(0,50mm) .0197"
QSH SERIES
QSH–030–01–F–D–A–RT1
QSH–060–01–L–D–A
Blade &
Beam Design
Alignment
Pin
QSH–060–01–L–D–DP–A
Integral metal plane
for power or ground
®
WWW.SAMTEC.COM
(20,00) .7875
–DP = (No. of Pairs per Row/20) x
(20,00) .7875 + (1,27) .050
–D = (No. of Pins per Row/30) x
(20,00) .7875 + (1,27) .050
01
02
(7,49)
.295
(0,15)
.006
(0,50)
.0197
(3,25)
.128
(0,76)
.030
(7,24)
.285
(0,89)
.035
DIA
(3,05)
.120
(3,81)
.150 (3,76)
.148
DIA
F-210
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?QSH
Insulator Material:
Liquid Crystal
Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over 50µ" (1,27µm) Ni
Current Rating:
Contact: 1.0A @ 30°C
Temperature Rise
Ground Plane: 7.8A @ 30°C
Temperature Rise
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
125 VAC (5mm Stack Height)
Max Cycles:
100
Unmating Force (-RT1 option):
-RT1 option increases
unmating force up to 50%
RoHS Compliant:
Ye s
Processing:
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead–Free Solderable:
Ye s
SMT Lead Coplanarity:
(0,10mm) .004" max (030-060)
(0,15mm) .006" max (090-120)
Board Stacking:
For applications requiring
more than two connectors
per board or 4 banks or more,
contact ipg@samtec.com
STACK HEIGHTS
Processing conditions will
affect mated height.
–01
–02
–03
–04
–05
–07
MATED HEIGHT
WITH QSH
QTH
LEAD
STYLE
(5,00) .197
(8,00) .315
(11,00) .433
(16,00) .630
(19,00) .748
(25,00) .984
APPLICATION
SPECIFIC OPTION
• 14mm, 15mm, 22mm and
30mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery specifi cations.)
• 30µ" (0,76µm) Gold
(Specify -H plating for Data
Rate cable mating
applications.)
• Edge Mount & Guide Posts
• 150 positions per row
Call Samtec.
–RT1
*Note: –C Plating passes
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
SPECIFICATIONS Board Mates:
QTH
Cable Mates:
HQCD, HQDP,
HFHM2
(See Application
Specifi c note)
Board Spacing Standoffs.
See SO Series.
ALSO AVAILABLE
Hypertransport
™
XAUI
PCI Express
®
SATA
Infiniband
Download app notes at
www.samtec.com/appnote
Contact SIG @ samtec.com
for questions on protocols
Protocols
Supported
QSH PINS PER ROW
NO. OF PAIRS
PLATING
OPTION
–030, –060, –090, –120
(60 total pins per bank = –D)
–020, –040, –060, –080
(20 pairs per bank = –D–DP)
–F
= Gold Flash on Signal Pins
and Ground Plane,
Matte Tin on tails
–L
= 10µ" (0,25µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–C*
= Electro-Polished Selective
50µ" (1,27µm) min Au over
150µ" (3,81µm) Ni on Signal
Pins in contact area,
10µ" (0,25µm) min Au over
50µ" (1,27µm) Ni on Ground
Plane in contact area,
Matte Tin over 50µ" (1,27µm)
min Ni on all solder tails
–D
= Single-Ended
–D–DP
= Differential Pair
(–01 only)
TYPE A01 OTHER
OPTION
–K
= (8,25mm)
.325" DIA
Polyimide Film
Pick &
Place Pad
–TR
= Tape & Reel
(–090 positions
maximum)
–RT1
= Retention
Option
(–090 positions
maximum)
HIGH SPEED GROUND PLANE SOCKET
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®
5mm Stack Height Type Rated @ -3dB Insertion Loss
Single-Ended Signaling –D 9 GHz / 18 Gbps
Differential Pair Signaling –D 8 GHz / 16 Gbps
Differential Pair Signaling –DP 9.5 GHz / 19 Gbps
Performance data for other stack heights and complete
test data available at www.samtec.com?QSH or contact
sig@samtec.com
EXTENDED LIFE PRODUCT
10 Year Mixed Flowing Gas (MFG)
TM
Call Samtec for maximum cycles mated with QSH
