Document Number: 28747 For technical questions, contact: thinfilm.chipfuse@vishay.com www.vishay.com
Revision: 06-May-10 1
Thin Film Chip Fuses
MFU Series
Vishay Beyschlag
MFU Thin Film Chip Fuses are the perfect choice for the
most fields of modern electronics. The highly controlled
manufacturing thin film process guarantees an outstanding
stability of fusing characteristics. Typical applications include
information technology, telecommunication, medical
equipment, industrial, audio/video, and automotive
electronics.
FEATURES
•Advanced thin film technology
•Very quick acting fuse characteristics
•Outstanding stability of fusing characteristics
•Standard SMD sizes
•Green product, supports lead (Pb)-free soldering
•Halogen-free according to IEC 61249-2-21 definition
•Compliant to RoHS directive 2002/95/EC
APPLICATIONS
•Information technology
•Industrial electronics
•Automotive electronics
•Telecommunication
•Medical equipment
•Audio/video electronics
SIZE
INCH 0402 0603 0805 1206
METRIC 1005M 1608M 2012M 3216M
TECHNICAL SPECIFICATIONS
DESCRIPTION MFU 0402 MFU 0603 MFU 0805 MFU 1206
Metric size 1005M 1608M 2012M 3216M
Rated Current range IR0.5 A to 3.15 A 0.5 A to 5.0 A 0.5 A to 5.0 A 0.5 A to 6.3 A
Rated voltage, Umax. DC 32 V 32 V 32 V 63 V
Breaking Capacity,
Imax. at Umax. DC 50 A at 32 V 50 A at 32 V 50 A at 32 V 50 A at 63 V
Voltage drop at 1 x IR90 mV to 368 mV 85 mV to 361 mV 98 mV to 374 mV 116 mV to 433 mV
Cold resistance at 0.1 x IR22 mΩ to 560 mΩ13 mΩ to 550 mΩ15 mΩ to 570 mΩ14 mΩ to 660 mΩ
Climatic category (LCT/UCT/days) 55/125/56 55/125/56 55/125/56 55/125/56
Permissible continuous
current rating at
ϑ
amb = 23 °C 0.7 x IR0.7 x IR0.7 x IR0.7 x IR
Approval
UL recognition file E253806 E253806 E253806 E253806
IEC 60127-4 n/a Refer to table:
MFU 0603 RATING
Refer to table:
MFU 1206 RATING
FITobserved ≤ 0.2 x 10- 9/h ≤ 0.2 x 10- 9/h ≤ 0.2 x 10- 9/h ≤ 0.2 x 10- 9/h
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2Revision: 06-May-10
MFU Series
Vishay Beyschlag Thin Film Chip Fuses
Notes
(1) Products can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION
(2) Please refer to table PACKAGING
PART NUMBER AND PRODUCT DESCRIPTION (1)
PART NUMBER: MFU0603FF01000PW00
MODEL/SIZE FUSE CHARACTERISTIC RATED CURRENT VALUE PACKAGING (2) SPECIAL
MFU0402
MFU0603
MFU0805
MFU1206
FF = Very quick acting Rated current value in mA
Examples:
0.5 A = 00500
1.0 A = 01000
6.3 A = 06300
E1
E5
E0
P1
P5
PW
Up to 2 digits
00 = Standard
PRODUCT DESCRIPTION: MFU 0603 -FF PW 1A0
MFU 0603 -FF PW 1A0
MODEL SIZE FUSE CHARACTERISTIC PACKAGING (2) RATED CURRENT VALUE
MFU 0402
0603
0805
1206
FF = Very quick acting E1
E5
E0
P1
P5
PW
Rated current value in mA
Examples:
0.5 A = 0A5
1.0 A = 1A0
6.3 A = 6A3
PACKAGING
MODEL
REEL
DIAMETER PIECES/REEL
CODE
MFU0402
180 mm/7" 1000 E1
180 mm/7" 5000 E5
180 mm/7" 10 000 E0
MFU0603
180 mm/7" 1000 P1
180 mm/7" 5000 P5
330 mm/13" 20 000 PW
MFU0805
180 mm/7" 1000 P1
180 mm/7" 5000 P5
330 mm/13" 20 000 PW
MFU1206
180 mm/7" 1000 P1
180 mm/7" 5000 P5
330 mm/13" 20 000 PW
MFU0603FF01000PW00
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Revision: 06-May-10 3
MFU Series
Thin Film Chip Fuses Vishay Beyschlag
DIMENSIONS
SOLDER PAD DIMENSIONS
Note
• The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in
publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other
parameters.
DIMENSIONS - Chip fuse types, mass and relevant physical dimensions
TYPE H
(mm)
L
(mm)
W
(mm)
WT
(mm)
T1
(mm)
T2
(mm)
MASS
(mg)
MFU 0402 0.32 ± 0.07 1.0 ± 0.05 0.5 ± 0.05 > 75 % of W 0.2 + 0.1/- 0.15 0.2 ± 0.1 0.65
MFU 0603 0.45 + 0.1/- 0.05 1.55 ± 0.05 0.85 ± 0.1 > 75 % of W 0.3 + 0.15/- 0.2 0.3 + 0.15/- 0.2 1.9
MFU 0805 0.45 + 0.1/- 0.05 2.0 ± 0.1 1.25 ± 0.15 > 75 % of W 0.4 + 0.1/- 0.2 0.4 + 0.1/- 0.2 4.7
MFU 1206 0.55 ± 0.1 3.2 + 0.1/- 0.2 1.6 ± 0.15 > 75 % of W 0.5 ± 0.25 0.5 ± 0.25 9.5
RECOMMENDED SOLDER PAD DIMENSIONS
TYPE
WAVE SOLDERING REFLOW SOLDERING
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
MFU 0402 - - - - 0.35 0.55 0.55 1.45
MFU 0603 0.55 1.10 1.10 2.75 0.65 0.70 0.95 2.05
MFU 0805 0.80 1.25 1.50 3.30 0.90 0.90 1.40 2.70
MFU 1206 1.40 1.50 1.90 4.40 1.50 1.15 1.75 3.80
T2
T1
L
H
WWT
GX
Y
Z
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4Revision: 06-May-10
MFU Series
Vishay Beyschlag Thin Film Chip Fuses
Notes
(1) Other values of rated current are available on request
(2) Typical values
(3) For packages with 1000 pieces, please use for packaging E1 instead of E5
(4) For packages with 10 000 pieces, please use for packaging E0 instead of E5
(5) Available on request
Notes
(6) Other values of rated current are available on request
(7) Typical values
(8) For packages with 1000 pieces, please use for packaging P1 instead of P5
(9) For packages with 20 000 pieces, please use for packaging PW instead of P5
MFU 0402 RATING - Very quick acting (FF)
SIZE FUSE
CHAR.
RATED
CURRENT
(1)
RATED
VOLTAGE
PRE-ARCING
(2)
I
2
t
at 10 x
I
R
VOLT.
DROP
(2)
at
1 x
I
R
COLD
RESIS
(2)
at
0.1 x
I
R
BREAKING
CAPACITY
DC
MARK. APPROVAL PART NUMBER
(3)(4)
0402 FF
500 mA
(5)
32 V 0.0009 A
2
s 368 mV 560 m
Ω
50 A at 32 V - UL
MFU0402FF00500E500
630 mA
(5)
32 V 0.0014 A
2
s 331 mV 400 m
Ω
50 A at 32 V - UL
MFU0402FF00630E500
750 mA
(5)
32 V 0.0020 A
2
s 275 mV 280 m
Ω
50 A at 32 V - UL
MFU0402FF00750E500
800 mA 32 V 0.0023 A
2
s 231 mV 220 m
Ω
50 A at 32 V - UL
MFU0402FF00800E500
1.0 A 32 V 0.0028 A
2
s 184 mV 140 m
Ω
50 A at 32 V - UL
MFU0402FF01000E500
1.25 A 32 V 0.0039 A
2
s 159 mV 97 m
Ω
50 A at 32 V - UL
MFU0402FF01250E500
1.5 A 32 V 0.0059 A
2
s 146 mV 74 m
Ω
50 A at 32 V - UL
MFU0402FF01500E500
1.6 A 32 V 0.0065 A
2
s 136 mV 65 m
Ω
50 A at 32 V - UL
MFU0402FF01600E500
1.75 A 32 V 0.0077 A
2
s 124 mV 54 m
Ω
50 A at 32 V - UL
MFU0402FF01750E500
2.0 A 32 V 0.0101 A
2
s 115 mV 44 m
Ω
50 A at 32 V - UL
MFU0402FF02000E500
2.5 A 32 V 0.0157 A
2
s 107 mV 33 m
Ω
50 A at 32 V - UL
MFU0402FF02500E500
3.0 A 32 V 0.0227 A
2
s 95 mV 24 m
Ω
50 A at 32 V - UL
MFU0402FF03000E500
3.15 A 32 V 0.0250 A
2
s 90 mV 22 m
Ω
50 A at 32 V - UL
MFU0402FF03150E500
MFU 0603 RATING - Very quick acting (FF)
SIZE FUSE
CHAR.
RATED
CURRENT
(6)
RATED
VOLTAGE
PRE-ARCING
(7)
I
2
t
at 10 x
I
R
VOLT.
DROP
(7)
at
1 x
I
R
COLD
RESIS
(7)
at
0.1 x
I
R
BREAKING
CAPACITY
DC
MARK. APPROVAL PART NUMBER
(8)(9)
0603 FF
500 mA 32 V 0.0009 A
2
s 361 mV 550 m
Ω
50 A at 32 V F UL/IEC
MFU0603FF00500P500
630 mA 32 V 0.0014 A
2
s 331 mV 400 m
Ω
50 A at 32 V CT UL
MFU0603FF00630P500
750 mA 32 V 0.0020 A
2
s 258 mV 262 m
Ω
50 A at 32 V G UL
MFU0603FF00750P500
800 mA 32 V 0.0023 A
2
s 249 mV 237 m
Ω
50 A at 32 V CV UL
MFU0603FF00800P500
1.0 A 32 V 0.0028 A
2
s 223 mV 170 m
Ω
50 A at 32 V H UL/IEC
MFU0603FF01000P500
1.25 A 32 V 0.0039 A
2
s 180 mV 110 m
Ω
50 A at 32 V J UL
MFU0603FF01250P500
1.5 A 32 V 0.0059 A
2
s 155 mV 79 m
Ω
50 A at 32 V K UL
MFU0603FF01500P500
1.6 A 32 V 0.0065 A
2
s 159 mV 76 m
Ω
50 A at 32 V EF UL/IEC
MFU0603FF01600P500
1.75 A 32 V 0.0077 A
2
s 138 mV 60 m
Ω
50 A at 32 V L UL
MFU0603FF01750P500
2.0 A 32 V 0.0101 A
2
s 150 mV 57 m
Ω
50 A at 32 V N UL/IEC
MFU0603FF02000P500
2.5 A 32 V 0.0157 A
2
s 121 mV 37 m
Ω
50 A at 32 V O UL
MFU0603FF02500P500
3.0 A 32 V 0.0227 A
2
s 126 mV 32 m
Ω
50 A at 32 V P UL
MFU0603FF03000P500
3.15 A 32 V 0.0250 A
2
s 120 mV 29 m
Ω
50 A at 32 V EL UL/IEC
MFU0603FF03150P500
3.5 A 32 V 0.0308 A
2
s 106 mV 23 m
Ω
50 A at 32 V R UL
MFU0603FF03500P500
4.0 A 32 V 0.0403 A
2
s 100 mV 19 m
Ω
50 A at 32 V S UL
MFU0603FF04000P500
5.0 A 32 V 0.2275 A
2
s 85 mV
13 mΩ
50 A at 32 V
T
UL
MFU0603FF05000P500
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Revision: 06-May-10 5
MFU Series
Thin Film Chip Fuses Vishay Beyschlag
Notes
(1) Other values of rated current are available on request
(2) Typical values
(3) For packages with 1000 pieces, please use for packaging P1 instead of P5
(4) For packages with 20 000 pieces, please use for packaging PW instead of P5
MFU 0805 RATING - Very quick acting (FF)
SIZE FUSE
CHAR.
RATED
CURRENT
(1)
RATED
VOLTAGE
PRE-ARCING
(2)
I
2
t
at 10 x
I
R
VOLT.
DROP
(2)
at
1 x
I
R
COLD
RESIS
(2)
at
0.1 x
I
R
BREAKING
CAPACITY
DC
MARK. APPROVAL PART NUMBER
(3)(4)
0805 FF
500 mA 32 V 0.0009 A
2
s 374 mV 570 m
Ω
50 A at 32 V F UL
MFU0805FF00500P500
630 mA 32 V 0.0014 A
2
s 347 mV 420 m
Ω
50 A at 32 V CT UL
MFU0805FF00630P500
750 mA 32 V 0.0021 A
2
s 280 mV 285 m
Ω
50 A at 32 V G UL
MFU0805FF00750P500
800 mA 32 V 0.0023 A
2
s 262 mV 250 m
Ω
50 A at 32 V CV UL
MFU0805FF00800P500
1.0 A 32 V 0.0028 A
2
s 243 mV 185 m
Ω
50 A at 32 V H UL
MFU0805FF01000P500
1.25 A 32 V 0.0040 A
2
s 205 mV 125 m
Ω
50 A at 32 V J UL
MFU0805FF01250P500
1.5 A 32 V 0.0059 A
2
s 171 mV 87 m
Ω
50 A at 32 V K UL
MFU0805FF01500P500
1.6 A 32 V 0.0065 A
2
s 164 mV 78 m
Ω
50 A at 32 V EF UL
MFU0805FF01600P500
1.75 A 32 V 0.0077 A
2
s 161 mV 70 m
Ω
50 A at 32 V L UL
MFU0805FF01750P500
2.0 A 32 V 0.0101 A
2
s 176 mV 67 m
Ω
50 A at 32 V N UL
MFU0805FF02000P500
2.5 A 32 V 0.0157 A
2
s 131 mV 40 m
Ω
50 A at 32 V O UL
MFU0805FF02500P500
3.0 A 32 V 0.0227 A
2
s 134 mV 34 m
Ω
50 A at 32 V P UL
MFU0805FF03000P500
3.15 A 32 V 0.0250 A
2
s 128 mV 31 m
Ω
50 A at 32 V EL UL
MFU0805FF03150P500
3.5 A 32 V 0.0308 A
2
s 119 mV 26 m
Ω
50 A at 32 V R UL
MFU0805FF03500P500
4.0 A 32 V 0.0403 A
2
s 105 mV 20 m
Ω
50 A at 32 V S UL
MFU0805FF04000P500
5.0 A 32 V 0.2275 A
2
s 98 mV
15 mΩ
50 A at 32 V
T
UL
MFU0805FF05000P500
MFU 1206 RATING - Very quick acting (FF)
SIZE FUSE
CHAR.
RATED
CURRENT
(1)
RATED
VOLTAGE
PRE-ARCING
(2)
I
2
t
at 10 x
I
R
VOLT.
DROP
(2)
at
1 x
I
R
COLD
RESIS
(2)
at
0.1 x
I
R
BREAKING
CAPACITY
DC
MARK. APPROVAL PART NUMBER
(3)(4)
1206 FF
500 mA 63 V 0.0009 A
2
s 433 mV 660 m
Ω
50 A at 63 V F UL/IEC
MFU1206FF00500P500
630 mA 63 V 0.0014 A
2
s 372 mV 450 m
Ω
50 A at 63 V CT UL
MFU1206FF00630P500
750 mA 63 V 0.0022 A
2
s 325 mV 330 m
Ω
50 A at 63 V G UL
MFU1206FF00750P500
800 mA 63 V 0.0023 A
2
s 273 mV 260 m
Ω
50 A at 63 V CV UL
MFU1206FF00800P500
1.0 A 63 V 0.0028 A
2
s 262 mV 200 m
Ω
50 A at 63 V H UL/IEC
MFU1206FF01000P500
1.25 A 63 V 0.0041 A
2
s 230 mV 140 m
Ω
50 A at 63 V J UL
MFU1206FF01250P500
1.5 A 63 V 0.0059 A
2
s 207 mV 105 m
Ω
50 A at 63 V K UL
MFU1206FF01500P500
1.6 A 63 V 0.0066 A
2
s 168 mV 80 m
Ω
50 A at 63 V EF UL/IEC
MFU1206FF01600P500
1.75 A 63 V 0.0077 A
2
s 174 mV 76 m
Ω
50 A at 63 V L UL
MFU1206FF01750P500
2.0 A 63 V 0.0102 A
2
s 181 mV 69 m
Ω
50 A at 63 V N UL/IEC
MFU1206FF02000P500
2.5 A 63 V 0.0159 A
2
s 161 mV 49 m
Ω
50 A at 63 V O UL
MFU1206FF02500P500
3.0 A 63 V 0.0229 A
2
s 173 mV 44 m
Ω
50 A at 63 V P UL
MFU1206FF03000P500
3.15 A 63 V 0.0251 A
2
s 153 mV 37 m
Ω
50 A at 63 V EL UL/IEC
MFU1206FF03150P500
3.5 A 63 V 0.0310 A
2
s 161 mV 35 m
Ω
50 A at 63 V R UL
MFU1206FF03500P500
4.0 A 63 V 0.0404 A
2
s 147 mV 28 m
Ω
50 A at 63 V S UL
MFU1206FF04000P500
5.0 A 63 V 0.2275 A
2
s 131 mV 20 m
Ω
50 A at 63 V T UL
MFU1206FF05000P500
6.3 A 63 V 0.5160 A
2
s 116 mV 14 m
Ω
50 A at 63 V
ET
UL
MFU1206FF06300P500
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6Revision: 06-May-10
MFU Series
Vishay Beyschlag Thin Film Chip Fuses
DESCRIPTION
Production is strictly controlled and follows an extensive
set of instructions established for reproducibility. A
homogeneous film of metal alloy is deposited on a high
grade ceramic body. The fuse elements are covered by a
protective coating designed for electrical, mechanical and
climatic protection. The terminations receive a final pure tin
on nickel plating.
The result of the determined production is verified by an
extensive testing procedure performed on 100 % of the
individual fuses. Only accepted products are laid directly
into the paper tape in accordance with IEC 60286-3.
APPROVALS
The fuses are tested in accordance with IEC 60127-4 and
UL 248-14 which refers to UL 248-1, IEC 60127-1 and
IEC 60068 series. Approval of conformity is indicated by the
UMF logo on the package label. Recognition by Underwriter
Laboratories Inc. is indicated by the UL logo on the package
label.
ASSEMBLY
The fuses are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic
soldering using wave, reflow or vapour phase. The
encapsulation is resistant to all cleaning solvents commonly
used in the electronics industry, including alcohols, esters
and aqueous solutions. The fuses are RoHS compliant, the
pure tin plating provides compatibility with lead (Pb)-free
and lead-containing soldering processes. The immunity of
the plating against tin whisker growth has been proven
under extensive testing. Solderability is specified for 2 years
after production or re-qualification. The permitted storage
time is 20 years.
All products comply with the CEFIC-EECA-EICTA list of legal
restrictions on hazardous substances.
This includes full compliance with the following directives:
•2000/53/EC End of Vehicle life Directive (ELV) and
Annex II (ELV II)
•2002/95/EC Restriction of the use of Hazardous
Substances Directive (RoHS)
•2002/96/EC Waste Electrical and Electronic Equipment
Directive (WEEE)
FUNCTIONAL PERFORMANCE
Note
(1) Current rating factor is in addition to the given permissible continuous current rating of 0.7
Lead (Pb)-free Identification
on the Package Label
e3
Current Rating Factor (1) vs. Ambient Temperature
ϑ
amb
- 60 150
0
Ambient Temperature amb [°C]
Current Rating Factor [%]
50
60
70
80
90
100
110
120
MFU Series
75 90 105 120 135
ϑ
40
30
20
10
- 45 - 30 - 15 0 15 30 45 60
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Revision: 06-May-10 7
MFU Series
Thin Film Chip Fuses Vishay Beyschlag
FUNCTIONAL PERFORMANCE
Note
(1) Fuses mounted on a test board according to IEC 60127-4
Typical tpre-arc vs. I characteristic of MFU 0402 (1)
Typical I2t vs. tpre-arc characteristic of MFU 0402 (1)
0.1 100
10
-4
1
Current I [A]
Pre-arc Time t
pre-arc
[s]
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
3
10
4
MFU 0402-FF
3.15 A
3.00 A
2.50 A
2.00 A
1.75 A
1.60 A
1.50 A
1.25 A
1.00 A
0.80 A
0.75 A
0.63 A
0.50 A
10
10-5
10-4
10-3
10-2
10-1
100
101
102
103
104
MFU 0402-FF
3.15 A
3.00 A
2.50 A
2.00 A
1.75 A
1.60 A
1.50 A
1.25 A
1.00 A
0.80 A
0.75 A
0.63 A
0.50 A
Pre-arc Time tpre-arc [s]
Joule Integral l2t [A2S]
10-4 10-3 10-2 10-1 100101102
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8Revision: 06-May-10
MFU Series
Vishay Beyschlag Thin Film Chip Fuses
FUNCTIONAL PERFORMANCE
Note
(1) Fuses mounted on a test board according to IEC 60127-4
Typical tpre-arc vs. I characteristic of MFU 0603 (1)
Typical I2t vs. tpre-arc characteristic of MFU 0603 (1)
0.1 100
10
-4
1
Current I [A]
Pre-arc Time t
pre-arc
[s]
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
3
10
4
MFU 0603-FF
5.00 A
4.00 A
3.50 A
3.15 A
3.00 A
2.50 A
2.00 A
1.75 A
1.60 A
1.50 A
1.25 A
1.00 A
0.80 A
0.75 A
0.63 A
0.50 A
10
10-5
10-4
10-3
10-2
10-1
100
101
102
103
104
MFU 0603-FF
5.00 A
4.00 A
3.50 A
3.15 A
3.00 A
2.50 A
2.00 A
1.75 A
1.60 A
1.50 A
1.25 A
1.00 A
0.80 A
0.75 A
0.63 A
0.50 A
Pre-arc Time tpre-arc [s]
Joule Integral l2t [A2S]
10-4 10-3 10-2 10-1 100101102
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Revision: 06-May-10 9
MFU Series
Thin Film Chip Fuses Vishay Beyschlag
FUNCTIONAL PERFORMANCE
Note
(1) Fuses mounted on a test board according to IEC 60127-4
Typical tpre-arc vs. I characteristic of MFU 0805 (1)
Typical I2t vs. tpre-arc characteristic of MFU 0805 (1)
0.1 100
10
-4
1
Current I [A]
Pre-arc Time t
pre-arc
[s]
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
3
10
4
MFU 0805-FF
5.00 A
4.00 A
3.50 A
3.15 A
3.00 A
2.50 A
2.00 A
1.75 A
1.60 A
1.50 A
1.25 A
1.00 A
0.80 A
0.75 A
0.63 A
0.50 A
10
10-5
10-4
10-3
10-2
10-1
100
101
102
103
104
MFU 0805-FF
5.00 A
4.00 A
3.50 A
3.15 A
3.00 A
2.50 A
2.00 A
1.75 A
1.60 A
1.50 A
1.25 A
1.00 A
0.80 A
0.75 A
0.63 A
0.50 A
Pre-arc Time tpre-arc [s]
Joule Integral l2t [A2S]
10-4 10-3 10-2 10-1 100101102
www.vishay.com For technical questions, contact: thinfilm.chipfuse@vishay.com Document Number: 28747
10 Revision: 06-May-10
MFU Series
Vishay Beyschlag Thin Film Chip Fuses
FUNCTIONAL PERFORMANCE
Note
(1) Fuses mounted on a test board according to IEC 60127-4
Typical tpre-arc vs. I characteristic of MFU 1206 (1)
Typical I2t vs. tpre-arc characteristic of MFU 1206 (1)
0.1 100
10
-4
1
Current I [A]
Pre-arc Time t
pre-arc
[s]
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
3
10
4
MFU 1206-FF
6.30 A
5.00 A
4.00 A
3.50 A
3.15 A
3.00 A
2.50 A
2.00 A
1.75 A
1.60 A
1.50 A
1.25 A
1.00 A
0.80 A
0.75 A
0.63 A
0.50 A
10
10-5
10-4
10-3
10-2
10-1
100
101
102
103
104
MFU 1206-FF
6.30 A
5.00 A
4.00 A
3.50 A
3.15 A
3.00 A
2.50 A
2.00 A
1.75 A
1.60 A
1.50 A
1.25 A
1.00 A
0.80 A
0.75 A
0.63 A
0.50 A
Pre-arc Time tpre-arc [s]
Joule Integral l2t [A2S]
10-4 10-3 10-2 10-1 100101102
Document Number: 28747 For technical questions, contact: thinfilm.chipfuse@vishay.com www.vishay.com
Revision: 06-May-10 11
MFU Series
Thin Film Chip Fuses Vishay Beyschlag
TEST AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
IEC 60127-1, Miniature fuse - Part 1: Definitions for miniature
fuses and general requirements for miniature fuse-links
IEC 60127-4, Universal Modular Fuse Links (UMF)
UL 248-1, Low voltage fuses - Part 1: General requirements
UL 248-14, Low voltage fuses - Part 14: Supplemental fuses
For the full test schedule refer to the documents listed above.
The testing also covers most of the requirements specified
by METI and CCC.
The tests are carried out in accordance with IEC 60068 and
under standard atmospheric conditions in accordance with
IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated
temperature range: Lower category temperature, upper
category temperature; damp heat, long term, 56 days) is
valid.
Unless otherwise specified the following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
The components are mounted for testing on printed-circuit
boards in accordance with IEC 60127-4, unless otherwise
specified.
The requirements stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of IEC 60127-1 and IEC 60127-4
respectively. However, some additional tests and a number
of improvements against those minimum requirements have
been included.
TEST PROCEDURES AND REQUIREMENTS
IEC
60127-4
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
PERMISSIBLE CHANGE
8.3.2 21 (Ue1)Substrate
bending
Depth 1 mm;
rate 1 mm/s
1 times
No visible damage
ΔR/R ≤ ± 10 %
8.6.2 58 (Td) Solderability
Solder bath method; SnPb40;
non-activated flux;
(215 ± 3) °C; (3 ± 0.3) s
Good tinning (≥ 95 % covered);
no visible damage
Solder bath method; SnAg3Cu0.5 or SnAg3.5;
non-activated flux;
(245 ± 3) °C; (2 ± 0.2) s
Good tinning (≥ 95 % covered);
no visible damage
8.7.2 58 (Td) Resistance to
soldering heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
No visible damage
ΔR/R ≤ ± 10 %
Reflow method 2
(IR/forced gas convection);
(260 ± 5) °C; (10 ± 1) s
No visible damage
ΔR/R ≤ ± 10 %
9.2.1 -
Time/current
characteristics
at nominal
temperature
Cold resistance at 0.1 x IR;
destructive testing under
overcurrent conditions
(DC-Current)
MFU 0402 IR ≤ 0.75 A
At 1.25 x IR, tpre-arc > 1 h
at 2.0 x IR, tpre-arc < 60 s
at 10 x IR, tpre-arc < 0.001 s
MFU 0402 0.8 A ≤ IR ≤ 3.15 A
At 1.25 x IR, tpre-arc > 1 h
at 2.0 x IR, tpre-arc < 5 s
at 10 x IR, tpre-arc < 0.001 s
MFU 0603 IR ≤ 5.0 A
MFU 0805 IR ≤ 5.0 A
MFU 1206 IR ≤ 6.3 A
9.3.2 - Breaking
capacity
50 A at rated voltage
acc. to UL 248-14
Optical inspection with naked eye
no visible damage
9.3.3 - Residual
resistance
50 A at rated voltage
acc. to UL 248-14
Insulation resistance
at 2.0 x UR (DC)
higher than 0.1 MΩ
www.vishay.com For technical questions, contact: thinfilm.chipfuse@vishay.com Document Number: 28747
12 Revision: 06-May-10
MFU Series
Vishay Beyschlag Thin Film Chip Fuses
9.4 -
Endurance test
acc. to
IEC 60127-1
a) I = 1.0 x IR (DC)
1.0 h on; 0.25 h off;
23 °C; 100 times
b) I = 1.25 x IR (DC)
1.0 h on
23 °C; 1 time
MFU 0402
IR ≤ 3.15 A
No visible damage
ΔR/R ≤ ± 10 %
MFU 0603
IR ≤ 3.15 A
MFU 0805
IR ≤ 3.15 A
MFU 1206
IR ≤ 3.15 A
9.5 -
Maximum
sustained
dissipation acc. to
IEC 60127-1
Calculation in accordance with results of clause 9.4 b) Dissipation ≤ acc. to
IEC 60127-4 table 2
9.7 - Fuse-link
temperature
The test is performed
during the final 5 min of
clause 9.4 b)
MFU 0402
IR ≤ 3.15 A
Temperature rise of terminals
≤ 85 K
MFU 0603
IR ≤ 3.15 A
MFU 0805
IR ≤ 3.15 A
MFU 1206
IR ≤ 3.15 A
--
Verification of
temp.-rise and
current- carrying
capacity acc. to
UL 248-14
clause 8.2.3
I = 1.0 x IR (DC)
MFU 0402
IR ≤ 3.15 A
Temperature rise
of hot spot
≤ 75 K
acc. to
UL 248-14 clause 8.2.4
MFU 0603
IR ≤ 5.0 A
MFU 0805
IR ≤ 5.0 A
MFU 1206
IR ≤ 6.3 A
- 78 (Cab) Damp heat,
steady state
(40 ± 2) °C; 56 days;
(93 ± 3) % RH
ΔR/R ≤ ± 10 %
I-t characteristic
- 14 (Na) Rapid change
of temperature
30 min at LCT;
30 min at UCT;
LCT = - 55 °C;
UCT = 125 °C;
5 cycles
ΔR/R ≤ ± 10 %
- 6 (Fc) Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude ≤ 1.5 mm or
≤ 200 m/s2; 6 h
ΔR/R ≤ ± 10 %
- 45 (XA)
Component
solvent
resistance
Isopropyl alcohol;
50 °C; method 2 No visible damage
- 45 (XA)
Solvent
resistance
of marking
Isopropyl alcohol;
50 °C; method 1, toothbrush
Marking legible,
no visible damage
- 21 (Ue3)Shear
(adhesion)
RR 1608M; 9 N
No visible damage
RR 2012M and RR 3216M; 45 N
- - Flammability IEC 60695-2-2,
needle flame test; 10 s No burning after 30 s
TEST PROCEDURES AND REQUIREMENTS
IEC
60127-4
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
PERMISSIBLE CHANGE
Document Number: 91000 www.vishay.com
Revision: 11-Mar-11 1
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