
• Low forward voltage drop
• Low leakage current
• Low profile - typical height of 1.0 mm
• Moisture sensitivity: level 1, per J-STD-020
• Glass passivated chip and super fast switching time
• High temperature soldering guaranteed: 260℃/10 seconds
• Halogen-free according to IEC 61249-2-21 definition
VRRM V
VRMS V
VDC V
IF(AV) A
IFSM A
TJ,
TSTG
Maximum Instantaneous
Forward Voltage 1 A VFV
TA=25℃
TA=125℃
IF=0.5A,IR=1.0A,
Irr=0.25A
Typical Junction
Capacitance 4.0 V, 1 MHz CJpF
Juntion to Ambient RθJA 97
Juntion to Lead RθJL
Note:1),The thermal resistance from junction to ambient or lead,mounted on P.C.B with 5×5mm copper pads,2 OZ,FR4 PCB
Maximum Pepetitive Peak Reverse Voltage 200
Typical Thermal
Resistance1) ℃/W
Parameter Symbol GSGP3U Unit
Maximum RMS Voltage 140
Maximum DC Blocking Voltage 200
Maximum Average Forward Rectified Current 1.0
µA
50
Peak Forward Surge Current 8.3ms Single
Half Sine-Wave Superimposed on Rated Load 25
Operating Junction and Storage
Temperature Range - 55 to + 150
Parameter Test Conditions Symbol GSGP3U Unit
27
0.95(typ:0.88)
Maximum DC Reverse
Current IR
5
Maximum Reverse
Recovery Time trr 35 nS
9.5
GSGP3U
Surface Mount Glass Passivated High Efficient Rectifier
Reverse Voltage 200V Forward Current 1A
Features
Package: eSGP
(SOD-323F)
Absolute Maximum Ratings (TA=25°C unless otherwise noted)
℃
Electrical Characteristics (TA=25°C unless otherwise noted)