32
Power Packages
TO-262AA
3 LEAD JEDEC TO-262AA PLASTIC PACKAGE
H1
D
L1
L
1e
e1
b
b1
A1
A
c
J1
E15o
23
TERM. 4
60o
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.170 0.180 4.32 4.57 -
A10.048 0.052 1.22 1.32 3, 4
b 0.030 0.034 0.77 0.86 3, 4
b10.045 0.055 1.15 1.39 3, 4
c 0.018 0.022 0.46 0.55 3, 4
D 0.405 0.425 10.29 10.79 -
E 0.395 0.405 10.04 10.28 -
e 0.100 TYP 2.54 TYP 5
e10.200 BSC 5.08 BSC 5
H10.045 0.055 1.15 1.39 -
J10.095 0.105 2.42 2.66 6
L 0.530 0.550 13.47 13.97 -
L10.110 0.130 2.80 3.30 2
NOTES:
1. These dimensions are within allowable dimensions of Rev. A of
JEDEC TO-262AA outline dated 6-90.
2. Solder finish uncontrolled in this area.
3. Dimension (without solder).
4. Add typically 0.002 inches (0.05mm) for solder plating.
5. P osition of lead to be measured 0.250 inches (6.35mm) from bottom
of dimension D.
6. P osition of lead to be measured 0.100 inches (2.54mm) from bottom
of dimension D.
7. Controlling dimension: Inch.
8. Revision 4 dated 10-95.
