May 2017
DocID026543 Rev 5
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This is information on a product in full production.
www.st.com
BALF-NRG-01D3
50 ohm nominal input / conjugate match balun balun to BlueNRG
tranceiver, with integrated harmonic filter
Datasheet - production data
Features
50 Ω nominal input / conjugate match to
BlueNRG device
Low insertion loss
Low amplitude imbalance
Low phase imbalance
Wafer level chip scale package (WLCSP)
Benefits
Very low profile < 670 μm
High RF performance
RF BOM reduction
Small footprint
Applications
Bluetooth low energy impedance matched
balun filter
Optimized for ST BlueNRG RFIC
Description
STMicroelectronics BALF-NRG-01D3 is an ultra
miniature balun. The BALF-NRG-01D3 integrates
matching network and harmonics filter. Matching
impedance has been customized for the
BlueNRG ST transceiver (both QFN and WLCSP
versions). It is using STMicroelectronics IPD
technology on non conductive glass substrate
which optimizes RF performance.
Figure 1: Application schematic with QFN type
BlueNRG
Figure 2: Application schematic with WLCSP type
BlueNRG
Flip-Chip (4 bumps) package
Solder a 10u_0805 between 1-2
or a 0R0_0805 between 1-3
Characteristics
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1 Characteristics
Table 1: Absolute maximum ratings (limiting values)
Symbol
Parameter
Value
Unit
Min.
Typ.
Max.
PIN
Input power RFIN
-
20
dBm
VESD
ESD ratings MIL STD883C (HBM: C = 100 pF, R = 1.5 Ω,
air discharge)
2000
-
V
ESD ratings machine model (MM: C = 200 pF, R = 25 W, L
= 500 nH)
200
-
TOP
Operating temperature
-40
-
+105
°C
Table 2: Impedances (Tamb = 25 °C)
Symbol
Parameter
Value
Unit
Min.
Typ.
Max.
ZOUT
Nominal differential output impedance
-
Match to BlueNRG
-
Ω
ZIN
Nominal input impedance
-
50
-
Ω
Table 3: RF performance (Tamb = 25 °C)
Symbol
Parameter
Test condition
Value
Unit
Min.
Typ.
Max.
f
Frequency range (bandwidth)
2400
2500
MHz
S11
Input return loss bandwidth
-20
dB
S21
Insertion loss
-1.1
dB
S21
Harmonic rejection (differential mode)
H2
-8
dB
H3
-38
H4
-31
H5
-23
ɸimb
Output phase imbalance
7
°
Aimb
Output amplitude imbalance
0.5
dB
BALF-NRG-01D3
Characteristics
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1.1 RF measurement
Figure 3: Differential transmission
Figure 4: Return loss
Figure 5: Insertion loss
Figure 6: H2 filtering
Figure 7: H3 filtering
Figure 8: H4 filtering
-10
0dB
-20
-30
-40
-50
-60
-70
-80 0 2 4 6 8 10 12 14
f(GHz)
dB
-19
-20
-21
-22
-23
-24
-25
2.40 2.42 2.44 2.46 2.48 2.50
f(GHz)
dB
-0.8
-0.9
-1.0
-1.1
-1.2
-1.3
-1.4
2.40 2.42 2.44 2.46 2.48 2.50
f(GHz)
dB
-5
-7
-9
-11
-13
-15
4.80 4.84 4.88 4.92 4.96 5.00
f(GHz)
dB
-35
-40
-45
-50
-55
-607.20 7.25 7.30 7.35 7.40 7.45
f(GHz)
7.50
-30
dB
-25
-30
-35
-40
-45
-50
9.60 9.70 9.80 9.90
f(GHz)
10
-20
Characteristics
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Figure 9: H5 filtering
Figure 10: Amplitude imbalance
Figure 11: Phase imbalance
dB
-15
-20
-25
-30
-35
12.00 12.10 12.20 12.30
f(GHz)
12.40 12.50
dB
0.4
0.2
02.40 2.42 2.44 2.46
f(GHz)
2.48 2.50
0.8
0.6
1.0
deg
4
2
0
2.40 2.42 2.44 2.46
f(GHz)
2.48 2.50
8
6
10
BALF-NRG-01D3
BALF-NRG-01D3 with QFN type BlueNRG
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2 BALF-NRG-01D3 with QFN type BlueNRG
Figure 12: Application board EVB (2 layers)
Figure 13: Recommended balun land pattern (EVB)
SMT = 320 µm
180 µm
254 µm
TOP and SPT = 220 µm
BALF-NRG-01D3 with QFN type BlueNRG
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2.1 BALF-NRG-01D3 measurements on QFN EVB
Figure 14: Harmonics
Figure 15: Sensitivity
BALF-NRG-01D3
BALF-NRG-01D3 with QFN type BlueNRG
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Figure 16: Pout
BALF-NRG-01D3 with WLCSP type BlueNRG
BALF-NRG-01D3
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3 BALF-NRG-01D3 with WLCSP type BlueNRG
Figure 17: Recommended balun land pattern (WLCSP)
Figure 18: PCB stack-up recommendation
800 µm
220 µm
µµµ
BALF-NRG-01D3
BALF-NRG-01D3 with WLCSP type BlueNRG
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3.1 BALF-NRG-01D3 measurements on WLCSP EVB
Figure 19: Harmonics
Figure 20: Sensitivity
BALF-NRG-01D3 with WLCSP type BlueNRG
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Figure 21: Pout
BALF-NRG-01D3
Package information
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4 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Epoxy meets UL94, V0
Lead-free package
4.1 Flip-Chip 4 bumps package information
Figure 22: Flip-Chip 4 bumps package outline
Table 4: Flip-Chip 5 bumps dimensions
Parameter
Dimesions (in mm)
Min.
Typ.
Max.
A
0.580
0.630
0.680
A1
0.180
0.205
0.230
A2
0.380
0.400
0.420
b
0.230
0.255
0.280
D
1.375
1.400
1.425
D1
0.990
1.000
1.010
E
0.825
0.850
0.875
E1
0.390
0.400
0.410
SE
0.200
fD
0.170
0.200
0.230
fE
0.195
0.225
0.255
ccc
0.050
Ø
0.025
Package information
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Figure 23: Footprint - 3 mils stencil -non solder
mask defined
Figure 24: Footprint - 3 mils stencil - solder mask
defined
Figure 25: Footprint - 5 mils stencil -non solder
mask defined
Figure 26: Footprint - 5 mils stencil - solder mask
defined
Copper pad diameter:
220 µm recommended
180 µm minimum
260 µm maximum
Solder mask opening:
320 µm recommended
300 µm minimum
340 µm maximum
Solder stencil opening:
220 µm recommended
Copper pad diameter:
220 µm recommended
180 µm minimum
260 µm maximum
Solder mask opening:
320 µm recommended
300 µm minimum
Solder stencil opening:
220 µm recommended
*depending on paste, it can go down to 270 µm
Copper pad diameter:
220 µm recommended
180 µm minimum
260 µm maximum
Solder mask opening:
320 µm recommended
300 µm minimum
340 µm maximum
Solder stencil opening:
330 µm recommended*
*depending on paste, it can go down to 270 µm
Copper pad diameter:
220 µm recommended
180 µm minimum
260 µm maximum
Solder mask opening:
320 µm recommended
300 µm minimum
Solder stencil opening:
330 µm recommended*
BALF-NRG-01D3
Package information
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4.2 Flip-chip 4 bumps packing information
Figure 27: Marking
Table 5: Document revision history
Ball
Name
Description
A1
ANT
Antenna connection
A2
GND
Ground
B1
Rx_P
Balun receive positive output
B2
Rx_N
Balun receive negative output
Figure 28: Flip Chip tape and reel specifications
More packing information is available in the application note:
AN2348 Flip-Chip: “Package description and recommendations for use”
Ordering information
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5 Ordering information
Table 6: Ordering information
Order code
Marking
Package
Weight
Base qty.
Delivery mode
BALF-NRG-01D3
SV
Flip-Chip package
(4 bumps)
1.35 mg
5000
Tape and reel (7'')
6 Revision history
Table 7: Document revision history
Date
Revision
Changes
17-Jun-2014
1
Initial release.
17-Jul-2014
2
Updated Figure 13, Figure 17, Figure 22 and package view on cover
page. Corrected typo error on Table 2.
18-Aug-2014
3
Updated title and description in cover page.
29-Sep-2015
4
Updated Figure 22. Added Figure 25 and Figure 26. Reformatted to
current standards.
04-May-2017
5
Updated Figure 2: "Application schematic with WLCSP type BlueNRG".
BALF-NRG-01D3
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