GE Energy Data Sheet 6A Austin MicroLynx IITM: SMT Non-Isolated DC-DC Power Module 2.4Vdc -5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current RoHS Compliant Features Compliant to RoHS EU Directive 2011/65/EU (-Z versions) Compliant to RoHS EU Directive 2011/65/EU under exemption 7b (Lead solder exemption). Exemption 7b will expire after June 1, 2016 at which time this product will no longer be RoHS compliant (non-Z versions) Flexible output voltage sequencing EZ-SEQUENCETM Delivers up to 6A output current High efficiency - 96% at 3.3V full load (VIN = 5.0V) Small size and low profile: 27.9 mm x 11.4 mm x 7.24 mm Applications (1.10 in x 0.45 in x 0.285 in) Distributed power architectures Low output ripple and noise Intermediate bus voltage applications High Reliability: Telecommunications equipment Servers and storage applications Networking equipment Enterprise Networks Latest generation IC's (DSP, FPGA, ASIC) and Microprocessor powered applications Calculated MTBF = 12.8M hours at 25oC Full-load Output voltage programmable from 0.75 Vdc to 3.63Vdc via external resistor Line Regulation: 0.3% (typical) Load Regulation: 0.4% (typical) Temperature Regulation: 0.4 % (typical) Remote On/Off Output overcurrent protection (non-latching) Wide operating temperature range (-40C to 85C) UL* 60950-1Recognized, CSA C22.2 No. 60950-1-03 Certified, and VDE 0805:2001-12 (EN60950-1) Licensed ISO** 9001 and ISO 14001 certified manufacturing facilities Description Austin MicroLynxTM II SMT (surface mount technology) power modules are non-isolated dc-dc converters that can deliver up to 6A of output current with full load efficiency of 96.0% at 3.3V output. These modules provide a precisely regulated output voltage programmable via an external resistor from 0.75Vdc to 3.63Vdc over a wide range of input voltage (VIN = 2.4 - 5.5Vdc). Austin MicroLynxTM II has a sequencing feature, EZ-SEQUENCETM that enable designers to implement various types of output voltage sequencing when powering multiple modules on board. * UL is a registered trademark of Underwriters Laboratories, Inc. CSA is a registered trademark of Canadian Standards Association. VDE is a trademark of Verband Deutscher Elektrotechniker e.V. ** ISO is a registered trademark of the International Organization of Standards October 1, 2015 (c)2015 General Electric Company. All rights reserved. GE Energy Data Sheet 6A Austin MicroLynxTMII: SMT Non-Isolated DC-DC Power Modules 2.4Vdc -5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. Parameter Device Symbol Min Max Unit All VIN -0.3 5.8 Vdc Sequencing voltage All Vseq -0.3 VIN,max Vdc Operating Ambient Temperature All TA -40 85 C All Tstg -55 125 C Input Voltage Continuous (see Thermal Considerations section) Storage Temperature Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Parameter Device Symbol Min Typ Max Unit 2.4 5.5 Vdc 6.0 Adc Operating Input Voltage Vo,set 3.63 VIN Maximum Input Current All IIN,max VO,set = 0.75 Vdc IIN,No load 20 mA VO,set = 3.3Vdc IIN,No load 45 mA All IIN,stand-by 0.6 mA Inrush Transient All I2t Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1H source impedance; VIN, min to VIN, max, IO= IOmax ; See Test configuration section) All 35 mAp-p Input Ripple Rejection (120Hz) All 30 dB (VIN= VIN, min to VIN, max, IO=IO, max ) Input No Load Current (VIN = VIN, nom, Io = 0, module enabled) Input Stand-by Current (VIN = VIN, nom, module disabled) 0.04 A 2s CAUTION: This power module is not internally fused. An input line fuse must always be used. This power module can be used in a wide variety of applications, ranging from simple standalone operation to being part of a complex power architecture. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 6 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer's data sheet for further information. October 1, 2015 (c)2015 General Electric Company. All rights reserved. Page 2 GE Energy Data Sheet 6A Austin MicroLynxTMII: SMT Non-Isolated DC-DC Power Modules 2.4Vdc -5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Electrical Specifications (continued) Parameter Output Voltage Set-point Device Symbol Min Typ Max Unit All VO, set -2.0 +2.0 % VO, set All VO, set -3.0 +3.0 % VO, set All VO 0.7525 3.63 Vdc % VO, set (VIN=IN, min, IO=IO, max, TA=25C) Output Voltage (Over all operating input voltage, resistive load, and temperature conditions until end of life) Adjustment Range Selected by an external resistor Output Regulation Line (VIN=VIN, min to VIN, max) All 0.3 Load (IO=IO, min to IO, max) All 0.4 % VO, set Temperature (Tref=TA, min to TA, max) All 0.4 % VO, set RMS (5Hz to 20MHz bandwidth) All 10 15 mVrms Peak-to-Peak (5Hz to 20MHz bandwidth) All 40 50 mVpk-pk Output Ripple and Noise on nominal output (VIN=VIN, nom and IO=IO, min to IO, max Cout = 1F ceramic//10Ftantalum capacitors) External Capacitance ESR 1 m All CO, max 1000 F ESR 10 m All CO, max 5000 F Output Current All Io 0 6 Adc Output Current Limit Inception (Hiccup Mode ) All IO, lim 220 % Io All IO, s/c 2 Adc (VO= 90% of VO, set) Output Short-Circuit Current (VO250mV) ( Hiccup Mode ) Efficiency VO, set = 0.75Vdc 81.2 % VIN= VIN, nom, TA=25C VO, set = 1.2Vdc 86.8 % IO=IO, max , VO= VO,set VO,set = 1.5Vdc 88.8 % VO,set = 1.8Vdc 89.7 % VO,set = 2.5Vdc 92.5 % VO,set = 3.3Vdc 95.4 % All fsw 300 kHz All Vpk 130 mV Switching Frequency Dynamic Load Response (dIo/dt=2.5A/s; VIN = VIN, nom; TA=25C) Load Change from Io= 50% to 100% of Io,max; 1F ceramic// 10 F tantalum Peak Deviation Settling Time (Vo<10% peak deviation) All ts 25 s (dIo/dt=2.5A/s; VIN = VIN, nom; TA=25C) Load Change from Io= 100% to 50%of Io,max: 1F ceramic// 10 F tantalum All Vpk 130 mV All ts 25 s Peak Deviation Settling Time (Vo<10% peak deviation) October 1, 2015 (c)2015 General Electric Company. All rights reserved. Page 3 GE Energy Data Sheet 6A Austin MicroLynxTMII: SMT Non-Isolated DC-DC Power Modules 2.4Vdc -5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Electrical Specifications (continued) Parameter Device Symbol Min Typ Max Unit All Vpk 50 mV Dynamic Load Response (dIo/dt=2.5A/s; V VIN = VIN, nom; TA=25C) Load Change from Io= 50% to 100% of Io,max; Co = 2x150 F polymer capacitors Peak Deviation Settling Time (Vo<10% peak deviation) All ts 50 s (dIo/dt=2.5A/s; VIN = VIN, nom; TA=25C) Load Change from Io= 100% to 50%of Io,max: Co = 2x150 F polymer capacitors Peak Deviation All Vpk 50 mV Settling Time (Vo<10% peak deviation) All ts 50 s General Specifications Parameter Min Calculated MTBF (IO=IO, max, TA=25C) Weight October 1, 2015 Typ Max 12,841,800 2.8 (0.1) (c)2015 General Electric Company. All rights reserved. Unit Hours g (oz.) Page 4 GE Energy Data Sheet 6A Austin MicroLynxTMII: SMT Non-Isolated DC-DC Power Modules 2.4Vdc -5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information. Parameter Device Symbol Input High Voltage (Module ON) All VIH Input High Current All IIH Input Low Voltage (Module OFF) All VIL Input Low Current All IIL Input High Voltage (Module OFF) All VIH Input High Current All IIH Input Low Voltage (Module ON) All VIL Input low Current All IIL Case 1: On/Off input is set to Logic Low (Module ON) and then input power is applied (delay from instant at which VIN =VIN, min until Vo=10% of Vo,set) Case 2: Input power is applied for at least one second and then the On/Off input is set to logic Low (delay from instant at which Von/Off=0.3V until Vo=10% of Vo, set) All Tdelay All Output voltage Rise time (time for Vo to rise from 10% of Vo,set to 90% of Vo, set) All Min Typ Max Unit VIN, max V 10 A -0.2 0.3 V 0.2 1 mA 1.5 VIN,max Vdc On/Off Signal interface Device code with Suffix "4" - Positive logic (On/Off is open collector/drain logic input; Signal referenced to GND - See feature description section) Device Code with no suffix - Negative Logic (On/OFF pin is open collector/drain logic input with external pull-up resistor; signal referenced to GND) 0.2 1 mA 0.3 Vdc 10 A 3.9 msec Tdelay 3.9 msec Trise 4.2 8.5 msec 1 % VO, set -0.2 Turn-On Delay and Rise Times (IO=IO, max , VIN = VIN, nom, TA = 25 oC, ) Output voltage overshoot - Startup IO= IO, max; VIN = 3.0 to 5.5Vdc, TA = 25 C o Sequencing Delay time Delay from VIN, min to application of voltage on SEQ pin Tracking Accuracy (Power-Up: 2V/ms) (Power-Down: 1V/ms) (VIN, min to VIN, max; IO, min to IO, max VSEQ < Vo) Overtemperature Protection All TsEQ- All All |VSEQ - |VVSEQ| - All Tref delay 10 V | msec 100 200 mV 200 400 mV 150 C (See Thermal Considerations section) Input Undervoltage Lockout Turn-on Threshold Turn-off Threshold October 1, 2015 All 2.2 V All 2.0 V (c)2015 General Electric Company. All rights reserved. Page 5 GE Energy Data Sheet 6A Austin MicroLynxTMII: SMT Non-Isolated DC-DC Power Modules 2.4Vdc -5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Characteristic Curves The following figures provide typical characteristics for the Austin MicroLynxTM II SMT modules at 25C. 98 91 95 88 92 EFFICIENCY, (%) EFFICIENCY, (%) 85 82 79 VIN=2.4V 76 VIN=5V 73 89 86 83 VIN=2.4V 80 VIN=5V 77 VIN=5.5V VIN=5.5V 70 74 0 1 2 3 4 5 6 0 1 OUTPUT CURRENT, IO (A) 3 4 5 6 Figure 4. Converter Efficiency versus Output Current (Vout = 1.8Vdc). 94 98 91 95 88 92 EFFICIENCY, (%) EFFICIENCY, (%) Figure 1. Converter Efficiency versus Output Current (Vout = 0.75Vdc). 85 82 VIN=2.4V 79 VIN=5V 76 VIN=5.5V 73 89 86 83 V IN=3V 80 V IN=5V 77 V IN=5.5V 74 70 0 1 2 3 4 5 0 6 1 OUTPUT CURRENT, IO (A) 2 3 4 5 Figure 5. Converter Efficiency versus Output Current (Vout = 2.5Vdc). 98 91 95 88 92 EFFICIENCY, (%) 94 85 82 VIN=2.4V 79 VIN=5V 76 VIN=5.5V 73 89 86 83 V IN=4.5V 80 V IN=5V 77 70 0 1 2 3 4 5 OUTPUT CURRENT, IO (A) Figure3. Converter Efficiency versus Output Current (Vout = 1.5Vdc). October 1, 2015 6 OUTPUT CURRENT, IO (A) Figure 2. Converter Efficiency versus Output Current (Vout = 1.2Vdc). EFFICIENCY, (%) 2 OUTPUT CURRENT, IO (A) 6 V IN=5.5V 74 0 1 2 3 4 OUTPUT CURRENT, IO (A) 5 6 Figure 6. Converter Efficiency versus Output Current (Vout = 3.3Vdc). (c)2015 General Electric Company. All rights reserved. Page 6 GE Energy Data Sheet 6A Austin MicroLynxTMII: SMT Non-Isolated DC-DC Power Modules 2.4Vdc -5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Characteristic Curves (continued) The following figures provide typical characteristics for the MicroLynxTM II SMT modules at 25C. 7 Io=6A 1 0 1 1.75 2.5 3.25 4 INPUT VOLTAGE, VIN (V) Figure 7. Input voltage vs. Input Current TIME, t (2s/div) TIME, t (2s/div) Figure 9. Typical Output Ripple and Noise (Vin = 5.0V dc, Vo = 3.3 Vdc, Io=6A). VO (V) (100mV/div) TIME, t (5 s/div) Figure 10. Transient Response to Dynamic Load Change from 50% to 100% of full load (Vo = 3.3Vdc). TIME, t (5 s/div) Figure 11. Transient Response to Dynamic Load Change from 100% to 50% of full load (Vo = 3.3 Vdc). OUTPUT CURRENT, OUTPUT VOLTAGE VO (V) (20mV/div) OUTPUT VOLTAGE Figure 8. Typical Output Ripple and Noise (Vin = 5.0V dc, Vo = 0.75 Vdc, Io=6A). October 1, 2015 5.5 OUTPUT CURRENT, OUTPUT VOLTAGE VO (V) (20mV/div) OUTPUT VOLTAGE (Vout =2.5Vdc). 4.75 IO (A) (2A/div) 2 OUTPUT CURRENT, OUTPUT VOLTAGE 3 VO (V) (100mV/div) 4 IO (A) (2A/div) Io=0A VO (V) (50mV/div) Io=3A 5 IO (A) (2A/div) INPUT CURRENT, IIN (A) 6 TIME, t (10s/div) Figure 12. Transient Response to Dynamic Load Change from 50% to 100% of full load (Vo = 3.3 Vdc, Cext = 2x150 F Polymer Capacitors). (c)2015 General Electric Company. All rights reserved. Page 7 GE Energy Data Sheet 6A Austin MicroLynxTMII: SMT Non-Isolated DC-DC Power Modules 2.4Vdc -5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Characteristic Curves (continued) VIN (V) (2V/div) VOn/off (V) (2V/div) TIME, t (2 ms/div) Figure 17 Typical Start-Up Using Remote On/Off with Prebias (Vin = 3.3Vdc, Vo = 1.8Vdc, Io = 1.0A, Vbias =1.0Vdc). OUTPUT CURRENT, VOn/off (V) (2V/div) VOV) (1V/div) OUTPUT VOLTAGE On/Off VOLTAGE Vo (V) (1V/div) OUTPUT VOLTAGE, INPUT VOLTAGE OUTPUT VOLTAGE TIME, t (2 ms/div) Figure 14. Typical Start-Up Using Remote On/Off (Vin = 5.0Vdc, Vo = 3.3Vdc, Io = 6A). TIME, t (2 ms/div) TIME, t (5ms/div) Figure 15. Typical Start-Up Using Remote On/Off with Low- ESR external capacitors (7x150uF Polymer) (Vin = 5.0Vdc, Vo = 3.3Vdc, Io = 6A, Co = 1050F). October 1, 2015 Figure 16. Typical Start-Up with application of Vin (Vin = 5.0Vdc, Vo = 3.3Vdc, Io = 6A). On/Off VOLTAGE VOn/off (V) (2V/div) VOV) (1V/div) OUTPUT VOLTAGE On/Off VOLTAGE Figure 13. Transient Response to Dynamic Load Change from 100% of 50% full load (Vo = 3.3Vdc, Cext = 2x150 F Polymer Capacitors). TIME, t (2 ms/div) VOV) (1V/div) TIME, t (10s/div) IO (A) (5A/div) OUTPUT CURRENT, OUTPUTVOLTAGE VO (V) (50mV/div) IO (A) (2A/div) The following figures provide typical characteristics for the Austin MicroLynxTM II SMT modules at 25C. Figure 18. Output short circuit Current (Vin = 5.0Vdc, Vo = 0.75Vdc). (c)2015 General Electric Company. All rights reserved. Page 8 GE Energy Data Sheet 6A Austin MicroLynxTMII: SMT Non-Isolated DC-DC Power Modules 2.4Vdc -5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Characteristic Curves (continued) 7.5 8 6.0 6 OUTPUT CURRENT, Io (A) OUTPUT CURRENT, Io (A) The following figures provide thermal derating curves for the Austin MicroLynxTM II SMT modules. 4.5 NC 3.0 0.5m/s (100 LFM) 1.5 1.0m/s (200 LFM) 0.0 5 NC 3 0.5m/s (100 LFM) 2 1.0m/s (200 LFM) 0 20 30 40 50 60 70 AMBIENT TEMPERATURE, T AO 80 90 C 20 30 40 50 60 70 AMBIENT TEMPERATURE, T Figure 19. Derating Output Current versus Local Ambient Temperature and Airflow (Vin = 5.0, Vo=3.3Vdc). AO 80 90 C Figure 22. Derating Output Current versus Local Ambient Temperature and Airflow (Vin = 3.3dc, Vo=0.75 Vdc). 7.5 OUTPUT CURRENT, Io (A) 6.0 4.5 NC 3.0 0.5m/s (100 LFM) 1.5 1.0m/s (200 LFM) 0.0 20 30 40 50 60 70 80 90 AMBIENT TEMPERATURE, TA OC Figure 20. Derating Output Current versus Local Ambient Temperature and Airflow (Vin = 5.0Vdc, Vo=0.75 Vdc). OUTPUT CURRENT, Io (A) 7.5 6.0 4.5 NC 3.0 0.5m/s (100 LFM) 1.5 1.0m/s (200 LFM) 0.0 20 30 40 50 60 70 80 90 AMBIENT TEMPERATURE, TA OC Figure 21. Derating Output Current versus Local Ambient Temperature and Airflow (Vin = 3.3Vdc, Vo=2.5 Vdc). October 1, 2015 (c)2015 General Electric Company. All rights reserved. Page 9 GE Energy Data Sheet 6A Austin MicroLynxTMII: SMT Non-Isolated DC-DC Power Modules 2.4Vdc -5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Test Configurations Design Considerations Input Filtering CURRENT PROBE TO OSCILLOSCOPE The Austin MicroLynxTM II SMT module should be connected to a low-impedance source. A highly inductive source can affect the stability of the module. An input capacitance must be placed directly adjacent to the input pin of the module, to minimize input ripple voltage and ensure module stability. LTEST VIN(+) BATTERY 1H CIN CS 1000F Electrolytic 2x100F Tantalum E.S.R.<0.1 @ 20C 100kHz COM NOTE: Measure input reflected ripple current with a simulated source inductance (LTEST) of 1H. Capacitor CS offsets possible battery impedance. Measure current as shown above. Figure 23. Input Reflected Ripple Current Test Setup. COPPER STRIP VO (+) To minimize input voltage ripple, low-ESR polymer and ceramic capacitors are recommended at the input of the module. Figure 26 shows the input ripple voltage (mVp-p) for various outputs with 1x150 F polymer capacitors (Panasonic p/n: EEFUE0J151R, Sanyo p/n: 6TPE150M) in parallel with 1 x 47 F ceramic capacitor (Panasonic p/n: ECJ-5YB0J476M, Taiyo- Yuden p/n: CEJMK432BJ476MMT) at full load. Figure 27 shows the input ripple with 2x150 F polymer capacitors in parallel with 2 x 47 F ceramic capacitor at full load. RESISTIVE LOAD . 10uF 120 SCOPE Input Ripple Voltage (mVp-p) 1uF COM GROUND PLANE NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance. Figure 24. Output Ripple and Noise Test Setup. 100 80 60 40 Vin = 3.3V 20 Vin = 5.0V 0 0 Rcontact Rcontact VIN(+) VO Rdistribution RLOAD VO VIN Rcontact Rcontact COM NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance. Figure 25. Output Voltage and Efficiency Test Setup. Efficiency = VIN. IIN x 100 % 2 3 4 Output Voltage (Vdc) Figure 26. Input ripple voltage for various output with 1x150 F polymer and 1x47 F ceramic capacitors at the input (80% of Io,max). 120 Rdistribution COM VO. IO 1 Rdistribution Input Ripple Voltage (mVp-p) Rdistribution 100 80 60 40 Vin = 3.3V 20 Vin = 5.0V 0 0 1 2 3 4 Output Voltage (Vdc) Figure 27. Input ripple voltage for various output with 2x150 F polymer and 2x47 F ceramic capacitors at the input (80% of Io,max). October 1, 2015 (c)2015 General Electric Company. All rights reserved. Page 10 GE Energy Data Sheet 6A Austin MicroLynxTMII: SMT Non-Isolated DC-DC Power Modules 2.4Vdc -5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Design Considerations (continued) Safety Considerations Output Filtering For safety agency approval the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standards, i.e., UL 60950-1, CSA C22.2 No. 60950-1-03, and VDE 0850:2001-12 (EN60950-1) Licensed. The Austin MicroLynxTM II SMT module is designed for low output ripple voltage and will meet the maximum output ripple specification with 1 F ceramic and 10 F tantalum capacitors at the output of the module. However, additional output filtering may be required by the system designer for a number of reasons. First, there may be a need to further reduce the output ripple and noise of the module. Second, the dynamic response characteristics may need to be customized to a particular load step change. To reduce the output ripple and improve the dynamic response to a step load change, additional capacitance at the output can be used. Low ESR polymer and ceramic capacitors are recommended to improve the dynamic response of the module. For stable operation of the module, limit the capacitance to less than the maximum output capacitance as specified in the electrical specification table. October 1, 2015 For the converter output to be considered meeting the requirements of safety extra-low voltage (SELV), the input must meet SELV requirements. The power module has extralow voltage (ELV) outputs when all inputs are ELV. The input to these units is to be provided with a fast-acting fuse with a maximum rating of 6A in the positive input lead. (c)2015 General Electric Company. All rights reserved. Page 11 GE Energy Data Sheet 6A Austin MicroLynxTMII: SMT Non-Isolated DC-DC Power Modules 2.4Vdc -5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Feature Description VIN+ Remote On/Off MODULE Rpull-up The Austin LynxTM II SMT power modules feature an On/Off pin for remote On/Off operation. Two On/Off logic options are available in the Austin LynxTM II series modules. Positive Logic On/Off signal, device code suffix "4", turns the module ON during a logic High on the On/Off pin and turns the module OFF during a logic Low. Negative logic On/Off signal, no device code suffix, turns the module OFF during logic High on the On/Off pin and turns the module ON during logic Low. For positive logic modules, the circuit configuration for using the On/Off pin is shown in Figure 28. The On/Off pin is an open collector/drain logic input signal (Von/Off) that is referenced to ground. During a logic-high (On/Off pin is pulled high internal to the module) when the transistor Q1 is in the Off state, the power module is ON. Maximum allowable leakage current of the transistor when Von/off = VIN,max is 10A. Applying a logiclow when the transistor Q1 is turned-On, the power module is OFF. During this state VOn/Off must be less than 0.3V. When not using positive logic On/off pin, leave the pin unconnected or tie to VIN. VIN+ MODULE I ON/OFF ON/OFF + VON/OFF PWM Enable R1 Q2 CSS Q1 R2 GND _ Figure 29. Circuit configuration for using negative logic On/OFF. Overcurrent Protection To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. The unit operates normally once the output current is brought back into its specified range. The typical average output current during hiccup is 2A. R2 Input Undervoltage Lockout ON/OFF I ON/OFF + VON/OFF Q2 R1 PWM Enable R3 Overtemperature Protection Q1 Q3 CSS R4 GND At input voltages below the input undervoltage lockout limit, module operation is disabled. The module will begin to operate at an input voltage above the undervoltage lockout turn-on threshold. _ Figure 28. Circuit configuration for using positive logic On/OFF. To provide over temperature protection in a fault condition, the unit relies upon the thermal protection feature of the controller IC. The unit will shutdown if the thermal reference point Tref, exceeds 150oC (typical), but the thermal shutdown is not intended as a guarantee that the unit will survive temperatures beyond its rating. The module will automatically restart after it cools down. For negative logic On/Off devices, the circuit configuration is shown is Figure 29. The On/Off pin is pulled high with an external pull-up resistor (typical Rpull-up = 5k, +/- 5%). When transistor Q1 is in the Off state, logic High is applied to the On/Off pin and the power module is Off. The minimum On/off voltage for logic High on the On/Off pin is 1.5Vdc. To turn the module ON, logic Low is applied to the On/Off pin by turning ON Q1. When not using the negative logic On/Off, leave the pin unconnected or tie to GND. October 1, 2015 (c)2015 General Electric Company. All rights reserved. Page 12 GE Energy Data Sheet 6A Austin MicroLynxTMII: SMT Non-Isolated DC-DC Power Modules 2.4Vdc -5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Feature Descriptions (continued) helps determine the required external trim resistor needed for a specific output voltage. Output Voltage Programming Voltage Margining II SMT can be The output voltage of the Austin programmed to any voltage from 0.75 Vdc to 3.63 Vdc by connecting a single resistor (shown as Rtrim in Figure 30) between the TRIM and GND pins of the module. Without an external resistor between TRIM pin and the ground, the output voltage of the module is 0.7525 Vdc. To calculate the value of the resistor Rtrim for a particular output voltage Vo, use the following equation: MicroLynxTM 21070 Rtrim = - 5110 Vo - 0.7525 Output voltage margining can be implemented in the Austin MicroLynxTM II modules by connecting a resistor, Rmargin-up, from the Trim pin to the ground pin for margining-up the output voltage and by connecting a resistor, Rmargin-down, from the Trim pin to the Output pin for margining-down. Figure 31 shows the circuit configuration for output voltage margining. The POL Programming Tool, available at www.gecriticalpower.com under the Design Tools section, also calculates the values of Rmargin-up and Rmargin-down for a specific output voltage and % margin. Please consult your local GE technical representative for additional details. For example, to program the output voltage of the Austin MicroLynxTM II module to 1.8 Vdc, Rtrim is calculated is follows: Vo Rmargin-down 21070 Rtrim = - 5110 1.8 - 0.7525 Austin Lynx or Lynx II Series Rtrim = 15.004k V IN(+) V O(+) Q2 Trim Vout Rmargin-up Rtrim ON/OFF LOAD TRIM Q1 R trim GND GND Figure 30. Circuit configuration to program output voltage using an external resistor. Figure 31. Circuit Configuration for margining Output voltage. Table 1 provides Rtrim values required for some common output voltages. Table 1 VO, set (V) Rtrim (K) 0.7525 Open 1.2 41.973 1.5 23.077 1.8 15.004 2.5 6.947 3.3 3.160 By using a 1% tolerance trim resistor, set point tolerance of 2% is achieved as specified in the electrical specification. The POL Programming Tool, available at www.gecriticalpower.com under the Design Tools section, October 1, 2015 (c)2015 General Electric Company. All rights reserved. Page 13 GE Energy Data Sheet 6A Austin MicroLynxTMII: SMT Non-Isolated DC-DC Power Modules 2.4Vdc -5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Feature Descriptions (continued) Voltage Sequencing Austin MicroLynxTM II series of modules include a sequencing feature, EZ-SEQUENCETM that enables users to implement various types of output voltage sequencing in their applications. This is accomplished via an additional sequencing pin. When not using the sequencing feature, either tie the SEQ pin to VIN or leave it unconnected. When an analog voltage is applied to the SEQ pin, the output voltage tracks this voltage until the output reaches the setpoint voltage. The SEQ voltage must be set higher than the set-point voltage of the module. The output voltage follows the voltage on the SEQ pin on a one-to-one volt basis. By connecting multiple modules together, customers can get multiple modules to track their output voltages to the voltage applied on the SEQ pin. For proper voltage sequencing, first, input voltage is applied to the module. The On/Off pin of the module is left unconnected (or tied to GND for negative logic modules or tied to VIN for positive logic modules) so that the module is ON by default. After applying input voltage to the module, a minimum of 10msec delay is required before applying voltage on the SEQ pin. During this time, potential of 50mV ( 10 mV) is maintained on the SEQ pin. After 10msec delay, an analog voltage is applied to the SEQ pin and the output voltage of the module will track this voltage on a one-to-one volt bases until output reaches the set-point voltage. To initiate simultaneous shutdown of the modules, the SEQ pin voltage is lowered in a controlled manner. Output voltage of the modules tracks the voltages below their set-point voltages on a one-to-one basis. A valid input voltage must be maintained until the tracking and output voltages reach ground potential to ensure a controlled shutdown of the modules. When using the EZ-SEQUENCETM feature to control start-up of the module, pre-bias immunity feature during start-up is disabled. The pre-bias immunity feature of the module relies on the module being in the diode-mode during start-up. When using the EZ-SEQUENCETM feature, modules goes through an internal set-up time of 10msec, and will be in synchronous rectification mode when voltage at the SEQ pin is applied. This will result in sinking current in the module if pre-bias voltage is present at the output of the module. When pre-bias immunity during start-up is required, the EZ-SEQUENCETM feature must be disabled. For additional guidelines on using EZ-SEQUENCETM feature of Austin MicroLynxTM II , contact GE technical representative for preliminary application note on output voltage sequencing using Austin Lynx II series. October 1, 2015 (c)2015 General Electric Company. All rights reserved. Page 14 GE Energy Data Sheet 6A Austin MicroLynxTMII: SMT Non-Isolated DC-DC Power Modules 2.4Vdc -5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Thermal Considerations Power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation. 25.4_ (1.0) Wind Tunnel PWBs Power Module Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability. The thermal data presented here is based on physical measurements taken in a wind tunnel. The test set-up is shown in Figure 33. Note that the airflow is parallel to the long axis of the module as shown in figure 32. The derating data applies to airflow in either direction of the module's long axis. 76.2_ (3.0) x 7.24_ (0.285) Probe Location for measuring airflow and ambient temperature Air flow Figure 33. Thermal Test Set-up. Heat Transfer via Convection Increased airflow over the module enhances the heat transfer via convection. Thermal derating curves showing the maximum output current that can be delivered by various module versus local ambient temperature (TA) for natural convection and up to 1m/s (200 ft./min) are shown in the Characteristics Curves section. Figure 32. Tref Temperature measurement location. The thermal reference point, Tref 1 used in the specifications of thermal derating curves is shown in Figure 32. For reliable operation this temperature should not exceed 125oC. The output power of the module should not exceed the rated power of the module (Vo,set x Io,max). Please refer to the Application Note "Thermal Characterization Process For Open-Frame Board-Mounted Power Modules" for a detailed discussion of thermal aspects including maximum device temperatures. October 1, 2015 (c)2015 General Electric Company. All rights reserved. Page 15 GE Energy Data Sheet 6A Austin MicroLynxTMII: SMT Non-Isolated DC-DC Power Modules 2.4Vdc -5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Mechanical Outline Dimensions are in millimeters and (inches). Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) [unless otherwise indicated] x.xx mm 0.25 mm (x.xxx in 0.010 in.) Top View Side View Bottom View PIN FUNCTION 1 On/Off 2 VIN 3 SEQ 4 GND 5 Trim 6 VOUT Co-planarity (max): 0.102 [0.004] October 1, 2015 (c)2015 General Electric Company. All rights reserved. Page 16 GE Energy Data Sheet 6A Austin MicroLynxTMII: SMT Non-Isolated DC-DC Power Modules 2.4Vdc -5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Recommended Pad Layout Dimensions are in millimeters and (inches). Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) [unless otherwise indicated] x.xx mm 0.25 mm (x.xxx in 0.010 in.) Surface Mount Pad Layout - Component side view. October 1, 2015 (c)2015 General Electric Company. All rights reserved. Page 17 GE Energy Data Sheet 6A Austin MicroLynxTMII: SMT Non-Isolated DC-DC Power Modules 2.4Vdc -5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Packaging Details The Austin MicroLynxTM II SMT versions are supplied in tape & reel as standard. Modules are shipped in quantities of 400 modules per reel. All Dimensions are in millimeters and (in inches). Reel Dimensions Outside Dimensions: 330.2 mm (13.00) Inside Dimensions: 177.8 mm (7.00") Width 44.0 mm (1.73") October 1, 2015 (c)2015 General Electric Company. All rights reserved. Page 18 GE Energy Data Sheet 6A Austin MicroLynxTMII: SMT Non-Isolated DC-DC Power Modules 2.4Vdc -5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Surface Mount Information The Austin MicroLynxTM II SMT modules use an open frame construction and are designed for a fully automated assembly process. The modules are fitted with a label designed to provide a large surface area for pick and placing. The label meets all the requirements for surface mount processing, as well as safety standards and is able to withstand maximum reflow temperature. The label also carries product information such as product code, serial number and location of manufacture. infrared), or a combination of convection/IR. For reliable soldering the solder reflow profile should be established by accurately measuring the modules CP connector temperatures. REFLOW TEMP (C) Pick and Place REFLOW TIME (S) Figure 35. Reflow Profile for Tin/Lead (Sn/Pb) process. Figure 34. Pick and Place Location. The module weight has been kept to a minimum by using open frame construction. Even so, these modules have a relatively large mass when compared to conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and pick & placement speed should be considered to optimize this process. The minimum recommended nozzle diameter for reliable operation is 3mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 8 mm max. Tin Lead Soldering The Austin MicroLynxTM II SMT power modules are lead free modules and can be soldered either in a lead-free solder process or in a conventional Tin/Lead (Sn/Pb) process. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each application board assembly. The following instructions must be observed when soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability. MAX TEMP SOLDER (C) Nozzle Recommendations Figure 36. Time Limit Curve Above 205oC for Tin/Lead (Sn/Pb) process. In a conventional Tin/Lead (Sn/Pb) solder process peak reflow temperatures are limited to less than 235oC. Typically, the eutectic solder melts at 183oC, wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant October 1, 2015 (c)2015 General Electric Company. All rights reserved. Page 19 GE Energy Data Sheet 6A Austin MicroLynxTMII: SMT Non-Isolated DC-DC Power Modules 2.4Vdc -5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Surface Mount Information (continued) 300 Lead Free Soldering 250 Per J-STD-020 Rev. D Peak Temp 260C The -Z version Austin MicroLynx II SMT modules are leadfree (Pb-free) and RoHS compliant and are both forward and backward compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability. Reflow Temp (C) 200 * Min. Time Above 235C 15 Seconds Cooling Zone 150 Heating Zone 1C/Second *Time Above 217C 60 Seconds 100 50 Pb-free Reflow Profile 0 Reflow Time (Seconds) Power Systems will comply with J-STD-020 Rev. D (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Figure. 37. Figure 37. Recommended linear reflow profile using Sn/Ag/Cu solder. MSL Rating The Austin MicroLynx II modules have a MSL rating of 2a. Storage and Handling The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of 30C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag seal date, when stored at the following conditions: < 40 C, < 90% relative humidity. Post Solder Cleaning and Drying Considerations Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to Board Mounted Power Modules: Soldering and Cleaning Application Note (AN04-001). October 1, 2015 (c)2015 General Electric Company. All rights reserved. Page 20 GE Energy Data Sheet 6A Austin MicroLynxTMII: SMT Non-Isolated DC-DC Power Modules 2.4Vdc -5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Ordering Information Please contact your GE Sales Representative for pricing, availability and optional features. Table 2. Device Codes Device Code Input Voltage Range Output Voltage Output Current Efficiency 3.3V@ 6A On/Off Logic Connector Type Comcodes ATH006A0X-SR 2.4 - 5.5Vdc 0.75 - 3.63Vdc 6A 96.0% Negative SMT 108988358 ATH006A0X-SRZ 2.4 - 5.5Vdc 0.75 - 3.63Vdc 6A 96.0% Negative SMT CC109104535 ATH006A0X4-SR 2.4 - 5.5Vdc 0.75 - 3.63Vdc 6A 96.0% Positive SMT 108988366 ATH006A0X4-SRZ 2.4 - 5.5Vdc 0.75 - 3.63Vdc 6A 96.0% Positive SMT 108996708 -Z refers to RoHS compliant parts Contact Us For more information, call us at USA/Canada: +1 877 546 3243, or +1 972 244 9288 Asia-Pacific: +86.021.54279977*808 Europe, Middle-East and Africa: +49.89.878067-280 www.gecriticalpower.com GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. October 1, 2015 (c)2015 General Electric Company. All International rights reserved. Version 1.07