FMS2023 FMS2023 DC-20GHz MMIC LOW LOSS SPST ABSORPTIVE SWITCH Package Style: Bare Die Product Description Features The FMS2023 is a low loss, high isolation broadband single-pole-single-throw Gallium Arsenide switch, designed on the FL05 0.5m switch process from RFMD. It offers absorptive properties from the output (50 termination). This process technology offers leading-edge performance optimized for switch applications. The FMS2023 is developed for the broadband communications, instrumentation, and electronic warfare markets. Optimum Technology Matching(R) Applied RF1 RF2 GaAs HBT Applications GaAs MESFET InGaP HBT SiGe BiCMOS Si BiCMOS 9 Low Insertion Loss: 1dB at 20GHz High Isolation: 50dB at 20GHz Absorptive Output in Off-State Excellent Low Control Voltage Performance Available in Die Form SiGe HBT GaAs pHEMT V1 Si BJT GaN HEMT V2 Si CMOS Broadband Communications Test Instrumentation Fiber Optics Electronic Warfare (ECM, ESM) InP HBT RF MEMS LDMOS Parameter Min. Specification Typ. Max. Unit Electrical Specifications (Small-Signal Unless Noted) Insertion Loss TAMBIENT =25C, VCTRL =0V/-5V. Specifications based on on-wafer measurements. -0.6 -0.75 -0.9 -1.05 -1.25 Isolation Input Return Loss (On State) Output Return Loss (On State) Output Return Loss (Off State) P1dB Condition 26 25 22 -0.42 -0.55 -0.7 -0.8 -1.0 -50 -21 -23 -11 28 27 24 -43 -17 -17 -9 dB dB dB dB dB dB dB dB dB dBm dBm dBm DC 5GHz 10GHz 15GHz 20GHz DC-20GHz DC-20GHz DC-20GHz DC-20GHz 2GHz 10GHz 20GHz RF MICRO DEVICES(R), RFMD(R), Optimum Technology Matching(R), Enabling Wireless ConnectivityTM, PowerStar(R), POLARISTM TOTAL RADIOTM and UltimateBlueTM are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. (c)2006, RF Micro Devices, Inc. Rev A1 DS090612 7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 1 of 6 FMS2023 Absolute Maximum Ratings1 Parameter Rating Maximum Input Power (PIN) Caution! ESD sensitive device. Unit +27 Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied. dBm Operating Temperature (TOPER) -40 to 85 C Storage Temperature (TSTOR) -55 to 150 C RoHS status based on EUDirective2002/95/EC (at time of this document revision). The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. Truth Table Control Line V1 V2 -5V 0V RF Path RFIN-RFOUT 0V -5V On (Low Loss) Off (Isolation) Note: -5V0.2 V; -0V0.2 V Pad Layout Pad RFIN RFO V1 V2 Description RFIN RFOUT V1 V2 Pin Coordinates (m) 141, 587 1789, 587 901, 161 1101, 161 Note: Coordinates are referenced from the bottom left hand corner of the die to the center of the bond pad opening. 2 of 6 Die Size (m) Die Thickness (m) Min. Bond Pad Pitch (m) Min. Bond Pad Opening (mxm) 1910x1110 100 150 116x116 7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Rev A1 DS090612 FMS2023 Typical Measured Performance for On-Wafer Measurements Measurement Conditions: VCTRL =5V (low) and 0V (high), TAMBIENT =25C unless otherwise stated. Ins e rtion Los s ( S21 ON) Is olation ( S21 OFF) 0.00 0.00 -0.20 -10.00 S21 ( dB) S21 ( dB) -20.00 -0.40 -0.60 -0.80 -30.00 -40.00 -50.00 -60.00 -1.00 -70.00 -1.20 -80.00 0 2 4 6 8 10 12 14 16 18 20 0 2 4 6 8 Fre quency (GHz) 10 12 14 16 18 20 14 16 18 20 Fre que ncy ( GHz ) Input Re turn Los s (S11 ON) Output Re turn Los s ( S22 ON) 0.00 0.00 -5.00 -5.00 S11 ( dB) S11 ( dB) -10.00 -10.00 -15.00 -20.00 -15.00 -20.00 -25.00 -30.00 -35.00 -25.00 -40.00 -30.00 -45.00 0 2 4 6 8 10 12 14 16 18 20 0 2 4 6 8 Fre que ncy ( GHz ) 10 12 Fre que ncy (GHz) Abs orptiv e Output Re t urn Los s ( S22 OFF) P1dB 0.00 28.00 24.00 P1dB (dBm) S11 ( dB) -5.00 -10.00 -15.00 20.00 16.00 12.00 8.00 -20.00 4.00 -25.00 0.00 0 2 4 6 8 10 12 Fre que ncy ( GHz ) Rev A1 DS090612 14 16 18 20 2 4 6 8 10 12 14 16 18 20 Fre quency (GHz) 7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 3 of 6 FMS2023 Typical Performance for On-Wafer Measurements Over Temperature Measurement Conditions: VCTRL =-5V (low) and 0V (high). TAMBIENT =25C, TCOLD =-40 C, THOT =+85C Ins e rtion Los s (S21 ON) Isolation (S21 OFF) 0.00 0.00 - 0.20 -10.00 -20.00 S21 (dB) S21 (dB) - 0.40 - 0.60 - 0.80 -30.00 -40.00 -50.00 -60.00 - 1.00 -70.00 - 1.20 -80.00 0 2 4 6 8 10 12 14 16 18 20 0 2 4 6 Fre que ncy ( GHz) 8 10 12 14 16 18 20 14 16 18 20 Fre que ncy (GHz) Input Re turn Los s ( S11 ON) Out put Re turn Los s (S22 ON) 0.00 0.00 -5.00 - 5.00 -10.00 -15.00 S22 (dB) S11 (dB) - 10.00 - 15.00 - 20.00 -20.00 -25.00 -30.00 -35.00 - 25.00 -40.00 - 30.00 -45.00 0 2 4 6 8 10 12 14 16 18 20 0 2 4 6 Fre que ncy (GHz) 10 12 Fre que ncy (GHz) P1dB Absorpt ive Output Re t urn Los s (S22 OFF) 0.00 28.00 24.00 P1dB (dBm) - 5.00 S22 (dB) 8 - 10.00 - 15.00 20.00 16.00 12.00 8.00 - 20.00 4.00 0.00 - 25.00 0 2 4 6 8 10 12 Fre que ncy (GHz) 4 of 6 14 16 18 20 2 4 6 8 10 12 14 16 18 20 Fre que ncy ( GHz) 7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Rev A1 DS090612 FMS2023 Preferred Assembly Instructions GaAs devices are fragile and should be handled with great care. Specially designed collets should be used where possible. The back of the die is metallized and the recommended mounting method is by the use of conductive epoxy. Epoxy should be applied to the attachment surface uniformly and sparingly to avoid encroachment of epoxy onto the top face of the die. Ideally it should not exceed half the chip height. For automated dispense Ablestick LMISR4 is recommended and for manual dispense Ablestick 84-1 LMI or 84-1 LMIT are recommended. These should be cured at a temperature of 150C for one hour in an oven especially set aside for epoxy curing only. If possible the curing oven should be flushed with dry nitrogen. The gold-tin (80% Au 20% Sn) eutectic die attach has a melting point of approximately 280C but the absolute temperature being used depends on the leadframe material used and the particular application. The maximum time at used should be kept to a minimum. This part has gold (Au) bond pads requiring the use of gold (99.99% pure) bondwire. It is recommended that 25.4mm diameter gold wire be used. Recommended lead bond technique is thermocompression wedge bonding with 0.001" (25m) diameter wire. Bond force, time stage temperature, and ultrasonics are all critical parameters and the settings are dependent on the setup and application being used. Ultrasonic or thermosonic bonding is not recommended. Bonds should be made from the die first and then to the mounting substrate or package. The physical length of the bondwires should be minimized especially when making RF or ground connections. Handling Precautions To avoid damage to the devices, care should be exercised during handling. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. ESD/MSL Rating These devices should be treated as Class 1A (250V to 500V) using the human body model as defined in JEDEC Standard No. 22-A114. Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263. This is an unpackaged part and therefore no MSL rating applies. Application Notes and Design Data Application Notes and design data including S-parameters are available on request at www.rfmd.com. Reliability An MTTF of in excess of 9 million hours at a channel temperature of 150C is achieved for the process used to manufacture this device. Disclaimers This product is not designed for use in any space-based or life-sustaining/supporting equipment. Ordering Information Rev A1 DS090612 Quantity Ordering Code Full pack (100) FMS2023-000 Small quantity (25) FMS2023-000SQ Sample quantity (3) FMS2023-000S3 7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 5 of 6 FMS2023 6 of 6 7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Rev A1 DS090612