Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC3240TB
3.3 V, SILICON MMIC WIDE BAND AMPLIFIER
Document No. PU10751EJ01V0DS (1st edition)
Date Published February 2009 NS
DESCRIPTION
The
PC3240TB is a silicon monolithic integrated circuit designed as IF amplifier for DBS LNB.
This device exhibits low noise figure and high power gain characteristics.
This IC is manufactured using our UHS0 (Ultra High Speed Process) bipolar process.
FEATURES
•Low current : ICC = 13 mA TYP.
•High linearity : PO (1 dB) = +1 dBm TYP. @ f = 1.0 GHz
: PO (1 dB) = 4 dBm TYP. @ f = 2.2 GHz
•Power gain : GP = 25 dB TYP. @ f = 1.0 GHz
: GP = 24.5 dB TYP. @ f = 2.2 GHz
•Gain flatness :
GP = 1.0 dB TYP. @ f = 1.0 to 2.2 GHz
•Noise figure : NF = 4.3 dB TYP. @ f = 1.0 GHz
: NF = 4.5 dB TYP. @ f = 2.2 GHz
•Supply voltage : VCC = 3.0 to 3.6 V
•Port impedance : input/output 50
APPLICATIONS
•IF amplifiers in DBS LNB, other L-band amplifiers, etc.
ORDERING INFORMATION
Part Number
Order Number
Package
Marking
Supplying Form
PC3240TB-E3
PC3240TB-E3-A
6-pin super minimold
(Pb-Free)
C3W
Embossed tape 8 mm wide
Pin 1, 2, 3 face the perforation side of the tape
Qty 3 kpcs/reel
Remark To order evaluation samples, please contact your nearby sales office.
Part number for sample order:
PC3240TB-A
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Data Sheet PU10751EJ01V0DS
PC3240TB
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin No.
Pin Name
1
OUTPUT
2
GND
3
VCC
4
INPUT
5
GND
6
NC Note
Note NC: Non-Connection
(Connect with pin 5)
Remark A NC pin is non-connection in the mold package. (When NC pin is open state, it will get influences of
floating capacitance. Therefore, we recommend connect to NC pin and GND pin).
PRODUCT LINE-UP OF 5 V or 3.3 V-BIAS SILICON MMIC WIDE BAND AMPLIFIER
(TA = +25°C, VCC = 5.0 V or 3.3 V, ZS = ZL = 50 )
Part No.
VCC
(V)
ICC
(mA)
GP
(dB)
NF
(dB)
PO (sat)
(dBm)
PO (1 dB)
(dBm)
Package
Marking
PC2711TB
5.0
12.0
13.0 (1.0 GHz)
5.0 (1.0 GHz)
＋1.0 (1.0 GHz)
–
6-pin
super
minimold
C1G
PC2712TB
12.0
20.0 (1.0 GHz)
4.5 (1.0 GHz)
＋3.0 (1.0 GHz)
–
C1H
PC3215TB
14.0
20.5 (1.5 GHz)
2.3 (1.5 GHz)
＋3.5 (1.5 GHz)
＋1.5 (1.5 GHz)
C3H
PC3224TB
9.0
21.5 (1.0 GHz)
21.5 (2.2 GHz)
4.3 (1.0 GHz)
4.3 (2.2 GHz)
＋4.0 (1.0 GHz)
＋1.5 (2.2 GHz)
–3.5 (1.0 GHz)
–5.5 (2.2 GHz)
C3K
PC3227TB
4.8
22.0 (1.0 GHz)
22.0 (2.2 GHz)
4.7 (1.0 GHz)
4.6 (2.2 GHz)
–1.0 (1.0 GHz)
–3.5 (2.2 GHz)
–6.5 (1.0 GHz)
–8.0 (2.2 GHz)
C3P
PC3240TB
3.3
13.0
25 (1.0 GHz)
24.5 (2.2 GHz)
4.3 (1.0 GHz)
4.5 (2.2 GHz)
–
–
＋1.0 (1.0 GHz)
–4.0 (2.2 GHz)
C3W
Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
DISCONTINUED
Data Sheet PU10751EJ01V0DS
3
PC3240TB
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Conditions
Ratings
Unit
Supply Voltage
VCC
TA = +25°C
4.0
V
Total Circuit Current
ICC
TA = +25°C
25
mA
Power Dissipation
PD
TA = +85C Note
270
mW
Operating Ambient Temperature
TA
40 to +85
°C
Storage Temperature
Tstg
55 to +150
°C
Input Power
Pin
TA = +25°C
10
dBm
Note Mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass PWB
RECOMMENDED OPERATING RANGE
Parameter
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
Supply Voltage
VCC
3.0
3.3
3.6
V
Operating Ambient Temperature
TA
40
+25
+85
°C
Input Power
Pin
20
dBm
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Data Sheet PU10751EJ01V0DS
PC3240TB
ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = 3.3 V, ZS = ZL = 50 , unless otherwise
specified)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Circuit Current
ICC
No input signal
9.5
13
17
mA
Power Gain 1
GP1
f = 0.25 GHz, Pin = 40 dBm
22
25
28
dB
Power Gain 2
GP2
f = 1.0 GHz, Pin = 40 dBm
22
25
28
Power Gain 3
GP3
f = 1.8 GHz, Pin = 40 dBm
22.5
25.5
28.5
Power Gain 4
GP4
f = 2.2 GHz, Pin = 40 dBm
21.5
24.5
27.5
Gain 1 dB Compression Output Power
1
PO (1 dB) 1
f = 1.0 GHz
2
+1
dBm
Gain 1 dB Compression Output Power
2
PO (1 dB) 2
f = 2.2 GHz
7
4
Noise Figure 1
NF1
f = 1.0 GHz
4.3
5.1
dB
Noise Figure 2
NF2
f = 2.2 GHz
4.5
5.3
Isolation 1
ISL1
f = 1.0 GHz, Pin = 40 dBm
37
42
dB
Isolation 2
ISL2
f = 2.2 GHz, Pin = 40 dBm
37
44
Input Return Loss 1
RLin1
f = 1.0 GHz, Pin = 40 dBm
10
23
dB
Input Return Loss 2
RLin2
f = 2.2 GHz, Pin = 40 dBm
10
13
Output Return Loss 1
RLout1
f = 1.0 GHz, Pin = 40 dBm
8
12
dB
Output Return Loss 2
RLout2
f = 2.2 GHz, Pin = 40 dBm
7
12
STANDARD CHARACTERISTICS FOR REFERENCE
(TA = +25°C, VCC = 3.3 V, ZS = ZL = 50 , unless otherwise specified)
Parameter
Symbol
Test Conditions
Reference Value
Unit
Power Gain 5
GP5
f = 2.6 GHz, Pin = 40 dBm
22.5
dB
Power Gain 6
GP6
f = 3.0 GHz, Pin = 40 dBm
20
Gain Flatness
GP
f = 1.0 to 2.2 GHz, Pin = 40 dBm
1.0
dB
K factor 1
K1
f = 1.0 GHz, Pin = 40 dBm
3.2
K factor 2
K2
f = 2.2 GHz, Pin = 40 dBm
4.6
Output 3rd Order Intercept Point 1
OIP31
f1 = 1 000 MHz, f2 = 1 001 MHz
12.5
dBm
Output 3rd Order Intercept Point 2
OIP32
f1 = 2 200 MHz, f2 = 2 201 MHz
5.5
Input 3rd Order Intercept Point 1
IIP31
f1 = 1 000 MHz, f2 = 1 001 MHz
13
dBm
Input 3rd Order Intercept Point 2
IIP32
f1 = 2 200 MHz, f2 = 2 201 MHz
19
2nd Order Intermodulation Distortion
IM2
f1 = 1 000 MHz, f2 = 1 001 MHz,
Pin = 40 dBm/tone
38
dBc
2nd Harmonics
2f0
f0 = 1.0 GHz, Pin = 40 dBm
44
dBc
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Data Sheet PU10751EJ01V0DS
5
PC3240TB
TEST CIRCUIT
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
COMPONENTS OF TEST CIRCUIT FOR MEASURING
ELECTRICAL CHARACTERISTICS
Type
Value
C1, C2
Chip Capacitor
100 pF
C3
Chip Capacitor
1 000 pF
C4
Feed-through Capacitor
1 000 pF
CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS
Capacitors of 1 000 pF are recommendable as the bypass capacitor for the VCC pin and the coupling capacitors for
the input and output pins.
The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias
can be supplied against VCC fluctuation.
The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial
impedance. Their capacitances are therefore selected as lower impedance against a 50 load. The capacitors thus
perform as high pass filters, suppressing low frequencies to DC.
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Data Sheet PU10751EJ01V0DS
PC3240TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
Notes
1. 30 30 0.4 mm double sided 35

m copper clad
polyimide board.
2. Back side: GND pattern
3. Au plated on pattern
4. : Through holes
COMPONENT LIST
Value
Size
C1, C2
100 pF
1608
C3
1 000 pF
1005
C4
1 000 pF
Feed-through Capacitor
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Data Sheet PU10751EJ01V0DS
7
PC3240TB
TYPICAL CHARACTERISTICS (TA = +25C, VCC = 3.3 V, ZS = ZL = 50 , unless otherwise specified)
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10751EJ01V0DS
PC3240TB
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10751EJ01V0DS
9
PC3240TB
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10751EJ01V0DS
10
PC3240TB
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10751EJ01V0DS
11
PC3240TB
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10751EJ01V0DS
12
PC3240TB
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10751EJ01V0DS
13
PC3240TB
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10751EJ01V0DS
14
PC3240TB
S-PARAMETERS (TA = +25C, VCC = 3.3 V, Pin = 40 dBm)
S11FREQUENCY
S22FREQUENCY
Remarks 1. Measured on the test circuit of evaluation board.
2. The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10751EJ01V0DS
15
PC3240TB
S-PARAMETERS
DISCONTINUED
Data Sheet PU10751EJ01V0DS
16
PC3240TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
DISCONTINUED
Data Sheet PU10751EJ01V0DS 17
PC3240TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground terminals must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to the VCC line.
(4) The DC cut capacitor must be attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature (package surface temperature) : 260C or below
Time at peak temperature : 10 seconds or less
Time at temperature of 220C or higher : 60 seconds or less
Preheating time at 120 to 180C : 12030 seconds
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
IR260
Wave Soldering
Peak temperature (molten solder temperature) : 260C or below
Time at peak temperature : 10 seconds or less
Preheating temperature (package surface temperature) : 120C or below
Maximum number of flow processes : 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (terminal temperature) : 350C or below
Soldering time (per side of device) : 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
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