GE Energy
Data Sheet
October 1, 2015 ©2015 General Electric Company. All rights reserved.
6A Austin MicroLynx IITM: SMT Non-Isolated DC-DC Power Module
2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current
Features
Compliant to RoHS EU Directive 2011/65/EU (-Z
versions)
Compliant to RoHS EU Directive 2011/65/EU under
exemption 7b (Lead solder exemption). Exemption 7b
will expire after June 1, 2016 at which time this
product will no longer be RoHS compliant (non-Z
versions)
Flexible output voltage sequencing EZ-SEQUENCETM
Delivers up to 6A output current
High efficiency – 96% at 3.3V full load (VIN = 5.0V)
Small size and low profile:
27.9 mm x 11.4 mm x 7.24 mm
(1.10 in x 0.45 in x 0.285 in)
Low output ripple and noise
High Reliability:
Calculated MTBF = 12.8M hours at 25oC Full-load
Output voltage programmable from 0.75 Vdc to
3.63Vdc via external resistor
Line Regulation: 0.3% (typical)
Load Regulation: 0.4% (typical)
Temperature Regulation: 0.4 % (typical)
Remote On/Off
Output overcurrent protection (non-latching)
Wide operating temperature range (-40°C to 85°C)
UL* 60950-1Recognized, CSA† C22.2 No. 60950-1-03
Certified, and VDE‡ 0805:2001-12 (EN60950-1)
Licensed
ISO** 9001 and ISO 14001 certified manufacturing
facilities
Applications
Distributed power architectures
Intermediate bus voltage applications
Telecommunications equipment
Servers and storage applications
Networking equipment
Enterprise Networks
Latest generation IC’s (DSP, FPGA, ASIC) and
Microprocessor powered applications
Description
Austin MicroLynxTM II SMT (surface mount technology) power modules are non-isolated dc-dc converters that can deliver
up to 6A of output current with full load efficiency of 96.0% at 3.3V output. These modules provide a precisely regulated
output voltage programmable via an external resistor from 0.75Vdc to 3.63Vdc over a wide range of input voltage (VIN =
2.4 – 5.5Vdc). Austin MicroLynxTM II has a sequencing feature, EZ-SEQUENCETM that enable designers to implement various
types of output voltage sequencing when powering multiple modules on board.
* UL is a registered trademark of Underwriters Laboratories, Inc.
† CSA is a registered trademark of Canadian Standards Association.
‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
** ISO is a registered trademark of the International Organization of Standards
RoHS Compliant
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Data Sheet
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Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings
only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations
sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.
Parameter Device Symbol Min Max Unit
Input Voltage All VIN -0.3 5.8 Vdc
Continuous
Sequencing voltage All Vseq -0.3 VIN,max Vdc
Operating Ambient Temperature All TA -40 85 °C
(see Thermal Considerations section)
Storage Temperature All Tstg -55 125 °C
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage Vo,set ≤ 3.63 VIN 2.4 5.5 Vdc
Maximum Input Current All IIN,max 6.0 Adc
(VIN= VIN, min to VIN, max, IO=IO, max )
Input No Load Current VO,set = 0.75 Vdc IIN,No load 20 mA
(VIN = VIN, nom, Io = 0, module enabled) VO,set = 3.3Vdc IIN,No load 45 mA
Input Stand-by Current All IIN,stand-by 0.6 mA
(VIN = VIN, nom, module disabled)
Inrush Transient All I2t 0.04 A2s
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; VIN, min to VIN,
max, IO= IOmax ; See Test configuration section)
All 35 mAp-p
Input Ripple Rejection (120Hz) All 30 dB
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to being part of a
complex power architecture. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety
and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 6 A
(see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input
current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information.
GE Energy
Data Sheet
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Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Output Voltage Set-point All VO, set -2.0 +2.0 % VO, set
(VIN=IN, min, IO=IO, max, TA=25°C)
Output Voltage All VO, set –3.0 +3.0 % VO, set
(Over all operating input voltage, resistive load, and
temperature conditions until end of life)
Adjustment Range All VO 0.7525 3.63 Vdc
Selected by an external resistor
Output Regulation
Line (VIN=VIN, min to VIN, max) All 0.3 % VO, set
Load (IO=IO, min to IO, max) All 0.4 % VO, set
Temperature (Tref=TA, min to TA, max) All 0.4 % VO, set
Output Ripple and Noise on nominal output
(VIN=VIN, nom and IO=IO, min to IO, max
Cout = 1μF ceramic//10μFtantalum capacitors)
RMS (5Hz to 20MHz bandwidth) All 10 15 mVrms
Peak-to-Peak (5Hz to 20MHz bandwidth) All 40 50 mVpk-pk
External Capacitance
ESR ≥ 1 mΩ All CO, max 1000 μF
ESR ≥ 10 mΩ All CO, max 5000 μF
Output Current All Io 0 6 Adc
Output Current Limit Inception (Hiccup Mode ) All IO, lim 220 % Io
(VO= 90% of VO, set)
Output Short-Circuit Current All IO, s/c 2 Adc
(VO≤250mV) ( Hiccup Mode )
Efficiency VO, set = 0.75Vdc η 81.2 %
VIN= VIN, nom, TA=25°C VO, set = 1.2Vdc η 86.8 %
IO=IO, max , VO= VO,set VO,set = 1.5Vdc η 88.8 %
VO,set = 1.8Vdc η 89.7 %
VO,set = 2.5Vdc η 92.5 %
VO,set = 3.3Vdc η 95.4 %
Switching Frequency All fsw 300 kHz
Dynamic Load Response
(dIo/dt=2.5A/µs; VIN = VIN, nom; TA=25°C) All Vpk 130 mV
Load Change from Io= 50% to 100% of Io,max; 1μF
ceramic// 10 μF tantalum
Peak Deviation
Settling Time (Vo<10% peak deviation)
All ts 25 µs
(dIo/dt=2.5A/µs; VIN = VIN, nom; TA=25°C) All Vpk 130 mV
Load Change from Io= 100% to 50%of Io,max: 1μF
ceramic// 10 μF tantalum
Peak Deviation
Settling Time (Vo<10% peak deviation)
All ts 25 µs
GE Energy
Data Sheet
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Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Dynamic Load Response
(dIo/dt=2.5A/µs; V VIN = VIN, nom; TA=25°C) All Vpk 50 mV
Load Change from Io= 50% to 100% of Io,max;
Co = 2x150 μF polymer capacitors
Peak Deviation
Settling Time (Vo<10% peak deviation) All ts 50 µs
(dIo/dt=2.5A/µs; VIN = VIN, nom; TA=25°C) All Vpk 50 mV
Load Change from Io= 100% to 50%of Io,max:
Co = 2x150 μF polymer capacitors
Peak Deviation
Settling Time (Vo<10% peak deviation) All ts 50 µs
General Specifications
Parameter Min Typ Max Unit
Calculated MTBF (IO=IO, max, TA=25°C) 12,841,800 Hours
Weight 2.8 (0.1) g (oz.)
GE Energy
Data Sheet
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Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See
Feature Descriptions for additional information.
Parameter Device Symbol Min Typ Max Unit
On/Off Signal interface
Device code with Suffix “4” – Positive logic
(On/Off is open collector/drain logic input;
Signal referenced to GND - See feature description section)
Input High Voltage (Module ON) All VIH ― ― VIN, max V
Input High Current All IIH ― ― 10 μA
Input Low Voltage (Module OFF) All VIL -0.2 ― 0.3 V
Input Low Current All IIL ― 0.2 1 mA
Device Code with no suffix – Negative Logic
(On/OFF pin is open collector/drain logic input with
external pull-up resistor; signal referenced to GND)
Input High Voltage (Module OFF) All VIH 1.5 ― VIN,max Vdc
Input High Current All IIH 0.2 1 mA
Input Low Voltage (Module ON) All VIL -0.2 ― 0.3 Vdc
Input low Current All IIL ― 10 μA
Turn-On Delay and Rise Times
(IO=IO, max , VIN = VIN, nom, TA = 25 oC, )
Case 1: On/Off input is set to Logic Low (Module
ON) and then input power is applied (delay from
instant at which VIN =VIN, min until Vo=10% of Vo,set)
All
Tdelay
―
3.9
―
msec
Case 2: Input power is applied for at least one second
and then the On/Off input is set to logic Low (delay from
instant at which Von/Off=0.3V until Vo=10% of Vo, set)
All
Tdelay
―
3.9
―
msec
Output voltage Rise time (time for Vo to rise from 10%
of Vo,set to 90% of Vo, set)
All
Trise
―
4.2
8.5
msec
Output voltage overshoot – Startup ―
1
% VO, set
IO= IO, max; VIN = 3.0 to 5.5Vdc, TA = 25 oC
Sequencing Delay time
Delay from VIN, min to application of voltage on SEQ pin All
Ts
EQ-
delay
10 msec
Tracking Accuracy (Power-Up: 2V/ms) All
|V
SEQ
–
V |
100 200 mV
(Power-Down: 1V/ms) All
|V
SEQ
–
V |
200 400 mV
(VIN, min to VIN, max; IO, min to IO, max VSEQ < Vo)
Overtemperature Protection
All Tref 150 °C
(See Thermal Considerations section)
Input Undervoltage Lockout
Turn-on Threshold
All
2.2
V
Turn-off Threshold All 2.0 V
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Characteristic Curves
The following figures provide typical characteristics for the Austin MicroLynxTM II SMT modules at 25ºC.
EFFICIENCY, η (%)
70
73
76
79
82
85
88
91
0 1 2 3 4 5 6
V
IN
=2.4V
V
IN
=5V
V
IN
=5.5V
EFFICIENCY, η (%)
74
77
80
83
86
89
92
95
98
0 1 2 3 4 5 6
VIN=2.4V
VIN=5V
VIN=5.5V
OUTPUT CURRENT, I
O
(A)
OUTPUT CURRENT, I
O
(A)
Figure 1. Converter Efficiency versus Output Current (Vout
= 0.75Vdc).
Figure 4. Converter Efficiency versus Output Current (Vout
= 1.8Vdc).
EFFICIENCY, η (%)
70
73
76
79
82
85
88
91
94
0123456
VIN=2.4V
VIN=5V
VIN=5.5V
EFFICIENCY, η (%)
74
77
80
83
86
89
92
95
98
0 1 2 3 4 5 6
V
IN
=3V
V
IN
=5V
V
IN
=5.5V
OUTPUT CURRENT, I
O
(A)
OUTPUT CURRENT, I
O
(A)
Figure 2. Converter Efficiency versus Output Current (Vout
= 1.2Vdc).
Figure 5. Converter Efficiency versus Output Current (Vout
= 2.5Vdc).
EFFICIENCY, η (%)
70
73
76
79
82
85
88
91
94
0123456
VIN=2.4V
VIN=5V
VIN=5.5V
EFFICIENCY, η (%)
74
77
80
83
86
89
92
95
98
0 1 2 3 4 5 6
VIN=4.5V
VIN=5V
VIN=5.5V
OUTPUT CURRENT, I
O
(A)
OUTPUT CURRENT, I
O
(A)
Figure3. Converter Efficiency versus Output Current
(Vout
= 1.5Vdc).
Figure 6. Converter Efficiency versus Output Current (Vout
= 3.3Vdc).
GE Energy
Data Sheet
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Characteristic Curves (continued)
The following figures provide typical characteristics for the MicroLynxTM II SMT modules at 25ºC.
INPUT CURRENT, IIN (A)
0
1
2
3
4
5
6
7
1 1.75 2.5 3.25 4 4.75 5.5
Io=3A
Io=0A
Io=6A
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (2A/div) VO (V) (100mV/div)
INPUT VOLTAGE, VIN (V)
TIME, t (5 µs/div)
Figure 7. Input voltage vs. Input Current
(Vout =2.5Vdc).
Figure 10. Transient Response to Dynamic Load Change
from 50% to 100% of full load (Vo = 3.3Vdc).
OUTPUT VOLTAGE
VO (V) (20mV/div)
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (2A/div) VO (V) (100mV/div)
TIME, t (2µs/div)
TIME, t (5 µs/div)
Figure 8. Typical Output Ripple and Noise
(Vin = 5.0V dc, Vo = 0.75 Vdc, Io=6A).
Figure 11. Transient Response to Dynamic Load Change
from 100% to 50% of full load (Vo = 3.3 Vdc).
OUTPUT VOLTAGE
VO (V) (20mV/div)
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (2A/div) VO (V) (50mV/div)
TIME, t (2µs/div)
TIME, t (10µs/div)
Figure 9. Typical Output Ripple and Noise
(Vin = 5.0V dc, Vo = 3.3 Vdc, Io=6A).
Figure 12. Transient Response to Dynamic Load Change
from 50% to 100% of full load (Vo = 3.3 Vdc, Cext = 2x150
μF Polymer Capacitors).
GE Energy
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Characteristic Curves (continued)
The following figures provide typical characteristics for the Austin MicroLynxTM II SMT modules at 25ºC.
OUTPUT CURRENT, OUTPUTVOLTAGE
IO (A) (2A/div) VO (V) (50mV/div)
OUTPUT VOLTAGE, INPUT VOLTAGE
Vo (V) (1V/div) VIN (V) (2V/div)
TIME, t (10µs/div)
TIME, t (2 ms/div)
Figure 13. Transient Response to Dynamic Load Change
from 100% of 50% full load (Vo = 3.3Vdc, Cext = 2x150 μF
Polymer Capacitors).
Figure 16. Typical Start-Up with application of Vin
(Vin = 5.0Vdc, Vo = 3.3Vdc, Io = 6A).
OUTPUT VOLTAGE On/Off VOLTAGE
VOV) (1V/div) VOn/off (V) (2V/div)
OUTPUT VOLTAGE On/Off VOLTAGE
VOV) (1V/div) VOn/off (V) (2V/div)
TIME, t (2 ms/div)
TIME, t (2 ms/div)
Figure 14. Typical Start-Up Using Remote On/Off
(Vin = 5.0Vdc, Vo = 3.3Vdc, Io = 6A).
Figure 17 Typical Start-Up Using Remote On/Off with
Prebias (Vin = 3.3Vdc, Vo = 1.8Vdc, Io = 1.0A, Vbias =1.0Vdc).
OUTPUT VOLTAGE On/Off VOLTAGE
VOV) (1V/div) VOn/off (V) (2V/div)
OUTPUT CURRENT,
IO (A) (5A/div)
TIME, t (2 ms/div)
TIME, t (5ms/div)
Figure 15. Typical Start-Up Using Remote On/Off with Low-
ESR external capacitors (7x150uF Polymer) (Vin = 5.0Vdc, Vo
= 3.3Vdc, Io = 6A, Co = 1050
µ
F).
Figure 18. Output short circuit Current
(Vin = 5.0Vdc, Vo = 0.75Vdc).
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Characteristic Curves (continued)
The following figures provide thermal derating curves for the Austin MicroLynxTM II SMT modules.
OUTPUT CURRENT, Io (A)
0.0
1.5
3.0
4.5
6.0
7.5
20 30 40 50 60 70 80 90
0.5m/s (100 LFM)
NC
1.0m/s (200 LFM)
OUTPUT CURRENT, Io (A)
0
2
3
5
6
8
20 30 40 50 60 70 80 90
NC
1.0m/s (200 LFM)
0.5m/s (100 LFM)
AMBIENT TEMPERATURE, T
A
O
C
AMBIENT TEMPERATURE, T
A
O
C
Figure 19. Derating Output Current versus Local Ambient
Temperature and Airflow (Vin = 5.0, Vo=3.3Vdc).
Figure 22. Derating Output Current versus Local Ambient
Temperature and Airflow (Vin = 3.3dc, Vo=0.75 Vdc).
OUTPUT CURRENT, Io (A)
0.0
1.5
3.0
4.5
6.0
7.5
20 30 40 50 60 70 80 90
NC
1.0m/s (200 LFM)
0.5m/s (100 LFM)
AMBIENT TEMPERATURE, T
A
O
C
Figure 20. Derating Output Current versus Local Ambient
Temperature and Airflow (Vin = 5.0Vdc, Vo=0.75 Vdc).
OUTPUT CURRENT, Io (A)
0.0
1.5
3.0
4.5
6.0
7.5
20 30 40 50 60 70 80 90
NC
1.0m/s (200 LFM)
0.5m/s (100 LFM)
AMBIENT TEMPERATURE, TA
O
C
Figure 21. Derating Output Current versus Local Ambient
Temperature and Airflow (Vin = 3.3Vdc, Vo=2.5 Vdc).
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Test Configurations
TO OSCILLOSCOPE
CURRENT PROBE
L
TEST
1μH
BATTERY
C
S
1000μF
Electrolytic
E.S.R.<0.1Ω
@ 20°C 100kHz
2x100μF
Tantalum
V
IN
(+)
COM
NOTE: Measure input ref l ect ed ripple current with a sim ulated
source inductance (LTEST) of 1μH. Capacitor CS offsets
possible battery impedance. Measure current as shown
above.
C
IN
Figure 23. Input Reflected Ripple Current Test Setup.
NOTE: All voltage measurem ents to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
V
O
(+)
COM
1uF
.
RESISTIVE
LOAD
SCOPE
COPPER STRIP
GROUND PLANE
10uF
Figure 24. Output Ripple and Noise Test Setup.
V
O
COM
V
IN
(+)
COM
R
LOAD
R
contact
R
distribution
R
contact
R
distribution
R
contact
R
contact
R
distribution
R
distribution
V
IN
V
O
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvi n c onnec ti ons are requ ired at the modul e termi nals
to avoi d m eas urem en t er r ors du e to s oc k et c ont act
resistance.
Figure 25. Output Voltage and Efficiency Test Setup.
η
=
V
O
.
I
O
V
IN
.
I
IN
x
100
%
Efficiency
Design Considerations
Input Filtering
The Austin MicroLynxTM II SMT module should be connected
to a low-impedance source. A highly inductive source can
affect the stability of the module. An input capacitance
must be placed directly adjacent to the input pin of the
module, to minimize input ripple voltage and ensure
module stability.
To minimize input voltage ripple, low-ESR polymer and
ceramic capacitors are recommended at the input of the
module. Figure 26 shows the input ripple voltage (mVp-p)
for various outputs with 1x150 µF polymer capacitors
(Panasonic p/n: EEFUE0J151R, Sanyo p/n: 6TPE150M) in
parallel with 1 x 47 µF ceramic capacitor (Panasonic p/n:
ECJ-5YB0J476M, Taiyo- Yuden p/n: CEJMK432BJ476MMT)
at full load. Figure 27 shows the input ripple with 2x150 µF
polymer capacitors in parallel with 2 x 47 µF ceramic
capacitor at full load.
Input Ripple Voltage (mVp-p)
0
20
40
60
80
100
120
0 1 2 3 4
Vin = 3.3V
Vin = 5.0V
Output Voltage (Vdc)
Figure 26. Input ripple voltage for various output with 1x150
µF polymer and 1x47 µF ceramic capacitors at the input
(80% of Io,max).
Input Ripple Voltage (mVp-p)
0
20
40
60
80
100
120
01234
Vin = 3.3V
Vin = 5.0V
Output Voltage (Vdc)
Figure 27. Input ripple voltage for various output with 2x150
µF polymer and 2x47 µF ceramic capacitors at the input
(80% of Io,max).
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Design Considerations (continued)
Output Filtering
The Austin MicroLynxTM II SMT module is designed for low
output ripple voltage and will meet the maximum output ripple
specification with 1 µF ceramic and 10 µF tantalum capacitors
at the output of the module. However, additional output
filtering may be required by the system designer for a number
of reasons. First, there may be a need to further reduce the
output ripple and noise of the module. Second, the dynamic
response characteristics may need to be customized to a
particular load step change.
To reduce the output ripple and improve the dynamic response
to a step load change, additional capacitance at the output
can be used. Low ESR polymer and ceramic capacitors are
recommended to improve the dynamic response of the
module. For stable operation of the module, limit the
capacitance to less than the maximum output capacitance as
specified in the electrical specification table.
Safety Considerations
For safety agency approval the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standards, i.e., UL
60950-1, CSA C22.2 No. 60950-1-03, and VDE 0850:2001-12
(EN60950-1) Licensed.
For the converter output to be considered meeting the
requirements of safety extra-low voltage (SELV), the input
must meet SELV requirements. The power module has extra-
low voltage (ELV) outputs when all inputs are ELV.
The input to these units is to be provided with a fast-acting
fuse with a maximum rating of 6A in the positive input lead.
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Feature Description
Remote On/Off
The Austin LynxTM II SMT power modules feature an On/Off pin
for remote On/Off operation. Two On/Off logic options are
available in the Austin LynxTM II series modules. Positive Logic
On/Off signal, device code suffix “4”, turns the module ON
during a logic High on the On/Off pin and turns the module OFF
during a logic Low. Negative logic On/Off signal, no device
code suffix, turns the module OFF during logic High on the
On/Off pin and turns the module ON during logic Low.
For positive logic modules, the circuit configuration for using
the On/Off pin is shown in Figure 28. The On/Off pin is an open
collector/drain logic input signal (Von/Off) that is referenced to
ground. During a logic-high (On/Off pin is pulled high internal
to the module) when the transistor Q1 is in the Off state, the
power module is ON. Maximum allowable leakage current of
the transistor when Von/off = VIN,max is 10µA. Applying a logic-
low when the transistor Q1 is turned-On, the power module is
OFF. During this state VOn/Off must be less than 0.3V. When
not using positive logic On/off pin, leave the pin unconnected
or tie to VIN.
Q1
R2
R1 Q2
R3
R4
Q3 CSS
GND
VIN+
ON/OFF
PW M Enable
+
_
ON/OFF
V
I
ON/OFF
MODULE
Figure 28. Circuit configuration for using positive logic
On/OFF.
For negative logic On/Off devices, the circuit configuration is
shown is Figure 29. The On/Off pin is pulled high with an
external pull-up resistor (typical Rpull-up = 5k, +/- 5%). When
transistor Q1 is in the Off state, logic High is applied to the
On/Off pin and the power module is Off. The minimum On/off
voltage for logic High on the On/Off pin is 1.5Vdc. To turn the
module ON, logic Low is applied to the On/Off pin by turning
ON Q1. When not using the negative logic On/Off, leave the
pin unconnected or tie to GND.
Q1
R1
R2
Q2 CSS
GND
PW M Enable
ON/OFF
VIN+
ON/OFF
_
+
V
I
MODULE
pull-up
R
ON/OFF
Figure 29. Circuit configuration for using negative logic
On/OFF.
Overcurrent Protection
To provide protection in a fault (output overload) condition, the
unit is equipped with internal current-limiting circuitry and can
endure current limiting continuously. At the point of
current-limit inception, the unit enters hiccup mode. The unit
operates normally once the output current is brought back into
its specified range. The typical average output current during
hiccup is 2A.
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout limit,
module operation is disabled. The module will begin to operate
at an input voltage above the undervoltage lockout turn-on
threshold.
Overtemperature Protection
To provide over temperature protection in a fault condition, the
unit relies upon the thermal protection feature of the controller
IC. The unit will shutdown if the thermal reference point Tref,
exceeds 150oC (typical), but the thermal shutdown is not
intended as a guarantee that the unit will survive temperatures
beyond its rating. The module will automatically restart after it
cools down.
GE Energy
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Feature Descriptions (continued)
Output Voltage Programming
The output voltage of the Austin MicroLynxTM II SMT can be
programmed to any voltage from 0.75 Vdc to 3.63 Vdc by
connecting a single resistor (shown as Rtrim in Figure 30)
between the TRIM and GND pins of the module. Without an
external resistor between TRIM pin and the ground, the output
voltage of the module is 0.7525 Vdc. To calculate the value of
the resistor Rtrim for a particular output voltage Vo, use the
following equation:
Ω
−
−
=5110
7525.0
21070
Vo
Rtrim
For example, to program the output voltage of the Austin
MicroLynxTM II module to 1.8 Vdc, Rtrim is calculated is follows:
−
−
=5110
7525.08.1
21070
Rtrim
Ω
=kRtrim 004.15
V
O
(+)
TRIM
GND
R
trim
LOAD
V
IN
(+)
ON/OFF
Vout
Figure 30. Circuit configuration to program output voltage
using an external resistor.
Table 1 provides Rtrim values required for some common
output voltages.
Table 1
V
O, set
(V)
Rtrim (KΩ)
0.7525
Open
1.2
41.973
1.5
23.077
1.8
15.004
2.5
6.947
3.3
3.160
By using a 1% tolerance trim resistor, set point tolerance of
±2% is achieved as specified in the electrical specification.
The POL Programming Tool, available at
www.gecriticalpower.com under the Design Tools section,
helps determine the required external trim resistor needed for
a specific output voltage.
Voltage Margining
Output voltage margining can be implemented in the Austin
MicroLynxTM II modules by connecting a resistor, Rmargin-up,
from the Trim pin to the ground pin for margining-up the
output voltage and by connecting a resistor, Rmargin-down,
from the Trim pin to the Output pin for margining-down.
Figure 31 shows the circuit configuration for output voltage
margining. The POL Programming Tool, available at
www.gecriticalpower.com under the Design Tools section,
also calculates the values of Rmargin-up and Rmargin-down for a
specific output voltage and % margin. Please consult your
local GE technical representative for additional details.
Vo
Austin Lynx or
Lynx II Series
GND
Trim
Q1
Rtrim
Rmargin-up
Q2
Rmargin-down
Figure 31. Circuit Configuration for margining Output
voltage.
GE Energy
Data Sheet
TM
October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 14
Feature Descriptions (continued)
Voltage Sequencing
Austin MicroLynxTM II series of modules include a sequencing
feature, EZ-SEQUENCETM that enables users to implement
various types of output voltage sequencing in their
applications. This is accomplished via an additional
sequencing pin. When not using the sequencing feature, either
tie the SEQ pin to VIN or leave it unconnected.
When an analog voltage is applied to the SEQ pin, the output
voltage tracks this voltage until the output reaches the set-
point voltage. The SEQ voltage must be set higher than the
set-point voltage of the module. The output voltage follows the
voltage on the SEQ pin on a one-to-one volt basis. By
connecting multiple modules together, customers can get
multiple modules to track their output voltages to the voltage
applied on the SEQ pin.
For proper voltage sequencing, first, input voltage is applied to
the module. The On/Off pin of the module is left unconnected
(or tied to GND for negative logic modules or tied to VIN for
positive logic modules) so that the module is ON by default.
After applying input voltage to the module, a minimum of
10msec delay is required before applying voltage on the SEQ
pin. During this time, potential of 50mV (± 10 mV) is maintained
on the SEQ pin. After 10msec delay, an analog voltage is
applied to the SEQ pin and the output voltage of the module
will track this voltage on a one-to-one volt bases until output
reaches the set-point voltage. To initiate simultaneous
shutdown of the modules, the SEQ pin voltage is lowered in a
controlled manner. Output voltage of the modules tracks the
voltages below their set-point voltages on a one-to-one basis.
A valid input voltage must be maintained until the tracking and
output voltages reach ground potential to ensure a controlled
shutdown of the modules.
When using the EZ-SEQUENCETM feature to control start-up of
the module, pre-bias immunity feature during start-up is
disabled. The pre-bias immunity feature of the module relies
on the module being in the diode-mode during start-up. When
using the EZ-SEQUENCETM feature, modules goes through an
internal set-up time of 10msec, and will be in synchronous
rectification mode when voltage at the SEQ pin is applied. This
will result in sinking current in the module if pre-bias voltage is
present at the output of the module. When pre-bias immunity
during start-up is required, the EZ-SEQUENCETM feature must
be disabled. For additional guidelines on using EZ-SEQUENCETM
feature of Austin MicroLynxTM II , contact GE technical
representative for preliminary application note on output
voltage sequencing using Austin Lynx II series.
GE Energy
Data Sheet
TM
October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 15
Thermal Considerations
Power modules operate in a variety of thermal environments;
however, sufficient cooling should be provided to help ensure
reliable operation.
Considerations include ambient temperature, airflow, module
power dissipation, and the need for increased reliability. A
reduction in the operating temperature of the module will
result in an increase in reliability. The thermal data presented
here is based on physical measurements taken in a wind
tunnel. The test set-up is shown in Figure 33. Note that the
airflow is parallel to the long axis of the module as shown in
figure 32. The derating data applies to airflow in either
direction of the module’s long axis.
Figure 32. Tref Temperature measurement location.
The thermal reference point, Tref 1 used in the specifications of
thermal derating curves is shown in Figure 32. For reliable
operation this temperature should not exceed 125oC.
The output power of the module should not exceed the rated
power of the module (Vo,set x Io,max).
Please refer to the Application Note “Thermal Characterization
Process For Open-Frame Board-Mounted Power Modules” for a
detailed discussion of thermal aspects including maximum
device temperatures.
Figure 33. Thermal Test Set-up.
Heat Transfer via Convection
Increased airflow over the module enhances the heat transfer
via convection. Thermal derating curves showing the
maximum output current that can be delivered by various
module versus local ambient temperature (TA) for natural
convection and up to 1m/s (200 ft./min) are shown in the
Characteristics Curves section.
Air
flow
x
Power Module
Wind Tunnel
PWBs
7.24_
(0.285)
76.2_
(3.0)
Probe Location
for measuring
airflo w and
ambient
temperature
25.4_
(1.0)
GE Energy
Data Sheet
TM
October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 16
Mechanical Outline
Dimensions are in millimeters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated]
x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.)
Top View
Side View
Bottom View
PIN
FUNCTION
1
On/Off
2
V
IN
3
SEQ
4
GND
5
Trim
6
V
OUT
Co-planarity (max): 0.102 [0.004]
GE Energy
Data Sheet
TM
October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 17
Recommended Pad Layout
Dimensions are in millimeters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated]
x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.)
Surface Mount Pad Layout – Component side view.
GE Energy
Data Sheet
TM
October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 18
Packaging Details
The Austin MicroLynxTM II SMT versions are supplied in tape & reel as standard. Modules are shipped in quantities of 400 modules
per reel.
All Dimensions are in millimeters and (in inches).
Reel Dimensions
Outside Dimensions: 330.2 mm (13.00)
Inside Dimensions: 177.8 mm (7.00”)
Width 44.0 mm (1.73”)
GE Energy
Data Sheet
TM
October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 19
Surface Mount Information
Pick and Place
The Austin MicroLynxTM II SMT modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a label
designed to provide a large surface area for pick and
placing. The label meets all the requirements for surface
mount processing, as well as safety standards and is able to
withstand maximum reflow temperature. The label also
carries product information such as product code, serial
number and location of manufacture.
Figure 34. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by using
open frame construction. Even so, these modules have a
relatively large mass when compared to conventional SMT
components. Variables such as nozzle size, tip style,
vacuum pressure and pick & placement speed should be
considered to optimize this process. The minimum
recommended nozzle diameter for reliable operation is
3mm. The maximum nozzle outer diameter, which will safely
fit within the allowable component spacing, is 8 mm max.
Tin Lead Soldering
The Austin MicroLynxTM II SMT power modules are lead free
modules and can be soldered either in a lead-free solder
process or in a conventional Tin/Lead (Sn/Pb) process. It is
recommended that the customer review data sheets in
order to customize the solder reflow profile for each
application board assembly. The following instructions must
be observed when soldering these units. Failure to observe
these instructions may result in the failure of or cause
damage to the modules, and can adversely affect long-term
reliability.
In a conventional Tin/Lead (Sn/Pb) solder process peak
reflow temperatures are limited to less than 235oC.
Typically, the eutectic solder melts at 183oC, wets the land,
and subsequently wicks the device connection. Sufficient
time must be allowed to fuse the plating on the connection
to ensure a reliable solder joint. There are several types of
SMT reflow technologies currently used in the industry.
These surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For reliable
soldering the solder reflow profile should be established by
accurately measuring the modules CP connector
temperatures.
REFLOW TEMP (°C)
REFLOW TIME (S)
Figure 35. Reflow Profile for Tin/Lead (Sn/Pb) process.
MAX TEMP SOLDER (°C)
Figure 36. Time Limit Curve Above 205oC for Tin/Lead
(Sn/Pb) process.
GE Energy
Data Sheet
TM
October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 20
Surface Mount Information (continued)
Lead Free Soldering
The –Z version Austin MicroLynx II SMT modules are lead-
free (Pb-free) and RoHS compliant and are both forward and
backward compatible in a Pb-free and a SnPb soldering
process. Failure to observe the instructions below may
result in the failure of or cause damage to the modules and
can adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. D
(Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices) for both Pb-free solder
profiles and MSL classification procedures. This standard
provides a recommended forced-air-convection reflow
profile based on the volume and thickness of the package
(table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu
(SAC). The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure. 37.
MSL Rating
The Austin MicroLynx II modules have a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount packages
is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping
and Use of Moisture/Reflow Sensitive Surface Mount
Devices). Moisture barrier bags (MBB) with desiccant are
required for MSL ratings of 2 or greater. These sealed
packages should not be broken until time of use. Once the
original package is broken, the floor life of the product at
conditions of ≤ 30°C and 60% relative humidity varies
according to the MSL rating (see J-STD-033A). The shelf life
for dry packed SMT packages will be a minimum of 12
months from the bag seal date, when stored at the following
conditions: < 40° C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures, refer
to Board Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).
Figure 37. Recommended linear reflow profile using
Sn/Ag/Cu solder.
Per J-STD-020 Rev. D
0
50
100
150
200
250
300
Reflow Time (Seconds)
Reflow Temp (°C)
Heating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone
GE Energy
Data Sheet
TM
Contact Us
For more information, call us at
USA/Canada:
+1 877 546 3243, or +1 972 244 9288
Asia-Pacific:
+86.021.54279977*808
Europe, Middle-East and Africa:
+49.89.878067-280
www.gecriticalpower.com
GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no
liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s)
or information.
October 1, 2015 ©2015 General Electric Company. All International rights reserved. Version 1.07
Ordering Information
Please contact your GE Sales Representative for pricing, availability and optional features.
Table 2. Device Codes
Device Code Input
Voltage Range
Output
Voltage
Output
Current
Efficiency
3.3V@ 6A
On/Off
Logic
Connector
Type Comcodes
ATH006A0X-SR 2.4 – 5.5Vdc 0.75 – 3.63Vdc 6 A 96.0% Negative SMT 108988358
ATH006A0X-SRZ 2.4 – 5.5Vdc 0.75 – 3.63Vdc 6 A 96.0% Negative SMT CC109104535
ATH006A0X4-SR 2.4 – 5.5Vdc 0.75 – 3.63Vdc 6 A 96.0% Positive SMT 108988366
ATH006A0X4-SRZ 2.4 – 5.5Vdc 0.75 – 3.63Vdc 6 A 96.0% Positive SMT 108996708
-Z refers to RoHS compliant parts