www.bergquistcompany.com
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED
WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to
replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR
MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT,
INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR
THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
PDS_10073_GP_1500_0305
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: 800-347-4572
Fax: 952-835-0430
The Bergquist Company - Europe
Bramenberg 9a, 3755 BT Eemnes
Netherlands
Phone: 31-35-5380684
Fax: 31-35-5380295
The Bergquist Company - China
Rm. 7C, Aihe Mansion
No. 629 Ling Ling Road
Shanghai, China 200030
Ph: 86-21-6464-2206
Fax: 86-21-6464-2209
Gap Pad
®
1500
Thermally Conductive, Unreinforced Gap Filling Material
Features and Benefits
• Thermal conductivity: 1.5 W/m-K
• Unreinforced construction for additional
compliancy
• Conformable, low hardness
• Electrically isolating
Gap Pad 1500 has an ideal filler blend that
gives its low-modulus characteristic that
maintains optimal thermal performance yet
still allows for easy handling.The natural tack
on both sides of the material allows for
good compliance to adjacent surfaces of
components, minimizing interfacial resistance.
Note: Resultant thickness is defined as the final gap
thickness of the application.
01 32546
200
150
100
50
0
Thickness vs. Thermal Resistance
Gap Pad 1500
Thermal Resistance (°C-in2/W)
Resultant Thickness (mils)
Typical Applications Include:
• Telecommunications
• Computer and peripherals
• Power conversion
• RDRAM™ memory modules / chip scale packages
• Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
Configurations Available:
• Sheet form and die-cut parts
Building a Part Number Standard Options
Gap Pad®:U.S. Patent 5,679,457 and others.
Section A
Section B
Section C
Section D
Section E
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
GP1500 = Gap Pad 1500 Material
GP1500 0.100 02 0816 NA
Note: To build a part number, visit our website at www.bergquistcompany.com.
Standard thicknesses available: 0.020", 0.040", 0.060",
0.080", 0.100", 0.125", 0.160", 0.200"
02 = Natural tack, both sides
0816 = Standard sheet size 8" x 16", or
00 = custom configuration
––––
TYPICAL PROPERTIES OF GAP PAD 1500
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Black Black Visual
Reinforcement Carrier ———
Thickness (inch) / (mm) 0.020 to 0.200 0.508 to 5.080 ASTM D374
Inherent Surface Tack (1- or 2-sided) 2 2 —
Density (g/cc) 2.1 2.1 ASTM D792
Heat Capacity (J/g-K) 1.0 1.0 ASTM E1269
Hardness, Bulk Rubber (Shore 00) (1) 40 40 ASTM D2240
Young’s Modulus (psi) / (kPa) (2) 45 310 ASTM D575
Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200 —
ELECTRICAL
Dielectric Breakdown Voltage (Vac) >6000 >6000 ASTM D149
Dielectric Constant (1000 Hz) 5.5 5.5 ASTM D150
Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257
Flame Rating V-O V- O U.L. 94
THERMAL
Thermal Conductivity (W/m-K) 1.5 1.5 ASTM D5470
1) Thirty second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2.For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
