®
®
. . . . . Engineered solutions for the transient environment
2929 South Fair Lane • Tempe, Arizona 85282 • USA
Tel 602-431-8101 • Fax 602-431-2288 • E-mail sales@protek-tvs.com • Web www.protek-tvs.com 1
PSLVU2.8PSLVU2.8
PSLVU2.8PSLVU2.8
PSLVU2.8
LOW CAPACITANCE TVS SOT-23
IEC 1000-4 COMPATIBLE
SOT-23 PACKAGE
CIRCUIT DIAGRAM
APPLICATIONS
●Low Voltage ASICs
●USB, ATM & SCSI Interfaces
●Ethernet & FireWire
●Cellular Phones
●Portable Electronics
FEATURES
●IEC 1000-4-2 & -4 Industry Requirements
●300 Watts Peak Pulse Power Dissipation (8/20 µs)
●Low Capacitance - 10 pF
●ESD Protection > 25 kilovolts
●IPP - 24A, 8/20 µs Waveshape
●Standard SOT-23 Package
●Low Clamping Voltage
●UL 94V-0 Flammability Classification
DESCRIPTION
The PSLVU2.8 transient voltage suppressor (TVS) array is designed for high speed
data line applications that provide protection against ESD, tertiary lightning and
switching (logic level) transients. This device protects in accordance with
Electromagnetic Compatibility (EMC) transient immunity standards IEC 1000-4-2, -4
and European standard EN50082 and EN61000-4.
The PSLVU2.8 offers low clamping voltage for the protection of sensitive CMOS,
BiCMOS, HCMOS and HSIC components. This device protects one unidirectional
line and has a peak pulse power (PPP) rating of 300 W atts for an 8/20 µs waveshape.
1
2
3
MAXIMUM RATINGS
Package
Packaging
Approximate Weight
Device Markings
Molded JEDEC SOT-23 Surface Mount Package
8mm Tape per EIA 481-1
10 milligrams
Marking Code
MECHANICAL CHARACTERISTICS
PPP @ 25°C (See Figure 1)
Operating & Storage Temperature
Repetition Rate (Duty Cycle)
tClamping (0 Volts to V(BR) Min.)
300 Watts, 8/20 µs Waveshape
-55° to +150°C
0.01%
Unidirectional: < 1 x 10-12 seconds
LINE DRIVER APPLICATION
LINE RECEIVER APPLICATION
®
25103 5/99
0.1 1 10 100 1,000 10,000
td - Pulse Duration - µs
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
10,000
1,000
100
10
PPP - Peak Pulse Power - Watts
300W, 8/20 µs Waveshape
0 10 20 30
t - Time - µs
FIGURE 2
PULSE WAVE FORM
100
50
0
td = t IPP/ 2
e-t
Peak Value IPP TEST
WAVEFORM
PARAMETERS
tf = 8 µs
td = 20µs
tf
IPP - Peak Pulse Current - % of IPP
0 25 50 75 100 125 150
TL - Lead Temperature - °C
FIGURE 3
POWER DERATING CURVE
100
80
60
40
20
0
% Of Rated Power
Average Power
Peak Pulse Power
8/20 µs
RATED
STAND-OFF
VOLTAGE
VWM
VOLTS
PROTEK
PART
NUMBER
MINIMUM
BREAKDOWN
VOLTAGE
@ 1 mA
V(BR)
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ IP = 5 A
VC
VOLTS
MAXIMUM
CAPACITANCE
@ 0V, 1 MHz
C
pF
ELECTRICAL CHARACTERISTICS @ 25° C Ambient Temperature
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ IP = 2 A
VC
VOLTS
PSLVU2.8 3.1
2.8 3.9 7.0 100 10
DEVICE
MARKING
CODE
MAXIMUM
LEAKAGE
CURRENT
@ VWM
ID
µA
PRV
2929 South Fair Lane • Tempe, Arizona 85282 • USA
Tel 602-431-8101 • Fax 602-431-2288 • E-mail sales@protek-tvs.com • Web www.protek-tvs.com 3
PSLVU2.8PSLVU2.8
PSLVU2.8PSLVU2.8
PSLVU2.8
PACKAGE OUTLINES & DIMENSIONS
COPYRIGHT © ProTek Devices 1999
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in
furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
SOT-23 PACKAGE DIMENSIONS
NOTES:
1. Dimensioning and tolerance per ANSI Y 14.5M,
1985.
2. Controlling Dimension: Inches
3. Maximum lead thickness includes lead finish
thickness.
4. Minimum lead thickness is the minimum thickness
of the base material.
4. Pin 3 is the cathode (Unidirectional only).
MILLIMETERS
DIM
INCHES
MIN MAX MIN MAX
A
B
C
D
G
H
J
K
L
S
V
2.80
1.20
0.89
0.37
1.78
0.013
0.085
0.45
0.89
2.10
0.45
3.04
1.40
1.11
0.50
2.04
0.100
0.177
0.60
1.02
2.50
0.60
0.1102
0.0472
0.0350
0.0150
0.0701
0.0005
0.0034
0.0180
0.0350
0.0830
0.0177
0.1197
0.0551
0.0440
0.0200
0.0807
0.0040
0.0070
0.0236
0.0401
0.0984
0.0236
SOT-23 PACKAGE OUTLINE
A
L
BS
G
V
DH
C
KJ
0° - 10 °
3
12
SOLDER PAD LAYOUT
TYPICAL
DIM Inches
1
2
3
4
5
0.85
0.95
0.95
2.00
0.85
0.033
0.037
0.037
0.079
0.033
Millimeters
1
23
4
5