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Old Company Name in Catalogs and Other Documents
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Corporation, and Renesas Electronics Corporation took over all the business of both
companies. Therefore, although the old company name remains in this document, it is a valid
Renesas Electronics document. We appreciate your understanding.
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April 1st, 2010
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
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Notice
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©
1995
DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µ
PC29L00 Series
DESCRIPTION
µ
PC29L00 Series are low dropout regulators which have 100 mA capable for the output current.
The variation of output voltage is 3 V, 3.3 V, 4 V and 5 V.
FEATURES
• Low dropout voltage. VDIF ≤ 0.3 V
• Built-in overcurrent protection circuit.
• Built-in thermal shut-down circuit.
ORDERING INFORMATION
Output Voltage Type Number Package
3 V
µ
PC29L03J TO-92
µ
PC29L03T SOT-89
3.3 V
µ
PC29L33J TO-92
µ
PC29L33T SOT-89
4 V
µ
PC29L04J TO-92
µ
PC29L04T SOT-89
5 V
µ
PC29L05J TO-92
µ
PC29L05T SOT-89
Document No. G10354EJ2V0DS00 (2nd edition)
Date Published December 1995 P
Printed in Japan
THREE TERMINAL LOW DROPOUT VOLTAGE REGULATOR
CONNECTION DIAGRAM
(TOP VIEW)
µ
PC29L00J Series
µ
PC29L00T Series
OUTPUT INPUTGND
GND
123
OUTPUT INPUTGND
123
2
µ
PC29L00 Series
BLOCK DIAGRAM
INPUT
OUTPUT
GND
Error
amplifier
Reference voltage
Thermal shut down
Over-current
protection
Drive circuit
Start-up circuit
3
µ
PC29L00 Series
ABSOLUTE MAXIMUM RATINGS (TA = 25 ˚C, Unless otherwise specified.)
PARAMETER SYMBOL RATING UNIT
Input Voltage VIN 16 V
Internal Power Dissipation PTJ 700 Note 1 mW
T 400 Note 1
2000 Note 1, 2
Operating Ambient Temperature Range TA–30 to +85 ˚C
Operating Junction Temperature Range TJ–30 to +150 ˚C
Storage Temperature Range Tstg –55 to +150 ˚C
Thermal Resistance (Junction to Case) Rth(J - C) J – ˚C/W
T30
Thermal Resistance (Junction to Ambient) Rth(J - A) J 180 ˚C/W
T 315
62.5 Note 2
Notes 1. TA ≤ 25 ˚C
2. With the 16 cm2 × 0.7 mm ceramic substrate
TYPICAL CONNECTION
D
1
C
IN
C
OUT
D
2
OUTPUTINPUT PC29L00 +
µ
CIN : 0.1 to 0.47
µ
F.
COUT : More than 10
µ
F.
D1: Need for VO > VIN.
D2: Need for VO < GND.
RECOMMENDED OPERATING CONDITIONS
PARAMETER SYMBOL TYPE NUMBER MIN. TYP. MAX. UNIT
Input Voltage VIN
µ
PC29L03 3.5 9 V
µ
PC29L33 3.8 9
µ
PC29L04 4.5 12
µ
PC29L05 5.5 12
Output Current IOAll 0 40 mA
Operating Ambient Temperature Range TAAll –30 +85 ˚C
Operating Junction Temperature Range TJAll –30 +125 ˚C
4
µ
PC29L00 Series
ELECTRICAL CHARACTERISTICS
µ
PC29L03 (VIN = 4 V, IO = 40 mA, TJ = 25 ˚C, Unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Output Voltage VO2.88 3.0 3.12 V
3.5 V ≤ VIN ≤ 9 V, 1 mA ≤ IO ≤ 40 mA,
2.85 3.15
0 ˚C ≤ TJ ≤ 125 ˚C
4.5 V ≤ VIN ≤ 5.5 V, 1 mA ≤ IO ≤ 100 mA,
2.85 3.15
0 ˚C ≤ TJ ≤ 125 ˚C
Line Regulation REG IN 3.5 V ≤ VIN ≤ 12 V 4 50 mV
3.5 V ≤ VIN ≤ 9 V 2 20
Load Regulation REGL1 mA ≤ IO ≤ 100 mA 37 50 mV
1 mA ≤ IO ≤ 40 mA 15 20
Quiescent Current IBIAS IO = 0 1.5 2.0 mA
IO = 100 mA 10 20 mA
Start-up Current IBIAS(S) IO = 0 mA, before VO regulation 6 20 mA
Quiescent Current Change ∆IBIAS 4 V ≤ VIN ≤ 12 V, 0 ˚C ≤ TJ ≤ 125 ˚C 1.0 mA
Output Noise Voltage Vn10 Hz ≤ f ≤ 100 kHz 25
µ
Vrms
Ripple Rejection R·R f = 120 Hz, 4 V ≤ VIN ≤ 9 V 48 66 dB
Dropout Voltage VDIF IO = 40 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 0.15 0.3 V
Peak Output Current IOpeak VIN = 5 V 190 mA
Short Circuit Current I Oshort VIN = 12 V 100 mA
Temperature Coefficient of ∆VO/∆TIO = 5 mA, 0 ˚C ≤ TJ ≤ 125 ˚C –0.5 mV/˚C
Output Voltage
5
µ
PC29L00 Series
ELECTRICAL CHARACTERISTICS
µ
PC29L33 (VIN = 5 V, IO = 40 mA, TJ = 25 ˚C, Unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Output Voltage VO3.17 3.3 3.43 V
3.8 V ≤ VIN ≤ 10 V, 1 mA ≤ IO ≤ 40 mA,
3.14 3.46
0 ˚C ≤ TJ ≤ 125 ˚C
4.5 V ≤ VIN ≤ 5.5 V, 1 mA ≤ IO ≤ 100 mA,
3.14 3.46
0 ˚C ≤ TJ ≤ 125 ˚C
Line Regulation REG IN 3.8 V ≤ VIN ≤ 12 V 4 50 mV
3.8 V ≤ VIN ≤ 9 V 2 20
Load Regulation REGL1 mA ≤ IO ≤ 100 mA 37 50 mV
1 mA ≤ IO ≤ 40 mA 16 20
Quiescent Current IBIAS IO = 0 1.5 2.0 mA
IO = 100 mA 10 20 mA
Start-up Current IBIAS(S) IO = 0 mA, before VO regulation 19 30 mA
Quiescent Current Change ∆IBIAS 4.3 V ≤ VIN ≤ 12 V, 0 ˚C ≤ TJ ≤ 125 ˚C 1.0 mA
Output Noise Voltage Vn10 Hz ≤ f ≤ 100 kHz 28
µ
Vrms
Ripple Rejection R·R f = 120 Hz, 4.3 V ≤ VIN ≤ 9 V 48 65 dB
Dropout Voltage VDIF IO = 40 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 0.15 0.3 V
Peak Output Current IOpeak VIN = 5 V 190 mA
Short Circuit Current I Oshort VIN = 12 V 100 mA
Temperature Coefficient of ∆VO/∆TIO = 5 mA, 0 ˚C ≤ TJ ≤ 125 ˚C –0.6 mV/˚C
Output Voltage
6
µ
PC29L00 Series
ELECTRICAL CHARACTERISTICS
µ
PC29L04 (VIN = 6 V, IO = 40 mA, TJ = 25 ˚C, Unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Output Voltage VO3.84 4.0 4.16 V
4.5 V ≤ VIN ≤ 12 V, 1 mA ≤ IO ≤ 40 mA,
3.80 4.20
0 ˚C ≤ TJ ≤ 125 ˚C
VIN
=
6 V, 1 mA ≤ IO ≤ 100 mA,
3.80 4.20
0 ˚C ≤ TJ ≤ 125 ˚C
Line Regulation REG IN 4.5 V ≤ VIN ≤ 12 V 4 30 mV
Load Regulation REGL1 mA ≤ IO ≤ 100 mA 33 60 mV
1 mA ≤ IO ≤ 40 mA 14 30
Quiescent Current IBIAS IO = 0 1.6 2.0 mA
IO = 100 mA 10 20 mA
Start-up Current IBIAS(S) IO = 0 mA, before VO regulation 20 50 mA
Quiescent Current Change ∆IBIAS 4.5 V ≤ VIN ≤ 12 V, 0 ˚C ≤ TJ ≤ 125 ˚C 1.0 mA
Output Noise Voltage Vn10 Hz ≤ f ≤ 100 kHz 35
µ
Vrms
Ripple Rejection R·R f = 120 Hz, 5 V ≤ VIN ≤ 10 V 47 65 dB
Dropout Voltage VDIF IO = 40 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 0.15 0.3 V
Peak Output Current IOpeak VIN = 6 V 220 mA
Short Circuit Current I Oshort VIN = 12 V 100 mA
Temperature Coefficient of ∆VO/∆TIO = 5 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 0.2 mV/˚C
Output Voltage
7
µ
PC29L00 Series
ELECTRICAL CHARACTERISTICS
µ
PC29L05 (VIN = 6 V, IO = 40 mA, TJ = 25 ˚C, Unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Output Voltage VO4.8 5.0 5.2 V
5.5 V ≤ VIN ≤ 12 V, 1 mA ≤ IO ≤ 40 mA,
4.75 5.25
0 ˚C ≤ TJ ≤ 125 ˚C
VIN
=
6 V, 1 mA ≤ IO ≤ 100 mA,
4.75 5.25
0 ˚C ≤ TJ ≤ 125 ˚C
Line Regulation REG IN 5.5 V ≤ VIN ≤ 12 V 4 30 mV
Load Regulation REGL1 mA ≤ IO ≤ 100 mA 35 80 mV
1 mA ≤ IO ≤ 40 mA 15 30
Quiescent Current IBIAS IO = 0 1.6 2.0 mA
IO = 100 mA 10 20 mA
Start-up Current IBIAS(S) IO = 0 mA, before VO regulation 50 90 mA
Quiescent Current Change ∆IBIAS 6 V ≤ VIN ≤ 12 V, 0 ˚C ≤ TJ ≤ 125 ˚C 1.0 mA
Output Noise Voltage Vn10 Hz ≤ f ≤ 100 kHz 40
µ
Vrms
Ripple Rejection R·R f = 120 Hz, 6 V ≤ VIN ≤ 11 V 46 62 dB
Dropout Voltage VDIF IO = 40 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 0.15 0.3 V
Peak Output Current IOpeak VIN = 7 V 210 mA
Short Circuit Current I Oshort VIN = 12 V 100 mA
Temperature Coefficient of ∆VO/∆TIO = 5 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 0.2 mV/˚C
Output Voltage
8
µ
PC29L00 Series
TYPICAL CHARACTERISTICS
P
d
- T
A
2000
1500
1000
500
0
700
400
0 50 100 150
PC29L00J
PC29L00T
180 ˚C/W
315 ˚C/W
85 ˚C
T
A
- Ambient Temperature - ˚C
P
d
- Power Dissipation - mW
60
50
40
30
20
10
0010
V
IN
- Input Voltage - V
I
BIAS
- Quiescent Current - mA
V
DIF
- T
J
–20 50 100 150
T
J
- Junction Tem
p
erature - ˚C
V
DIF
- Dropout Voltage - V
5
4
3
2
1
0016
V
IN
- Input Voltage - V
V
O
- Output Voltage - V
T
A
= 25 ˚C
I
O
= 0 mA 40 mA
100 mA
V
O
- V
IN
( PC29L03)
48 142 6 10 12
T
J
= 25 ˚C
I
O
= 100 mA
I
O
= 40 mA
I
O
= 0
8642
I
O
= 0
I
O
= 40 mA
I
O
= 100 mA
60
50
40
30
20
10
00108642
T
J
= 25 ˚C
0.5
0.4
0.3
0.2
0.1
0
0.5
0.4
0.3
0.2
0.1
00 10080604020
T
J
= 25 ˚C
I
O
= 40 mA
PC29L03
PC29L05
µ
µ
µ
µ
PC29L00T
62.5 ˚C/W
(With the 16 cm
2
× 0.7 mm
ceramic substrate)
I
BIAS
(I
BIAS(S)
) - V
IN
( PC29L03)
µ
V
IN
- Input Voltage - V
I
BIAS
- Quiescent Current - mA
I
BIAS
(I
BIAS(S)
) - V
IN
( PC29L05)
µ
µ
µ
V
DIF
- Dropout Voltage - V
I
O
- Out
p
ut Current - mA
V
DIF
- I
O
0
9
µ
PC29L00 Series
TYPICAL CHARACTERISTICS
R·R - f
100
80
60
40
20
010 100 k
f - Frequency - Hz
R·R - Ripple Rejection - dB
100 1 k 10 k
T
J
= 25 ˚C
∆V
IN
= 5 V
I
O
= 40 mA
PC29L03
PC29L05
50
0
–50
–100 0 50 100 150
T
J
- Junction Temperature - ˚C
∆ V
O
- Output Voltage Deviation - mV
∆ V
O
- T
J
( PC29L03)
V
IN
= 4 V
I
O
= 5 mA
50
0
–50
–100 0 50 100 150
50
0
–50
–100 0 50 100 150
V
IN
= 6 V
I
O
= 5 mA
50
0
–50
–100 0 50 100 150
V
IN
= 6 V
I
O
= 5 mA
V
IN
= 5 V
I
O
= 5 mA
µ
µ
µ
∆ V
O
- T
J
( PC29L04)
µ
∆ V
O
- T
J
( PC29L33)
µ
∆ V
O
- Output Voltage Deviation - mV
∆ V
O
- Output Voltage Deviation - mV
T
J
- Junction Temperature - ˚C
T
J
- Junction Temperature - ˚C
∆ V
O
- Output Voltage Deviation - mV
∆ V
O
- T
J
( PC29L05)
µ
T
J
- Junction Temperature - ˚C
10
µ
PC29L00 Series
PACKAGE DIMENSIONS (Unit: mm)
µ
PC29L00J Series
3PIN PLASTIC SIP (TO-92)
11
µ
PC29L00 Series
µ
PC29L00T Series
SOT-89
4.5±0.1
1.6±0.2 1.5±0.1
2.5±0.1
4.0±0.25
0.42±0.06
3.0
1.5
0.47
±0.06
0.42
±0.06
0.8 MIN.
0.41
+0.03
–0.05
12
µ
PC29L00 Series
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales offices in case other soldering process is used, or in case soldering is done under
different conditions.
TYPES OF THROUGH HOLE MOUNT DEVICE
µ
PC29L00J Series
Soldering Process Soldering Conditions Symbol
Wave soldering Solder temperature: 260 ˚C or below.
Flow Time: 10 seconds or below.
TYPES OF SURFACE MOUNT DEVICE
For more details, refer to our document “Semiconductor Device Mounting Manual” (IEI-1207).
µ
PC29L00T Series
Soldering Process Soldering Conditions Symbol
Infrared ray reflow Peak package’s temperature: 235 ˚C or below. IR35-00-2
Reflow time: 30 seconds or below (210 ˚C or higher).
Number of flow process: 2. Exposure limit Note: None.
Vapor phase soldering Peak package’s temperature: 215 ˚C or below. VP15-00-2
Reflow time: 40 seconds or below (200 ˚C or higher).
Number of flow process: 2. Exposure limit Note: None.
Wave soldering Solder temperature: 260 ˚C or below. WS60-00-1
Flow time: 10 seconds or below.
Number of flow process: 1. Exposure limit Note: None.
Note Exposure limit before soldering after dry-pack package is opened.
Remark Storage conditions: 25 ˚C and relative humidity at 65 % or less.
Caution Do not apply more than a single process at once, except for “Partial heating method”.
REFERENCE
Document Name Document No.
NEC semiconductor device reliability/quality control system. IEI-1212
Quality grade on NEC semiconductor devices. IEI-1209
Semiconductor device mounting technology manual. IEI-1207
Semiconductor device package manual. IEI-1213
Guide to quality assurance for semiconductor devices. MEI-1202
Semiconductor selection guide. MF-1134
13
µ
PC29L00 Series
[MEMO]
µ
PC29L00 Series
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
“Standard“, “Special“, and “Specific“. The Specific quality grade applies only to devices developed based on
a customer designated “quality assurance program“ for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices in “Standard“ unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact NEC Sales Representative in advance.
Anti-radioactive design is not implemented in this product.
M4 94.11
