October 2010
© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1207 / FPF1208 • Rev. 1.0.0
FPF1207 / FPF1208 — IntelliMAX™ Advance Load Switch
FPF1207 / FPF1208
IntelliMAX™ Advanced Load Switch
Features
1.2V to 4.0V Input Voltage Operating Range
Typical RON: 50mΩ at VIN=3.3V
77mΩ at VIN=1.8V
150mΩ at VIN=1.2V
Slew Rate Control with tR: 110µs
Output Discharge Function on FPF1208
Low <1.5µA Quiescent Current
Extra Low <100nA Off Supply Current
ESD Protected: Above 7000V HBM, 2000V CDM
GPIO/CMOS-Compatible Enable Circuitry
4-Bump WLCSP 0.76mm x 0.76mm, 0.4mm Pitch
Applications
Mobile Devices and Smart Phones
Portable Media Devices
Ultra-Portable / Mobile Computing
Advanced Notebook, UMPC, MID
Portable Medical Devices
GPS and Navigation Equipment
Description
The FPF1207/08 is an ultra-small integrated IntelliMAX™
load switch with integrated P-channel switch and analog
control features. Integrated slew-rate control prevents
inrush current and the resulting excessive voltage drop
on power rail. The input voltage range operates from
1.2V to 4.0V to provide power-disconnect capability for
post-regulated power rails in portable and consumer
products. The low shut-off current of 1µA (maximum)
allows power designs to meet standby and off-power
drain specifications.
The FPF1207/08 is controlled by an active-HIGH logic
input (ON pin) compatible with standard CMOS GPIO
circuitry found on Field Programmable Gate Array
(FPGA) and embedded processors. The FPF1207/08 is
available in 0.76mm x 0.76mm 4-bump WLCSP.
Ordering Information
Part Number Top
Marking
Switch
(Typical)
at 3.3VIN
Output
Discharge
ON Pin
Activity tR Package
FPF1207UCX QG 50mΩ NA
Active
HIGH 110µs 4-Ball, Wafer-Level Chip-
Scale Package (WLCSP),
0.76 x 0.76mm, 0.4mm Pitch
FPF1208UCX QH 50mΩ 65Ω Active
HIGH 110µs
© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1207 / FPF1208 • Rev. 1.0.0 2
FPF1207 / FPF1208 — IntelliMAX™ Advance Load Switch
Application Diagram
Figure 1. Typical Application
Notes:
1. CIN=1μF, X5R, 0603 (for example, Murata GRM185R60J105KE26).
2. COUT=1μF, X5R, 0805 (for example, Murata GRM216R61A105KA01).
Functional Block Diagram
Figure 2. Functional Block Diagram (Output Discharge for FPF1208 Only)
© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1207 / FPF1208 • Rev. 1.0.0 3
FPF1207 / FPF1208 — IntelliMAX™ Advance Load Switch
Pin Configurations
Figure 3. WLCSP Bumps Facing Up (Top View) Figure 4. WLCSP Bumps Facing Down (Bottom View)
Figure 5. Pin Assignments (Top View) Figure 6. Pin Assignments (Bottom View)
Pin Definitions
Pin # Name Description
A1 VOUT Switch Output
A2 VIN Supply Input: Input to the power switch
B1 GND Ground
B2 ON ON/OFF control, active HIGH
A
1
A
2
B1 B2
V
OUT
ON
V
IN
GND
A
2
A
1
B2 B1
V
IN
GND
V
OUT
ON
© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1207 / FPF1208 • Rev. 1.0.0 4
FPF1207 / FPF1208 — IntelliMAX™ Advance Load Switch
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol Parameter Min. Max. Unit
VIN V
IN, VOUT, VON to GND -0.3 4.2 V
ISW Maximum Continuous Switch Current 1.2 A
PD Power Dissipation at TA=25°C 1.0 W
TSTG Storage Junction Temperature -65 +150 °C
TA Operating Temperature Range -40 +85 °C
ΘJA Thermal Resistance, Junction-to-Ambient 1S2P with One Thermal Via 110 °C/W
1S2P without Thermal Via 95
ESD Electrostatic Discharge Capability(3,4)
Human Body Model,
JESD22-A114 7
kV
Charged Device Model,
JESD22-C101 2
Notes:
3. Measured using 2S2P JEDEC std. PCB.
4. Measured using 2S2P JEDEC PCB COLD PLATE Method.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol Parameter Min. Max. Unit
VIN Supply Voltage 1.2 4.0 V
TA Ambient Operating Temperature -40 +85 °C
© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1207 / FPF1208 • Rev. 1.0.0 5
FPF1207 / FPF1208 — IntelliMAX™ Advance Load Switch
Electrical Characteristics
Unless otherwise noted, VIN=1.2 to 4.0V and TA=-40 to +85°C. Typical values are at VIN=3.3V and TA=25°C.
Symbol Parameter Conditions Min. Typ. Max. Units
Basic Operation
VIN Supply Voltage 1.2 4.0 V
IQ(OFF) Off Supply Current VON=GND, VOUT=Open, VIN=4V 100 nA
ISD(OFF) Off Switch Current VON=GND, VOUT=GND 1 μA
IQ Quiescent Current IOUT=0mA 1.5 μA
RON On Resistance
VIN=3.3V, IOUT=200mA, TA=25°C 50 66
mΩ
VIN=1.8V, IOUT=200mA, TA=25°C 77 91
VIN=1.2V, IOUT=200mA, TA=25°C 150 160
VIN=1.8V, IOUT=200mA, TA=85°C 100
RPD Output Discharge RPULL DOWN VIN=3.3V, VON=0V, IFORCE=20mA,
TA=25°C, FPF1208 65 110 Ω
VIH On Input Logic HIGH Voltage VIN <1.5V 0.9 V
VIN=1.5V to 4.0V 1.1
VIL On Input Logic LOW Voltage VIN=1.2V to 4.0V 0.75 V
ION On Input Leakage VON=VIN or GND 1 μA
Dynamic Characteristics(5)
tDON Turn-On Delay(6)
VIN=3.3V, RL=10Ω, CL=0.1µF,
TA=25°C
110
μs
tR V
OUT Rise Time(6) 110
tON Turn-On Time(6) 220
tDOFF Turn-Off Delay(6)
VIN=3.3V, RL=10Ω, CL=0.1µF,
TA=25°C, FPF1207
7
μs
tF V
OUT Fall Time(6) 2
tOFF Turn-Off Time(6) 9
tDOFF Turn-Off Delay
VIN=3.3V, RL=10Ω, CL=0.1µF,
TA=25°C, FPF1208
2.0
μs tF V
OUT Fall Time 1.9
tOFF Turn-Off Time 3.9
tDOFF Turn-Off Delay
VIN=3.3V, RL=500Ω, CL=0.1µF,
TA=25°C, FPF1207
10
μs
tF V
OUT Fall Time 95
tOFF Turn-Off Time(6) 105
tDOFF Turn-Off Delay
VIN=3.3V, RL=500Ω, CL=0.1µF,
TA=25°C, FPF1208(7)
7.0
μs
tF V
OUT Fall Time 10.5
tOFF Turn-Off Time(6) 17.5
Notes:
5. These parameters are guaranteed by design and characterization; not production tested.
6. tDON/tDOFF/tR/tF are defined in Figure 25.
7. Output discharge path is enabled during device off.
© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1207 / FPF1208 • Rev. 1.0.0 6
FPF1207 / FPF1208 — IntelliMAX™ Advance Load Switch
Typical Performance Characteristics
Figure 7. Shutdown Current vs. Temperature Figure 8. Shutdown Current vs. Supply Voltage
Figure 9. Off Supply Current vs. Temperature
(FPF1207, VOUT Floating)
Figure 10. Off Supply Current vs. Supply Voltage
(FPF1207, VOUT Floating)
Figure 11. Quiescent Current vs. Temperature Figure 12. Quiescent Current vs. Supply Voltage
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
0.90
1.00
-40 -15 10 35 60 8
5
V
IN
SHUTDOWN CURRENT (μA)
T
J
, JUNCTION TEMPERATURE (°C)
ON = 0V
V
IN
= 4.0V
V
IN
= 1.2V
V
IN
= 3.3V
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
0.90
1.00
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.
VIN SHUTDOWN CURRENT (μA)
SUPPLY VOLTAGE (V)
ON = 0V
25°C
85°C
-40°C
0.00
0.05
0.10
0.15
0.20
0.25
0.30
-40 -15 10 35 60 8
5
OFF SUPPLY CURRENT (μA)
T
J
, JUNCTION TEMPERATURE (°C)
ON = 0V
V
IN
= 4.0V
V
IN
= 1.2V
V
IN
= 3.3V
0.00
0.05
0.10
0.15
0.20
0.25
0.30
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.
OFF SUPPLY CURRENT (μA)
SUPPLY VOLTAGE (V)
ON = 0V
25°C
85°C
-40°C
0.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
-40 -15 10 35 60 8
5
SUPPLY CURRENT (μA)
T
J
, JUNCTION TEMPERATURE (°C)
ON = V
IN
V
IN
= 4.0V
V
IN
= 1.2V
V
IN
= 3.3V
0.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
1.60
1.80
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.
SUPPLY CURRENT (μA)
SUPPLY VOLTAGE (V)
25°C
85°C
-40°C
ON = V
IN
© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1207 / FPF1208 • Rev. 1.0.0 7
FPF1207 / FPF1208 — IntelliMAX™ Advance Load Switch
Typical Performance Characteristics
Figure 13. RON vs. Temperature Figure 14. RON vs. Supply Voltage
Figure 15. ON-Pin Threshold vs. VIN Figure 16.
V
OUT Rise and Fall Time vs. Temperature
at RL=10Ω
Figure 17. VOUT Turn-On and Turn-Off Delay vs. Temperature at RL=10Ω
0
20
40
60
80
100
120
140
160
-40 -15 10 35 60 8
5
ON RESISTANCE (mΩ)
T
J
, JUNCTION TEMPERATURE (°C)
ON = V
IN
I
OUT
= 200mA
V
IN
= 4.0V
V
IN
= 1.2V
V
IN
= 3.3V
0
20
40
60
80
100
120
140
160
1.21.72.22.73.23.74.24.75.2
ON RESISTANCE (mΩ)
SUPPLY VOLTAGE (V)
25°C
85°C
-40°C
ON = V
IN
I
OUT
= 200mA
0.70
0.75
0.80
0.85
0.90
0.95
1.00
1.05
1.10
1.15
1.20
1.0 1.5 2.0 2.5 3.0 3.5 4.0
ON INPUT LOGIC VOLTAGE (V)
SUPPLY VOLTAGE (V)
25°C
V
IH
V
IL
1
10
100
1000
-40 -15 10 35 60 85
RISE/FALL TIME (us)
T
J
, JUNCTION TEMPERATURE (°C)
t
R
t
F
V
IN
= 3.3V
C
L
= 0.1µF
R
L
= 10Ω
0
10
20
30
40
50
60
70
80
90
100
-40 -15 10 35 60 85
ON/OFF DELAY TIME (µs)
T
J
, JUNCTION TEMPERATURE (°C)
t
doff
t
don
V
IN
= 3.3V
C
L
= 0.1µF
R
L
= 10Ω
© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1207 / FPF1208 • Rev. 1.0.0 8
FPF1207 / FPF1208 — IntelliMAX™ Advance Load Switch
Typical Performance Characteristics
Figure 18.
V
OUT Rise and Fall Time vs. Temperature
at RL=500Ω
Figure 19.
V
OUT Turn-On and Turn-Off Dela
y
vs. Temperature at RL=500Ω
Figure 20. Turn-On Response (VIN=3.3V, CIN=1µF,
COUT=0.1µF, RL=10Ω)
Figure 21. Turn-Off Response (VIN=3.3V, CIN=1µF,
COUT=0.1µF, RL=10Ω)
Figure 22. Turn-Off Response (FPF1207 = No Output Pull-Down Resistor)
(VIN=3.3V, CIN=1µF, COUT=0.1µF, RL=500Ω)
50
55
60
65
70
75
80
85
90
95
100
-40 -15 10 35 60 85
RISE/FALL TIME (μs)
T
J
, JUNCTION TEMPERATURE (°C)
t
R
V
IN
= 3.3V
C
L
= 0.1µF
R
L
= 500Ω
t
F
0
10
20
30
40
50
60
70
80
90
-40 -15 10 35 60 85
ON/OFF DELAY TIME (µs)
T
J
, JUNCTION TEMPERATURE (°C)
t
doff
t
don
V
IN
= 3.3V
C
L
= 0.1µF
R
L
= 500Ω
© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1207 / FPF1208 • Rev. 1.0.0 9
FPF1207 / FPF1208 — IntelliMAX™ Advance Load Switch
Typical Performance Characteristics
Figure 23. ISW vs.
V
DS -- SOA of FPF1207 Figure 24. ISW vs.
V
DS -- SOA of FPF1208
Timing Diagram
Figure 25. Timing Diagram
Notes:
8. tON=tR + tDON.
9. tOFF=tF + tDOFF.
0.01
0.1
1
10
100
0.0100 0.1000 1.0000 10.0000 100.0000
ID, DRAIN CURRENT (A)
VDS, DRAIN-SOURCE VOLTAGE (V)
DC
10s
1s
100ms
RDS(ON) LIMIT
VGS = 10.0V
SINGLE PULSE
RθJA = 125oC/W
TA= 25oC
10ms
0.01
0.1
1
10
100
0.0100 0.1000 1.0000 10.0000 100.0000
ID, DRAIN CURRENT (A)
VDS, DRAIN-SOURCE VOLTAGE (V)
DC
10s
1s
100ms
RDS(ON) LIMIT
VGS = 10.0V
SINGLE PULSE
RθJA = 125oC/W
TA= 25oC
10ms
10%
VON
V
OUT
VOUT
t
DON
t
DOFF
10%
3.3V
90%
t
F
90%
t
R
90%
10%
50%
50%
© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1207 / FPF1208 • Rev. 1.0.0 10
FPF1207 / FPF1208 — IntelliMAX™ Advance Load Switch
Operation and Application Description
The FPF1207 and FPF1208 are low-RON P-channel load
switches with controlled turn-on. The core of each
device is a 50mΩ P-channel MOSFET and controller
capable of functioning over a wide input operating range
of 1.2-4.0V. The ON pin, an active HIGH GIOP/CMOS-
compatible input, controls the state of the switch.
The FPF1208 contains a 65Ω on-chip load resistor for
quick output discharge when the switch is turned off.
Input Capacitor
To limit the voltage drop on the input supply caused by
transient inrush current when the switch turns on into a
discharged load capacitor or short-circuit, a capacitor
must be placed between the VIN and GND pins. A 1µF
ceramic capacitor, CIN, placed close to the pins is
usually sufficient. Higher-value CIN can be used to
reduce the voltage drop in higher-current applications.
Output Capacitor
A 0.1µF capacitor, COUT, should be placed between the
VOUT and GND pins. This capacitor prevents parasitic
board inductance from forcing VOUT below GND when
the switch is on. CIN greater than COUT is highly
recommended. COUT greater than CIN can cause VOUT to
exceed VIN when the system supply is removed. This
could result in current flow through the body diode from
VOUT to VIN.
Board Layout
For best performance, all traces should be as short as
possible. To be most effective, the input and output
capacitors should be placed close to the device to
minimize the effect that parasitic trace inductance may
have on normal and short-circuit operation. Using wide
traces or large copper planes for all pins (VIN, VOUT, ON,
and GND) helps minimize the parasitic electrical effects
along with minimizing the case ambient thermal
impedance. However, the VOUT pin of FPF1208 should
not connect directly the battery source due to the
discharge mechanism of the load switch.
Figure 26. Typical Application
© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1207 / FPF1208 • Rev. 1.0.0 11
FPF1207 / FPF1208 — IntelliMAX™ Advance Load Switch
Physical Dimensions
Figure 27. 4 Ball, 0.76 x 0.76 mm Wafer Level Chip Scale WLCSP Packaging
Product-Specific Dimensions
Product D E X Y
FPF1207UCX 760µm ± 30µm 760µm ± 30µm 0.180mm± 0.018µm 0.180mm± 0.018µm
FPF1208UCX 760µm ± 30µm 760um ± 30µm 0.180mm± 0.018µm 0.180mm± 0.018µm
Package drawings are provided as a service to customers consideri ng Fairchild components. Drawings may change in any manner
without notic e. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representativ e to verify or
obtain the most recent revisi on. Package specific ati ons do not ex pand the terms of Fairchild’s worl dwide terms and condi tions,
specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for
the most recent package drawi ng: http://www.fairchildsemi.com/packaging/.
BOTTOM VIEW
SIDE VIEWS
TOP VIEW RECOMMENDED LAND PATTERN
BALL A1
INDEX AREA
A1
0.005 CAB
F
(NSMD PAD TYPE)
B
A
0.292±0.018
0.208±0.021
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
PER ASME Y14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 500 MICRONS
±39 MICRONS (461-539 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC004AFrev1.
0.03 C
2X
0.03 C
2X
12
A
B
0.40
0.40
(X)±0.018
SEATING PLANE
C
0.06 C
0.05 C E
D
D
E
0.40
0.40 Ø0.20
Cu Pad
Ø0.30
Solder Mask
(Y)±0.018
Ø0.260±0.020
4X
0.539
0.461
F
© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1207 / FPF1208 • Rev. 1.0.0 12
FPF1207 / FPF1208 — IntelliMAX™ Advance Load Switch
