Power Packages TO-262AA 3 LEAD JEDEC TO-262AA PLASTIC PACKAGE E INCHES A 15o A1 H1 TERM. 4 D L1 b1 MIN MAX MIN MAX c A 0.170 0.180 4.32 4.57 - 0.048 0.052 1.22 1.32 3, 4 b 0.030 0.034 0.77 0.86 3, 4 b1 0.045 0.055 1.15 1.39 3, 4 c 0.018 0.022 0.46 0.55 3, 4 D 0.405 0.425 10.29 10.79 - E 0.395 0.405 10.04 10.28 e1 L 60o 1 2 e 3 J1 NOTES A1 e b MILLIMETERS SYMBOL 0.100 TYP 0.200 BSC - 2.54 TYP 5 5.08 BSC 5 H1 0.045 0.055 1.15 1.39 - J1 0.095 0.105 L 0.530 0.550 2.42 2.66 6 13.47 13.97 - L1 0.110 0.130 2.80 3.30 2 NOTES: 1. These dimensions are within allowable dimensions of Rev. A of JEDEC TO-262AA outline dated 6-90. 2. Solder finish uncontrolled in this area. 3. Dimension (without solder). 4. Add typically 0.002 inches (0.05mm) for solder plating. 5. Position of lead to be measured 0.250 inches (6.35mm) from bottom of dimension D. 6. Position of lead to be measured 0.100 inches (2.54mm) from bottom of dimension D. 7. Controlling dimension: Inch. 8. Revision 4 dated 10-95. e1 32