FPF1207 / FPF1208 IntelliMAXTM Advanced Load Switch Features Description 1.2V to 4.0V Input Voltage Operating Range Slew Rate Control with tR: 110s The FPF1207/08 is an ultra-small integrated IntelliMAX load switch with integrated P-channel switch and analog control features. Integrated slew-rate control prevents inrush current and the resulting excessive voltage drop on power rail. The input voltage range operates from 1.2V to 4.0V to provide power-disconnect capability for post-regulated power rails in portable and consumer products. The low shut-off current of 1A (maximum) allows power designs to meet standby and off-power drain specifications. TM Typical RON: 50m at VIN=3.3V 77m at VIN=1.8V 150m at VIN=1.2V Output Discharge Function on FPF1208 Low <1.5A Quiescent Current Extra Low <100nA Off Supply Current ESD Protected: Above 7000V HBM, 2000V CDM GPIO/CMOS-Compatible Enable Circuitry 4-Bump WLCSP 0.76mm x 0.76mm, 0.4mm Pitch The FPF1207/08 is controlled by an active-HIGH logic input (ON pin) compatible with standard CMOS GPIO circuitry found on Field Programmable Gate Array (FPGA) and embedded processors. The FPF1207/08 is available in 0.76mm x 0.76mm 4-bump WLCSP. Applications Mobile Devices and Smart Phones Portable Media Devices Ultra-Portable / Mobile Computing Advanced Notebook, UMPC, MID Portable Medical Devices GPS and Navigation Equipment Ordering Information Part Number Top Marking Switch (Typical) at 3.3VIN Output Discharge ON Pin Activity tR FPF1207UCX QG 50m NA Active HIGH 110s FPF1208UCX QH 50m 65 Active HIGH 110s (c) 2010 Fairchild Semiconductor Corporation FPF1207 / FPF1208 * Rev. 1.0.0 Package 4-Ball, Wafer-Level ChipScale Package (WLCSP), 0.76 x 0.76mm, 0.4mm Pitch www.fairchildsemi.com FPF1207 / FPF1208 -- IntelliMAXTM Advance Load Switch October 2010 Figure 1. Typical Application Notes: 1. CIN=1F, X5R, 0603 (for example, Murata GRM185R60J105KE26). 2. COUT=1F, X5R, 0805 (for example, Murata GRM216R61A105KA01). Functional Block Diagram FPF1207 / FPF1208 -- IntelliMAXTM Advance Load Switch Application Diagram Figure 2. Functional Block Diagram (Output Discharge for FPF1208 Only) (c) 2010 Fairchild Semiconductor Corporation FPF1207 / FPF1208 * Rev. 1.0.0 www.fairchildsemi.com 2 Figure 3. WLCSP Bumps Facing Up (Top View) Figure 4. WLCSP Bumps Facing Down (Bottom View) VOUT A1 A2 VIN VIN A2 A1 VOUT GND B1 B2 ON ON B2 B1 GND Figure 5. Pin Assignments (Top View) Figure 6. Pin Assignments (Bottom View) FPF1207 / FPF1208 -- IntelliMAXTM Advance Load Switch Pin Configurations Pin Definitions Pin # Name Description A1 VOUT Switch Output A2 VIN B1 GND B2 ON Supply Input: Input to the power switch Ground ON/OFF control, active HIGH (c) 2010 Fairchild Semiconductor Corporation FPF1207 / FPF1208 * Rev. 1.0.0 www.fairchildsemi.com 3 Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit -0.3 4.2 V VIN VIN, VOUT, VON to GND ISW Maximum Continuous Switch Current 1.2 A PD Power Dissipation at TA=25C 1.0 W TSTG Storage Junction Temperature -65 +150 C TA Operating Temperature Range -40 +85 C JA Thermal Resistance, Junction-to-Ambient ESD (3,4) Electrostatic Discharge Capability 1S2P with One Thermal Via 110 1S2P without Thermal Via 95 Human Body Model, JESD22-A114 7 Charged Device Model, JESD22-C101 2 C/W kV Notes: 3. Measured using 2S2P JEDEC std. PCB. 4. Measured using 2S2P JEDEC PCB COLD PLATE Method. FPF1207 / FPF1208 -- IntelliMAXTM Advance Load Switch Absolute Maximum Ratings Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Max. Unit VIN Supply Voltage 1.2 4.0 V TA Ambient Operating Temperature -40 +85 C (c) 2010 Fairchild Semiconductor Corporation FPF1207 / FPF1208 * Rev. 1.0.0 www.fairchildsemi.com 4 Unless otherwise noted, VIN=1.2 to 4.0V and TA=-40 to +85C. Typical values are at VIN=3.3V and TA=25C. Symbol Parameter Conditions Min. Typ. Max. Units 4.0 V Basic Operation VIN Supply Voltage 1.2 IQ(OFF) Off Supply Current VON=GND, VOUT=Open, VIN=4V ISD(OFF) Off Switch Current VON=GND, VOUT=GND IQ Quiescent Current IOUT=0mA VIN=3.3V, IOUT=200mA, TA=25C RON On Resistance 50 100 nA 1 A 1.5 A 66 VIN=1.8V, IOUT=200mA, TA=25C 77 91 VIN=1.2V, IOUT=200mA, TA=25C 150 160 VIN=1.8V, IOUT=200mA, TA=85C m 100 VIN=3.3V, VON=0V, IFORCE=20mA, TA=25C, FPF1208 RPD Output Discharge RPULL DOWN VIH On Input Logic HIGH Voltage VIL On Input Logic LOW Voltage VIN=1.2V to 4.0V 0.75 V ION On Input Leakage VON=VIN or GND 1 A Dynamic Characteristics tDON (6) VOUT Rise Time Turn-On Time tDOFF Turn-Off Delay (6) VIN=1.5V to 4.0V 1.1 VIN=3.3V, RL=10, CL=0.1F, TA=25C (6) (6) VOUT Fall Time (6) tOFF Turn-Off Time tDOFF Turn-Off Delay tF VOUT Fall Time tOFF Turn-Off Time tDOFF Turn-Off Delay tF VOUT Fall Time Turn-Off Time (6) tDOFF Turn-Off Delay tF VOUT Fall Time tOFF 0.9 (6) Turn-On Delay tR tOFF VIN <1.5V 110 V (5) tON tF 65 Turn-Off Time (6) VIN=3.3V, RL=10, CL=0.1F, TA=25C, FPF1207 VIN=3.3V, RL=10, CL=0.1F, TA=25C, FPF1208 VIN=3.3V, RL=500, CL=0.1F, TA=25C, FPF1207 VIN=3.3V, RL=500, CL=0.1F, (7) TA=25C, FPF1208 110 110 s FPF1207 / FPF1208 -- IntelliMAXTM Advance Load Switch Electrical Characteristics 220 7 2 s 9 2.0 1.9 s 3.9 10 95 s 105 7.0 10.5 s 17.5 Notes: 5. These parameters are guaranteed by design and characterization; not production tested. 6. tDON/tDOFF/tR/tF are defined in Figure 25. 7. Output discharge path is enabled during device off. (c) 2010 Fairchild Semiconductor Corporation FPF1207 / FPF1208 * Rev. 1.0.0 www.fairchildsemi.com 5 1.00 ON = 0V 0.90 ON = 0V 0.90 VIN SHUTDOWN CURRENT (A) VIN SHUTDOWN CURRENT (A) 1.00 0.80 0.70 0.60 0.50 0.40 0.30 VIN = 4.0V VIN = 3.3V 0.20 VIN = 1.2V 0.10 0.00 0.80 0.70 0.60 0.50 0.40 0.30 85C 0.20 -40C 0.10 25C 0.00 -40 -15 10 35 60 85 1.0 1.5 2.0 TJ, JUNCTION TEMPERATURE (C) 0.30 ON = 0V 0.25 0.20 0.15 0.10 VIN = 3.3V VIN = 1.2V 0.00 4.0 4.5 5.0 5. ON = 0V 0.25 0.20 0.15 -40C 0.10 25C 0.05 85C 0.00 -40 -15 10 35 60 85 1.0 1.5 2.0 TJ, JUNCTION TEMPERATURE (C) 2.5 3.0 3.5 4.0 4.5 5.0 5. SUPPLY VOLTAGE (V) Figure 9. Off Supply Current vs. Temperature (FPF1207, VOUT Floating) Figure 10. Off Supply Current vs. Supply Voltage (FPF1207, VOUT Floating) 1.40 1.80 ON = VIN 1.60 1.20 VIN = 4.0V 1.00 SUPPLY CURRENT (A) SUPPLY CURRENT (A) 3.5 Figure 8. Shutdown Current vs. Supply Voltage OFF SUPPLY CURRENT (A) OFF SUPPLY CURRENT (A) 0.30 0.05 3.0 SUPPLY VOLTAGE (V) Figure 7. Shutdown Current vs. Temperature VIN = 4.0V 2.5 FPF1207 / FPF1208 -- IntelliMAXTM Advance Load Switch Typical Performance Characteristics 0.80 VIN = 3.3V 0.60 0.40 VIN = 1.2V 0.20 ON = VIN 1.40 1.20 25C 1.00 85C 0.80 -40C 0.60 0.40 0.20 0.00 0.00 -40 -15 10 35 60 85 TJ, JUNCTION TEMPERATURE (C) 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5. SUPPLY VOLTAGE (V) Figure 11. Quiescent Current vs. Temperature (c) 2010 Fairchild Semiconductor Corporation FPF1207 / FPF1208 * Rev. 1.0.0 1.0 Figure 12. Quiescent Current vs. Supply Voltage www.fairchildsemi.com 6 160 160 VIN = 1.2V 120 100 80 VIN = 3.3V 60 40 ON = VIN IOUT = 200mA 140 ON RESISTANCE (m) ON RESISTANCE (m) 140 120 100 80 -40C ON = VIN IOUT = 200mA 0 25C 40 VIN = 4.0V 20 85C 60 20 0 -40 -15 10 35 60 85 1.2 1.7 2.2 TJ, JUNCTION TEMPERATURE (C) 4.2 4.7 1000 1.05 1.00 VIH 0.95 0.90 VIL 0.85 5.2 VIN = 3.3V CL = 0.1F RL = 10 1.10 RISE/FALL TIME (us) ON INPUT LOGIC VOLTAGE (V) 3.7 Figure 14. RON vs. Supply Voltage 25C 1.15 3.2 SUPPLY VOLTAGE (V) Figure 13. RON vs. Temperature 1.20 2.7 tR 100 10 0.80 tF 0.75 FPF1207 / FPF1208 -- IntelliMAXTM Advance Load Switch Typical Performance Characteristics 1 0.70 1.0 1.5 2.0 2.5 3.0 3.5 -40 4.0 -15 10 SUPPLY VOLTAGE (V) 60 85 Figure 16. VOUT Rise and Fall Time vs. Temperature at RL=10 Figure 15. ON-Pin Threshold vs. VIN 100 VIN = 3.3V CL = 0.1F RL = 10 90 ON/OFF DELAY TIME (s) 35 TJ, JUNCTION TEMPERATURE (C) 80 tdon 70 60 50 40 30 20 tdoff 10 0 -40 -15 10 35 60 85 TJ, JUNCTION TEMPERATURE (C) Figure 17. VOUT Turn-On and Turn-Off Delay vs. Temperature at RL=10 (c) 2010 Fairchild Semiconductor Corporation FPF1207 / FPF1208 * Rev. 1.0.0 www.fairchildsemi.com 7 90 100 85 80 75 tR 70 65 60 VIN = 3.3V CL = 0.1F RL = 500 55 50 -40 -15 10 VIN = 3.3V CL = 0.1F RL = 500 80 tF 90 ON/OFF DELAY TIME (s) RISE/FALL TIME (s) 95 35 60 70 tdon 60 50 40 30 20 tdoff 10 0 -40 85 TJ, JUNCTION TEMPERATURE (C) -15 10 35 60 85 TJ, JUNCTION TEMPERATURE (C) Figure 18. VOUT Rise and Fall Time vs. Temperature at RL=500 Figure 19. VOUT Turn-On and Turn-Off Delay vs. Temperature at RL=500 Figure 20. Turn-On Response (VIN=3.3V, CIN=1F, COUT=0.1F, RL=10) Figure 21. Turn-Off Response (VIN=3.3V, CIN=1F, COUT=0.1F, RL=10) FPF1207 / FPF1208 -- IntelliMAXTM Advance Load Switch Typical Performance Characteristics Figure 22. Turn-Off Response (FPF1207 = No Output Pull-Down Resistor) (VIN=3.3V, CIN=1F, COUT=0.1F, RL=500) (c) 2010 Fairchild Semiconductor Corporation FPF1207 / FPF1208 * Rev. 1.0.0 www.fairchildsemi.com 8 100 10ms 100ms 10 ID, DRAIN CURRENT (A) ID, DRAIN CURRENT (A) 100 1s 10s 1 RDS(ON) LIMIT DC 0.1 VGS = 10.0V SINGLE PULSE RJA = 125oC/W TA = 25oC 0.01 0.0100 0.1000 1.0000 10.0000 VDS, DRAIN-SOURCE VOLTAGE (V) 10ms 100ms 10 1s 10s 1 RDS(ON) LIMIT VGS = 10.0V SINGLE PULSE RJA = 125oC/W TA = 25oC 0.1 0.01 0.0100 100.0000 Figure 23. ISW vs. VDS -- SOA of FPF1207 DC 0.1000 1.0000 10.0000 VDS, DRAIN-SOURCE VOLTAGE (V) Figure 24. ISW vs. VDS -- SOA of FPF1208 Timing Diagram 90% VOUT 100.0000 90% 10% 10% tR FPF1207 / FPF1208 -- IntelliMAXTM Advance Load Switch Typical Performance Characteristics tF 3.3V 50% 50% VON 90% 10% VOUT tDOFF tDON Figure 25. Timing Diagram Notes: 8. tON=tR + tDON. 9. tOFF=tF + tDOFF. (c) 2010 Fairchild Semiconductor Corporation FPF1207 / FPF1208 * Rev. 1.0.0 www.fairchildsemi.com 9 The FPF1207 and FPF1208 are low-RON P-channel load switches with controlled turn-on. The core of each device is a 50m P-channel MOSFET and controller capable of functioning over a wide input operating range of 1.2-4.0V. The ON pin, an active HIGH GIOP/CMOScompatible input, controls the state of the switch. board inductance from forcing VOUT below GND when the switch is on. CIN greater than COUT is highly recommended. COUT greater than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow through the body diode from VOUT to VIN. The FPF1208 contains a 65 on-chip load resistor for quick output discharge when the switch is turned off. Board Layout For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effect that parasitic trace inductance may have on normal and short-circuit operation. Using wide traces or large copper planes for all pins (VIN, VOUT, ON, and GND) helps minimize the parasitic electrical effects along with minimizing the case ambient thermal impedance. However, the VOUT pin of FPF1208 should not connect directly the battery source due to the discharge mechanism of the load switch. Input Capacitor To limit the voltage drop on the input supply caused by transient inrush current when the switch turns on into a discharged load capacitor or short-circuit, a capacitor must be placed between the VIN and GND pins. A 1F ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher-value CIN can be used to reduce the voltage drop in higher-current applications. Output Capacitor A 0.1F capacitor, COUT, should be placed between the VOUT and GND pins. This capacitor prevents parasitic FPF1207 / FPF1208 -- IntelliMAXTM Advance Load Switch Operation and Application Description Figure 26. Typical Application (c) 2010 Fairchild Semiconductor Corporation FPF1207 / FPF1208 * Rev. 1.0.0 www.fairchildsemi.com 10 FPF1207 / FPF1208 -- IntelliMAXTM Advance Load Switch Physical Dimensions 0.03 C 2X F E A 0.40 B O0.20 Cu Pad A1 0.40 D BALL A1 INDEX AREA O0.30 Solder Mask 0.03 C 2X TOP VIEW RECOMMENDED LAND PATTERN (NSMD PAD TYPE) 0.06 C 0.2920.018 0.539 0.461 0.05 C C E 0.2080.021 SEATING PLANE SIDE VIEWS D NOTES: A. NO JEDEC REGISTRATION APPLIES. 0.005 B. DIMENSIONS ARE IN MILLIMETERS. C A B O0.2600.020 4X 0.40 B A 0.40 C. DIMENSIONS AND TOLERANCE PER ASME Y14.5M, 1994. D. DATUM C IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS. (Y)0.018 F 1 2 E. PACKAGE NOMINAL HEIGHT IS 500 MICRONS 39 MICRONS (461-539 MICRONS). (X)0.018 F. FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. BOTTOM VIEW G. DRAWING FILNAME: MKT-UC004AFrev1. Figure 27. 4 Ball, 0.76 x 0.76 mm Wafer Level Chip Scale WLCSP Packaging Product-Specific Dimensions Product D E X Y FPF1207UCX 760m 30m 760m 30m 0.180mm 0.018m 0.180mm 0.018m FPF1208UCX 760m 30m 760um 30m 0.180mm 0.018m 0.180mm 0.018m Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild's worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor's online packaging area for the most recent package drawing: http://www.fairchildsemi.com/packaging/. (c) 2010 Fairchild Semiconductor Corporation FPF1207 / FPF1208 * Rev. 1.0.0 www.fairchildsemi.com 11 FPF1207 / FPF1208 -- IntelliMAXTM Advance Load Switch (c) 2010 Fairchild Semiconductor Corporation FPF1207 / FPF1208 * Rev. 1.0.0 www.fairchildsemi.com 12