System Lens Driver Series for Digital Still Cameras / Single-lens Reflex Cameras 1 to 2ch Lens Drivers for Single-Lens Reflex Cameras No.09014EAT03 BD6735FV, BD6736FV Description The BD6735FV motor driver provides 2 Full-ON Drive H-bridge channels, while BD6736FV provides 1 Full-ON Drive H-bridge channel. ROHM's lens driver series features high voltage resistance and large current output in a compact surface mount package, making it ideally suited for smaller systems such as Single-Lens Reflex with Interchangeable Lenses. Features 1) Low ON-Resistance Power MOS output: Full-ON Drive block with 1.0 Typ. (BD6735FV) Full-ON Drive block with 0.35 Typ. (BD6736FV) 2) DMOS output allowing a range power supply: 2.0V to 8.0V (BD6735FV), 2.0V to 9.0V (BD6736FV) 3) Built-in step-up circuit for the DMOS gate voltage drive 4) Drive mode switching function 5) H bridge maximum output current: DC maximum 1.0A (BD6735FV and BD6736FV), Peak maximum 3.2A (BD6736FV) 6) UVLO (Under Voltage Lockout Protection) function 7) Built-in TSD (Thermal Shut Down) circuit 8) Standby current consumption: 0A Typ. Absolute Maximum Ratings Parameter Power supply voltage Motor power supply voltage Charge pump step-up power supply voltage Limit Symbol BD6735FV BD6736FV Unit VCC -0.5 to +10.0 -0.5 to +10.0 V VM -0.5 to +10.0 -0.5 to +10.0 V VBST -0.5 to +15.0 -0.5 to +15.0 V Control input voltage VIN -0.5 to VCC+0.5 -0.5 to VCC+0.5 V Power dissipation Pd 8101 8101 mW Topr -30 to +75 -30 to +75 Tjmax +150 +150 Operating temperature range Junction temperature Storage temperature range Tstg -55 to +150 -55 to +150 H-bridge output current (DC) Iout -1000 to +10002 -1000 to +10002 mA/ch Ipeak - -3200 to +32003 mA/ch H-bridge output current (Peak) 1 Reduced by 6.48mW/C over 25, when mounted on a glass epoxy board (70mm 70mm 1.6mm). 2 Must not exceed Pd, ASO, or Tjmax of 150 3 Peak=100msec Operating Conditions (Ta=-30 to +75) Parameter Limit Symbol Unit BD6735FV BD6736FV VCC 2.0 to 8.0 2.0 to 9.0 V Motor power supply voltage VM 2.0 to 8.0 2.0 to 9.0 V Control input voltage VIN 0 to VCC 0 to VCC V Logic input frequency FIN 0 to 100 0 to 100 kHz Min. logic input pulse width TIN 0.5 0.5 s Power supply voltage www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved. 1/8 2009.06 - Rev.A Technical Note BD6735FV, BD6736FV Electrical Characteristics 1) BD6735FV and BD6736FV Electrical Characteristics (Unless otherwise specified, Ta=25C, VCC=5.0V, VM=5.0V) Limit Parameter Symbol Unit Conditions Min. Typ. Max. Overall Circuit current ICCST 0 1 A PS=0V during standby operation Circuit current (BD6735FV) ICC 0.5 2.0 4.0 mA PS=H, FIN=100kHz Circuit current (BD6736FV) ICC 0.5 1.5 4.0 mA PS=H, FIN=100kHz Power saving (PS) High-level input voltage VPSH 2.0 VCC V Low-level input voltage VPSL -0.3 0.5 V High-level input current IPSH 25 50 100 A VPSH=5V Low-level input current IPSL -1 0 1 A VPSL=0V Control input (BD6735FV; INxA, INxB, PWMEN, and BD6736FV; INA, INB, PWM) High-level input voltage VINH 2.0 VCC V Low-level input voltage VINL -0.3 0.7 V High-level input current IINH 25 50 100 A VINH=5V Low-level input current IINL -1 0 1 A VINL=0V UVLO UVLO voltage VUVLO 1.5 1.9 V BD6735FV Full-ON Drive block (ch1 and ch2) Output ON-Resistance RON 1.0 1.35 Io=700mA on high and low sides in total BD6736FV Full-ON Drive block (ch1) Output ON-Resistance RON 0.35 0.5 Io=500mA on high and low sides in total Electrical Characteristics BD6735FV, BD6736FV BD6735FV, BD6736FV 5.0 600 486mW 400 200 75C 25 50 75 BD6735FV Op. range 3.0 (2.0V to 8.0V) 2.0 Top 75C Mid 25C Low -30C 1.0 0.0 2.0 Ambient temperature : Ta [C] 400 200 0 6.0 8.0 200 400 600 800 1000 Output current : IOUT [mA] Fig.4 Output ON-Voltage on Low-Side www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved. Top 75C Mid 25C Low -30C 0 400 600 800 1000 Fig.3 Output ON-Voltage on High-Side 200 150 100 Top 75C Mid 25C Low -30C 50 200 Output current : IOUT [mA] 0 0 200 10.0 BD6736FV 250 Output VDS : VDSH [mV] Output VDS : VDSL [mV] 600 4.0 Fig.2 Circuit current BD6735FV Top 75C Mid 25C Low -30C 400 Supply voltage : VCC [V] Fig.1 Power Dissipation Reduction 800 600 0 0.0 100 125 150 BD6736FV 250 Output VDS : VDSH [mV] 0 (2.0V to 9.0V) 4.0 Output VDS : VDSL [mV] 810mW 800 0 BD6735FV 800 BD6736FV Op. range Circuit current : ICC [mA] Power dissipation : Pd [mW] 1000 Top 75C Mid 25C Low -30C 200 150 100 50 0 0 200 400 600 800 1000 Output current : IOUT [mA] Fig.5 Output ON-Voltage on High-Side 2/8 0 200 400 600 800 1000 Output current : IOUT [mA] Fig.6 Output ON-Voltage on Low-Side 2009.06 - Rev.A Technical Note BD6735FV, BD6736FV Application Circuit Diagram, Pin Function, and Pin Arrangement Bypass filter Capacitor for power supply input. (p.7/8) Power-saving (p.5/8) H : Active L : Standby 1100uF 1 Power Save PS 20 TSD & UVLO Motor control input (p.5/8) Bypass filter Capacitor for power supply input. (p.7/8) VCC BandGap 1100uF 5 BST 6 H bridge IN1A 19 Level Shift IN1B 18 Logic IN2A 17 Full ON 7 & Pre Driver 4 H bridge IN2B 16 Full ON 3 PWMEN 15 2 Power Save Drive mode selection (p.5/8) H : EN/IN L : IN/IN OSC 10 8 Charge Pump 14 GND 13 CPL1 0.1F OUT1 OUT2 M OUT3 OUT4 MGND2 MGND1 Charge Pump 12 CPL2 VM 11 CPH1 0.1F 9 CPH2 BST 1.0F Connecting capacitors between the CPL1 and CPL2, CPH1 and CPH2, and BST and GND pins generate a BST voltage. Use caution to ensure that the voltage differential between BST and VM is 3.0V or higher, and that the BST voltage does not exceed the absolute maximum rating of 15V, especially set the BST voltage direct input.(p.5/8) Fig.7 BD6735FV Application Circuit Diagram PS 20 MGND2 IN1A 19 3 OUT4 IN1B 18 4 OUT3 IN2A 17 5 VM IN2B 16 6 OUT1 PWMEN 15 7 OUT2 CPL1 14 8 MGND1 CPL2 13 9 BST CPH1 12 10 GND CPH2 11 1 VCC 2 No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 BD6735FV Pin Function Table Pin Name Function VCC Power supply pin MGND2 Motor ground pin 2 OUT4 H-bridge output pin 4 OUT3 H-bridge output pin 3 VM Motor power supply pin OUT1 H-bridge output pin 1 OUT2 H-bridge output pin 2 MGND1 Motor ground pin 1 BST Charge pump step-up power supply pin GND Ground pin CPH2 Capacitor connection pin for second charge 2 CPH1 Capacitor connection pin for second charge 1 CPL2 Capacitor connection pin for first charge 2 CPL1 Capacitor connection pin for first charge 1 PWMEN Drive mode selection pin IN2B Control input pin ch2 B IN2A Control input pin ch2 A IN1B Control input pin ch1 B IN1A Control input pin ch1 A PS Power-saving pin Fig.8 BD6735FV Pin Arrangement (Top View) www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved. 3/8 2009.06 - Rev.A Technical Note BD6735FV, BD6736FV Bypass filter Capacitor for power supply input. (p.7/8) Power-saving (p.5/8) H : Active L : Standby 1100uF 20 PS 19 Power Save VCC TSD & UVLO Motor control input (p.5/8) Bypass filter Capacitor for power supply input. (p.7/8) BandGap BST INA 18 1100uF Level Shift Logic H bridge & INB 17 Full ON Pre Driver 1 9 3 4 7 8 5 6 VM OUTA OUTB MGND PWM 16 Power Save Drive mode selection (p.5/8) H : EN/IN L : IN/IN OSC Charge Pump 10 15 GND 14 CPL1 Charge Pump 13 CPL2 0.1F 12 CPH1 0.1F 11 BST CPH2 1.0F Connecting capacitors between the CPL1 and CPL2, CPH1 and CPH2, and BST and GND pins generate a BST voltage. Use caution to ensure that the voltage differential between BST and VM is 3.0V or higher, and that the BST voltage does not exceed the absolute maximum rating of 15V, especially set the BST voltage direct input. (p.5/8) Fig.9 BD6736FV Application Circuit Diagram VCC 20 PS 19 OUTA INA 18 4 OUTA INB 17 5 MGND PWM 16 6 MGND CPL1 15 7 OUTB CPL2 14 8 OUTB CPH1 13 9 VM CPH2 12 BST 11 1 VM 2 N.C. 3 10 GND No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Pin Name VM N.C. OUTA OUTA MGND MGND OUTB OUTB VM GND BST CPH2 CPH1 CPL2 CPL1 PWM INB INA PS VCC BD6736FV Pin Function Table Function Motor power supply pin H-bridge output pin A H-bridge output pin A Motor ground pin Motor ground pin H-bridge output pin B H-bridge output pin B Motor power supply pin Ground pin Charge pump step-up power supply pin Capacitor connection pin for second charge 2 Capacitor connection pin for second charge 1 Capacitor connection pin for first charge 2 Capacitor connection pin for first charge 1 Drive mode selection pin Control input pin ch1 B Control input pin ch1 A Power-saving pin Power supply pin Fig.10 BD6736FV Pin Arrangement (Top View) www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved. 4/8 2009.06 - Rev.A Technical Note BD6735FV, BD6736FV Function Explanation 1) Power-saving function When Low-level voltage is applied to PS pin, the IC will be turned off internally and the circuit current will be 0A (Typ.). During operating mode, PS pin should be High-level. (See the Electrical Characteristics; p.2/8) 2) Motor Control input (1) INxA and INxB pins (BD6735FV), INA and INB pins (BD6736FV) These pins are used to program and control the motor drive modes. (See the Electrical Characteristics; p.2/8, and I/O Truth Table; p.5/8) (2) PWMEN pin (BD6735FV), PWM pin (BD6736FV) When the High-level voltage is applied to the PWMEN pin (PWM pin), the I/O logic can be set to EN/IN mode. However, when the Low-level voltage is applied, the I/O logic can be set to IN/IN mode. (See the Electrical Characteristics; p.2/8, and I/O Truth Table; p.5/8) 3) H-bridge The 2-channel H-bridges can be controlled independently. For this reason, it is possible to drive the H-bridges simultaneously, as long as the package thermal tolerances are not exceeded. The H-bridge output transistors consist of Power DMOS with the charge pump step-up power supply BST. The total H-bridge ON-Resistance on the high and low sides varies with the BST voltages. 4) Charge pump Each output H-bridge on the high and low sides consists of Nch DMOS. Therefore, the gate voltage BST should be higher than the VM voltage to drive the Nch DMOS on the high side. The BD6735FV and BD6736FV have a built-in charge pump circuit that generates BST voltage by connecting an external capacitor, between CPL1 and CPL2, CPH1 and CPH2, BST and GND. In order to ensure better performance, the voltage differential between BST and VM must be 3.0V or higher, and the BST voltage must not exceed the absolute maximum rating of 15.0V. I/O Truth Table BD6735FV I/O Truth Table INPUT Drive mode PS EN/IN PWM EN IN1A/2A IN1B/2B OUT1/3 OUT2/4 L H H L H L H X X L H L L H H X L H L Z H L L Z L L H Z L H L Z H H IN/IN - L L OUTPUT X Output mode Brake CW CCW Standby CW CCW Brake Standby L: Low, H: High, X: Don't care, Z: High Impedance At CW, current flows from OUT1(3) to OUT2(4). At CCW, current flows from OUT2(4) to OUT1(3). BD6736FV I/O Truth Table Drive mode PS EN/IN PWM H H IN/IN - L L X INPUT INA L H H L H L H X INB X L H L L H H X OUTPUT OUTA OUTB L L H L L H Z Z H L L H L L Z Z Output mode Brake CW CCW Standby CW CCW Brake Standby L: Low, H: High, X: Don't care, Z: High Impedance At CW, current flows from OUTA to OUTB. At CCW, current flows from OUTB to OUTA. www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved. 5/8 2009.06 - Rev.A Technical Note BD6735FV, BD6736FV I/O Circuit Diagram INxA, INxB, PWMEN (BD6735FV) INA, INB, PWM (BD6736FV) PS VCC VCC VM, MGND, OUT14 (BD6735FV) VCC VM, MGND, OUTA, B (BD6736FV) VM VM OUT1, 3 OUTA OUT2, 4 VCC OUTB VM 70k 10k 100k 100k 275k 3.33k MGND CPH1, CPL1 Inside REG MGND BST, CPH2, CPL2 BST VM CPH2 CPL2 VM Fig.11 I/O Circuit Diagram (Resistance values are typical ones) Notes for use 1) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. The implementation of a physical safety measure such as a fuse should be considered when use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated. 2) Storage temperature range As long as the IC is kept within this range, there should be no problems in the IC's performance. Conversely, extreme temperature changes may result in poor IC performance, even if the changes are within the above range. 3) Power supply pins and lines None of the VM line for the H-bridges is internally connected to the VCC power supply line, which is only for the control logic or analog circuit. Therefore, the VM and VCC lines can be driven at different voltages. Although these lines can be connected to a common power supply, do not open the power supply pin but connect it to the power supply externally. Regenerated current may flow as a result of the motor's back electromotive force. Insert capacitors between the power supply and ground pins to serve as a route for regenerated current. Determine the capacitance in full consideration of all the characteristics of the electrolytic capacitor, because the electrolytic capacitor may loose some capacitance at low temperatures. If the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp diode between the power supply and ground pins. For this IC with 2 power supplies and a part consists of the CMOS block, it is possible that rush current may flow instantaneously due to the internal powering sequence and delays, and to the unstable internal logic, respectively. Therefore, give special consideration to power coupling capacitance, width of power and ground wirings, and routing of wiring. 4) Ground pins and lines Ensure a minimum GND pin potential in all operating conditions. Make sure that no pins are at a voltage below the GND at any time, regardless of whether it is a transient signal or not. When using both small signal GND and large current MGND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. The power supply and ground lines must be as short and thick as possible to reduce line impedance. www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved. 6/8 2009.06 - Rev.A Technical Note BD6735FV, BD6736FV 5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 6) Pin short and wrong direction assembly of the device Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if positive and ground power supply terminals are reversed. The IC may also be damaged if pins are shorted together or are shorted to other circuit's power lines. 7) Actions in strong magnetic field Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction. 8) ASO When using the IC, set the output transistor for the motor so that it does not exceed absolute maximum ratings or ASO. 9) Thermal shutdown circuit If the junction temperature (Tjmax) reaches 175C (BD6735FV Typ.) and 160C (BD6736FV Typ.), the TSD circuit will operate, and the coil output circuit of the motor will open. There is a temperature hysteresis of approximately 20C. The TSD circuit is designed only to shut off the IC in order to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. The performance of the IC's characteristics is not guaranteed and it is recommended that the device is replaced after the TSD is activated. 10) Testing on application board When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to, or removing it from a jig or fixture, during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting and storing the IC. 11) Application example The application circuit is recommended for use. Make sure to confirm the adequacy of the characteristics. When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external components including static and transitional characteristics as well as dispersion of the IC. 12) Regarding input pin of the IC + This monolithic IC contains P isolation and P substrate layers between adjacent elements to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic diode and transistor. Parasitic elements can occur inevitably in the structure of the IC. The operation of parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic elements operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used. Resistor Pin A Pin B C Transistor (NPN) B Pin A N P+ N P+ P N N Parasitic element P+ GND www.rohm.com P+ P C N E Parasitic element P substrate Parasitic element Fig.12 Example of Simple IC Architecture (c) 2009 ROHM Co., Ltd. All rights reserved. B N P substrate Parasitic element Pin B E 7/8 GND GND Other adjacent elements GND 2009.06 - Rev.A Technical Note BD6735FV, BD6736FV Ordering part number B D 6 Part No. 7 3 5 F Part No. 6735 : 8.0V power supply voltage 6736 : 9.0V power supply voltage 3.2A peak current V - Package FV : SSOP-B20 E 2 Packaging and forming specification E2: Embossed tape and reel SSOP-B20 <Tape and Reel information> 6.5 0.2 11 0.3Min. 4.4 0.2 6.4 0.3 20 1 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 10 0.1 0.1 1.15 0.1 0.15 0.1 0.1 0.65 0.22 0.1 1pin Reel (Unit : mm) www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved. 8/8 Direction of feed Order quantity needs to be multiple of the minimum quantity. 2009.06 - Rev.A Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. 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The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. 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The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.001