LM3150 www.ti.com SNVS561D - SEPTEMBER 2008 - REVISED MARCH 2011 LM3150 SIMPLE SWITCHER(R) CONTROLLER, 42V Synchronous Step-Down Check for Samples: LM3150 FEATURES DESCRIPTION 1 * * * * 2 * * * * * * * * * The LM3150 SIMPLE SWITCHER(R) Controller is an easy to use and simplified step down power controller capable of providing up to 12A of output current in a typical application. Operating with an input voltage range of 6V-42V, the LM3150 features an adjustable output voltage down to 0.6V. The switching frequency is adjustable up to 1 MHz and the synchronous architecture provides for highly efficient designs. The LM3150 controller employs a Constant On-Time (COT) architecture with a proprietary Emulated Ripple Mode (ERM) control that allows for the use of low ESR output capacitors, which reduces overall solution size and output voltage ripple. The Constant On-Time (COT) regulation architecture allows for fast transient response and requires no loop compensation, which reduces external component count and reduces design complexity. (R) PowerWise Step-down Controller 6V to 42V Wide Input Voltage Range Adjustable Output Voltage Down to 0.6V Programmable Switching Frequency up to 1 MHz No Loop Compensation Required Fully WEBENCH(R) Enabled Low External Component Count Constant On-Time Control Ultra-fast Transient Response Stable with Low ESR Capacitors Output Voltage Pre-bias Startup Valley Current Limit Programmable Soft-start Fault protection features such as thermal shutdown, under-voltage lockout, over-voltage protection, shortcircuit protection, current limit, and output voltage prebias startup allow for a reliable and robust solution. TYPICAL APPLICATIONS * * * * * Telecom Networking Equipment Routers Security Surveillance Power Modules The LM3150 SIMPLE SWITCHER(R) concept provides for an easy to use complete design using a minimum number of external components and TI's WEBENCH(R) online design tool. WEBENCH(R) provides design support for every step of the design process and includes features such as external component calculation with a new MOSFET selector, electrical simulation, thermal simulation, and Build-It boards for prototyping. Typical Application VCC EN CVCC VIN VIN VIN M1 HG RON CIN RON BST LM3150 CBST L SS SW CSS VOUT ILIM FB RFB2 COUT RLIM SGND LG M2 RFB1 PGND 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2008-2011, Texas Instruments Incorporated LM3150 SNVS561D - SEPTEMBER 2008 - REVISED MARCH 2011 www.ti.com Connection Diagram 1 2 3 4 5 6 7 PGND VCC VIN LG BST EN FB SGND SS RON EP HG SW SGND ILIM 14 13 12 11 10 9 8 Figure 1. TSSOP-14 PIN DESCRIPTIONS Pin Name Description Function 1 VCC Supply Voltage for FET Drivers Nominally regulated to 5.95V. Connect a 1.0 F to 4.7 F decoupling capacitor from this pin to ground. 2 VIN Input Supply Voltage Supply pin to the device. Nominal input range is 6V to 42V. 3 EN Enable To enable the IC apply a logic high signal to this pin greater than 1.26V typical or leave floating. To disable the part, ground the EN pin. 4 FB Feedback Internally connected to the regulation, over-voltage, and short-circuit comparators. The regulation setting is 0.6V at this pin. Connect to feedback resistor divider between the output and ground to set the output voltage. 5,9 SGND Signal Ground Ground for all internal bias and reference circuitry. Should be connected to PGND at a single point. 6 SS Soft-Start An internal 7.7 A current source charges an external capacitor to provide the soft-start function. 7 RON On-time Control An external resistor from VIN to this pin sets the high-side switch on-time. 8 ILIM Current Limit Monitors current through the low-side switch and triggers current limit operation if the inductor valley current exceeds a user defined value that is set by RLIM and the Sense current, ILIM-TH, sourced out of this pin during operation. 10 SW Switch Node Switch pin of controller and high-gate driver lower supply rail. A boost capacitor is also connected between this pin and BST pin 11 HG High-Side Gate Drive Gate drive signal to the high-side NMOS switch. The high-side gate driver voltage is supplied by the differential voltage between the BST pin and SW pin. 12 BST Connection for Bootstrap Capacitor High-gate driver upper supply rail. Connect a 0.33 F-0.47 F capacitor from SW pin to this pin. An internal diode charges the capacitor during the high-side switch off-time. Do not connect to an external supply rail. 13 LG Low-Side Gate Drive Gate drive signal to the low-side NMOS switch. The low-side gate driver voltage is supplied by VCC. 14 PGND Power Ground Synchronous rectifier MOSFET source connection. Tie to power ground plane. Should be tied to SGND at a single point. EP EP Exposed Pad Exposed die attach pad should be connected directly to SGND. Also used to help dissipate heat out of the IC. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright (c) 2008-2011, Texas Instruments Incorporated Product Folder Links: LM3150 LM3150 www.ti.com SNVS561D - SEPTEMBER 2008 - REVISED MARCH 2011 Absolute Maximum Ratings (1) (2) VIN, RON to GND -0.3V to 47V SW to GND -3V to 47V BST to SW -0.3V to 7V BST to GND -0.3V to 52V All Other Inputs to GND -0.3V to 7V ESD Rating (3) 2 kV Storage Temperature Range (1) -65C to +150C Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications and conditions, see the Electrical Characteristics. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. The human body model is a 100 pF capacitor discharged through a 1.5 k resistor into each pin. Test Method is per JESD-22-A114. (2) (3) Operating Ratings (1) VIN 6V to 42V -40C to + 125C Junction Temperature Range (TJ) EN (1) 0V to 5V Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications and conditions, see the Electrical Characteristics. Electrical Characteristics Limits in standard type are for TJ = 25C only; limits in boldface type apply over the junction temperature (TJ) range of -40C to +125C. Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25C, and are provided for reference purposes only. Unless otherwise stated the following conditions apply: VIN = 18V. Symbol Parameter Conditions Min Typ Max Units 5.65 5.95 6.25 V Start-Up Regulator, VCC VCC VIN - VCC CVCC = 1 F, 0 mA to 40 mA VIN - VCC Dropout Voltage IVCC = 2 mA, VIN = 5.5V 40 IVCC = 30 mA, VIN = 5.5V 330 mV VCC Current Limit (1) VCC = 0V VCC Under-Voltage Lockout Threshold (UVLO) VCC Increasing VCCUVLO-HYS VCC UVLO Hysteresis VCC Decreasing 475 tCC-UVLO-D VCC UVLO Filter Delay IIN Input Operating Current No Switching, VFB = 1V 3.5 5 mA Input Operating Current, Device Shutdown VEN = 0V 32 55 A Boost Pin Leakage VBST - VSW = 6V 2 nA HG Drive Pull-Up On-Resistance IHG Source = 200 mA 5 HG Drive Pull-Down On-Resistance IHG Sink = 200 mA 3.4 LG Drive Pull-Up On-Resistance ILG Source = 200 mA 3.4 LG Drive Pull-Down On-Resistance ILG Sink = 200 mA 2 SS Pin Source Current VSS = 0V IVCCL VCCUVLO IIN-SD 65 100 4.75 5.1 mA 5.40 V mV 3 s GATE Drive IQ-BST RDS-HG-Pull-Up RDS-HG-Pull-Down RDS-LG-Pull-Up RDS-LG-Pull-Down Soft-Start ISS ISS-DIS 5.9 SS Pin Discharge Current 7.7 9.5 200 A A Current Limit ILIM-TH (1) Current Limit Sense Pin Source Current 75 85 95 A VCC provides self bias for the internal gate drive and control circuits. Device thermal limitations limit external loading. Submit Documentation Feedback Copyright (c) 2008-2011, Texas Instruments Incorporated Product Folder Links: LM3150 3 LM3150 SNVS561D - SEPTEMBER 2008 - REVISED MARCH 2011 www.ti.com Electrical Characteristics (continued) Limits in standard type are for TJ = 25C only; limits in boldface type apply over the junction temperature (TJ) range of -40C to +125C. Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25C, and are provided for reference purposes only. Unless otherwise stated the following conditions apply: VIN = 18V. Symbol Parameter Conditions Min Typ Max Units ON/OFF Timer tON ON Timer Pulse Width tON-MIN ON Timer Minimum Pulse Width tOFF OFF Timer Minimum Pulse Width VIN = 10V, RON = 100 k, VFB = 0.6V 1.02 VIN = 18V, RON = 100 k, VFB = 0.6V 0.62 VIN = 42V, RON = 100 k, VFB = 0.6V 0.36 See (2) 200 s ns 370 525 1.20 1.26 ns Enable Input VEN VEN-HYS EN Pin Input Threshold Trip Point VEN Rising EN Pin Threshold Hysteresis VEN Falling 1.14 120 V mV Regulation and Over-Voltage Comparator VFB VFB-OV IFB In-Regulation Feedback Voltage VSS > 0.6V Feedback Over-Voltage Threshold 0.588 0.600 0.612 0.690 0.720 0.748 Feedback Bias Current 20 V V nA Boost Diode Vf Forward Voltage IBST = 2 mA 0.7 IBST = 30 mA 1 V Thermal Characteristics TSD JA JC (2) 4 Thermal Shutdown Rising 165 C Thermal Shutdown Hysteresis Falling 15 C 4 Layer JEDEC Printed Circuit Board, 9 Vias, No Air Flow 40 2 Layer JEDEC Printed Circuit Board. No Air Flow 140 Junction to Ambient Junction to Case No Air Flow C/W 4 C/W See Theory of Operation section for minimum on-time when using MOSFETs connected to gate drivers. Submit Documentation Feedback Copyright (c) 2008-2011, Texas Instruments Incorporated Product Folder Links: LM3150 LM3150 www.ti.com SNVS561D - SEPTEMBER 2008 - REVISED MARCH 2011 Simplified Block Diagram EN EN LM3150 6V VIN AVDD 1 M5 6V LDO VIN 1.20V 0.72V 0.6V Vbias VDD VCC UVLO CIN GND RON ON TIMER Ron START COMPLETE RON VCC THERMAL SHUTDOWN CVCC 1.20V toff OFF TIMER START COMPLETE BST CBST VDD HG ISS SS LOGIC DrvH LEVEL SHIFT DrvL CSS REGULATION COMPARATOR FB Vref = 0.6V PMOS input Zero Current Detect 0.36V VFB-OV and SHORT CIRCUIT PROTECTION SGND M1 DRIVER L VOUT SW VCC DRIVER LG PGND CURRENT LIMIT COMPARATOR M2 RFB2 COUT VDD ILIM-TH ILIM 0.72V VIN RLIM RFB1 GND PGND ERM CONTROL Submit Documentation Feedback Copyright (c) 2008-2011, Texas Instruments Incorporated Product Folder Links: LM3150 5 LM3150 SNVS561D - SEPTEMBER 2008 - REVISED MARCH 2011 www.ti.com Typical Performance Characteristics 6 Boost Diode Forward Voltage vs. Temperature ILIM-TH vs. Temperature Figure 2. Figure 3. Quiescent Current vs. Temperature Soft-Start Current vs. Temperature Figure 4. Figure 5. tON vs. Temperature tON vs. Temperature Figure 6. Figure 7. Submit Documentation Feedback Copyright (c) 2008-2011, Texas Instruments Incorporated Product Folder Links: LM3150 LM3150 www.ti.com SNVS561D - SEPTEMBER 2008 - REVISED MARCH 2011 Typical Performance Characteristics (continued) tON vs. Temperature VCC Current Limit vs. Temperature Figure 8. Figure 9. VCC Dropout vs. Temperature VCC vs. Temperature Figure 10. Figure 11. Submit Documentation Feedback Copyright (c) 2008-2011, Texas Instruments Incorporated Product Folder Links: LM3150 7 LM3150 SNVS561D - SEPTEMBER 2008 - REVISED MARCH 2011 www.ti.com THEORY OF OPERATION The LM3150 synchronous step-down SIMPLE SWITCHER(R) Controller utilizes a Constant On-Time (COT) architecture which is a derivative of the hysteretic control scheme. COT relies on a fixed switch on-time to regulate the output. The on-time of the high-side switch can be set manually by adjusting the size of an external resistor (RON). To maintain a relatively constant switching frequency as VIN varies, the LM3150 automatically adjusts the on-time inversely with the input voltage. Assuming an ideal system and VIN is much greater than 1V, the following approximations can be made: The on-time, tON: tON = K x RON VIN where * constant K = 100 pC (1) The RON resistance value can be calculated as follows: RON = VOUT K x fS where * fs is the desired switching frequency (2) Control is based on a comparator and the on-timer, with the output voltage feedback (FB) compared with an internal reference of 0.6V. If the FB level is below the reference, the high-side switch is turned on for a fixed time, tON, which is determined by the input voltage and the resistor RON. Following this on-time, the switch remains off for a minimum off-time, tOFF, as specified in the Electrical Characteristics table or until the FB pin voltage is below the reference, then the switch turns on again for another on-time period. The switching will continue in this fashion to maintain regulation. During continuous conduction mode (CCM), the switching frequency ideally depends on duty-cycle and on-time only. In a practical application however, there is a small delay in the time that the HG goes low and the SW node goes low that also affects the switching frequency that is accounted for in the typical application curves. The duty-cycle and frequency can be approximated as: D= tON VOUT =t xf | tON + tOFF ON S VIN (3) VOUT fS = K x RON (4) Typical COT hysteretic controllers need a significant amount of output capacitor ESR to maintain a minimum amount of ripple at the FB pin in order to switch properly and maintain efficient regulation. The LM3150 however, utilizes a proprietary Emulated Ripple Mode control scheme (ERM) that allows the use of low ESR output capacitors. Not only does this reduce the need for high output capacitor ESR, but also significantly reduces the amount of output voltage ripple seen in a typical hysteretic control scheme. The output ripple voltage can become so low that it is comparable to voltage-mode and current-mode control schemes. Programming the Output Voltage The output voltage is set by two external resistors (RFB1,RFB2). The regulated output voltage is calculated as follows: VOUT = VFB x (RFB1 + RFB2) RFB1 where * * RFB2 is the top resistor connected between VOUT and FB RFB1 is the bottom resistor connected between FB and GND (5) Regulation Comparator The feedback voltage at FB is compared to the internal reference voltage of 0.6V. In normal operation (the output voltage is regulated), an on-time period is initiated when the voltage at FB falls below 0.6V. The high-side switch stays on for the on-time, causing the FB voltage to rise above 0.6V. After the on-time period, the high-side switch stays off until the FB voltage falls below 0.6V. 8 Submit Documentation Feedback Copyright (c) 2008-2011, Texas Instruments Incorporated Product Folder Links: LM3150 LM3150 www.ti.com SNVS561D - SEPTEMBER 2008 - REVISED MARCH 2011 Over-Voltage Comparator The over-voltage comparator is provided to protect the output from over-voltage conditions due to sudden input line voltage changes or output loading changes. The over-voltage comparator continuously monitors the voltage at the FB pin and compares it to a 0.72V internal reference. If the voltage at FB rises above 0.72V, the on-time pulse is immediately terminated. This condition can occur if the input or the output load changes suddenly. Once the over-voltage protection is activated, the HG and LG signals remain off until the voltage at FB pin falls below 0.72V. Current Limit Current limit detection occurs during the off-time by monitoring the current through the low-side switch using an external resistor, RLIM. If during the off-time the current in the low-side switch exceeds the user defined current limit value, the next on-time cycle is immediately terminated. Current sensing is achieved by comparing the voltage across the low side FET with the voltage across the current limit set resistor RLIM. If the voltage across RLIM and the voltage across the low-side FET are equal then the current limit comparator will terminate the next on-time cycle. The RLIM value can be approximated as follows: 'IL 2 ICL x RDS(ON)max ICL = IOCL RLIM = (6) ILIM-TH where * * * IOCL is the user-defined average output current limit value RDS(ON)max is the resistance value of the low-side FETat the expected maximum FET junction temperature ILIM-TH is an internal current supply of 85 A typical (7) Figure 12 illustrates the inductor current waveform. During normal operation, the output current ripple is dictated by the switching of the FETs. The current through the low-side switch, Ivalley, is sampled at the end of each switching cycle and compared to the current limit, ICL, current. The valley current can be calculated as follows: Ivalley = IOUT - 'IL 2 where * * IOUT is the average output current IL is the peak-to-peak inductor ripple current (8) If an overload condition occurs, the current through the low-side switch will increase which will cause the current limit comparator to trigger the logic to skip the next on-time cycle. The IC will then try to recover by checking the valley current during each off-time. If the valley current is greater than or equal to ICL, then the IC will keep the low-side FET on and allow the inductor current to further decay. Throughout the whole process, regardless of the load current, the on-time of the controller will stay constant and thereby the positive ripple current slope will remain constant. During each on-time the current ramps-up an amount equal to: 'IL = (VIN - VOUT) x tON (9) L The valley current limit feature prevents current runaway conditions due to propagation delays or inductor saturation since the inductor current is forced to decay following any overload conditions. Current sensing is achieved by either a low value sense resistor in series with the low-side FET or by utilizing the RDS(ON) of the low-side FET. The RDS(ON) sensing method is the preferred choice for a more simplified design and lower costs. The RDS(ON) value of a FET has a positive temperature coefficient and will increase in value as the FET's temperature increases. The LM3150 controller will maintain a more stable current limit that is closer to the original value that was set by the user, by positively adjusting the ILIM-TH value as the IC temperature increases. This does not provide an exact temperature compensation but allows for a more tightly controlled current limit when compared to traditional RDS(ON) sensing methods when the RDS(ON) value can change typically 140% from room to maximum temperature and cause other components to be over-designed. The temperature compensated ILIM-TH is shown below where TJ is the die temperature of the LM3150 in Celsius: Submit Documentation Feedback Copyright (c) 2008-2011, Texas Instruments Incorporated Product Folder Links: LM3150 9 LM3150 SNVS561D - SEPTEMBER 2008 - REVISED MARCH 2011 www.ti.com ILIM-TH(TJ) = ILIM-TH x [1 + 3.3 x 10-3 x (TJ - 27)] (10) To calculate the RLIM value with temperature compensation, substitute equation (10) into ILIM-TH in equation (7). Short-Circuit Protection The LM3150 will sense a short-circuit on the output by monitoring the output voltage. When the feedback voltage has fallen below 60% of the reference voltage, Vref x 0.6 ( 0.36V), short-circuit mode of operation will start. During short-circuit operation, the SS pin is discharged and the output voltage will fall to 0V. The SS pin voltage, VSS, is then ramped back up at the rate determined by the SS capacitor and ISS until VSS reaches 0.7V. During this re-ramp phase, if the short-circuit fault is still present the output current will be equal to the set current limit. Once the soft-start voltage reaches 0.7V the output voltage is sensed again and if the VFB is still below Vref x 0.6 then the SS pin is discharged again and the cycle repeats until the short-circuit fault is removed. Soft-Start The soft-start (SS) feature allows the regulator to gradually reach a steady-state operating point, which reduces start-up stresses and current surges. At turn-on, while VCC is below the under-voltage threshold, the SS pin is internally grounded and VOUT is held at 0V. The SS capacitor is used to slowly ramp VFB from 0V to 0.6V. By changing the capacitor value, the duration of start-up can be changed accordingly. The start-up time can be calculated using the following equation: Vref x CSS tSS = ISS where * * * tSS is measured in seconds Vref = 0.6V ISS is the soft-start pin source current, which is typically 7.7 A (refer to Electrical Characteristics table) (11) An internal switch grounds the SS pin if VCC is below the under-voltage lockout threshold, if a thermal shutdown occurs, or if the EN pin is grounded. By using an externally controlled switch, the output voltage can be shut off by grounding the SS pin. During startup the LM3150 will operate in diode emulation mode, where the low-side gate LG will turn off and remain off when the inductor current falls to zero. Diode emulation mode will allow start-up into a pre-biased output voltage. When soft-start is greater than 0.7V, the LM3150 will remain in continuous conduction mode. During diode emulation mode at current limit the low-gate will remain off when the inductor current is off. IPK 'I IOCL Inductor Current ICL IOUT Normal Operation Load Current Increases Current Limited Figure 12. Inductor Current - Current Limit Operation The soft-start time should be greater than the input voltage rise time and also satisfy the following equality to maintain a smooth transition of the output voltage to the programmed regulation voltage during startup. 10 tSS (VOUT x COUT) / (IOCL - IOUT) (12) Submit Documentation Feedback Copyright (c) 2008-2011, Texas Instruments Incorporated Product Folder Links: LM3150 LM3150 www.ti.com SNVS561D - SEPTEMBER 2008 - REVISED MARCH 2011 Enable/Shutdown The EN pin can be activated by either leaving the pin floating due to an internal pull up resistor to VIN or by applying a logic high signal to the EN pin of 1.26V or greater. The LM3150 can be remotely shut down by taking the EN pin below 1.02V. Low quiescent shutdown is achieved when VEN is less than 0.4V. During low quiescent shutdown the internal bias circuitry is turned off. The LM3150 has certain fault conditions that can trigger shutdown, such as over-voltage protection, current limit, under-voltage lockout, or thermal shutdown. During shutdown, the soft-start capacitor is discharged. Once the fault condition is removed, the soft-start capacitor begins charging, allowing the part to start-up in a controlled fashion. In conditions where there may be an open drain connection to the EN pin, it may be necessary to add a 1 nF bypass capacitor to this pin. This will help decouple noise from the EN pin and prevent false disabling. Thermal Protection The LM3150 should be operated such that the junction temperature does not exceed the maximum operating junction temperature. An internal thermal shutdown circuit, which activates at 165C (typical), takes the controller to a low-power reset state by disabling the buck switch and the on-timer, and grounding the SS pin. This feature helps prevent catastrophic failures from accidental device overheating. When the junction temperature falls back below 150C the SS pin is released and device operation resumes. Design Guide The design guide provides the equations required to design with the LM3150 SIMPLE SWITCHER(R) Controller. WEBENCH(R) design tool can be used with or in place of this section for a more complete and simplified design process. 1. Define Power Supply Operating Conditions a. Required Output Voltage b. Maximum and Minimum DC Input Voltage c. Maximum Expected Load Current during Normal Operation d. Soft-Start Time 2. Set Output Voltage With Feedback Resistors VOUT = VFB x (RFB1 + RFB2) RFB1 where * * RFB1 is the bottom resistor RFB2 is the top resistor (13) 3. Determine RON and fs The available frequency range for a given input voltage range, is determined by the duty-cycle, D = VOUT/VIN, and the minimum tON and tOFF times as specified in the Electrical Characteristics table. The maximum frequency is thus, fsmax = Dmin/tON-MIN. Where Dmin=VOUT/VIN-MAX, is the minimum duty-cycle. The off-time will need to be less than the minimum off-time tOFF as specified in the Electrical Characteristics table plus any turn off and turn on delays of the MOSFETs which can easily add another 200 ns. The minimum off-time will occur at maximum duty cycle Dmax and will determine if the frequency chosen will allow for the minimum desired input voltage. The requirement for minimum off-time is tOFF= (1-Dmax)/fs (tOFF-MIN + 200 ns). If tOFF does not meet this requirement it will be necessary to choose a smaller switching frequency fS. Choose RON so that the switching frequency at your typical input voltage matches your fS chosen above using the following formula: RON = [(VOUT x VIN) - VOUT] / (VIN x K x fS) + ROND ROND = - [(VIN - 1) x (VIN x 16.5 + 100)] - 1000 (14) (15) Use Figure 13 to determine if the calculated RON will allow for the minimum desired input voltage. If the minimum desired input voltage is not met, recalculate RON for a lower switching frequency. Submit Documentation Feedback Copyright (c) 2008-2011, Texas Instruments Incorporated Product Folder Links: LM3150 11 LM3150 SNVS561D - SEPTEMBER 2008 - REVISED MARCH 2011 www.ti.com Figure 13. Minimum VIN vs. VOUT IOUT = 10 A 4. Determine Inductor Required Using Figure 14 To use the nomograph in Figure 14, calculate the inductor volt-microsecond constant ET from the following formula: ET = (Vinmax VOUT) x VOUT Vinmax x 1000 (V x Ps) fS where * fs is in kHz units (16) The intersection of the Load Current and the Volt-microseconds lines on the chart below will determine which inductors are capable for use in the design. The chart shows a sample of parts that can be used. The offline calculator tools and WEBENCH(R) will fully calculate the requirements for the components needed for the design. 12 Submit Documentation Feedback Copyright (c) 2008-2011, Texas Instruments Incorporated Product Folder Links: LM3150 LM3150 www.ti.com SNVS561D - SEPTEMBER 2008 - REVISED MARCH 2011 47 P 100 90 80 70 60 50 L13 L02 L14 H L37 L25 L03 40 E A T (V A Ps) 33 P H L01 L04 L16 20 L05 L17 L06 L18 L22 2 L11 L23 L12 L24 5 H 4.7 P L29 L42 H 3.3 P L43 2.2 P L44 1.5 P L32 L45 1.0 P L33 L46 P 0.68 L34 L47 PH 0.47 L35 6 H 6.8 P L48 H H H H P 0.33 H L36 1 4 L41 L21 L10 H L28 L31 3 10 P L40 L20 L09 4 H L27 L19 L08 15 P L39 L30 L07 H L26 L15 30 10 9 8 7 6 5 L38 22 P 7 8 9 10 12 MAXIMUM LOAD CURRENT (A) Figure 14. Inductor Nomograph Table 1. Inductor Selection Table Inductor Designator Inductance (H) Current (A) Part Name Vendor L01 47 7-9 L02 33 L03 22 7-9 SER2817H-333KL COILCRAFT 7-9 SER2814H-223KL L04 COILCRAFT 15 7-9 7447709150 WURTH L05 10 7-9 RLF12560T-100M7R5 TDK L06 6.8 7-9 B82477-G4682-M EPCOS L07 4.7 7-9 B82477-G4472-M EPCOS L08 3.3 7-9 DR1050-3R3-R COOPER L09 2.2 7-9 MSS1048-222 COILCRAFT L10 1.5 7-9 SRU1048-1R5Y BOURNS L11 1 7-9 DO3316P-102 COILCRAFT L12 0.68 7-9 DO3316H-681 COILCRAFT L13 33 9-12 L14 22 9-12 SER2918H-223 COILCRAFT L15 15 9-12 SER2814H-153KL COILCRAFT L16 10 9-12 7447709100 WURTH L17 6.8 9-12 SPT50H-652 COILCRAFT L18 4.7 9-12 SER1360-472 COILCRAFT L19 3.3 9-12 MSS1260-332 COILCRAFT L20 2.2 9-12 DR1050-2R2-R COOPER L21 1.5 9-12 DR1050-1R5-R COOPER L22 1 9-12 DO3316H-102 COILCRAFT L23 0.68 9-12 L24 0.47 9-12 L25 22 12-15 SER2817H-223KL COILCRAFT Submit Documentation Feedback Copyright (c) 2008-2011, Texas Instruments Incorporated Product Folder Links: LM3150 13 LM3150 SNVS561D - SEPTEMBER 2008 - REVISED MARCH 2011 www.ti.com Table 1. Inductor Selection Table (continued) Inductor Designator Inductance (H) Current (A) Part Name Vendor L26 15 12-15 L27 10 L28 6.8 12-15 SER2814L-103KL COILCRAFT 12-15 7447709006 WURTH L29 L30 4.7 12-15 7447709004 WURTH 3.3 12-15 L31 2.2 12-15 L32 1.5 12-15 MLC1245-152 COILCRAFT L33 1 12-15 L34 0.68 12-15 DO3316H-681 COILCRAFT L35 0.47 12-15 L36 0.33 12-15 DR73-R33-R COOPER L37 22 15- L38 15 15- SER2817H-153KL COILCRAFT L39 10 15- SER2814H-103KL COILCRAFT L40 6.8 15- L41 4.7 15- SER2013-472ML COILCRAFT L42 3.3 15- SER2013-362L COILCRAFT L43 2.2 15- L44 1.5 15- HA3778-AL COILCRAFT L45 1 15- B82477-G4102-M EPCOS L46 0.68 15- L47 0.47 15- L48 0.33 15- 5. Determine Output Capacitance Typical hysteretic COT converters similar to the LM3150 require a certain amount of ripple that is generated across the ESR of the output capacitor and fed back to the error comparator. Emulated Ripple Mode control built into the LM3150 will recreate a similar ripple signal and thus the requirement for output capacitor ESR will decrease compared to a typical Hysteretic COT converter. The emulated ripple is generated by sensing the voltage signal across the low-side FET and is then compared to the FB voltage at the error comparator input to determine when to initiate the next on-time period. COmin = 70 / (fs2 x L) (17) The maximum ESR allowed to prevent over-voltage protection during normal operation is: ESRmax = (80 mV x L x Af) / ETmin (18) ETmin is calculated using VIN-MIN Af = VOUT / 0.6 if there is no feed-forward capacitor used Af = 1 if there is a feed-forward capacitor used The minimum ESR must meet both of the following criteria: ESRmin (15 mV x L x Af) / ETmax ESRmin [ ETmax / (VIN - VOUT) ] x (Af / CO) (19) (20) ETmax is calculated using VIN-MAX. Any additional parallel capacitors should be chosen so that their effective impedance will not negatively attenuate the output ripple voltage. 6. Determine The Use of Feed-Forward Capacitor Certain applications may require a feed-forward capacitor for improved stability and easier selection of available output capacitance. Use the following equation to calculate the value of Cff. 14 Submit Documentation Feedback Copyright (c) 2008-2011, Texas Instruments Incorporated Product Folder Links: LM3150 LM3150 www.ti.com SNVS561D - SEPTEMBER 2008 - REVISED MARCH 2011 ZFB = (RFB1 x RFB2)/(RFB1 + RFB2) Cff = VOUT/(VIN-MIN x fS x ZFB) (21) (22) 7. MOSFET and RLIM Selection The high-side and low-side FETs must have a drain to source (VDS) rating of at least 1.2 x VIN. Use the following equations to calculate the desired target value of the low-side FET RDS(ON) for current limit. ICL x RDS(ON)max RLIM (Tj) = ILIM-TH (Tj) (23) (24) ILIM-TH(Tj) = ILIM-TH x [1 + 3.3 x 10-3 x (Tj - 27)] The gate drive current from VCC must not exceed the minimum current limit of VCC. The drive current from VCC can be calculated with: IVCCdrive = Qgtotal x fS where * Qgtotal is the combined total gate charge of the high-side and low-side FETs (25) The plateau voltage of the FET VGS vs Qg curve, as shown in Figure 15, must be less than VCC - 750 mV. Figure 15. Typical MOSFET Gate Charge Curve See following design example for estimated power dissipation calculation. 8. Calculate Input Capacitance The main parameters for the input capacitor are the voltage rating, which must be greater than or equal to the maximum DC input voltage of the power supply, and its rms current rating. The maximum rms current is approximately 50% of the maximum load current. CIN = Iomax x D x (1-D) fs x 'VIN-MAX where * VIN-MAX is the maximum allowable input ripple voltage (26) A good starting point for the input ripple voltage is 5% of VIN. When using low ESR ceramic capacitors on the input of the LM3150 a resonant circuit can be formed with the impedance of the input power supply and parasitic impedance of long leads/PCB traces to the LM3150 input capacitors. It is recommended to use a damping capacitor under these circumstances, such as aluminum electrolytic that will prevent ringing on the input. The damping capacitor should be chosen to be approximately 5 times greater than the parallel ceramic capacitors combination. The total input capacitance should be greater than 10 times the input inductance of the power supply leads/pcb trace. The damping capacitor should also be chosen to handle its share of the rms input current which is shared proportionately with the parallel impedance of the ceramic capacitors and aluminum electrolytic at the LM3150 switching frequency. The CBYP capacitor should be placed directly at the VIN pin. The recommended value is 0.1 F. Submit Documentation Feedback Copyright (c) 2008-2011, Texas Instruments Incorporated Product Folder Links: LM3150 15 LM3150 SNVS561D - SEPTEMBER 2008 - REVISED MARCH 2011 www.ti.com 9. Calculate Soft-Start Capacitor ISS x tSS Vref CSS = where * * tss is the soft-start time in seconds Vref = 0.6V (27) 10. CVCC, CBST and CEN CVCC should be placed directly at the VCC pin with a recommended value of 1 F to 4.7 F. CBST creates a voltage used to drive the gate of the high-side FET. It is charged during the SW off-time. The recommended value for CBST is 0.47 F. The EN bypass capacitor, CEN, recommended value is 1000 pF when driving the EN pin from open drain type of signal. Design Example VIN VCC EN CVCC CEN VIN VIN M1 HG RON CBYP RON CIN BST LM3150 CBST L SS SW CSS VOUT COUT ILIM FB RLIM SGND LG CFF M2 RFB2 PGND RFB1 Figure 16. Design Example Schematic 1.Define Power Supply Operating Conditions a. VOUT = 3.3V b. VIN-MIN = 6V, VIN-TYP = 12V, VIN-MAX = 24V c. Typical Load Current = 12A, Max Load Current = 15A d. Soft-Start time tSS = 5 ms 2. Set Output Voltage with Feedback Resistors RFB2 = RFB1 VOUT VFB RFB2 = 4.99 k: -1 3.3V -1 0.6V RFB2 = 22.455 k RFB2 = 22.6 k, nearest 1% standard value. 3. Determine RON and fS Dmin = VOUT/VIN-MAX Dmin = 3.3V/24V = 0.137 Dmax = 3.3V / 6V = 0.55 fsmax = 0.137/ 200 ns = 687 kHz Dmax = VOUT/VIN-MIN 16 Submit Documentation Feedback Copyright (c) 2008-2011, Texas Instruments Incorporated Product Folder Links: LM3150 LM3150 www.ti.com SNVS561D - SEPTEMBER 2008 - REVISED MARCH 2011 tOFF = (1-0.55)/687 kHz = 654 ns tOFF should meet the following criteria: tOFF > tOFF-MIN + 200 ns tOFF > 725 ns At the maximum switching frequency of 687 kHz, which is limited by the minimum on-time, the off-time of 654 ns is less than 725 ns. Therefore the switching frequency should be reduced and meet the following criteria: fs < (1 - D)/725 ns fS < (1 - 0.55)/725 ns = 620 kHz A switching frequency is arbitrarily chosen at 500 kHz which should allow for reasonable size components and satisfies the requirements above. fS = 500 kHz Using fS = 500 kHz RON can be calculated as follows: RON = [(VOUT x VIN) - VOUT] / (VIN x K x fS) + ROND ROND = - [(VIN - 1) x (VIN x 16.5 + 100)] - 1000 ROND = - [(12 - 1) x (12 x 16.5 + 100)] -1000 ROND = -4.3 k RON = [(3.3 x 12) - 3.3] / (12 x 100 pC x 500 kHz) - 4.3 k RON = 56.2 k Next, check the desired minimum input voltage for RON using Figure 13. This design will meet the desired minimum input voltage of 6V. 4. Determine Inductor Required a. ET = (24-3.3) x (3.3/24) x (1000/500) = 5.7 V s b. From the inductor nomograph a 12A load and 5.7 V s calculation corresponds to a L44 type of inductor. c. Using the inductor designator L44 in Table 1 the Coilcraft HA3778-AL 1.65 H inductor is chosen. 5. Determine Output Capacitance The voltage rating on the output capacitor should be greater than or equal to the output voltage. As a rule of thumb most capacitor manufacturers suggests not to exceed 90% of the capacitor rated voltage. In the case of multilayer ceramics the capacitance will tend to decrease dramatically as the applied voltage is increased towards the capacitor rated voltage. The capacitance can decrease by as much as 50% when the applied voltage is only 30% of the rated voltage. The chosen capacitor should also be able to handle the rms current which is equal to: Irmsco = IOUT x r 12 For this design the chosen ripple current ratio, r = 0.3, represents the ratio of inductor peak-to-peak current to load current IOUT. A good starting point for ripple ratio is 0.3 but it is acceptable to choose r between 0.25 to 0.5. The nomographs in this datasheet all use 0.3 as the ripple current ratio. Irmsco = 12 x 0.3 12 Irmsco = 1A tON = (3.3V/12V)/500 kHz = 550 ns Minimum output capacitance is: COmin = 70 / (fs2 x L) COmin = 70 / (500 kHz2 x 1.65 H) = 169 F The maximum ESR allowed to prevent over-voltage protection during normal operation is: ESRmax = (80 mV x L x Af) / ET Af = VOUT / 0.6 without a feed-forward capacitor Af = 1 with a feed-forward capacitor Submit Documentation Feedback Copyright (c) 2008-2011, Texas Instruments Incorporated Product Folder Links: LM3150 17 LM3150 SNVS561D - SEPTEMBER 2008 - REVISED MARCH 2011 www.ti.com For this design a feed-forward capacitor will be used to help minimize output ripple. ESRmax = (80 mV x 1.65 H x 1) / 5.7 V s ESRmax = 23 m The minimum ESR must meet both of the following criteria: ESRmin (15 mV x L x Af) / ET ESRmin [ ET / (VIN - VOUT) ] x (Af / CO) ESRmin (15 mV x 1.65 H x 1) / 5.7 V s = 4.3 m ESRmin [5.7 V s / (12 - 3.3) ] x (1 / 169 F) = 3.9 m Based on the above criteria two 150 F polymer aluminum capacitors with a ESR = 12 m each for a effective ESR in parallel of 6 m was chosen from Panasonic. The part number is EEF-UE0J101P. 6. Determine Use of Feed-Forward Capacitor From step 5 the capacitor chosen in ESR is small enough that we should use a feed-forward capacitor. This is calculated from: Cff = Cff = VOUT VIN-MIN x fs x RFB1 + RFB2 RFB1 x RFB2 3.3V 4.99 k: + 22.6 k: x = 269 pF 6V x 500 kHz 4.99 k: x 22.6 k: Let Cff = 270 pF, which is the closest next standard value. 7. MOSFET and RLIM Selection The LM3150 is designed to drive N-channel MOSFETs. For a maximum input voltage of 24V we should choose N-channel MOSFETs with a maximum drain-source voltage, VDS, greater than 1.2 x 24V = 28.8V. FETs with maximum VDS of 30V will be the first option. The combined total gate charge Qgtotal of the high-side and low-side FET should satisfy the following: Qgtotal IVCCL / fs Qgtotal 65 mA / 500 kHz Qgtotal 130 nC Where IVCCL is the minimum current limit of VCC, over the temperature range, specified in the Electrical Characteristics table. The MOSFET gate charge Qg is gathered from reading the VGS vs Qg curve of the MOSFET datasheet at the VGS = 5V for the high-side, M1, MOSFET and VGS = 6V for the low-side, M2, MOSFET. The Renesas MOSFET RJK0305DPB has a gate charge of 10 nC at VGS = 5V, and 12 nC at VGS = 6V. This combined gate charge for a high-side, M1, and low-side, M2, MOSFET 12 nC + 10 nC = 22 nC is less than 130 nC calculated Qgtotal. The calculated MOSFET power dissipation must be less than the max allowed power dissipation, Pdmax, as specified in the MOSFET datasheet. An approximate calculation of the FET power dissipated Pd, of the high-side and low-side FET is given by: High-Side MOSFET 2 Pcond = Iout x RDS(ON) x D Psw = 8.5 6.8 1 + x Vin x Iout x Qgd x fs x Vcc - Vth Vth 2 Pdh = Pcond + Psw 2 Pcond = 12 x 0.01 x 0.275 = 0.396W Psw = 8.5 6.8 1 x 12 x 12 x 1.5 nC x 500 kHz x + = 0.278W 6 2.5 2.5 2 Pdh = 0.396 + 0.278 = 0.674W 18 Submit Documentation Feedback Copyright (c) 2008-2011, Texas Instruments Incorporated Product Folder Links: LM3150 LM3150 www.ti.com SNVS561D - SEPTEMBER 2008 - REVISED MARCH 2011 The max power dissipation of the RJK0305DPB is rated as 45W for a junction temperature that is 125C higher than the case temperature and a thermal resistance from the FET junction to case, JC, of 2.78C/W. When the FET is mounted onto the PCB, the PCB will have some additional thermal resistance such that the total system thermal resistance of the FET package and the PCB, JA, is typically in the range of 30C/W for this type of FET package. The max power dissipation, Pdmax, with the FET mounted onto a PCB with a 125C junction temperature rise above ambient temperature and JA = 30C/W, can be estimated by: Pdmax = 125C / 30C/W = 4.1W The system calculated Pdh of 0.674W is much less than the FET Pdmax of 4.1W and therefore the RJK0305DPB max allowable power dissipation criteria is met. Low-Side MOSFET Primary loss is conduction loss given by: Pdl = Iout2 x RDS(ON) x (1-D) = 122 x 0.01 x (1-0.275) = 1W Pdl is also less than the Pdmax specified on the RJK0305DPB MOSFET datasheet. However, it is not always necessary to use the same MOSFET for both the high-side and low-side. For most applications it is necessary to choose the high-side MOSFET with the lowest gate charge and the low-side MOSFET is chosen for the lowest allowed RDS(ON). The plateau voltage of the FET VGS vs Qg curve must be less than VCC - 750 mV. The current limit resistor, RLIM, is calculated by estimating the RDS(ON) of the low-side FET at the maximum junction temperature of 100C. By choosing to go into current limit when the average output load current is 20% higher than the output load current of 12A while the inductor ripple current ratio is 1/3 of the load current will make ICL= 10.4A. Then the following calculation of RLIM is: RLIM = (10.4 x 0.014) / (75 x 10-6) = 1.9 k Let RLIM = 1.91 k which is the next standard value. 8. Calculate Input Capacitance The input capacitor should be chosen so that the voltage rating is greater than the maximum input voltage which for this example is 24V. Similar to the output capacitor, the voltage rating needed will depend on the type of capacitor chosen. The input capacitor should also be able to handle the input rms current, which is a maximum of approximately 0.5 x IOUT. For this example the rms input current is approximately 0.5 x 12A = 6A. The minimum capacitance with a maximum 5% input ripple VIN-MAX = (0.05 x 12) = 0.6V: CIN = [12 x 0.275 x (1-0.275)] / [500 kHz x 0.6] = 8 F To handle the large input rms current 2 ceramic capacitors are chosen at 10 F each with a voltage rating of 50V and case size of 1210. Each ceramic capacitor is capable of handling 3A of rms current. A aluminum electrolytic of 5 times the combined input capacitance, 5 x 20 F = 100 F, is chosen to provide input voltage filter damping because of the low ESR ceramic input capacitors. CBYP = 0.1F ceramic with a voltage rating greater than maximum VIN 9. Calculate Soft-Start Capacitor The soft start-time should be greater than the input voltage rise time and also satisfy the following equality to maintain a smooth transition of the output voltage to the programmed regulation voltage during startup. The desired soft-start time, tss, of 5 ms also needs to satisfy the equality in equation 12, by using the chosen component values through the previous steps as shown below: 5 ms > (3.3V x 300 F) / (1.2 x 12A - 12A) 5 ms > 0.412 ms Since the desired soft-start time satisfies the equality in equation 12, the soft start capacitor is calculated as: CSS = (7.7 A x 5 ms) / 0.6V = 0.064 F Let CSS = 0.068 F, which is the next closest standard value. This should be a ceramic cap with a voltage rating greater than 10V. Submit Documentation Feedback Copyright (c) 2008-2011, Texas Instruments Incorporated Product Folder Links: LM3150 19 LM3150 SNVS561D - SEPTEMBER 2008 - REVISED MARCH 2011 www.ti.com 10. CVCC, CEN, and CBST CVCC = 4.7 F ceramic with a voltage rating greater than 10V CEN = 1000 pF ceramic with a voltage rating greater than 10V CBST = 0.47 F ceramic with a voltage rating greater than 10V Bill of Materials Designator Value Parameters Manufacturer Part Number CBST 0.47 F Ceramic, X7R, 16V, 10% TDK C2012X7R1C474K CBYP 0.1 F Ceramic, X7R, 50V, 10% TDK C2012X7R1H104K CEN 1000 pF Ceramic, X7R, 50V, 10% TDK C1608X7R1H102K CFF 270 pF Ceramic, C0G, 50V, 5% Vishay-Bccomponents VJ0805A271JXACW1BC GMK325BJ106KN-T CIN1, CIN2 10 F Ceramic, X5R, 35V, 20% Taiyo Yuden COUT1, COUT2 150 F Polymer Aluminum, , 6.3V, 20% Panasonic EEF-UE0J151R CSS 0.068 F Ceramic, 0805, 25V, 10% Vishay VJ0805Y683KXXA GRM21BR71C475KA73L CVCC 4.7 F Ceramic, X7R, 16V, 10% Murata L1 1.65 H Shielded Drum Core, 2.53 m Coilcraft HA3778-AL M1, M2 30V 8 nC, RDS(ON) @4.5V=10 m Renesas RJK0305DPB RFB1 4.99 k 1%, 0.125W Vishay-Dale CRCW08054k99FKEA RFB2 22.6 k 1%, 0.125W Vishay-Dale CRCW080522k6FKEA RLIM 1.91 k 1%, 0.125W Vishay-Dale CRCW08051K91FKEA RON 56.2 k 1%, 0.125W Vishay-Dale CRCW080556K2FKEA U1 LM3150 Texas Instruments LM3150MH PCB Layout Considerations It is good practice to layout the power components first, such as the input and output capacitors, FETs, and inductor. The first priority is to make the loop between the input capacitors and the source of the low-side FET to be very small and tie the grounds of the low-side FET and input capacitor directly to each other and then to the ground plane through vias. As shown in Figure 17 when the input capacitor ground is tied directly to the source of the low-side FET, parasitic inductance in the power path, along with noise coupled into the ground plane, are reduced. The switch node is the next item of importance. The switch node should be made only as large as required to handle the load current. There are fast voltage transitions occurring in the switch node at a high frequency, and if the switch node is made too large it may act as an antennae and couple switching noise into other parts of the circuit. For high power designs, it is recommended to use a multi-layer board. The FETs are going to be the largest heat generating devices in the design, and as such, care should be taken to remove the heat. On multilayer boards using exposed-pad packages for the FETs such as the power-pak SO-8, vias should be used under the FETs to the same plane on the interior layers to help dissipate the heat and cool the FETs. For the typical single FET Power-Pak type FETs, the high-side FET DAP is VIN. The VIN plane should be copied to the other interior layers to the bottom layer for maximum heat dissipation. Likewise, the DAP of the low-side FET is connected to the SW node and the SW node shape should be duplicated to the other PCB layers for maximum heat dissipation. See the Evaluation Board application note AN-1900 (SNVA371) for an example of a typical multi-layer board layout, and the Demonstration Board Reference Design Application Note for a typical 2 layer board layout. Each design allows for single sided component mounting. 20 Submit Documentation Feedback Copyright (c) 2008-2011, Texas Instruments Incorporated Product Folder Links: LM3150 LM3150 www.ti.com SNVS561D - SEPTEMBER 2008 - REVISED MARCH 2011 VIN M1 L M2 CIN COUT Figure 17. Schematic of Parasitics HG D G D S M1 S + - S D D VIN L VOUT CIN S xx S S LG D D COUT D G LG HG xx PGND vias to ground plane D M2 LM3150 Figure 18. PCB Placement of Power Stage Submit Documentation Feedback Copyright (c) 2008-2011, Texas Instruments Incorporated Product Folder Links: LM3150 21 PACKAGE OPTION ADDENDUM www.ti.com 24-Jan-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Top-Side Markings (3) (4) LM3150MH/NOPB ACTIVE HTSSOP PWP 14 94 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM3150 MH LM3150MHE/NOPB ACTIVE HTSSOP PWP 14 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM3150 MH LM3150MHX/NOPB ACTIVE HTSSOP PWP 14 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM3150 MH (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Only one of markings shown within the brackets will appear on the physical device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 Samples PACKAGE MATERIALS INFORMATION www.ti.com 21-Mar-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) LM3150MHE/NOPB HTSSOP PWP 14 250 178.0 12.4 LM3150MHX/NOPB HTSSOP PWP 14 2500 330.0 12.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.95 8.3 1.6 8.0 12.0 Q1 6.95 8.3 1.6 8.0 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 21-Mar-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM3150MHE/NOPB HTSSOP PWP LM3150MHX/NOPB HTSSOP PWP 14 250 210.0 185.0 35.0 14 2500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA PWP0014A MXA14A (Rev A) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2013, Texas Instruments Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: 551600142-002/NOPB