○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays
. 1/11
TSZ02201-0M2M0F515100-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
06.Nov.2015 Rev.001
TSZ22111・14・001
www.rohm.com
Temperature Sensor ICs
Thermostat Output
with Variable Detection Temperature
BDExxx0G Series
General Description
BDExxx0G series are low quiescent current (16µA),
high accuracy thermostat (temperature switch) ICs.
This IC has a built-in temperature sensor, reference
voltage regulator, D/A converter, and comparator. The
IC’s OS terminal changes its logic state upon detection
of temperature. An open-drain output (Active-L) is
available in this series.
Features
±5°C-step Selectable Detection Temperature with
Control.
ESD Rating of 8kV (HBM)
Excellent Ripple Rejection Characteristic
Applications
Thermal Protection for Electrical Equipment (Notebook
PC, Cellular phone, FPD-TV, etc.). Fan Control for
Thermal Management.
Key Specifications
Power Supply Voltage Range: 2.9V to 5.5V
Supply Current: 16.0µA (Typ)
Detection Temperature Range: +55°C to +115°C
Detection Temperature Accuracy:
±4.0°C (Max) @Ta=-20°C to +115°C
Hysteresis Temperature: 10°C (Typ)
High Accuracy Analog Output:
±3.5°C (Max) @Ta=30°C
Analog Output Temperature Sensitivity:
-10.68mV/°C (Typ)
Operating Temperature Range: -30°C to +130°C
Package W(Typ) x D(Typ) x H(Max)
Block Diagram and Pin Configuration
Pin Descriptions
Pin No.
Pin Name
Function
Comment
1
CTRL
Detection Temperature Setting
Refer to page 9/11 for the temperature settings.
(Temperature / Output Format Table)
2
GND
Ground
3
TEMP
Output voltage in inverse proportion to
the temperature (Typ -10.68mV/°C)
Set to Open state or connect to a high input
impedance node (over 10MΩ).
4
VDD
Power Supply Voltage
5
OS
Digital Thermostat Output
Open-Drain type.
Use pull-up resistor of over 10kΩ.
SSOP5
2.90mm x 2.80mm x 1.25mm
VTemp
CTRL
GND
OS
VDD
+
-
1
2
3
5
4
Vref
TEMP
SENSOR Iref
OUT
TOP VIEW
TEMP
VREF
IREF
Datashee
t
Datashee
t
BDExxx0G Series
2/11
TSZ02201-0M2M0F515100-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
06.Nov.2015 Rev.001
www.rohm.com
TSZ22111・15・001
Absolute Maximum Ratings (Ta = 25°C)
Parameters
Symbol
Limit
Unit
Power Supply Voltage
VDD
-0.3 to +7.0 (Note 1)
V
Input Voltage (CTRL)
VIN
-0.3 to +VDD+0.3
V
Input Current (CTRL)
IIN
-1.0, +0.1
mA
OS Terminal Voltage
VOS
-0.3 to +7.0
V
OS Terminal Current
IOS
5.0
mA
Power Dissipation
Pd
0.54 (Note 2)
W
Storage Temperature Range
Tstg
-55 to +150
°C
(Note 1) However, not exceeding Pd.
(Note 2) When mounted on ROHM standard board, derate by 5.40mW/°C for Ta higher than 25 °C.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions
Parameters
Symbol
Min
Typ
Max
Unit
Power Supply Voltage
VDD
2.9
3.0
5.5
V
Operating Temperature Range
Topr
-30
-
+130
°C
Electrical Characteristics (Unless otherwise specified, VDD = 3.0V, Ta = 25°C)
Parameter
Symbol
Limits
Unit
Conditions
Min
Typ
Max
Supply Current
IDD
-
16.0
20.0
µA
VCTRL = 3.0V
Analog Output
TEMP Output Voltage
VTEMP
1.716
1.753
1.790
V
Ta = 30°C
TEMP Temperature Sensitivity
VSE
-10.28
-10.68
-11.08
mV/°C
Ta = -30°C to +100°C
TEMP Load Regulation
∆VTEMPRL
-
-
1
mV
difference of IOUT : 0µA / 2µA
OS Output Open Drain
OS Leakage Current
IL
-
-
1.0
µA
VOS = 5.0V
OS Output Voltage
VOL
-
-
0.4
V
IOS = 1.2mA
CTRL
Input L Voltage
VIL
GND
-
0.6
V
Input H Voltage
VIH
2.4
-
VDD
V
(Note) Radiation hardiness is not designed.
Temperature Accuracy (Unless otherwise specified, VDD = 3.0V)
Parameters
Symbol
Limit
Unit
Conditions
Min
Typ
Max
Thermostat (Temperature Switch)
Detection Temperature Accuracy
Tacc
-
-
±4.0
°C
Ta = -20°C to +115°C
Detection Temperature Hysteresis
Thys
7.5
10.0
12.5
°C
Analog Output
TEMP Temperature Accuracy
TTEMP
-
-
±3.5
°C
Ta = 30°C
BDExxx0G Series
3/11
TSZ02201-0M2M0F515100-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
06.Nov.2015 Rev.001
www.rohm.com
TSZ22111・15・001
Typical Performance Curves
Figure 1. TEMP Voltage vs Temperature
(Temperature Sensitivity)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-80 -40 040 80 120 160
Temperature [℃]
VTemp [V]
VDD=3V
Temperature : Ta [°C]
TEMP Voltage : VTEMP [V]
Figure 2. Supply Current vs Supply Voltage
0
5
10
15
20
25
0 1 2 3 4 5 6 7 8
VDD [V]
IDD [uA]
Ta=25°C
Supply Voltage : VDD [V]
Supply Current : IDD [µA]
Figure 3. TEMP Voltage vs Supply Voltage
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 1 2 3 4 5 6 7 8
VDD [V]
VTemp [V]
Ta=25°C
Supply Voltage : VDD [V]
TEMP Voltage : VTEMP [V]
Figure 4. TEMP Voltage vs Output Current
-200
-175
-150
-125
-100
-75
-50
-25
0
25
0 1 2 3 4 5
ITemp [uA]
ΔVTemp [mV]
VDD=3V, Ta=25°C
Output Current : ITEMP [µA]
∆TEMP Voltage : ∆VTEMP [V]
BDExxx0G Series
4/11
TSZ02201-0M2M0F515100-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
06.Nov.2015 Rev.001
www.rohm.com
TSZ22111・15・001
Typical Performance Curves – continued
Figure 5. OS Output Voltage vs Load Current
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 5 10 15 20 25
IOS [mA]
VOS[V]
VDD=3V, Ta=25°C
Load Current : IOS [mA]
OS Output Voltage : VOS [V]
BDExxx0G Series
5/11
TSZ02201-0M2M0F515100-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
06.Nov.2015 Rev.001
www.rohm.com
TSZ22111・15・001
Application Information
1. Functional Diagram (ex. Detection Temperature 110°C)
Temperature Hysteresis
(10°C Typical)
OS Output Voltage (VOS) [V]
VOS
110
90
70
50
10
130
-30
30
-10
-50
Temperature [°C]
0
VTEMP@30°C
(1.753V Typical)
Temperature
Sensitivity
(-10.68mV/°C Typical)
Analog Output Voltage (VTEMP) [V]
1.0
110
90
70
10
130
-30
30
-10
-50
Temperature [°C]
1.5
2.0
2.5
3.0
0.5
BDExxx0G Series
7/11
TSZ02201-0M2M0F515100-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
06.Nov.2015 Rev.001
www.rohm.com
TSZ22111・15・001
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
BDExxx0G Series
8/11
TSZ02201-0M2M0F515100-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
06.Nov.2015 Rev.001
www.rohm.com
TSZ22111・15・001
Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Figure 6. Example of monolithic IC structure
N N
P+PN N
P+
P Substrate
GND
NP+N N
P+
NP
P Substrate
GND GND
Parasitic
Elements
Pin A
Pin A
Pin B Pin B
B C
EParasitic
Elements
GND
Parasitic
Elements
CB
E
Transistor (NPN)Resistor
N Region
close-by
Parasitic
Elements
BDExxx0G Series
9/11
TSZ02201-0M2M0F515100-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
06.Nov.2015 Rev.001
www.rohm.com
TSZ22111・15・001
Ordering Information
B
D
E
x
x
x
0
G
-
T R
Detect Temp.
060: 60°C
070: 70°C
080: 80°C
090: 90°C
100: 100°C
110: 110°C
Output Format
0 : Active-L
Package
G:SSOP5
Packaging and forming specification
TR: Embossed tape and reel
(SSOP5)
Lineup
Temperature / Output Format Table
CTRL status description (L : Low, O : Open, H : High)
Product
Name
Detection Temperature (°C)
OS Output Format
CTRL
L
H
O
BDE1100G
105
110
115
Open-Drain
Active-L
BDE1000G
95
100
105
Open-Drain
Active-L
BDE0900G
85
90
95
Open-Drain
Active-L
BDE0800G
75
80
85
Open-Drain
Active-L
BDE0700G
65
70
75
Open-Drain
Active-L
BDE0600G
55
60
65
Open-Drain
Active-L
Marking Diagram
Orderable Part Number
Part Number Marking
BDE1100G-TR
eB
BDE1000G-TR
eC
BDE0900G-TR
eD
BDE0800G-TR
eE
BDE0700G-TR
eF
BDE0600G-TR
eG
Part Number Marking
SSOP5 (TOP VIEW)
LOT Number
Datasheet
Datasheet
Notice-PGA-E Rev.00
2
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for applicatio n in ordinar y elec tronic eq uipm ents (such as AV equipment ,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred b y you or third parties arisin g from the use of an y ROHM’s Prod ucts for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which
a failure or malfunction of our Products may cause. T he following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliabili ty, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlig ht or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing comp onents, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radi ation-proof design.
5. Please verify and confirm ch aracteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperatur e. When used in sealed are a, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specifi ed range described in the product specification.
9. ROHM shall not be in any way responsible or lia ble for failure induced under deviant conditio n from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogen ous (chlori ne, bromine, etc.) flu x is used, the residue of flux may negativel y affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM represe ntative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice-PGA-E Rev.00
2
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise you r own indepen dent verificatio n and judgmen t in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please t ake special care under dry condit ion (e.g. Grounding of human body / equipment / sol der iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportati on
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds thos e recommended by ROHM
[c] the Products are exposed to direct sunshine or conde nsation
[d] the Products are exposed to high Electrostati c
2. Even under ROHM recommended storage condition, solderabilit y of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommen de d storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive s t ress applied when dropping o f a carton.
4. Use Products within the spec ified time after opening a hum idity barrier bag. Baking is r equired before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products pl ease dispose them properly using a n authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained i n this document. Provide d, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including b ut not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
