SO T2 23 MCR08BT1 Thyristor; logic level Rev. 4 -- 2 November 2011 Product data sheet SOT223 1. Product profile 1.1 General description Passivated, sensitive gate thyristor in a SOT223 plastic package. 1.2 Features and benefits Sensitive gate Surface mount package. 1.3 Applications General purpose switching and phase control Designed to be interfaced directly to microcontrollers, logic integrated circuits and low power gate trigger circuits. 1.4 Quick reference data VDRM, VRRM 200 V IT(AV) 0.5 A IGT = 50 A (typ). IT(RMS) 0.8 A ITSM 9 A 2. Pinning information Table 1: Pinning Pin Description 1 cathode 2 anode 3 gate 4 anode Simplified outline Symbol A 4 K G sym037 1 2 3 SOT223 (SC-73) 3. Ordering information Table 2: Ordering information Type number MCR08BT1 Package Name Description Version SC-73 plastic surface mounted package with increased heat sink; 4 leads SOT223 MCR08BT1 NXP Semiconductors Thyristor; logic level 4. Limiting values Table 3: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min [1] Max Unit 200 V VDRM, VRRM repetitive peak off-state voltage IT(AV) average on-state current half sine wave; Tsp 112 C; see Figure 1 - 0.5 A IT(RMS) RMS on-state current all conduction angles; see Figure 4 and 5 - 0.8 A ITSM non-repetitive peak on-state current half sine wave; Tj = 25 C prior to surge; see Figure 2 and 3 t = 10 ms - 8 A t = 8.3 ms - 9 A I2t I2t for fusing t = 10 ms - 0.32 A2s dIT/dt repetitive rate of rise of on-state current after triggering ITM = 2 A; IG = 10 mA; dIG/dt = 100 mA/s - 50 A/s IGM peak gate current - 1 A VGM peak gate voltage - 5 V VRGM peak reverse gate voltage - 5 V PGM peak gate power - 2 W PG(AV) average gate power - 0.1 W Tstg storage temperature 40 +150 C Tj junction temperature - 125 C [1] over any 20 ms period Although not recommended, off-state voltages up to 800 V may be applied without damage, but the thyristor may switch to the on-state. The rate of rise of current should not exceed 15 A/s. 001aac104 1 a= 1.57 Ptot (W) 1.9 0.8 110 Tsp(max) (C) 113 2.2 2.8 0.6 116 4 0.4 conduction angle (degrees) form factor a 30 60 90 120 180 4 2.8 2.2 1.9 1.57 0.2 119 122 125 0.7 0 0 0.1 0.2 0.3 0.4 0.5 0.6 IT(AV) (A) a = form factor = IT(RMS)/IT(AV). Fig 1. Total power dissipation as a function of average on-state current; maximum values MCR08BT1 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 -- 2 November 2011 (c) NXP B.V. 2011. All rights reserved. 2 of 13 MCR08BT1 NXP Semiconductors Thyristor; logic level 001aac105 10 ITSM (A) IT ITSM 8 t tp Tj initial = 25 C max 6 4 2 0 1 102 10 103 n f = 50 Hz. Fig 2. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values 001aac106 103 IT ITSM (A) 102 ITSM t tp Tj initial = 25 C max 10 1 10-5 10-4 10-3 10-2 tp (s) tp 10 ms. Fig 3. Non-repetitive peak on-state current as a function of pulse width for sinusoidal currents; maximum values MCR08BT1 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 -- 2 November 2011 (c) NXP B.V. 2011. All rights reserved. 3 of 13 MCR08BT1 NXP Semiconductors Thyristor; logic level 001aac107 2.0 001aac108 1.2 IT(RMS) (A) 1.0 IT(RMS) (A) 1.5 0.8 0.6 1.0 0.4 0.5 0.2 0 10-2 10-1 1 10 surge duration (s) f = 50 Hz; Tsp 112 C. 0 -50 0 50 100 150 Tsp (C) Tsp = 112 C. Fig 4. RMS on-state current as a function of surge duration for sinusoidal currents; maximum values Fig 5. RMS on-state current as a function of solder point temperature; maximum values 5. Thermal characteristics Table 4: Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-sp) thermal resistance from junction to solder point see Figure 6 - - 15 K/W Rth(j-a) thermal resistance from junction to ambient printed-circuit board mounted, minimum footprint - 156 - K/W printed-circuit board mounted, pad area as in Figure 14 - 70 - K/W MCR08BT1 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 -- 2 November 2011 (c) NXP B.V. 2011. All rights reserved. 4 of 13 MCR08BT1 NXP Semiconductors Thyristor; logic level 001aac114 102 Zth(j-sp) (K/W) 10 1 = P tp T 10-1 t tp T 10-2 10-5 10-4 10-3 10-2 10-1 1 10 tp (s) Fig 6. Transient thermal impedance from junction to solder point as a function of pulse duration 6. Characteristics Table 5: Characteristics Tj = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Static characteristics IGT gate trigger current VD = 12 V; IT = 10 mA; gate open circuit; see Figure 8 - 50 200 A IL latching current VD = 12 V; IGT = 0.5 mA; RGK = 1 k; see Figure 10 - 2 6 mA IH holding current VD = 12 V; IGT = 0.5 mA; RGK = 1 k; see Figure 11 - 2 5 mA VT on-state voltage IT = 1.2 A; see Figure 9 - 1.25 1.7 V VGT gate trigger voltage IT = 10 mA; gate open circuit; see Figure 7 VD = 12 V - 0.5 0.8 V VD = VDRM(max); Tj = 125 C 0.2 0.3 - V ID off-state leakage current VD = VDRM(max); Tj = 125 C; RGK = 1 k - 0.05 0.1 mA IR reverse current VR = VRRM(max); Tj = 125 C; RGK = 1 k - 0.05 0.1 mA RGK = 1 k 500 800 - V/s gate open circuit - 25 - V/s Dynamic characteristics dVD/dt critical rate of rise of off-state voltage VDM = 67 % VDRM(max); Tj = 125 C; exponential waveform tgt gate controlled turn-on time ITM = 2 A; VD = VDRM(max); IG = 10 mA; dIG/dt = 0.1 A/s - 2 - s tq circuit commutated turn-off time VD = 67 % VDRM(max); Tj = 125 C; ITM = 1.6 A; VR = 35 V; dITM/dt = 30 A/s; dVD/dt = 2 V/s; RGK = 1 k - 100 - s MCR08BT1 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 -- 2 November 2011 (c) NXP B.V. 2011. All rights reserved. 5 of 13 MCR08BT1 NXP Semiconductors Thyristor; logic level 001aac109 1.6 VGT(Tj) VGT(25 C) IGT(Tj) IGT(25 C) 1.2 2 0.8 1 0.4 -50 0 50 100 150 Tj (C) Fig 7. Normalized gate trigger voltage as a function of junction temperature 001aac113 5 IT (A) 001aac110 3 0 -50 0 50 100 150 Tj (C) Fig 8. Normalized gate trigger current as a function of junction temperature 001aab503 3 IL IL(25C) 4 2 3 2 1 1 (1) 0 0.4 (2) (3) 1.2 2 2.8 0 -50 0 VT (V) 50 100 150 Tj (C) RGK = 1 k . VO = 1.0 V. RS = 0.27 . (1) Tj = 125 C; typical values. (2) Tj = 125 C; maximum values. (3) Tj = 25 C; maximum values. Fig 9. On-state current characteristics MCR08BT1 Product data sheet Fig 10. Normalized latching current as a function of junction temperature All information provided in this document is subject to legal disclaimers. Rev. 4 -- 2 November 2011 (c) NXP B.V. 2011. All rights reserved. 6 of 13 MCR08BT1 NXP Semiconductors Thyristor; logic level 001aab504 3 001aac115 104 dVD/dt (V/s) IH IH(25C) 2 103 1 102 (1) (2) 0 -50 10 0 50 100 150 0 50 Tj (C) 100 150 Tj (C) RGK = 1 k . (1) RGK = 1 k. (2) Gate open circuit. Fig 11. Normalized holding current as a function of junction temperature Fig 12. Critical rate of rise of off-state voltage as a function of junction temperature; typical values 7. Package information Epoxy meets requirements of UL94 V-0 at 18 inch. MCR08BT1 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 -- 2 November 2011 (c) NXP B.V. 2011. All rights reserved. 7 of 13 MCR08BT1 NXP Semiconductors Thyristor; logic level 8. Package outline Plastic surface-mounted package with increased heatsink; 4 leads D SOT223 E B A X c y HE v M A b1 4 Q A A1 1 2 3 Lp bp e1 w M B detail X e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp b1 c D E e e1 HE Lp Q v w y mm 1.8 1.5 0.10 0.01 0.80 0.60 3.1 2.9 0.32 0.22 6.7 6.3 3.7 3.3 4.6 2.3 7.3 6.7 1.1 0.7 0.95 0.85 0.2 0.1 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT223 JEITA SC-73 EUROPEAN PROJECTION ISSUE DATE 04-11-10 06-03-16 Fig 13. Package outline SOT223 (SC-73) MCR08BT1 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 -- 2 November 2011 (c) NXP B.V. 2011. All rights reserved. 8 of 13 MCR08BT1 NXP Semiconductors Thyristor; logic level 9. Mounting 9.1 Mounting instructions 3.8 min 1.5 min 6.3 1.5 min (3x) 2.3 1.5 min 4.6 001aab508 Dimensions in mm. Fig 14. SOT223: minimum footprint MCR08BT1 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 -- 2 November 2011 (c) NXP B.V. 2011. All rights reserved. 9 of 13 MCR08BT1 NXP Semiconductors Thyristor; logic level 10. Revision history Table 6. Revision history Document ID Release date Data sheet status MCR08BT1 v.4 20111102 Product data sheet Modifications: Change notice Supersedes MCR08BT1 v.3 * The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. * Legal texts have been adapted to the new company name where appropriate. MCR08BT1 v.3 20041129 Product data sheet MCR08BT1_HG v.2 MCR08BT1_HG v.2 20011023 Product specification MCR08BT1 v.1 MCR08BT1 v.1 20010701 Product specification - MCR08BT1 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 -- 2 November 2011 (c) NXP B.V. 2011. All rights reserved. 10 of 13 MCR08BT1 NXP Semiconductors Thyristor; logic level 11. Legal information 11.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term `short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 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NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. 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Export might require a prior authorization from competent authorities. MCR08BT1 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 -- 2 November 2011 (c) NXP B.V. 2011. All rights reserved. 11 of 13 MCR08BT1 NXP Semiconductors Thyristor; logic level Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products -- Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications. 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com MCR08BT1 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 -- 2 November 2011 (c) NXP B.V. 2011. All rights reserved. 12 of 13 MCR08BT1 NXP Semiconductors Thyristor; logic level 13. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 10 11 11.1 11.2 11.3 11.4 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package information . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Mounting instructions . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 2 November 2011 Document identifier: MCR08BT1