RELIABILITY TESTING
6
7
8
Type
1
2
3
4
5
Operating
temperature
range
Storage
temperature
range
Solderability
Resistance
to soldering
Thermal shock
Loading at
low
temperature
Loading at
high
temperature
Loading
under
Damp Heat
Item Specified value
-40to+125
-10to+40
At least 90% of terminal electrode
is covered by new solder
Appearance:
No significant abnormality.
At least 75% of terminal electrode
is covered by new solder
Impedance change: within 20%
Inductor change: within 10%
Appearance:
No significant abnormality.
Impedance change: within 30%
Inductor change: within 10%
Q value change(ferrite):within 30%
Q value change(ceramic):within 20%
Appearance:
No significant abnormality.
Impedance change: within 20%
Inductor change: within 10%
Appearance:
No significant abnormality.
Impedance change: within 30%
Inductor change: within 10%
Q value change(ferrite):within 30%
Q value change(ceramic):within 20%
Appearance:
No significant abnormality.
Impedance change: within 30%
Inductor change : within 10%
Q value change(ferrite):within 30%
Q value change(ceramic):within 20%
Test methods
Solder temperature: 230 5
Duration: 4 1S
Preheating temperature: 120 to 150
Preheating time: 60S
immersion into the colophony flux for 3 to 5 sec.
Flux: immersion into methanol solution with colophony
for3to5sec.
Immersion speed: 25mm/sec
Solder temperature: 260 5
Duration: 10 0.5S
Preheating temperature: 120 to 150
Preheating time: 60S
immersion into the colophony flux for 3 to 5 sec.
Flux: immersion into methanol solution with colophony
for3to5sec.
Immersion speed: 25mm/sec
Temperature: -40 for 30 3min
+85 for 30 3min
Transforming interval :max 20 sec
Number of cycles: 32
Temperature: -55 2
Duration: 500 hrs
Temperature: 85 2
Duration: 1000 hrs
Applied current: Rated current
Temperature: 55 2
Duration: 500 hrs
Humidity: 90 to 95%RH
Applied current: Rated current
RELIABILITY TESTING
24
0
+
-
24
0
+
-
24
0
+
-
A