2N5638 2N5638 N-Channel Switch * This device is designed for low level analog switchng, sample and hold circuits and chopper stabilized amplifiers. * Sourced from process 51. TO-92 1 1. Drain 2. Source 3. Gate Absolute Maximum Ratings * TC=25C unless otherwise noted Symbol VDG Drain-Gate Voltage Parameter Value 30 Units V VGS Gate-Source Voltage -30 V IGF Forward Gate Current 50 mA TJ, TSTG Operating and Storage Junction Temperature Range -55 ~ +150 C * These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. NOTES: 1. These ratings are based on a maximum junction temperature of 150 degrees C. 2. These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations. Electrical Characteristics TC=25C unless otherwise noted Symbol Off Characteristics Parameter Test Condition Min. Typ. Max. Units V(BR)GSS Gate-Source Breakdown Voltage VDS = 0, IG = -10A IGSS Gate Reverse Current VGS = -15V, VDS = 0 -30 -1.0 nA V ID(off) Drain Cutoff Leakage Current VDS = 12V, VGS = 15V 1.0 nA On Characteristics IDSS Zero-Gate Voltage Drain Current * VDS = 20V, IGS = 0 rDS(on) Drain-Source On Resistance VGS = 0V, ID = 1.0mA 50 30 mA Small Signal Characteristics rds(on) Drain-Source On Resistance VDS = VGS = 0, f = 1.0kHz 30 Ciss Input Capacitance VDS = 0, VGS = 12V, f = 1.0MHz 10 pF Crss Reverse Transfer Capacitance VDS = 0V, VGS = 12V, f = 1.0MHz 4.0 pF VDD = 10V, VGS(on) = 0 VGS(off) = -12, ID(on) = 12mA RG = 50 4.0 ns 5.0 ns Switching Characteristics td(on) Trun On Delay Time tr Rise Time td(off) Trun Off Delay Time tf Fall Time 5.0 ns 10 ns * Pulse Test: Pulse Width 300s, Duty Cycle 1.0% Thermal Characteristics TA=25C unless otherwise noted Symbol PD Total Device Dissipation Derate above 25C Parameter Max. 350 2.8 Units mW mW/C RJC Thermal Resistance, Junction to Case 125 C/W RJA Thermal Resistance, Junction to Ambient 357 C/W (c)2002 Fairchild Semiconductor Corporation Rev. A1, November 2002 2N5638 Package Dimensions TO-92 +0.25 4.58 0.20 4.58 -0.15 0.10 14.47 0.40 0.46 1.27TYP [1.27 0.20] 1.27TYP [1.27 0.20] 0.20 (0.25) +0.10 0.38 -0.05 1.02 0.10 3.86MAX 3.60 +0.10 0.38 -0.05 (R2.29) Dimensions in Millimeters (c)2002 Fairchild Semiconductor Corporation Rev. A1, November 2002 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM FACTTM ActiveArrayTM FACT Quiet seriesTM BottomlessTM FAST(R) FASTrTM CoolFETTM CROSSVOLTTM FRFETTM GlobalOptoisolatorTM DOMETM EcoSPARKTM GTOTM E2CMOSTM HiSeCTM EnSignaTM I2CTM Across the board. Around the world.TM The Power FranchiseTM Programmable Active DroopTM ImpliedDisconnectTM ISOPLANARTM LittleFETTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM PACMANTM POPTM Power247TM PowerTrench(R) QFETTM QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SILENT SWITCHER(R) SMART STARTTM SPMTM StealthTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogicTM TruTranslationTM UHCTM UltraFET(R) VCXTM DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. (c)2002 Fairchild Semiconductor Corporation Rev. I1