F-210 QSH-060-01-L-D-DP-A (R) QSH-060-01-L-D-A (0,50mm) .0197" QSH-030-01-F-D-A-RT1 QSH SERIES HIGH SPEED GROUND PLANE SOCKET SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?QSH Insulator Material: Liquid Crystal Polymer Contact Material: Phosphor Bronze Plating: Au or Sn over 50" (1,27m) Ni Current Rating: Contact: 1.0A @ 30C Temperature Rise Ground Plane: 7.8A @ 30C Temperature Rise Operating Temp Range: -55C to +125C Voltage Rating: 125 VAC (5mm Stack Height) Max Cycles: 100 Unmating Force (-RT1 option): -RT1 option increases unmating force up to 50% RoHS Compliant: Yes Cable Mates: HQCD, HQDP, HFHM2 (See Application Specific note) *Note: -C Plating passes 10 year MFG testing Note: Some lengths, styles and options are non-standard, non-returnable. fina s Alignment ocol ProtPinorted Supp l i nch.com sportTM Hypertran XAUI (R) s E I PC xpres SATA Infiniband EXTENDED LIFE PRODUCT Blade & Beam Design 10 Year Mixed Flowing Gas (MFG) Call Samtec for maximum cycles mated with QSH 5mm Stack Height Type Rated @ -3dB Insertion Loss Single-Ended Signaling -D 9 GHz / 18 Gbps Differential Pair Signaling -D 8 GHz / 16 Gbps Differential Pair Signaling -DP 9.5 GHz / 19 Gbps Performance data for other stack heights and complete test data available at www.samtec.com?QSH or contact sig@samtec.com QSH PINS PER ROW NO. OF PAIRS notes at Download app ppnote /a m co c. www.samte mtec.com sa @ IG S t Contac protocols on s on for questi ALSO AVAILABLE Board Spacing Standoffs. See SO Series. PLATING OPTION 01 A TYPE OTHER OPTION -K -030, -060, -090, -120 -F -D (60 total pins per bank = -D) = Gold Flash on Signal Pins and Ground Plane, Matte Tin on tails = Single-Ended -020, -040, -060, -080 (20 pairs per bank = -D-DP) APPLICATION SPECIFIC OPTION * 14mm, 15mm, 22mm and 30mm stack height (Caution: Some automatic placement/inspection machines may have component height restrictions. Please consult machinery specifications.) * 30" (0,76m) Gold (Specify -H plating for Data Rate cable mating applications.) * Edge Mount & Guide Posts * 150 positions per row Call Samtec. (R) TM Processing: Max Processing Temp: 230C for 60 seconds, or 260C for 20 seconds 3x Lead-Free Solderable: Yes SMT Lead Coplanarity: (0,10mm) .004" max (030-060) (0,15mm) .006" max (090-120) Board Stacking: For applications requiring more than two connectors per board or 4 banks or more, contact ipg@samtec.com Integral metal plane for power or ground Board Mates: QTH -D-DP = Differential Pair (-01 only) -L = 10" (0,25m) Gold on Signal Pins and Ground Plane, Matte Tin on tails -DP = (No. of Pairs per Row/20) x (20,00) .7875 + (1,27) .050 (20,00) .7875 02 (7,49) .295 01 (3,05) .120 (0,50) .0197 -RT1 = Retention Option (-090 positions maximum) = Electro-Polished Selective 50" (1,27m) min Au over 150" (3,81m) Ni on Signal Pins in contact area, 10" (0,25m) min Au over 50" (1,27m) Ni on Ground Plane in contact area, Matte Tin over 50" (1,27m) min Ni on all solder tails (0,15) .006 STACK HEIGHTS QTH LEAD MATED HEIGHT WITH QSH STYLE (5,00) .197 -01 -02 -03 -04 -05 -07 (7,24) .285 (0,76) .030 (3,25) .128 (0,89) .035 DIA (3,81) .150 -RT1 WWW.SAMTEC.COM -TR = Tape & Reel (-090 positions maximum) -C* -D = (No. of Pins per Row/30) x (20,00) .7875 + (1,27) .050 = (8,25mm) .325" DIA Polyimide Film Pick & Place Pad (3,76) .148 DIA (8,00) .315 (11,00) .433 (16,00) .630 (19,00) .748 (25,00) .984 Processing conditions will affect mated height.