E1WS Series
Revised J: 1/19/2017
Page 2 of 10 www.ecliptek.com
REGULATORY COMPLIANCE
2011/65 + 191 SVHC
2015/863
ITEM DESCRIPTION
Watch Crystal Resonator 3.7mm x 7.9mm x 2.5mm 4 Pad Plastic Surface Mount (SMD)
ELECTRICAL SPECIFICATIONS
Nominal Frequency
32.768kHz
Frequency Tolerance
±20ppm at 25°C
Frequency Stability Temperature
Coefficient
-
0.034±0.006ppm/(Change in °C)² Maximum
Turn over Temperature
25°C ±5°C
Aging at 25°C
±3ppm/year Maximum
Operating Temperature Range
-40°C to +85°C
Load Capacitance
6 pF Parallel Resonant
12.5pF Parallel Resonant
Shunt Capacitance
1.35pF Typical
Motional Capacitance
3.0fF
Typical
Equivalent Series Resistance
50,000 Ohms Maximum
Mode of Operation
Fundamental
Drive Level
1µWatt Maximum
Crystal Cut
Tuning Fork
Storage Temperature Range
-55°C to +125°C
Insulation Resistance
Measured at 100Vdc
500 Megaohms Minimum
PART NUMBERING GUIDE
E1WS Series
Revised J: 1/19/2017
Page 3 of 10 www.ecliptek.com
PIN
CONNECTION
Crystal
No Connect to Pin 3
No Connect to Pin 2
Crystal
MECHANICAL DIMENSIONS
SUGGESTED SOLDER PAD LAYOUT
All Tolerances are ±0.1
All Dimensions in Millimeters
E1WS Series
Revised J: 1/19/2017
Page 4 of 10 www.ecliptek.com
TAPE & REEL DIMENSIONS
Quantity per Reel: 3000 Units
All Dimensions in Millimeters
Compliant to EIA-481
E1WS Series
RECOMMENDED SOLDER REFLOW METHOD
Revised J: 1/19/2017
Page 5 of 10 www.ecliptek.com
HIGH TEMPERATURE INFRARED/CONVECTION
T
S
MAX to T
L
(Ramp-up Rate)
3°C/Second Maximum
Preheat
-
Temperature Minimum (TS MIN)
-
Temperature Typical (TS TYP)
-
Temperature Maximum(TS MAX)
-
Time (tS)
150°C
175°C
200°C
60
- 180 Seconds
Ramp-up Rate (T
L
to T
P
)
3°C/Second Maximum
Time Maintained Above:
-
Temperature (TL)
-
Time (tL)
217°C
60
- 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
Target Peak Temperature(T
P
Target)
250°C +0/-5°C
Time within 5°C of actual peak (t
p
)
20 - 40 Seconds
Ramp-down Rate
6°C/Second Maximum
Time 25°C to Peak Temperature (t)
8 Minutes Maximum
Moisture Sensitivity Level
Level 1
Additional Notes
Temperatures shown are applied to body of device.
High Temperature Manual Soldering
260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
E1WS Series
RECOMMENDED SOLDER REFLOW METHOD
Revised J: 1/19/2017
Page 6 of 10 www.ecliptek.com
LOW TEMPERATURE INFRARED/CONVECTION
T
S
MAX to T
L
(Ramp-up Rate)
5°C/Second Maximum
Preheat
-
Temperature Minimum (Ts MIN)
-
Temperature Typical (Ts TYP)
-
Temperature Maximum(Ts MAX)
-
Time (ts)
N/A
150°C
N/A
30
- 60 Seconds
Ramp-up Rate (T
L
to T
P
)
5°C/Second Maximum
Time Maintained Above:
-
Temperature (TL)
-
Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
245°C Maximum
Target Peak Temperature (T
P
Target)
245°C Maximum 2 Times / 230˚C Maximum 1 Time
Time within 5°C of actual peak (t
p
)
10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time
Ramp-down Rate
5°C/Second Maximum
Time 25°C to Peak Temperature (t)
N/A
Moisture Sensitivity Level
Level 1
Additional Notes
Temperatures shown are applied to body of device.
Low Temperature Manual Soldering
185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)