160J/
TLP161J
TLP165J/
TLP166J
TLP131
TLP280/TLP281
TLP141G
TLP114A
—
—
—
—
—
—
—
—
—
—
—
—
—
——
—
—
—
—
—
TLP176G
TLP206G
2.54SOP
4.0
4.0
—
—
1.5
—
—
—
—
—
—
—
—
—
MFSOP MFSOPSOP
4.0
4.0
—
2.5
———
3.75
0.4 —
4.0
4.0
0.4
—
2.5
Internal
Construction
(Cross Section)
UL1577
(File No. E67349)
DIN
VDE 0884/08.87
DIN IEC65/
VDE 0860/08.81
DIN IEC380/
VDE 0806/08.81
DIN IEC435/
VDE 0805/08.79
DIN57 804
VDE 0804/01.83
DIN57 700T1/
VDE 0700T1/2.81
DIN IEC601T1/
VDE 0750T1/05.82
BS EN60065: 1994
BS EN60950: 1992
BS6301: 1989
SEMKO
SS-EN60950
Body
Window
Detector
LED
Film
—
Safety
Standard
Approved
ELV
satisfied
SELV
satisfied
Device Type
Construction
Mechanical
Ratings
(min)
Parts
Specifica-
tions
Double
Protection
Home
Appliances
Home
Appliances
Home
Appliances
Office
Equipment
Office
Equipment
Telecom-
munications
Networks
Office
Equipment
Medical
Equipment
Data pro-
cessing
Equipment
Data pro-
cessing
Equipment
Parts
Specifica-
tions
(Note 1) (Note 1)
**: Only applied for TLP181
**
39
r
s
P
and
12
4
—
—
—
—
—
176G
206G
4
SOP
4
.0
4
.0
—
—
.5
—
T
LP181 Note 2: 8.0 for (LF2) or F type. Note 3: VDE0884-approved with option (D4).
Note 4: TLP621 / 620 / 627 / 750 / 751 are approved. TOSHIBA recommend TLP621 rather than TLP721 for your new designing.
*: Only applied for TLP621
4pin and Multichannel
Transistor Output
Thyristor Output
Triac Output
IC Output
Photorelay
Package
Isolation Creepage Path (mm)
Isolation Clearance (mm)
Isolation Thickness (mm)
Internal Creepage Path (mm)
Isolation V oltage (kVrms)
DE
V
G
E
P
R
U
F
T
B
A
U
A
R
T
12
4
3 12
4
3
5
12
4
3
5
Device Type
Construction
Mechanical
Ratings
(min)
TLP624/626
TLP621*/
620/627
TLP741G/
TLP747J
TLP3022F/3052F
TLP3042F/3062F
TLP747G
/
TLP747J TLP762J
/
TLP763J
TLP733/734
TLP421
TLP731/732
TLP750
/
TLP751
—
—
—
—
—
—
—
—
——
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
DIPDIP
7.0
8.0
(Note 2)
7.0
8.0
(Note 2)
7.0
8.0
(Note 2)
DIP
6.4
6.4
0.4
—
5.0
DIP
0.5
—
4.0 5.04.0
0.5 0.4
—
5.0
4.0
0.4
UL1577
(File No. E67349)
DIN
VDE 0884/08.87
DIN IEC65/
VDE 0860/08.81
DIN IEC380/
VDE 0806/08.81
DIN IEC435/
VDE 0805/08.79
DIN57 804
VDE 0804/01.83
DIN57 700T1/
VDE 0700T1/2.81
DIN IEC601T1/
VDE 0750T1/05.82
BS EN60065: 1994
BS EN60950: 1992
BS6301: 1989
SEMKO
SS-EN60950
Safety
Standard
Approved
ELV
satisfied
SELV
satisfied
Internal
Construction
(Cross Section)
Parts
Specifica-
tions
Double
Protection
Home
Appliances
Home
Appliances
Home
Appliances
Office
Equipment
Office
Equipment
Telecom-
munications
Networks
Office
Equipment
Medical
Equipment
Data pro-
cessing
Equipment
Data pro-
cessing
Equipment
Parts
Specifica-
tions
Body
Window
Detector
LED
Film
*
(Note 3)
(Note 3)
(Note 3) (TUV)
(Note 3)
(Note 4)
1
24 3
—
—
—
—
—
