TPS65023-Q1
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SLVS927D MARCH 2009REVISED SEPTEMBER 2011
POWER MANAGEMENT IC FOR LI-ION POWERED SYSTEMS
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1FEATURES
23Qualified for Automotive Applications Separate Enable Pins for Inductive Converters
1.5 A, 90% Efficient Step-Down Converter for I2CCompatible Serial Interface
Processor Core (VDCDC1) 85-μA Quiescent Current
1.2 A, Up to 95% Efficient Step-Down Low Ripple PFM Mode
Converter for System Voltage (VDCDC2) Thermal Shutdown Protection
1.0 A, 92% Efficient Step-Down Converter for 40-Pin 5-mmx5-mm QFN (RSB) or
Memory Voltage (VDCDC3) 6-mmx6-mm QFN (RHA) Package
30 mA LDO/Switch for Real Time Clock (VRTC)
2×200 mA General-Purpose LDO APPLICATIONS
Dynamic Voltage Management for Processor Digital Media Players
Core Internet Audio Player
Preselectable LDO Voltage Using Two Digital Digital Still Camera
Input Pins Digital Radio Player
Externally Adjustable Reset Delay Time Supply DaVinciDSP Family Solutions
Battery Backup Functionality
DESCRIPTION
The TPS65023 is an integrated Power Management IC for applications powered by one Li-Ion or Li-Polymer cell,
and which require multiple power rails. The TPS65023 provides three highly efficient, step-down converters
targeted at providing the core voltage, peripheral, I/O and memory rails in a processor based system. The core
converter allows for on-the-fly voltage changes via serial interface, allowing the system to implement dynamic
power savings. All three step-down converters enter a low-power mode at light load for maximum efficiency
across the widest possible range of load currents. The TPS65023 also integrates two general-purpose 200 mA
LDO voltage regulators, which are enabled with an external input pin. Each LDO operates with an input voltage
range between 1.5 V and 6.5 V, allowing them to be supplied from one of the step-down converters or directly
from the battery. The default output voltage of the LDOs can be digitally set to 4 different voltage combinations
using the DEFLDO1 and DEFLDO2 pins. The serial interface can be used for dynamic voltage scaling, masking
interrupts, or for dis/enabling and setting the LDO output voltages. The interface is compatible with the
Fast/Standard mode I2C specification, allowing transfers at up to 400 kHz. The TPS65023 is available in 40-pin
QFN packages (RHA and RSB), and operates over a free-air temperature of 40°C to 125°C.
ORDERING INFORMATION(1)
TAPACKAGE(2) ORDERABLE PART NUMBER TOP-SIDE MARKING
QFN RSB Reel of 3000 TPS65023QRSBRQ1 TPS65023Q
40°C to 125°CQFN RHA Reel of 2500 TPS65023QRHARQ1 65023QRHA
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2DaVinci, PowerPAD are trademarks of Texas Instruments.
3I2C is a trademark of Philips Electronics.
PRODUCTION DATA information is current as of publication date. Copyright ©20092011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TPS65023-Q1
SLVS927D MARCH 2009REVISED SEPTEMBER 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
VIInput voltage range on all pins except AGND and PGND pins with respect to AGND 0.3 V to 7 V
Current at VINDCDC1, L1, PGND1, VINDCDC2, L2, PGND2, VINDCDC3, L3, PGND3 2000 mA
Peak current at all other pins 1000 mA
Continuous total power dissipation See Dissipation Rating Table
TAOperating free-air temperature 40°C to 125°C
TJMaximum junction temperature 125°C
Tstg Storage temperature 65°C to 150°C
Human-body model (HBM) 2000 V
RHA package Machine model (MM) 50 V
Charged-device model (CDM) 750 V
ESD Electrostatic discharge protection Human-body model (HBM) 2000 V
RSB package Machine model (MM) 100 V
Charged-device model (CDM) 1000 V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability
THERMAL INFORMATION TPS65023-Q1
THERMAL METRIC(1) RHA UNITS
40 PINS
θJA Junction-to-ambient thermal resistance 31.6
θJCtop Junction-to-case (top) thermal resistance 18.2
θJB Junction-to-board thermal resistance 6.6 °C/W
ψJT Junction-to-top characterization parameter 0.2
ψJB Junction-to-board characterization parameter 6.5
θJCbot Junction-to-case (bottom) thermal resistance 1.7
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
DISSIPATION RATINGS THERMAL RESISTANCE,
TA25°C TA= 70°C TA= 85°C
PACKAGE JUNCTION TO AMBIENT
POWER RATING POWER RATING POWER RATING
(RθJA)
RSB(1) 2.65 W 39°C/W 1.41 W 1.025 W
RHA(2) 3.175 W 31.5°C/W 1.746 W 1.269 W
(1) The thermal resistance, junction-to-ambient (RθJA), of the RSB package is 39°C/W measured on a high-K board.
(2) The thermal resistance, junction-to-ambient (RθJA), of the RHA package is 31.5°C/W measured on a high-K board.
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RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT
Input voltage range step-down converters
VCC 2.5 6 V
(VINDCDC1, VINDCDC2, VINDCDC3)
Output voltage range for VDCDC1 step-down converter(1) 0.6 VINDCDC1
VOOutput voltage range for VDCDC2 step-down converter(1) 0.6 VINDCDC2 V
Output voltage range for VDCDC3 step-down converter(1) 0.6 VINDCDC3
VIInput voltage range for LDOs (VINLDO1, VINLDO2) 1.5 6.5 V
VOOutput voltage range for LDOs (VLDO1, VLDO2) 1 VINLDO1-2 V
IO(DCDC1) Output current at L1 1500 mA
Inductor at L1(2) 1.5 2.2 μH
CI(DCDC1) Input capacitor at VINDCDC1 (2) 10 μF
CO(DCDC1) Output capacitor at VDCDC1 (2) 10 22 μF
IO(DCDC2) Output current at L2 1200 mA
Inductor at L2 (2) 1.5 2.2 μH
CI(DCDC2) Input capacitor at VINDCDC2 (2) 10 μF
CO(DCDC2) Output capacitor at VDCDC2 (2) 10 22 μF
IO(DCDC3) Output current at L3 1000 mA
Inductor at L3 (2) 1.5 2.2 μH
CI(DCDC3) Input capacitor at VINDCDC3(2) 10 μF
CO(DCDC3) Output capacitor at VDCDC3 (2) 10 22 μF
CI(VCC) Input capacitor at VCC (2) 1μF
Ci(VINLDO) Input capacitor at VINLDO (2) 1μF
CO(VLDO1-2) Output capacitor at VLDO1, VLDO2 (2) 2.2 μF
IO(VLDO1-2) Output current at VLDO1, VLDO2 200 mA
CO(VRTC) Output capacitor at VRTC (2) 4.7 μF
TAOperating ambient temperature 40 125 °C
TJOperating junction temperature 40 125 °C
Resistor from VINDCDC3, VINDCDC2, VINDCDC1 to VCC used for filtering(3) 1 10
(1) When using an external resistor divider at DEFDCDC3, DEFDCDC2, DEFDCDC1
(2) See Applications Information section for more information.
(3) Up to 3 mA can flow into VCC when all three converters are running in PWM. This resistor causes the UVLO threshold to be shifted
accordingly.
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ELECTRICAL CHARACTERISTICS
VINDCDC1 = VINDCDC2 = VINDCDC3 = VCC = VINLDO = 3.6 V, VBACKUP = 3 V, TA=40°C to 125°C, typical values are
at TA= 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
CONTROL SIGNALS : SCLK, SDAT (input), DCDC1_EN, DCDC2_EN, DCDC3_EN, LDO_EN, DEFLDO1, DEFLDO2
Resistor pullup at SCLK and SDAT = 4.7 k,
VIH High level input voltage 1.3 VCC V
pulled to VRTC
Resistor pullup at SCLK and SDAT = 4.7 k,
VIH High level input voltage, SDAT 1.45 VCC V
pulled to VRTC
Resistor pullup at SCLK and SDAT = 4.7 k,
VIL Low level input voltage 0 0.4 V
pulled to VRTC
IHInput bias current 0.01 0.1 μA
CONTROL SIGNALS : HOT_RESET
VIH High-level input voltage 1.3 VCC V
VIL Low-level input voltage 0 0.4 V
IIB Input bias current 0.01 0.1 μA
tglitch Deglitch time at HOT_RESET 25 30 35 ms
CONTROL SIGNALS : LOWBAT, PWRFAIL, RESPWRON, INT, SDAT (output)
VOH High-level output voltage 6 V
VOL Low-level output voltage IIL = 5 mA 0 0.3 V
Duration of low pulse at RESPWRON External capacitor 1 nF 100 ms
VRTC falling 3% 2.4 +3%
Reset power-on threshold V
VRTC rising 3% 2.52 +3%
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SLVS927D MARCH 2009REVISED SEPTEMBER 2011
ELECTRICAL CHARACTERISTICS
VINDCDC1 = VINDCDC2 = VINDCDC3 = VCC = VINLDO = 3.6 V, VBACKUP = 3 V, TA=40°C to 125°C, typical values are
at TA= 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY PINS: VCC, VINDCDC1, VINDCDC2, VINDCDC3
All three dc-dc converters enabled, VCC = 3.6 V, VBACKUP = 3 V,
zero load, and no switching, LDOs 85 100
V(VSYSIN) = 0 V
enabled
All three dc-dc converters enabled, VCC = 3.6 V, VBACKUP = 3 V,
zero load, and no switching, LDOs 78 90
V(VSYSIN) = 0 V
Operating quiescent off
I(q) μA
current, PFM DCDC1 and DCDC2 converters VCC = 3.6 V, VBACKUP = 3 V,
enabled, zero load, and no 57 70
V(VSYSIN) = 0 V
switching, LDOs off
DCDC1 converter enabled, zero VCC = 3.6 V, VBACKUP = 3 V, 43 55
load, and no switching, LDOs off V(VSYSIN) = 0 V
All three dc-dc converters enabled VCC = 3.6 V, VBACKUP = 3 V, 2 3
and running in PWM, LDOs off V(VSYSIN) = 0 V
DCDC1 and DCDC2 converters
Current into VCC, VCC = 3.6 V, VBACKUP = 3 V,
IIenabled and running in PWM, 1.5 2.5 mA
PWM V(VSYSIN) = 0 V
LDOs off
DCDC1 converter enabled and VCC = 3.6 V, VBACKUP = 3 V, 0.85 2
running in PWM, LDOs off V(VSYSIN) = 0 V
VCC = 3.6 V, VBACKUP = 3 V, 23 33 μA
V(VSYSIN) = 0 V
VCC = 2.6 V, VBACKUP = 3 V,
I(q) Quiescent current All converters disabled, LDOs off 3.5 5 μA
V(VSYSIN) = 0 V
VCC = 3.6 V, VBACKUP = 0 V, 43 μA
V(VSYSIN) = 0 V
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ELECTRICAL CHARACTERISTICS
VINDCDC1 = VINDCDC2 = VINDCDC3 = VCC = VINLDO = 3.6 V, VBACKUP = 3 V, TA=40°C to 125°C, typical values are
at TA= 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY PINS: VBACKUP, VSYSIN, VRTC
VBACKUP = 3 V, VSYSIN = 0 V,
I(q) Operating quiescent current 20 33 μA
VCC = 2.6 V, current into VBACKUP
VBACKUP <V_VBACKUP, current into
I(SD) Operating quiescent current 2 3 μA
VBACKUP
VRTC LDO output voltage VSYSIN = VBACKUP = 0 V, IO= 0 mA 3 V
IOOutput current for VRTC VSYSIN <2.57 V and VBACKUP <2.57 V 30 mA
VRTC short-circuit current limit VRTC = GND, VSYSIN = VBACKUP = 0 V 100 mA
Maximum output current at VRTC for VRTC >2.6 V, VCC = 3 V, 30 mA
RESPWRON = 1 VSYSIN = VBACKUP = 0 V
VOOutput voltage accuracy for VRTC VSYSIN = VBACKUP = 0 V, IO= 0 mA 1% 1%
Line regulation for VRTC VCC = VRTC + 0.5 V to 6.5 V, IO= 5 mA 1% 1%
IO= 1 mA to 30 mA,
Load regulation VRTC 3% 1%
VSYSIN = VBACKUP = 0 V
Regulation time for VRTC Load change from 10% to 90% 10 μs
Ilkg Input leakage current at VSYSIN VSYSIN <V_VSYSIN 2 μA
rDS(on) of VSYSIN switch 12.5
rDS(on) of VBACKUP switch 12.5
Input voltage range at VBACKUP(1) 2.73 3.75 V
Input voltage range at VSYSIN(1) 2.73 3.75 V
VSYSIN threshold VSYSIN falling 3% 2.55 3% V
VSYSIN threshold VSYSIN rising 3% 2.65 3% V
VBACKUP threshold VBACKUP falling 3% 2.55 3% V
VBACKUP threshold VBACKUP falling 3% 2.65 3% V
SUPPLY PIN: VINLDO
I(q) Operating quiescent current Current per LDO into VINLDO 16 30 μA
Total current for both LDOs into VINLDO,
I(SD) Shutdown current 0.1 1 μA
VLDO = 0 V
(1) Based on the requirements for the Intel PXA270 processor.
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SLVS927D MARCH 2009REVISED SEPTEMBER 2011
ELECTRICAL CHARACTERISTICS
VINDCDC1 = VINDCDC2 = VINDCDC3 = VCC = VINLDO = 3.6 V, VBACKUP = 3 V, TA=40°C to 125°C, typical values are
at TA= 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VDCDC1 STEP-DOWN CONVERTER
VIInput voltage range, VINDCDC1 2.5 6 V
IOMaximum output current 1500 mA
I(SD) Shutdown supply current in VINDCDC1 DCDC1_EN = GND 0.1 1 μA
rDS(on) P-channel MOSFET on-resistance VINDCDC1 = V(GS) = 3.6 V 125 261 m
Ilkg P-channel leakage current VINDCDC1 = 6 V 2 μA
rDS(on) N-channel MOSFET on-resistance VINDCDC1 = V(GS) = 3.6 V 130 260 m
Ilkg N-channel leakage current V(DS) = 6 V 7 10 μA
Forward current limit 2.5 V <VI(MAIN) <6 V 1.9 2.19 2.6 A
(P-channel and N-channel)
fSOscillator frequency 1.95 2.25 2.55 MHz
Fixed output voltage VINDCDC1 = 2.5 V to 6 V, 2 2
FPWMDCDC1=0 0 mA IO1.5 A
All VDCDC1 %
Fixed output voltage VINDCDC1 = 2.5 V to 6 V, 1 1
FPWMDCDC1=1 0 mA IO1.5 A
Adjustable output voltage with resistor VINDCDC1 = VDCDC1 + 0.3 V (min 2.5 V) 2 2 %
divider at DEFDCDC1, FPWMDCDC1=0 to 6 V, 0 mA IO1.2 A
Adjustable output voltage with resistor VINDCDC1 = VDCDC1 + 0.3 V (min 2.5 V) 1 1 %
divider at DEFDCDC1, FPWMDCDC1=1 to 6 V, 0 mA IO1.2 A
VINDCDC1 = VDCDC1 + 0.3 V (min. 2.5 V)
Line Regulation 0 %/V
to 6 V, IO= 10 mA
Load Regulation IO= 10 mA to 1200 mA 0.25 %/A
VDCDC1 ramping from 5% to 95% of target
Soft start ramp time 750 μs
value
Internal resistance from L1 to GND 1 M
VDCDC1 discharge resistance DCDC1 discharge = 1 300
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ELECTRICAL CHARACTERISTICS
VINDCDC1 = VINDCDC2 = VINDCDC3 = VCC = VINLDO = 3.6 V, VBACKUP = 3 V, TA=40°C to 125°C, typical values are
at TA= 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VDCDC2 STEP-DOWN CONVERTER
VIInput voltage range, VINDCDC2 2.5 6 V
DEFDCDC2 = GND 1200
IOMaximum output current mA
VINDCDC2 = 3.6 V, 1000
3.3 V - 1% VDCDC2 3.3 V + 1%
I(SD) Shutdown supply current in VINDCDC2 DCDC2_EN = GND 0.1 1 μA
rDS(on) P-channel MOSFET on-resistance VINDCDC2 = V(GS) = 3.6 V 140 300 m
Ilkg P-channel leakage current VINDCDC2 = 6 V 2 μA
rDS(on) N-channel MOSFET on-resistance VINDCDC2 = V(GS) = 3.6 V 150 297 m
Ilkg N-channel leakage current V(DS) = 6 V 7 10 μA
Forward current limit
ILIMF 2.5 V <VINDCDC2 <6 V 1.7 1.94 2.2 A
(P-channel and N-channel)
fSOscillator frequency 1.95 2.25 2.55 MHz
VINDCDC2 = 2.5 V to 6 V,
VDCDC2 = 1.8 V 2 2
0 mA IO1.2 A
Fixed output voltage %
FPWMDCDC2=0 VINDCDC2 = 3.7 V to 6 V,
VDCDC2 = 3.3 V 1 1
0 mA IO1.2 A
VINDCDC2 = 2.5 V to 6 V,
VDCDC2 = 1.8 V 2 2
0 mA IO1.2 A
Fixed output voltage %
FPWMDCDC2=1 VINDCDC2 = 3.7 V to 6 V,
VDCDC2 = 3.3 V 1 1
0 mA IO1.2 A
Adjustable output voltage with resistor VINDCDC2 = VDCDC2 + 0.3 V (min 2.5 V) 2% 2%
divider at DEFDCDC2 FPWMDCDC2=0 to 6 V, 0 mA IO1 A
Adjustable output voltage with resistor VINDCDC2 = VDCDC2 + 0.3 V (min 2.5 V) 1% 1%
divider at DEFDCDC2, FPWMDCDC2=1 to 6 V, 0 mA IO1 A
VINDCDC2 = VDCDC2 + 0.3 V (min. 2.5 V)
Line Regulation 0 %/V
to 6 V, IO= 10 mA
Load Regulation IO= 10 mA to 1000 mA 0.25 %/A
VDCDC2 ramping from 5% to 95% of target
Soft start ramp time 750 μs
value
Internal resistance from L2 to GND 1 M
VDCDC2 discharge resistance DCDC2 discharge =1 300
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SLVS927D MARCH 2009REVISED SEPTEMBER 2011
ELECTRICAL CHARACTERISTICS
VINDCDC1 = VINDCDC2 = VINDCDC3 = VCC = VINLDO = 3.6 V, VBACKUP = 3 V, TA=40°C to 125°C, typical values are
at TA= 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VDCDC3 STEP-DOWN CONVERTER
VIInput voltage range, VINDCDC3 2.5 6 V
DEFDCDC3 = GND 1000
IOMaximum output current mA
VINDCDC3 = 3.6 V, 525
3.3 V - 1% VDCDC3 3.3 V + 1%
I(SD) Shutdown supply current in VINDCDC3 DCDC3_EN = GND 0.1 1 μA
rDS(on) P-channel MOSFET on-resistance VINDCDC3 = V(GS) = 3.6 V 310 698 m
Ilkg P-channel leakage current VINDCDC3 = 6 V 0.1 2 μA
rDS(on) N-channel MOSFET on-resistance VINDCDC3 = V(GS) = 3.6 V 220 503 m
Ilkg N-channel leakage current V(DS) = 6 V 7 10 μA
Forward current limit (P-channel and 2.5 V <VINDCDC3 <6 V 1.28 1.49 1.69 A
N-channel)
fSOscillator frequency 1.95 2.25 2.55 MHz
VINDCDC3 = 2.5 V to 6 V,
VDCDC3 = 1.8 V 2 2
0 mA IO1 A
Fixed output voltage %
FPWMDCDC3=0 VINDCDC3 = 3.6 V to 6 V,
VDCDC3 = 3.3 V 1 1
0 mA IO1 A
VINDCDC3 = 2.5 V to 6 V,
VDCDC3 = 1.8 V 2 2
0 mA IO1 A
Fixed output voltage %
FPWMDCDC3=1 VINDCDC3 = 3.6 V to 6 V,
VDCDC3 = 3.3 V 1 1
0 mA IO1 A
Adjustable output voltage with resistor VINDCDC3 = VDCDC3 + 0.5 V (min 2.5 V) 2% 2%
divider at DEFDCDC3 FPWMDCDC3=0 to 6 V, 0 mA IO800 mA
Adjustable output voltage with resistor VINDCDC3 = VDCDC3 + 0.5 V (min 2.5 V) 1% 1%
divider at DEFDCDC3, FPWMDCDC3=1 to 6 V, 0 mA IO800 mA
VINDCDC3 = VDCDC3 + 0.3 V (min. 2.5 V)
Line Regulation 0 %/V
to 6 V, IO= 10 mA
Load Regulation IO= 10 mA to 1000 mA 0.25 %/A
VDCDC3 ramping from 5% to 95% of target
Soft start ramp time 750 μs
value
Internal resistance from L3 to GND 1 M
VDCDC3 discharge resistance DCDC3 discharge =1 300
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ELECTRICAL CHARACTERISTICS
VINDCDC1 = VINDCDC2 = VINDCDC3 = VCC = VINLDO = 3.6 V, VBACKUP = 3 V, TA=40°C to 125°C, typical values are
at TA= 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VLDO1 and VLDO2 LOW DROPOUT REGULATORS
VIInput voltage range for LDO1, 2 1.5 6.5 V
VO(LD01) LDO1 output voltage range 1 3.15 V
VO(LDO2) LDO2 output voltage range 1 3.3 V
VI= 1.8 V, VO= 1.3 V 200
Maximum output current for LDO1,
IOmA
LDO2 VI= 1.5 V, VO= 1.3 V 120
LDO1 and LDO2 short circuit
I(SC) V(LDO1) = GND, V(LDO2) = GND 400 mA
current limit IO= 50 mA, VINLDO = 1.8 V 120
Minimum voltage drop at LDO1, IO= 50 mA, VINLDO = 1.5 V 65 150 mV
LDO2 IO= 200 mA, VINLDO = 1.8 V 300
Output voltage accuracy for LDO1, IO= 10 mA 2% 1%
LDO2 VINLDO1, 2 = VLDO1,2 + 0.5 V
Line regulation for LDO1, LDO2 1% 1%
(min. 2.5 V) to 6.5 V, IO= 10 mA
Load regulation for LDO1, LDO2 IO= 0 mA to 50 mA 1% 1%
Regulation time for LDO1, LDO2 Load change from 10% to 90% 10 μs
ANALOG SIGNALS DEFDCDC1, DEFDCDC2, DEFDCDC3
VIH High-level input voltage 1.3 VCC V
VIL Low-level input voltage 0 0.1 V
Input bias current 0.001 0.05 μA
THERMAL SHUTDOWN
T(SD) Thermal shutdown Increasing junction temperature 160 °C
Thermal shutdown hysteresis Decreasing junction temperature 20 °C
INTERNAL UNDERVOLTAGE LOCK OUT
UVLO Internal UVLO VCC falling 2% 2.35 2% V
Internal UVLO comparator
V(UVLO_HYST) 120 mV
hysteresis
VOLTAGE DETECTOR COMPARATORS
Comparator threshold Falling threshold 2% 1 2% V
(PWRFAIL_SNS, LOWBAT_SNS)
Hysteresis 40 50 60 mV
Propagation delay 25-mV overdrive 10 μs
POWER GOOD
VDCDC1, VDCDC2, VDCDC3, VLDO1,
V(PGOODF) 12% 10% 8%
VLDO2, decreasing
VDCDC1, VDCDC2, VDCDC3, VLDO1,
V(PGOODR) 7% 5% 3%
VLDO2, increasing
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1
2
3
4
5
6
7
8
9
10
30
29
28
27
26
25
24
23
22
21
11 12 13 14 15 16 17 18 19 20
40 39 38 37 36 35 34 33 32 31
DEFDCDC3
VDCDC3
PGND3
L3
VINDCDC3
VINDCDC1
L1
PGND1
VDCDC1
DEFDCDC1
HOT_RESET
DEFLDO1
DEFLDO2
VSYSIN
VBACKUP
VRTC
AGND2
VINLDO
VLDO1
VLDO2
SCLK
SDAT
INT
RESPWRON
TRESPWRON
DCDC1_EN
DCDC2_EN
DCDC3_EN
LDO_EN
LOWBAT
AGND1
LOWBAT_SNS
PWRFAIL_SNS
VCC
VINDCDC2
L2
PGND2
VDCDC2
DEFDCDC2
PWRFAIL
TPS65023-Q1
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PIN ASSIGNMENT
(TOP VIEW)
TERMINAL FUNCTIONS
TERMINAL I/O DESCRIPTION
NAME NO.
SWITCHING REGULATOR SECTION
AGND1 40 Analog ground. All analog ground pins are connected internally on the chip.
AGND2 17 Analog ground. All analog ground pins are connected internally on the chip.
PowerPAD Connect the exposed thermal pad to analog ground.
Input voltage for VDCDC1 step-down converter. VINDCDC1 must be connected to the same voltage
VINDCDC1 6 I supply as VINDCDC2, VINDCDC3, and VCC.
L1 7 Switch pin of VDCDC1 converter. The VDCDC1 inductor is connected here.
VDCDC1 9 I VDCDC1 feedback voltage sense input. Connect directly to VDCDC1
PGND1 8 Power ground for VDCDC1 converter.
Input voltage for VDCDC2 step-down converter. VINDCDC2 must be connected to the same voltage
VINDCDC2 36 I supply as VINDCDC1, VINDCDC3, and VCC.
L2 35 Switch pin of VDCDC2 converter. The VDCDC2 inductor is connected here.
VDCDC2 33 I VDCDC2 feedback voltage sense input. Connect directly to VDCDC2
PGND2 34 Power ground for VDCDC2 converter
Input voltage for VDCDC3 step-down converter. VINDCDC3 must be connected to the same voltage
VINDCDC3 5 I supply as VINDCDC1, VINDCDC2, and VCC.
L3 4 Switch pin of VDCDC3 converter. The VDCDC3 inductor is connected here.
VDCDC3 2 I VDCDC3 feedback voltage sense input. Connect directly to VDCDC3
PGND3 3 Power ground for VDCDC3 converter.
Copyright ©20092011, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Link(s): TPS65023-Q1
TPS65023-Q1
SLVS927D MARCH 2009REVISED SEPTEMBER 2011
www.ti.com
TERMINAL FUNCTIONS (continued)
TERMINAL I/O DESCRIPTION
NAME NO.
Power supply for digital and analog circuitry of VDCDC1, VDCDC2, and VDCDC3 dc-dc converters.
VCC 37 I VCC must be connected to the same voltage supply as VINDCDC3, VINDCDC1, and VINDCDC2.
VCC also supplies serial interface block.
Input signal indicating default VDCDC1 voltage, 0 = 1.2 V, 1 = 1.6 V DEFDCDC1 can also be
DEFDCDC1 10 I connected to a resistor divider between VDCDC1 and GND, if the output voltage of the DCDC1
converter is set in a range from 0.6 V to VINDCDC1 V.
Input signal indicating default VDCDC2 voltage, 0 = 1.8 V, 1 = 3.3 V DEFDCDC2 can also be
DEFDCDC2 32 I connected to a resistor divider between VDCDC2 and GND, if the output voltage of the DCDC2
converter is set in a range from 0.6 V to VINDCDC2 V.
Input signal indicating default VDCDC3 voltage, 0 = 1.8 V, 1 = 3.3 V DEFDCDC3 can also be
DEFDCDC3 1 I connected to a resistor divider between VDCDC3 and GND, if the output voltage of the DCDC3
converter is set in a range from 0.6 V to VINDCDC3 V.
DCDC1_EN 25 I VDCDC1 enable pin. A logic high enables the regulator, a logic low disables the regulator.
DCDC2_EN 24 I VDCDC2 enable pin. A logic high enables the regulator, a logic low disables the regulator.
DCDC3_EN 23 I VDCDC3 enable pin. A logic high enables the regulator, a logic low disables the regulator.
LDO REGULATOR SECTION
VINLDO 19 I Input voltage for LDO1 and LDO2
VLDO1 20 O Output voltage of LDO1
VLDO2 18 O Output voltage of LDO2
LDO_EN 22 I Enable input for LDO1 and LDO2. A Logic high enables the LDOs, a logic low disables the LDOs.
VBACKUP 15 I Connect the backup battery to this input pin.
VRTC 16 O Output voltage of the LDO/switch for the real time clock.
VSYSIN 14 I Input of system voltage for VRTC switch.
DEFLD01 12 I Digital input. DEFLD01 sets the default output voltage of LDO1 and LDO2.
DEFLD02 13 I Digital input. DEFLD02 sets the default output voltage of LDO1 and LDO2.
CONTROL AND I2C SECTION
HOT_RESET 11 I Push button input that reboots or wakes up the processor via RESPWRON output pin.
TRESPWRON 26 I Connect the timing capacitor to TRESPWRON to set the reset delay time: 1 nF 100 ms.
RESPWRON 27 O Open drain system reset output.
PWRFAIL 31 O Open drain output. Active low when PWRFAIL comparator indicates low VBAT condition.
LOW_BAT 21 O Open drain output of LOW_BAT comparator.
INT 28 O Open drain output
SCLK 30 I Serial interface clock line
SDAT 29 I/O Serial interface data/address
PWRFAIL_SNS 38 I Input for the comparator driving the PWRFAIL output.
LOWBAT_SNS 39 I Input for the comparator driving the LOW_BAT output.
12 Submit Documentation Feedback Copyright ©20092011, Texas Instruments Incorporated
Product Folder Link(s): TPS65023-Q1
TPS65023
LOW_BATT
VCC
HOT_RESET
INT
RESPWRON
VINDCDC1
DCDC1_EN
PWRFAIL
BBAT
SWITCH
SerialInterface
CONTROL
UVLO
VREF
OSC
Thermal
Shutdown
DCDC1
BuckConverter
1500mA
DCDC2
BuckConverter
1200mA
DCDC3
BuckConverter
1000mA
LDO1
200mA
LDO2
200mA
Dynamic
Voltage
Management
VSYSIN
VBACKUP
VRTC
SCLK
SDAT
DCDC2_EN
DCDC3_EN
LDO_EN
LOWBAT_SNS
PWRFAIL_SNS
TRESPWRON
DEFLDO1
DEFLDO2
L1
VDCDC1
DEFDCDC1
PGND1
VINDCDC2
L2
VDCDC2
DEFDCDC2
PGND2
VINDCDC3
L3
VDCDC3
DEFDCDC3
PGND3
AGND1
VLDO1
AGND2
VINLDO
VLDO2
TPS65023-Q1
www.ti.com
SLVS927D MARCH 2009REVISED SEPTEMBER 2011
FUNCTIONAL BLOCK DIAGRAM
Copyright ©20092011, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Link(s): TPS65023-Q1
0
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100 1k 10k
I -OutputCurrent-mA
O
Efficiency-%
T =25°C
V =1.2V
PWM/PFMMode
A
O
V =4.2V
I
V =2.5V
I
V =3.6V
I
V =5V
I
0
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100 1k 10k
I -OutputCurrent-mA
O
Efficiency-%
T =25°C
V =1.2V
PWMMode
A
O
V =4.2V
I
V =2.5V
I
V =3.6V
I
V =5V
I
TPS65023-Q1
SLVS927D MARCH 2009REVISED SEPTEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS
Graphs were taken using the EVM with the following inductor/output capacitor combinations:
CONVERTER INDUCTOR OUTPUT CAPACITOR OUTPUT CAPACITOR VALUE
VDCDC1 VLCF4020-2R2 C2012X5R0J106M 2 ×10 μF
VDCDC2 VLCF4020-2R2 C2012X5R0J106M 2 ×10 μF
VDCDC3 VLF4012AT-2R2M1R5 C2012X5R0J106M 2 ×10 μF
Table 1. Table of Graphs
FIGURE
ηEfficiency vs Output current 1, 2, 3, 4, 5, 6
Output voltage vs Output current @ 85°C 7, 8
Line transient response 9, 10, 11
Load transient response 12, 13, 14
VDCDC2 PFM operation 15
VDCDC2 low ripple PFM operation 16
VDCDC2 PWM operation 17
Startup VDCDC1, VDCDC2 and VDCDC3 18
Startup LDO1 and LDO2 19
Line transient response 20, 21, 22
Load transient response 23, 24, 25
DCDC1: EFFICIENCY DCDC1: EFFICIENCY
vs vs
OUTPUT CURRENT OUTPUT CURRENT
Figure 1. Figure 2.
14 Submit Documentation Feedback Copyright ©20092011, Texas Instruments Incorporated
Product Folder Link(s): TPS65023-Q1
0
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100 1k 10k
I -OutputCurrent-mA
O
Efficiency-%
T =25°C
V =1.8V
PWM/PFMMode
A
O
V =4.2V
I
V =2.5V
I
V =3.6V
I
V =5V
I
0
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100 1k 10k
I -OutputCurrent-mA
O
Efficiency-%
T =25°C
V =1.8V
PWMMode
A
O
V =4.2V
I
V =2.5V
I
V =3.6V
I
V =5V
I
0
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100 1k 10k
I -OutputCurrent-mA
O
Efficiency-%
T =25°C
V =1.8V
PWM/PFMMode
A
O
V =4.2V
I
V =2.5V
I
V =3.6V
I
V =5V
I
0
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100 1k 10k
I -OutputCurrent-mA
O
Efficiency-%
T =25°C
V =1.8V
PWMMode
A
O
V =4.2V
I
V =2.5V
I
V =3.6V
I
V =5V
I
TPS65023-Q1
www.ti.com
SLVS927D MARCH 2009REVISED SEPTEMBER 2011
DCDC2: EFFICIENCY DCDC2: EFFICIENCY
vs vs
OUTPUT CURRENT OUTPUT CURRENT
Figure 3. Figure 4.
DCDC3: EFFICIENCY DCDC3: EFFICIENCY
vs vs
OUTPUT CURRENT OUTPUT CURRENT
Figure 5. Figure 6.
Copyright ©20092011, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Link(s): TPS65023-Q1
3.234
3.254
3.274
3.294
3.314
3.334
3.354
0.1 110
I -OutputCurrent- A
O
V -OutputVoltage-V
O
T =85°C
DEFDCDC2=VINDCDC2
A
V =3.8V
I
V =3.7V
I
V =3.6V
I
V =3.5V
I
3.234
3.254
3.274
3.294
3.314
3.334
3.354
I -OutputCurrent- A
O
V -OutputVoltage-V
O
T =85°C
DEFDCDC3=VINDCDC3
A
V =3.8V
I
V =3.7V
I
V =3.6V
I
0.1 110
V =4V
I
V =3.9V
I
V =3.5V
I
C1High
4.71V
C1Low
3.68V
C2Pk-Pk
28.5mV
C2Mean
1.18925V
VINDCDC1
VDCDC1
I =100mA
VINDCDC1=3.7V-4.7V
DEFDCDC1=VINDCDC1
PWWMode
O
C2Pk-Pk
48.9mV
C2Mean
1.81053V
C1High
4.01V
C1Low
3.02V
VINDCDC2
VDCDC2
I =100mA
VINDCDC2=3V-4V
DEFDCDC2=GND
PWWMode
O
TPS65023-Q1
SLVS927D MARCH 2009REVISED SEPTEMBER 2011
www.ti.com
DCDC2: OUTPUT VOLTAGE DCDC3: OUTPUT VOLTAGE
vs vs
OUTPUT CURRENT at 85°C OUTPUT CURRENT at 85°C
Figure 7. Figure 8.
VDCDC1 LINE TRANSIENT RESPONSE VDCDC2 LINE TRANSIENT RESPONSE
Figure 9. Figure 10.
16 Submit Documentation Feedback Copyright ©20092011, Texas Instruments Incorporated
Product Folder Link(s): TPS65023-Q1
VDCDC3=3.3V@50mV/Div
(ACCoupled)
ILOAD@500mA/Div
100mA
800mA
VIN=3.8V TIMESCALE=50 s/Divm
TPS65023-Q1
www.ti.com
SLVS927D MARCH 2009REVISED SEPTEMBER 2011
VDCDC3 LINE TRANSIENT RESPONSE VDCDC1 LOAD TRANSIENT RESPONSE
Figure 11. Figure 12.
VDCDC2 LOAD TRANSIENT RESPONSE VDCDC3 LOAD TRANSIENT RESPONSE
Figure 13. Figure 14.
Copyright ©20092011, Texas Instruments Incorporated Submit Documentation Feedback 17
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SLVS927D MARCH 2009REVISED SEPTEMBER 2011
www.ti.com
VDCDC2 OUTPUT VOLTAGE RIPPLE VDCDC2 OUTPUT VOLTAGE RIPPLE
Figure 15. Figure 16.
VDCDC2 OUTPUT VOLTAGE RIPPLE STARTUP VDCDC1, VDCDC2, AND VDCDC3
Figure 17. Figure 18.
18 Submit Documentation Feedback Copyright ©20092011, Texas Instruments Incorporated
Product Folder Link(s): TPS65023-Q1
C1High
3.83V
C1Low
3.29V
C2PK-PK
6.2mV
C2Mean
1.09702V
=Ch1 V
Ch2 V
I
O
=
I =25mA
V =1.1V
T =25 C
O
O
A
o
ENABLE
LDO1
LDO2
C1High
3.82V
C1Low
3.28V
C2PK-PK
22.8mV
=Ch1 V
Ch2 V
I
O
=
I =10mA
V =3V
T =25 C
O
O
A
o
C2Mean
2.98454V
C1High
4.51V
C1Low
3.99V
C2PK-PK
6.1mV
=Ch1 V
Ch2 V
I
O
=
I =25mA
V =3.3V
T =25 C
O
O
A
o
C2Mean
3.29828V
TPS65023-Q1
www.ti.com
SLVS927D MARCH 2009REVISED SEPTEMBER 2011
STARTUP LDO1 AND LDO2 LDO1 LINE TRANSIENT RESPONSE
Figure 19. Figure 20.
LDO2 LINE TRANSIENT RESPONSE VRTC LINE TRANSIENT RESPONSE
Figure 21. Figure 22.
Copyright ©20092011, Texas Instruments Incorporated Submit Documentation Feedback 19
Product Folder Link(s): TPS65023-Q1
C4High
47.8mA
C4Low
-2.9mA
C2PK-PK
40.4mV
=Ch2 V
Ch4 I
O
O
=
VI
O
A
=4V
V =3.3V
T =25 C
o
C2Mean
3.29821V
C4High
48.9mA
C4Low
2.1mA
C2PK-PK
42.5mV
=Ch2 V
Ch4
O
O
=I
VI
O
A
=3.3V
V =1.1V
T =25 C
o
C2Mean
1.09664V
C4High
21.4mA
C4Low
-1.4mA
C2PK-PK
76mV
=Ch2 V
Ch4 I
O
O
=
VI
O
A
=3.8V
V =3V
T =25 C
o
C2Mean
2.9762V
TPS65023-Q1
SLVS927D MARCH 2009REVISED SEPTEMBER 2011
www.ti.com
LDO1 LOAD TRANSIENT RESPONSE LDO2 LOAD TRANSIENT RESPONSE
Figure 23. Figure 24.
VRTC LOAD TRANSIENT RESPONSE
Figure 25.
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Product Folder Link(s): TPS65023-Q1
TPS65023-Q1
www.ti.com
SLVS927D MARCH 2009REVISED SEPTEMBER 2011
DETAILED DESCRIPTION
VRTC Output and Operation With or Without Backup Battery
The VRTC pin is an always-on output, intended to supply up to 30 mA to a permanently required rail (i.e., for a
real-time clock). The TPS65023 asserts the RESPWRON signal if VRTC drops below 2.4 V. VRTC is selected
from a priority scheme based on the VSYSIN and VBACKUP inputs.
When the voltage at the VSYSIN pin exceeds 2.65 V, VRTC connects to the VSYSIN input via a PMOS switch
and all other paths to VRTC are disabled. The PMOS switch drops a maximum of 375 mV at 30 mA, which
should be considered when using VRTC. VSYSIN can be connected to any voltage source with the appropriate
input voltage, including VCC or, if set to 3.3-V output, DCDC2 or DCDC3. When VSYSIN falls below 2.65 V or
shorts to ground, the PMOS switch connecting VRTC and VSYSIN opens and VRTC then connects to either
VBACKUP or the output of a dedicated 3-V/30-mA LDO. Texas Instruments recommends connecting VSYSIN to
VCC or ground - VCC if a non-replaceable primary cell is connected to VBACKUP and ground if the VRTC
output will float.
If the PMOS switch between VSYSIN and VRTC is open and VBACKUP exceeds 2.65 V, VRTC connects to
VBACKUP via a PMOS switch. The PMOS switch drops a maximum of 375 mV at 30 mA, which should be
considered if using VRTC. A typical application may connect VBACKUP to a primary Li button cell, but any
battery that provides a voltage between 2.65 V and 6 V (i.e. a single Li-Ion cell or a single boosted NiMH battery)
is acceptable, to supply the VRTC output. In systems with no backup battery, the VBACKUP pin should be
connected to GND.
If the switches between VRTC and VSYSIN or VBACKUP are open, the dedicated 3-V/30-mA LDO, driven from
VCC, connects to VRTC. This LDO is disabled if the voltage at the VSYSIN input exceeds 2.65 V.
Inside TPS65023 there is a switch (Vmax switch) which selects the higher voltage between VCC and VBACKUP.
This is used as the supply voltage for some basic functions. The functions powered from the output of the Vmax
switch are:
INT output
RESPWRON output
HOT_RESET input
LOW_BAT output
PWRFAIL output
Enable pins for dc-dc converters, LDO1 and LDO2
Undervoltage lockout comparator (UVLO)
Reference system with low frequency timing oscillators
LOW_BAT and PWRFAIL comparators
The main 2.25-MHz oscillator, and the I2Cinterface are only powered from VCC.
Copyright ©20092011, Texas Instruments Incorporated Submit Documentation Feedback 21
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RESPWRON
VRTC
LDO
VCC
VRTC
Vref
Vref Vref
priority
#3
priority
#2
priority
#1
EN
V_VSYSIN
V_VBACKUP
VBACKUP
V_VBACKUP
VSYSIN
V_VSYSIN
TPS65023-Q1
SLVS927D MARCH 2009REVISED SEPTEMBER 2011
www.ti.com
A. V_VSYSIN, V_VBACKUP thresholds: falling = 2.55 V, rising = 2.65 V ±3%
B. RESPWRON thresholds: falling = 2.4 V, rising = 2.52 V ±3%
Figure 26.
Step-Down Converters, VDCDC1, VDCDC2, and VDCDC3
The TPS65023 incorporates three synchronous step-down converters operating typically at 2.25 MHz fixed
frequency pulse width modulation (PWM) at moderate to heavy load currents. At light load currents, the
converters automatically enter the power save mode (PSM), and operate with pulse frequency modulation (PFM).
The VDCDC1 converter is capable of delivering 1.5 A output current, the VDCDC2 converter is capable of
delivering 1.2 A and the VDCDC3 converter is capable of delivering up to 1 A.
The converter output voltages can be programmed via the DEFDCDC1, DEFDCDC2 and DEFDCDC3 pins. The
pins can either be connected to GND, VCC, or to a resistor divider between the output voltage and GND. The
VDCDC1 converter defaults to 1.2 V or 1.6 V depending on the DEFDCDC1 configuration pin. If DEFDCDC1 is
tied to ground, the default is 1.2 V. If it is tied to VCC, the default is 1.6 V. When the DEFDCDC1 pin is
connected to a resistor divider, the output voltage can be set in the range of 0.6 V to VINDCDC1 V. See the
application information section for more details. The core voltage can be reprogrammed via the serial interface in
the range of 0.8 V to 1.6 V with a programmable slew rate. The converter is forced into PWM operation whilst
any programmed voltage change is underway, whether the voltage is being increased or decreased. The
DEFCORE and DEFSLEW registers are used to program the output voltage and slew rate during voltage
transitions.
The VDCDC2 converter defaults to 1.8 V or 3.3 V depending on the DEFDCDC2 configuration pin. If DEFDCDC2
is tied to ground, the default is 1.8 V. If it is tied to VCC, the default is 3.3 V. When the DEFDCDC2 pin is
connected to a resistor divider, the output voltage can be set in the range of 0.6 V to VINDCDC2 V.
The VDCDC3 converter defaults to 1.8 V or 3.3 V depending on the DEFDCDC3 configuration pin. If DEFDCDC3
is tied to ground the default is 1.8 V. If it is tied to VCC, the default is 3.3 V. When the DEFDCDC3 pin is
connected to a resistor divider, the output voltage can be set in the range of 0.6 V to VINDCDC3 V.
The step-down converter outputs (when enabled) are monitored by power good (PG) comparators, the outputs of
which are available via the serial interface. The outputs of the dc-dc converters can be optionally discharged via
on-chip 300-resistors when the dc-dc converters are disabled.
22 Submit Documentation Feedback Copyright ©20092011, Texas Instruments Incorporated
Product Folder Link(s): TPS65023-Q1
I =
PFMDCDC1 enter
I =
PFMDCDC2 enter
I =
PFMDCDC3 enter
VINDCDC1
VINDCDC2
VINDCDC3
24 W
26 W
39 W
I =
PFMDCDC1 leave
I =
PFMDCDC2 leave
I =
PFMDCDC3 leave
VINDCDC1
VINDCDC2
VINDCDC3
18 W
20 W
29 W
TPS65023-Q1
www.ti.com
SLVS927D MARCH 2009REVISED SEPTEMBER 2011
During PWM operation, the converters use a unique fast response voltage mode controller scheme with input
voltage feed-forward to achieve good line and load regulation allowing the use of small ceramic input and output
capacitors. At the beginning of each clock cycle initiated by the clock signal, the P-channel MOSFET switch is
turned on. The inductor current ramps up until the comparator trips and the control logic turns off the switch. The
current limit comparator also turns off the switch if the current limit of the P-channel switch is exceeded. After the
adaptive dead time used to prevent shoot through current, the N-channel MOSFET rectifier is turned on, and the
inductor current ramps down. The next cycle is initiated by the clock signal, again turning off the N-channel
rectifier and turning on the P-channel switch.
The three dc-dc converters operate synchronized to each other with the VDCDC1 converter as the master. A
180°phase shift between the VDCDC1 switch turn on and the VDCDC2 and a further 90°shift to the VDCDC3
switch turn on decreases the input RMS current and smaller input capacitors can be used. This is optimized for a
typical application where the VDCDC1 converter regulates a Li-Ion battery voltage of 3.7 V to 1.2 V, the
VDCDC2 converter from 3.7 V to 1.8 V, and the VDCDC3 converter from 3.7 V to 3.3 V. The phase of the three
converters can be changed using the CON_CTRL register.
Power-Save Mode Operation (PSM)
As the load current decreases, the converters enter the power-save mode operation. During PSM, the converters
operate in a burst mode (PFM mode) with a frequency between 750 kHz and 2.25 MHz, nominal for one burst
cycle. However, the frequency between different burst cycles depends on the actual load current and is typically
far less than the switching frequency with a minimum quiescent current to maintain high efficiency.
In order to optimize the converter efficiency at light load, the average current is monitored and if in PWM mode
the inductor current remains below a certain threshold, then PSM is entered. The typical threshold to enter PSM
is calculated as follows:
(1)
During the PSM the output voltage is monitored with a comparator, and by maximum skip burst width. As the
output voltage falls below the threshold, set to the nominal VO, the P-channel switch turns on and the converter
effectively delivers a constant current defined as follows.
(2)
If the load is below the delivered current then the output voltage rises until the same threshold is crossed in the
other direction. All switching activity ceases, reducing the quiescent current to a minimum until the output voltage
has again dropped below the threshold. The power save mode is exited, and the converter returns to PWM mode
if either of the following conditions are met:
1. the output voltage drops 2% below the nominal VOdue to increasing load current
2. the PFM burst time exceeds 16 ×1/fs (7.11 μs typical).
These control methods reduce the quiescent current to typically 14 μA per converter, and the switching activity to
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a minimum, thus achieving the highest converter efficiency. Setting the comparator thresholds at the nominal
output voltage at light load current results in a low output voltage ripple. The ripple depends on the comparator
delay and the size of the output capacitor. Increasing capacitor values makes the output ripple tend to zero. The
PSM is disabled through the I2C interface to force the individual converters to stay in fixed frequency PWM
mode.
Low-Ripple Mode
Setting Bit 3 in register CON-CTRL to 1 enables the low ripple mode for all of the dc-dc converters if operated in
PFM mode. For an output current less than approximately 10 mA, the output voltage ripple in PFM mode is
reduced, depending on the actual load current. The lower the actual output current on the converter, the lower
the output ripple voltage. For an output current above 10 mA, there is only minor difference in output voltage
ripple between PFM mode and low ripple PFM mode. As this feature also increases switching frequency, it is
used to keep the switching frequency above the audible range in PFM mode down to a low output current.
Soft Start
Each of the three converters has an internal soft start circuit that limits the inrush current during start-up. The soft
start is realized by using a low current to initially charge the internal compensation capacitor. The soft start time
is typically 750 μs if the output voltage ramps from 5% to 95% of the final target value. If the output is already
precharged to some voltage when the converter is enabled, then this time is reduced proportionally. There is a
short delay of typically 170 μs between the converter being enabled and switching activity actually starting. This
allows the converter to bias itself properly, to recognize if the output is precharged, and if so to prevent
discharging of the output while the internal soft start ramp catches up with the output voltage.
100% Duty Cycle Low-Dropout Operation
The TPS65023 converters offer a low input to output voltage difference while still maintaining operation with the
use of the 100% duty cycle mode. In this mode the P-channel switch is constantly turned on. This is particularly
useful in battery-powered applications to achieve longest operation time by taking full advantage of the whole
battery voltage range. The minimum input voltage required to maintain dc regulation depends on the load current
and output voltage. It is calculated as:
(3)
with:
Ioutmax = maximum load current (Note: ripple current in the inductor is zero under these conditions)
rDS(on)max = maximum P-channel switch rDS(on)
RL= DC resistance of the inductor
Voutmin = nominal output voltage minus 2% tolerance limit
Active Discharge When Disabled
When the VDCDC1, VDCDC2, and VDCDC3 converters are disabled, due to an UVLO, DCDC_EN or
OVERTEMP condition, it is possible to actively pull down the outputs. This feature is disabled per default and is
individually enabled via the CON_CTRL2 register in the serial interface. When this feature is enabled, the
VDCDC1, VDCDC2, and VDCDC3 outputs are discharged by a 300 (typical) load which is active as long as
the converters are disabled.
Power Good Monitoring
All three step-down converters and both the LDO1 and LDO2 linear regulators have power good comparators.
Each comparator indicates when the relevant output voltage has dropped 10% below its target value with 5%
hysteresis. The outputs of these comparators are available in the PGOODZ register via the serial interface. An
interrupt is generated when any voltage rail drops below the 10% threshold. The comparators are disabled when
the converters are disabled and the relevant PGOODZ register bits indicate that power is good.
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Low-Dropout Voltage Regulators
The low dropout voltage regulators are designed to operate well with low value ceramic input and output
capacitors. They operate with input voltages down to 1.5 V. The LDOs offer a maximum dropout voltage of
300 mV at rated output current. Each LDO supports a current limit feature. Both LDOs are enabled by the
LDO_EN pin, both LDOs can be disabled or programmed via the serial interface using the REG_CTRL and
LDO_CTRL registers. The LDOs also have reverse conduction prevention. This allows the possibility to connect
external regulators in parallel in systems with a backup battery. The TPS65023 step-down and LDO voltage
regulators automatically power down when the VCC voltage drops below the UVLO threshold or when the junction
temperature rises above 160°C.
Power Good Monitoring
Both the LDO1 and LDO2 linear regulators have power good comparators. Each comparator indicates when the
relevant output voltage has dropped 10% below its target value, with 5% hysteresis. The outputs of these
comparators are available in the PGOODZ register via the serial interface. An interrupt is generated when any
voltage rail drops below the 10% threshold. The comparators are disabled when the LDOs are disabled and the
relevant PGOODZ register bits indicate that power is good.
Undervoltage Lockout
The undervoltage lockout circuit for the five regulators on the TPS65023 prevents the device from malfunctioning
at low-input voltages and from excessive discharge of the battery. It disables the converters and LDOs. The
UVLO circuit monitors the VCC pin, the threshold is set internally to 2.35 V with 5% (120 mV) hysteresis. Note
that when any of the dc-dc converters are running, there is an input current at the VCC pin, which is up to 3 mA
when all three converters are running in PWM mode. This current needs to be taken into consideration if an
external RC filter is used at the VCC pin to remove switching noise from the TPS65023 internal analog circuitry
supply.
Power-Up Sequencing
The TPS65023 power-up sequencing is designed to be entirely flexible and customer driven. This is achieved by
providing separate enable pins for each switch-mode converter, and a common enable signal for the LDOs. The
relevant control pins are described in Table 2.
Table 2. Control Pins and Status Outputs for DC-DC Converters
PIN NAME I/O FUNCTION
Defines the default voltage of the VDCDC3 switching converter. DEFDCDC3 = 0 defaults VDCDC3 to
DEFDCDC3 I 1.8 V, DEFDCDC3 = VCC defaults VDCDC3 to 3.3 V.
Defines the default voltage of the VDCDC2 switching converter. DEFDCDC2 = 0 defaults VDCDC2 to
DEFDCDC2 I 1.8 V, DEFDCDC2 = VCC defaults VDCDC2 to 3.3 V.
Defines the default voltage of the VDCDC1 switching converter. DEFDCDC1 = 0 defaults VDCDC1 to 1.2
DEFDCDC1 I V, DEFDCDC1 = VCC defaults VDCDC1 to 1.6 V.
DCDC3_EN I Set DCDC3_EN = 0 to disable and DCDC3_EN = 1 to enable the VDCDC3 converter
DCDC2_EN I Set DCDC2_EN = 0 to disable and DCDC2_EN = 1 to enable the VDCDC2 converter
DCDC1_EN I Set DCDC1_EN = 0 to disable and DCDC1_EN = 1 to enable the VDCDC1 converter
The HOT_RESET pin generates a reset (RESPWRON) for the processor.HOT_RESET does not alter any
TPS65023 settings except the output voltage of VDCDC1. Activating HOT_RESET sets the voltage of
HOT_RESET I VDCDC1 to its default value defined with the DEFDCDC1 pin. HOT_RESET is internally de-bounced by the
TPS65023.
RESPWRON is held low when power is initially applied to the TPS65023. The VRTC voltage is monitored:
RESPWRON O RESWPRON is low when VRTC <2.4 V and remains low for a time defined by the external capacitor at the
TRESPWRON pin. RESPWRON can also be forced low by activation of the HOT_RESET pin.
TRESPWRON I Connect a capacitor here to define the RESET time at the RESPWRON pin (1 nF typically gives 100 ms).
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System Reset and Control Signals
The RESPWRON signal can be used as a global reset for the application. It is an open drain output. The
RESPWRON signal is generated according to the power good comparator of VRTC, and remains low for tnrespwron
seconds after VRTC has risen above 2.52 V (falling threshold is 2.4 V, 5% hysteresis). tnrespwron is set by an
external capacitor at the TRESPWRON pin. 1 nF gives typically 100 ms. RESPWRON is also triggered by the
HOT_RESET input. This input is internally debounced, with a filter time of typically 30 ms.
The PWRFAIL and LOW_BAT signals are generated by two voltage detectors using the PWRFAIL_SNS and
LOWBAT_SNS input signals. Each input signal is compared to a 1 V threshold (falling edge) with 5% (50 mV)
hysteresis.
The DCDC1 converter is reset to its default output voltage defined by the DEFDCDC1 input, when HOT_RESET
is asserted. Other I2C registers are not affected. Generally, the DCDC1 converter is set to its default voltage with
one of these conditions: HOT_RESET active, VRTC lower than its threshold voltage, undervoltage lockout
(UVLO) condition, or RESPWRON active.
DEFLDO1 and DEFLDO2
These two pins are used to set the default output voltage of the two 200 mA LDOs. The digital value applied to
the pins is latched during power up and determines the initial output voltage according to Table 3. The voltage of
both LDOs can be changed during operation with the I2C interface as described in the interface description.
Table 3.
DEFLDO2 DEFLDO1 VLDO1 VLDO2
0 0 1.3 V 3.3 V
0 1 2.8 V 3.3 V
1 0 1.3 V 1.8 V
1 1 1.8 V 3.3 V
Interrupt Management and the INT Pin
The INT pin combines the outputs of the PGOOD comparators from each dc-dc converter and the LDOs. The
INT pin is used as a POWER_OK pin to indicate when all enabled supplies are in regulation. The INT pin
remains active (low state) during power up as long as all enabled power rails are below their regulation limit.
Once the last enabled power rail is within regulation, the INT pin transitions to a high state.
During operation, if one of the enabled supplies goes out of regulation, INT transitions to a low state, and the
corresponding bit in the PGOODZ register goes high. If the supply goes back to its regulation limits, INT
transitions back to a high state.
While INT is in an active low state, reading the PGOODZ register via the I2C bus forces INT into a high-Z state.
Since this pin requires an external pullup resistor, the INT pin transitions to a logic high state even though the
supply in question is still out of regulation. The corresponding bit in the PGOODZ register still indicates that the
power rail is out of regulation.
Interrupts can be masked using the MASK register. The default operation is to not mask any DCDC or LDO
interrupts, because these provide the POWER_OK function.
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VCC
UVLO*
VRTC
VSYSIN=VBACKUP=GND;
VINLDO=VCC
tNRESPWRON
DCDCx_EN
VODCDCx
*...internalsignal
0.8V
1.9V
2.52V 3.0V
Rampwithin
800 μs
LDO_EN
slopedepending
onload
2.47V
VOLDOx
2.4V
2.35V
1.2V
1.9V
RESPWRON
TPS65023-Q1
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SLVS927D MARCH 2009REVISED SEPTEMBER 2011
Timing Diagrams
Figure 27. HOT_RESET Timing
Figure 28. Power-Up and Power-Down Timing
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Figure 29. DVS Timing
Serial Interface
The serial interface is compatible with the standard and fast mode I2C specifications, allowing transfers at up to
400 kHz. The interface adds flexibility to the power supply solution, enabling most functions to be programmed to
new values depending on the instantaneous application requirements and charger status to be monitored.
Register contents remain intact as long as VCC remains above 2 V. The TPS65023 has a 7-bit address:
1001000, other addresses are available upon contact with the factory. Attempting to read data from the register
addresses not listed in this section results in FFh being read out.
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DataLine
Stable;
DataValid
DATA
CLK
Change
ofData
Allowed
DATA
CLK
CE
SP
STARTCondition STOP Condition
SCLK
SDAT
Start Slave Address Register Address Data
0
A6 A5 A4 A0 R/W R7 R6 R5 R0 D7 D6 D5 D0
ACK ACK ACK
0 0 0
Stop
Note:SLAVE=TPS65020
TPS65023-Q1
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SLVS927D MARCH 2009REVISED SEPTEMBER 2011
For normal data transfer, DATA is allowed to change only when CLK is low. Changes when CLK is high are
reserved for indicating the start and stop conditions. During data transfer, the data line must remain stable
whenever the clock line is high. There is one clock pulse per bit of data. Each data transfer is initiated with a start
condition and terminated with a stop condition. When addressed, the TPS65023 device generates an
acknowledge bit after the reception of each byte. The master device (microprocessor) must generate an extra
clock pulse that is associated with the acknowledge bit. The TPS65023 device must pull down the DATA line
during the acknowledge clock pulse so that the DATA line is a stable low during the high period of the
acknowledge clock pulse. The DATA line is a stable low during the high period of the acknowledgerelated clock
pulse. Setup and hold times must be taken into account. During read operations, a master must signal the end of
data to the slave by not generating an acknowledge bit on the last byte that was clocked out of the slave. In this
case, the slave TPS65023 device must leave the data line high to enable the master to generate the stop
condition
Figure 30. Bit Transfer on the Serial Interface
Figure 31. Start and Stop Conditions
Figure 32. Serial Interface Write to TPS65023 Device
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SCLK
SDAT
Start
Repeated
Start
Slave
Drives
theData
Master
Drives
ACKandStop
Slave Address Slave Address
Register
Address
0
A6A6 A0A0 R/W R/WR7 R0 D7 D0
ACK ACKACK ACK
0 0 0
1
Stop
Note:SLAVE=TPS65020
SCLK
SDA
Start
StopStart
Slave
Drives
theData
Master
Drives
ACKandStop
Slave Address Slave Address
Register
Address
0 0 0 0
1
Stop
Note:SLAVE=TPS65020
A6A6 A0A0 R/W R/WR7 R0 D7 D0
ACK ACKACK ACK
CLK
DATA
STA STA STOSTO
th(STA)
t(BUF)
t(LOW)
trtf
th(DATA) tsu(DATA)
tsu(STA)
th(STA)
tsu(STO)
t(HIGH)
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Figure 33. Serial Interface Read from TPS65023: Protocol A
Figure 34. Serial Interface Read from TPS65023: Protocol B
Figure 35. Serial Interface Timing Diagram
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Table 4. Serial Interface Timing
MIN MAX UNIT
fMAX Clock frequency 400 kHz
twH(HIGH) Clock high time 600 ns
twL(LOW) Clock low time 1300 ns
tRDATA and CLK rise time 300 ns
tFDATA and CLK fall time 300 ns
th(STA) Hold time (repeated) START condition (after this period the first clock pulse is generated) 600 ns
th(DATA) Setup time for repeated START condition 600 ns
th(DATA) Data input hold time 300 ns
tsu(DATA) Data input setup time 300 ns
tsu(STO) STOP condition setup time 600 ns
t(BUF) Bus free time 1300 ns
VERSION. Register Address: 00h (read only)
VERSION B7 B6 B5 B4 B3 B2 B1 B0
Bit name and 0 0 1 0 0 0 1 1
function
Read/Write R R R R R R R R
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PGOODZ. Register Address: 01h (read only)
PGOODZ B7 B6 B5 B4 B3 B2 B1 B0
Bit name and LOWBATTZ PGOODZ PGOODZ PGOODZ PGOODZ PGOODZ
PWRFAILZ
function VDCDC1 VDCDC2 VDCDC3 LDO2 LDO1
LOWBATT PGOODZ PGOODZ PGOODZ PGOODZ PGOODZ
Set by signal PWRFAIL VDCDC1 VDCDC2 VDCDC3 LDO2 LDO1
Default value LOWBATTZ PGOOD PGOOD PGOOD PGOOD PGOOD
PWRFAILZ
loaded by: VDCDC1 VDCDC2 VDCDC3 LDO2 LDO1
Read/Write R R R R R R R R
Bit 7 PWRFAILZ:
0 = indicates that the PWRFAIL_SNS input voltage is above the 1-V threshold.
1 = indicates that the PWRFAIL_SNS input voltage is below the 1-V threshold.
Bit 6 LOWBATTZ:
0 = indicates that the LOWBATT_SNS input voltage is above the 1-V threshold.
1 = indicates that the LOWBATT_SNS input voltage is below the 1-V threshold.
Bit 5 PGOODZ VDCDC1:
0 = indicates that the VDCDC1 converter output voltage is within its nominal range. This bit is zero if
the VDCDC1 converter is disabled.
1 = indicates that the VDCDC1 converter output voltage is below its target regulation voltage
Bit 4 PGOODZ VDCDC2:
0 = indicates that the VDCDC2 converter output voltage is within its nominal range. This bit is zero if
the VDCDC2 converter is disabled.
1 = indicates that the VDCDC2 converter output voltage is below its target regulation voltage
Bit 3 PGOODZ VDCDC3:
0 = indicates that the VDCDC3 converter output voltage is within its nominal range. This bit is zero if
the VDCDC3 converter is disabled and during a DVM controlled output voltage transition
1 = indicates that the VDCDC3 converter output voltage is below its target regulation voltage
Bit 2 PGOODZ LDO2:
0 = indicates that the LDO2 output voltage is within its nominal range. This bit is zero if LDO2 is
disabled.
1 = indicates that LDO2 output voltage is below its target regulation voltage
Bit 1 PGOODZ LDO1
0 = indicates that the LDO1 output voltage is within its nominal range. This bit is zero if LDO1 is
disabled.
1 = indicates that the LDO1 output voltage is below its target regulation voltage
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MASK. Register Address: 02h (read/write) Default Value: C0h
MASK B7 B6 B5 B4 B3 B2 B1 B0
Bit name and MASK MASK MASK MASK MASK MASK MASK
function PWRFAILZ LOWBATTZ VDCDC1 VDCDC2 VDCDC3 LDO2 LDO1
Default 1 1 0 0 0 0 0 0
Default value UVLO UVLO UVLO UVLO UVLO UVLO UVLO
loaded by:
Read/Write R/W R/W R/W R/W R/W R/W R/W
The MASK register can be used to mask particular fault conditions from appearing at the INT pin. MASK<n>= 1
masks PGOODZ<n>.
REG_CTRL. Register Address: 03h (read/write) Default Value: FFh
The REG_CTRL register is used to disable or enable the power supplies via the serial interface. The contents of
the register are logically ANDed with the enable pins to determine the state of the supplies. A UVLO condition
resets the REG_CTRL to 0xFF, so the state of the supplies defaults to the state of the enable pin. The
REG_CTRL bits are automatically reset to default when the corresponding enable pin is low.
REG_CTRL B7 B6 B5 B4 B3 B2 B1 B0
Bit name and VDCDC1 VDCDC2 VDCDC3 LDO2 LDO1
function ENABLE ENABLE ENABLE ENABLE ENABLE
Default 1 1 1 1 1 1 1 1
Set by signal DCDC1_ENZ DCDC2_ENZ DCDC3_ENZ LDO_ENZ LDO_ENZ
Default value UVLO UVLO UVLO UVLO UVLO
loaded by:
Read/Write R/W R/W R/W R/W R/W
Bit 5 VDCDC1 ENABLE
DCDC1 Enable. This bit is logically ANDed with the state of the DCDC1_EN pin to turn on the DCDC1
converter. Reset to 1 by a UVLO condition, the bit can be written to 0 or 1 via the serial interface. The
bit is reset to 1 when the pin DCDC1_EN is pulled to GND, allowing DCDC1 to turn on when
DCDC1_EN returns high.
Bit 4 VDCDC2 ENABLE
DCDC2 Enable. This bit is logically ANDed with the state of the DCDC2_EN pin to turn on the DCDC2
converter. Reset to 1 by a UVLO condition, the bit can be written to 0 or 1 via the serial interface. The
bit is reset to 1 when the pin DCDC2_EN is pulled to GND, allowing DCDC2 to turn on when
DCDC2_EN returns high.
Bit 3 VDCDC3 ENABLE
DCDC3 Enable. This bit is logically ANDed with the state of the DCDC3_EN pin to turn on the DCDC3
converter. Reset to 1 by a UVLO condition, the bit can be written to 0 or 1 via the serial interface. The
bit is reset to 1 when the pin DCDC3_EN is pulled to GND, allowing DCDC3 to turn on when
DCDC3_EN returns high.
Bit 2 LDO2 ENABLE
LDO2 Enable. This bit is logically ANDed with the state of the LDO2_EN pin to turn on LDO2. Reset to
1 by a UVLO condition, the bit can be written to 0 or 1 via the serial interface. The bit is reset to 1 when
the pin LDO_EN is pulled to GND, allowing LDO2 to turn on when LDO_EN returns high.
Bit 1 LDO1 ENABLE
LDO1 Enable. This bit is logically ANDed with the state of the LDO1_EN pin to turn on LDO1. Reset to
1 by a UVLO condition, the bit can be written to 0 or 1 via the serial interface. The bit is reset to 1 when
the pin LDO_EN is pulled to GND, allowing LDO1 to turn on when LDO_EN returns high.
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CON_CTRL. Register Address: 04h (read/write) Default Value: B1h
CON_CTRL B7 B6 B5 B4 B3 B2 B1 B0
Bit name and DCDC2 DCDC2 DCDC3 DCDC3 LOW FPWM FPWM FPWM
function PHASE1 PHASE0 PHASE1 PHASE0 RIPPLE DCDC2 DCDC1 DCDC3
Default 1 0 1 1 0 0 0 0
Default value UVLO UVLO UVLO UVLO UVLO UVLO UVLO UVLO
loaded by:
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
The CON_CTRL register is used to force any or all of the converters into forced PWM operation, when low
output voltage ripple is vital. It is also used to control the phase shift between the three converters in order to
minimize the input RMS current, hence reduce the required input blocking capacitance. The DCDC1 converter is
taken as the reference and consequently has a fixed zero phase shift.
DCDC2 CONVERTER DCDC3 CONVERTER
CON_CTRL<7:6>CON_CTRL<5:4>
DELAYED BY DELAYED BY
00 zero 00 zero
01 1/4 cycle 01 1/4 cycle
10 1/2 cycle 10 1/2 cycle
11 3/4 cycle 11 3/4 cycle
Bit 3 LOW RIPPLE:
0 = PFM mode operation optimized for high efficiency for all converters
1 = PFM mode operation optimized for low output voltage ripple for all converters
Bit 2 FPWM DCDC2:
0 = DCDC2 converter operates in PWM / PFM mode
1 = DCDC2 converter is forced into fixed frequency PWM mode
Bit 1 FPWM DCDC1:
0 = DCDC1 converter operates in PWM / PFM mode
1 = DCDC1 converter is forced into fixed frequency PWM mode
Bit 0 FPWM DCDC3:
0 = DCDC3 converter operates in PWM / PFM mode
1 = DCDC3 converter is forced into fixed frequency PWM mode
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CON_CTRL2. Register Address: 05h (read/write) Default Value: 40h
CON_CTRL2 B7 B6 B5 B4 B3 B2 B1 B0
Bit name and Core adj DCDC2 DCDC1 DCDC3
GO
function allowed discharge discharge discharge
Default 0 1 0 0 0 0 0 0
Default value UVLO + RESET(1) UVLO UVLO UVLO
loaded by: DONE
Read/Write R/W R/W R/W R/W R/W
The CON_CTRL2 register can be used to take control the inductive converters.
RESET(1): CON_CTRL2[6] is reset to its default value by one of these events:
undervoltage lockout (UVLO)
HOT_RESET pulled low
RESPWRON active
VRTC below threshold
Bit 7 GO
0 = no change in the output voltage for the DCDC1 converter
1 = the output voltage of the DCDC1 converter is changed to the value defined in DEFCORE with
the slew rate defined in DEFSLEW. This bit is automatically cleared when the DVM transition is
complete. The transition is considered complete in this case when the desired output voltage
code has been reached, not when the VDCDC3 output voltage is actually in regulation at the
desired voltage.
Bit 6 CORE ADJ allowed
0 = the output voltage is set with the I2C register
1 = DEFDCDC1 is either connected to GND or VCC or an external voltage divider. When
connected to GND or VCC, VDCDC1 defaults to 1.2 V or 1.6 V respectively at start-up.
Bit 20 0 = the output capacitor of the associated converter is not actively discharged when the converter is
disabled
1 = the output capacitor of the associated converter is actively discharged when the converter is
disabled. This decreases the fall time of the output voltage at light load.
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DEFCORE. Register Address: 06h (read/write Default Value: 14h/1Eh
DEFCORE B7 B6 B5 B4 B3 B2 B1 B0
Bit name and CORE4 CORE3 CORE2 CORE1 CORE0
function
Default 0 0 0 1 DEFDCDC1 DEFDCDC1 DEFDCDC1 DEFDCDC1
Default value RESET(1) RESET(1) RESET(1) RESET(1) RESET(1)
loaded by:
Read/Write R/W R/W R/W R/W R/W
RESET(1): DEFCORE is reset to its default value by one of these events:
undervoltage lockout (UVLO)
HOT_RESET pulled low
RESPWRON active
VRTC below threshold
CORE4 CORE3 CORE2 CORE1 CORE0 VDCDC1 CORE4 CORE3 CORE2 CORE1 CORE0 VDCDC1
0 0 0 0 0 0.8 V 1 0 0 0 0 1.2 V
0 0 0 0 1 0.825 V 1 0 0 0 1 1.225 V
0 0 0 1 0 0.85 V 1 0 0 1 0 1.25 V
0 0 0 1 1 0.875 V 1 0 0 1 1 1.275 V
0 0 1 0 0 0.9 V 1 0 1 0 0 1.3 V
0 0 1 0 1 0.925 V 1 0 1 0 1 1.325 V
0 0 1 1 0 0.95 V 1 0 1 1 0 1.35 V
0 0 1 1 1 0.975 V 1 0 1 1 1 1.375 V
0 1 0 0 0 1 V 1 1 0 0 0 1.4 V
0 1 0 0 1 1.025 V 1 1 0 0 1 1.425 V
0 1 0 1 0 1.05 V 1 1 0 1 0 1.45 V
0 1 0 1 1 1.075 V 1 1 0 1 1 1.475 V
0 1 1 0 0 1.1 V 1 1 1 0 0 1.5 V
0 1 1 0 1 1.125 V 1 1 1 0 1 1.525 V
0 1 1 1 0 1.15 V 1 1 1 1 0 1.55 V
0 1 1 1 1 1.175 V 1 1 1 1 1 1.6 V
DEFSLEW. Register Address: 07h (read/write) Default Value: 06h
DEFSLEW B7 B6 B5 B4 B3 B2 B1 B0
Bit name and SLEW2 SLEW1 SLEW0
function
Default 1 1 0
Default value UVLO UVLO UVLO
loaded by:
Read/Write R/W R/W R/W
SLEW2 SLEW1 SLEW0 VDCDC1 SLEW RATE
0 0 0 0.225 mV/μs
0 0 1 0.45 mV/μs
0 1 0 0.9 mV/μs
0 1 1 1.8 mV/μs
1 0 0 3.6 mV/μs
1 0 1 7.2 mV/μs
1 1 0 14.4 mV/μs
1 1 1 Immediate
36 Submit Documentation Feedback Copyright ©20092011, Texas Instruments Incorporated
Product Folder Link(s): TPS65023-Q1
DIL+Vout 1*Vout
Vin
L ƒ
ILmax +Ioutmax )
DIL
2
TPS65023-Q1
www.ti.com
SLVS927D MARCH 2009REVISED SEPTEMBER 2011
LDO_CTRL. Register Address: 08h (read/write) Default Value: set with DEFLDO1 and DEFLDO2
LDO_CTRL B7 B6 B5 B4 B3 B2 B1 B0
Bit name and RSVD RSVD
LDO2_2 LDO2_1 LDO2_0 LDO1_2 LDO1_1 LDO1_0
function
Default DEFLDOx DEFLDOx DEFLDOx DEFLDOx DEFLDOx DEFLDOx
Default value UVLO UVLO UVLO UVLO UVLO UVLO
loaded by:
Read/Write R/W R/W R/W R/W R/W R/W
The LDO_CTRL registers can be used to set the output voltage of LDO1 and LDO2. LDO_CTRL[7] and
LDO_CTRL[3] are reserved and should always be written to 0.
The default voltage is set with DEFLDO1 and DEFLDO2 pins as described in Table 3.
LDO2 OUTPUT LDO1 OUTPUT
LDO2_2 LDO2_1 LDO2_0 LDO1_2 LDO1_1 LDO1_0
VOLTAGE VOLTAGE
0 0 0 1.05 V 0 0 0 1 V
0 0 1 1.2 V 0 0 1 1.1 V
0 1 0 1.3 V 0 1 0 1.3 V
0 1 1 1.8 V 0 1 1 1.8 V
1 0 0 2.5 V 1 0 0 2.2 V
1 0 1 2.8 V 1 0 1 2.6 V
1 1 0 3.0 V 1 1 0 2.8 V
1 1 1 3.3 V 1 1 1 3.15 V
Design Procedure
Inductor Selection for the DC-DC Converters
Each of the converters in the TPS65023 typically use a 2.2-μH output inductor. Larger or smaller inductor values
are used to optimize the performance of the device for specific operation conditions. The selected inductor has to
be rated for its dc resistance and saturation current. The dc resistance of the inductance influences directly the
efficiency of the converter. Therefore, an inductor with lowest dc resistance should be selected for highest
efficiency.
For a fast transient response, a 2.2-μH inductor in combination with a 22-μF output capacitor is recommended.
Equation 4 calculates the maximum inductor current under static load conditions. The saturation current of the
inductor should be rated higher than the maximum inductor current as calculated with Equation 4. This is needed
because during heavy load transient the inductor current rises above the value calculated under Equation 4.
(4)
(5)
with:
f = Switching Frequency (2.25 MHz typical)
L = Inductor Value
ΔIL= Peak-to-Peak inductor ripple current
ILMAX = Maximum Inductor current
The highest inductor current occurs at maximum Vin.
Open core inductors have a soft saturation characteristic, and they can usually handle higher inductor currents
versus a comparable shielded inductor.
Copyright ©20092011, Texas Instruments Incorporated Submit Documentation Feedback 37
Product Folder Link(s): TPS65023-Q1
IRMSCout =Vout x
1-
Vout
Vin
L x ¦x1
2x 3Ö
DVout =Vout x
1- Vout
Vin
L x ¦x+ESR
( )
1
8xC x
out ¦
TPS65023-Q1
SLVS927D MARCH 2009REVISED SEPTEMBER 2011
www.ti.com
A more conservative approach is to select the inductor current rating just for the maximum switch current of the
TPS65023 (2 A for the VDCDC1 and VDCDC2 converters, and 1.5 A for the VDCDC3 converter). The core
material from inductor to inductor differs and has an impact on the efficiency especially at high switching
frequencies.
See Table 5 and the typical applications for possible inductors.
Table 5. Tested Inductors
DEVICE INDUCTOR VALUE TYPE COMPONENT SUPPLIER
2.2 μH LPS4012-222LMB Coilcraft
All converters 2.2 μH VLCF4020T-2R2N1R7 TDK
Output Capacitor Selection
The advanced Fast Response voltage mode control scheme of the inductive converters implemented in the
TPS65023 allow the use of small ceramic capacitors with a typical value of 10 μF for each converter without
having large output voltage under and overshoots during heavy load transients. Ceramic capacitors having low
ESR values have the lowest output voltage ripple and are recommended. See Table 6 for recommended
components.
If ceramic output capacitors are used, the capacitor RMS ripple current rating always meets the application
requirements. Just for completeness, the RMS ripple current is calculated as:
(6)
At nominal load current, the inductive converters operate in PWM mode. The overall output voltage ripple is the
sum of the voltage spike caused by the output capacitor ESR plus the voltage ripple caused by charging and
discharging the output capacitor:
(7)
Where the highest output voltage ripple occurs at the highest input voltage Vin.
At light load currents, the converters operate in PSM and the output voltage ripple is dependent on the output
capacitor value. The output voltage ripple is set by the internal comparator delay and the external capacitor. The
typical output voltage ripple is less than 1% of the nominal output voltage.
Input Capacitor Selection
Because of the nature of the buck converter having a pulsating input current, a low ESR input capacitor is
required for best input voltage filtering and minimizing the interference with other circuits caused by high input
voltage spikes. Each dc-dc converter requires a 10-μF ceramic input capacitor on its input pin VINDCDCx. The
input capacitor is increased without any limit for better input voltage filtering. The VCC pin is separated from the
input for the dc-dc converters. A filter resistor of up to 10R and a 1-μF capacitor is used for decoupling the VCC
pin from switching noise. Note that the filter resistor may affect the UVLO threshold since up to 3 mA can flow via
this resistor into the VCC pin when all converters are running in PWM mode.
Table 6. Possible Capacitors
CAPACITOR VALUE CASE SIZE COMPONENT SUPPLIER COMMENTS
22 μF 1206 TDK C3216X5R0J226M Ceramic
22 μF 1206 Taiyo Yuden JMK316BJ226ML Ceramic
22 μF 0805 TDK C2012X5R0J226MT Ceramic
22μF 0805 Taiyo Yuden JMK212BJ226MG Ceramic
10 μF 0805 Taiyo Yuden JMK212BJ106M Ceramic
10 μF 0805 TDK C2012X5R0J106M Ceramic
38 Submit Documentation Feedback Copyright ©20092011, Texas Instruments Incorporated
Product Folder Link(s): TPS65023-Q1
VDCDC3
DCDC3_EN DEFDCDC3
AGND PGND
L3
R1
R2
VO
L
CO
VCC
VINDCDC3
CI
1 Fm
10R
V(bat)
VOUT DEFDCDCx
=V x R1+R2
R2 R1=R2x
VOUT
VDEFDCDCx
-R2
()
TPS65023-Q1
www.ti.com
SLVS927D MARCH 2009REVISED SEPTEMBER 2011
Output Voltage Selection
The DEFDCDC1, DEFDCDC2, and DEFDCDC3 pins are used to set the output voltage for each step-down
converter. See Table 7 for the default voltages if the pins are pulled to GND or to VCC. If a different voltage is
needed, an external resistor divider can be added to the DEFDCDCx pin as shown in Figure 36.
The output voltage of VDCDC1 is set with the I2C interface. If the voltage is changed from the default, using the
DEFCORE register, the output voltage only depends on the register value. Any resistor divider at DEFDCDC1
does not change the voltage set with the register.
Table 7.
PIN LEVEL DEFAULT OUTPUT VOLTAGE
VCC 1.6 V
DEFDCDC1 GND 1.2 V
VCC 3.3 V
DEFDCDC2 GND 1.8 V
VCC 3.3 V
DEFDCDC3 GND 1.8 V
Using an external resistor divider at DEFDCDCx:
Figure 36. External Resistor Divider
When a resistor divider is connected to DEFDCDCx, the output voltage can be set from 0.6 V up to the input
voltage V(bat). The total resistance (R1+R2) of the voltage divider should be kept in the 1-MR range in order to
maintain a high efficiency at light load.
V(DEFDCDCx) = 0.6 V
(8)
VRTC Output
It is recommended that a 4.7-μF (minimum) capacitor be added to the VRTC pin.
LDO1 and LDO2
The LDOs in the TPS65023 are general-purpose LDOs which are stable using ceramics capacitors. The
minimum output capacitor required is 2.2 μF. The LDOs output voltage can be changed to different voltages
between 1 V and 3.3 V using the I2C interface. Therefore, they can also be used as general-purpose LDOs in
applications powering processors different from DaVinci. The supply voltage for the LDOs needs to be connected
to the VINLDO pin, giving the flexibility to connect the lowest voltage available in the system and provides the
highest efficiency.
Copyright ©20092011, Texas Instruments Incorporated Submit Documentation Feedback 39
Product Folder Link(s): TPS65023-Q1
t =2
(reset) x128x
(1V-0.25V)xC(reset)
2 Am
()
TPS65023-Q1
SLVS927D MARCH 2009REVISED SEPTEMBER 2011
www.ti.com
TRESPWRON
This is the input to a capacitor that defines the reset delay time after the voltage at VRTC rises above 2.52 V.
The timing is generated by charging and discharging the capacitor with a current of 2 μA between a threshold of
0.25 V and 1 V for 128 cycles. A 1-nF capacitor gives a delay time of 100 ms.
(9)
Where:
t(reset) is the reset delay time
C(reset) is the capacitor connected to the TRESPWRON pin
VCC Filter
An RC filter connected at the VCC input is used to keep noise from the internal supply for the bandgap and other
analog circuitry. A typical value of 10 R and 1 μF is used to filter the switching spikes, generated by the dc-dc
converters. A larger resistor than 10 R should not be used because the current into VCC of up to 3 mA causes a
voltage drop at the resistor causing the undervoltage lockout circuitry connected at VCC internally to switch off
too early.
40 Submit Documentation Feedback Copyright ©20092011, Texas Instruments Incorporated
Product Folder Link(s): TPS65023-Q1
VCC/VINDCDC1
DCDC1_EN
VDCDC1
1.225V 1.225V 1.225V
TPS65023-Q1
www.ti.com
SLVS927D MARCH 2009REVISED SEPTEMBER 2011
APPLICATION INFORMATION
Typical Configuration for the Texas Instruments®TMS320DM644x DaVinci Processors
Reset Condition of DCDC1
If DEFDCDC1 is connected to ground and DCDC1_EN is pulled high after VINDCDC1 is applied, the output
voltage of DCDC1 defaults to 1.225 V instead of 1.2 V (high by 2%). Figure 37 illustrates the problem.
Figure 37. Default DCDC1
Copyright ©20092011, Texas Instruments Incorporated Submit Documentation Feedback 41
Product Folder Link(s): TPS65023-Q1
VCC/VINDCDC1
DCDC1_EN
VDCDC1
1.20V 1.20V 1.20V
VCC/VINDCDC1
DCDC1_EN
I2CBus
DEF_CORE
VDCDC1
?? 0x1F 0x11 0x10 ?? 0x1E0x1F 0x10
1.20V
1.225V 1.20V
PullDCDC1_ENHigh
WriteDEF_COREto0x10
WriteCON_CTRL [7]to1
WriteDEF_COREto0x10
PullDCDC1_ENHigh
VCC/VINDCDC1
DCDC1_EN
HOT_RESET
VDCDC1
1.225V
1.20V
1.225V 1.20V
TPS65023-Q1
SLVS927D MARCH 2009REVISED SEPTEMBER 2011
www.ti.com
Workaround 1: Tie DCDC1_EN to VINDCDC1 (Figure 38)
Figure 38. Workaround 1
Workaround 2: Write the correct voltage to the DEF_CORE register via I2C. This can be done before or after the
converter is enabled. If written before the enable, the only bit changed is DEF_CORE[0]. The voltage will be 1.2
V, however, when the enable is pulled high (Figure 39).
Figure 39. Workaround 2
Workaround 3: Generate a HOT_RESET after enabling DCDC1 (Figure 40)
Figure 40. Workaround 3
42 Submit Documentation Feedback Copyright ©20092011, Texas Instruments Incorporated
Product Folder Link(s): TPS65023-Q1
PACKAGE OPTION ADDENDUM
www.ti.com 16-Sep-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS65023QRHARQ1 ACTIVE VQFN RHA 40 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
TPS65023QRSBRQ1 ACTIVE WQFN RSB 40 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS65023-Q1 :
Catalog: TPS65023
NOTE: Qualified Version Definitions:
PACKAGE OPTION ADDENDUM
www.ti.com 16-Sep-2011
Addendum-Page 2
Catalog - TI's standard catalog product
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS65023QRHARQ1 VQFN RHA 40 3000 330.0 16.4 6.3 6.3 1.1 12.0 16.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS65023QRHARQ1 VQFN RHA 40 3000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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