1
LTC1748
1748fa
14-Bit, 80Msps Low Noise ADC
Sample Rate: 80Msps
76.3dB SNR and 90dB SFDR (3.2V Range)
72.6dB SNR and 90dB SFDR (2V Range)
No Missing Codes
Single 5V Supply
Power Dissipation: 1.4W
Selectable Input Ranges: ±1V or ±1.6V
240MHz Full Power Bandwidth S/H
Pin Compatible Family
25Msps: LTC1746 (14-Bit), LTC1745 (12-Bit)
50Msps: LTC1744 (14-Bit), LTC1743 (12-Bit)
65Msps: LTC1742 (14-Bit), LTC1741 (12-Bit)
80Msps: LTC1748 (14-Bit), LTC1747 (12-Bit)
48-Pin TSSOP Package
Telecommunications
Receivers
Cellular Base Stations
Spectrum Analysis
Imaging Systems
, LTC and LT are registered trademarks of Linear Technology Corporation.
The LTC
®
1748 is an 80Msps, sampling 14-bit A/D con-
verter designed for digitizing high frequency, wide dy-
namic range signals. Pin selectable input ranges of ±1V
and ±1.6V along with a resistor programmable mode
allow the LTC1748’s input range to be optimized for a wide
variety of applications.
The LTC1748 is perfect for demanding communications
applications with AC performance that includes 76.3dB
SNR and 90dB spurious free dynamic range. Ultralow jitter
of 0.15ps
RMS
allows undersampling of IF frequencies with
excellent noise performance. DC specs include ±3LSB INL
and no missing codes.
The digital interface is compatible with 5V, 3V, 2V and
LVDS logic systems. The ENC and ENC inputs may be
driven differentially from PECL, GTL and other low swing
logic families or from single-ended TTL or CMOS. The low
noise, high gain ENC and ENC inputs may also be driven
by a sinusoidal signal without degrading performance. A
separate output power supply can be operated from 0.5V
to 5V, making it easy to connect directly to any low voltage
DSPs or FIFOs.
The TSSOP package with a flow-through pinout simplifies
the board layout.
80Msps, 14-Bit ADC with a 2V Differential Input Range
14-BIT
PIPELINED ADC
14
S/H
AMP
±1V
DIFFERENTIAL
ANALOG INPUT
A
IN+
A
IN
SENSE
V
CM
4.7µF
DIFF AMP
REFLA REFHB
GND
1748 BD
ENC
4.7µF
1µF1µF
0.1µF 0.1µF
REFHAREFLB
BUFFER
RANGE
SELECT
2.35V
REF
CORRECTION
LOGIC AND
SHIFT
REGISTER
OUTPUT
LATCHES
CONTROL LOGIC
OV
DD
V
DD
OGND
0.5V
TO 5V
5V
0.1µF
1µF
1µF
1µF
D13
D0
CLKOUT
OF
ENC
DIFFERENTIAL
ENCODE INPUT
OEMSBINV
0.1µF
DESCRIPTIO
U
FEATURES
APPLICATIO S
U
BLOCK DIAGRA
W
2
LTC1748
1748fa
PARAMETER CONDITIONS MIN TYP MAX UNITS
Resolution (No Missing Codes) 14 Bits
Integral Linearity Error (Note 6) 3 ±0.75 3 LSB
Differential Linearity Error –1 ±0.5 1.5 LSB
Offset Error (Note 7) 35 ±835 mV
Gain Error External Reference (SENSE = 1.6V) 3.5 ±1 3.5 %FS
Full-Scale Tempco Internal Reference ±40 ppm/°C
External Reference (SENSE = 1.6V) ±20 ppm/°C
Offset Tempco ±20 µV/°C
Input Referred Noise (Transition Noise) SENSE = 1.6V 0.82 LSB
RMS
ORDER PART
NUMBER
OVDD = VDD (Notes 1, 2)
Supply Voltage (V
DD
)............................................. 5.5V
Analog Input Voltage (Note 3) ....0.3V to (V
DD
+ 0.3V)
Digital Input Voltage (Note 4) .....0.3V to (V
DD
+ 0.3V)
Digital Output Voltage................. 0.3V to (V
DD
+ 0.3V)
OGND Voltage..............................................0.3V to 1V
Power Dissipation............................................ 2000mW
Operating Temperature Range
LTC1748C ............................................... 0°C to 70°C
LTC1748I............................................ 40°C to 85°C
Storage Temperature Range ................. 65°C to 150°C
Lead Temperature (Soldering, 10 sec)..................300°C
LTC1748CFW
LTC1748IFW
T
JMAX
= 150°C, θ
JA
= 35°C/W
The indicates specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. (Note 5)
ABSOLUTE MAXIMUM RATINGS
W
WW
U
PACKAGE/ORDER INFORMATION
W
UU
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
TOP VIEW
FW PACKAGE
48-LEAD PLASTIC TSSOP
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
SENSE
V
CM
GND
A
IN+
A
IN
GND
V
DD
V
DD
GND
REFLB
REFHA
GND
GND
REFLA
REFHB
GND
V
DD
V
DD
GND
V
DD
GND
MSBINV
ENC
ENC
OF
OGND
D13
D12
D11
OV
DD
D10
D9
D8
D7
OGND
GND
GND
D6
D5
D4
OV
DD
D3
D2
D1
D0
OGND
CLKOUT
OE
CO VERTER CHARACTERISTICS
U
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
V
IN
Analog Input Range (Note 8) 4.75V V
DD
5.25V ±1 to ±1.6 V
I
IN
Analog Input Leakage Current 0 < A
IN+
, A
IN
< V
DD
–1 1 µA
C
IN
Analog Input Capacitance Sample Mode ENC < ENC 8 pF
Hold Mode ENC > ENC 4 pF
t
ACQ
Sample-and-Hold Acquisition Time 56ns
t
AP
Sample-and-Hold Acquisition Delay Time 0 ns
t
JITTER
Sample-and-Hold Acquisition Delay Time Jitter 0.15 ps
RMS
CMRR Analog Input Common Mode Rejection Ratio 1.5V < (A
IN
= A
IN+
) < 3V 80 dB
The indicates specifications which apply over the full operating temperature range, otherwise
specifications are at TA = 25°C. (Note 5)
A ALOG I PUT
UU
Consult LTC Marketing for parts specified with wider operating temperature ranges.
3
LTC1748
1748fa
PARAMETER CONDITIONS MIN TYP MAX UNITS
V
CM
Output Voltage I
OUT
= 0 2.30 2.35 2.40 V
V
CM
Output Tempco I
OUT
= 0 ±30 ppm/°C
V
CM
Line Regulation 4.75V V
DD
5.25V 3 mV/V
V
CM
Output Resistance 1mA I
OUT
1mA 4
(Note 5)
I TER AL REFERE CE CHARACTERISTICS
UU U
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
SNR Signal-to-Noise Ratio 5MHz Input Signal (2V Range) 72.6 dB
5MHz Input Signal (3.2V Range) 75 76.3 dB
30MHz Input Signal (2V Range) 72.5 dB
30MHz Input Signal (3.2V Range) 74 76.1 dB
70MHz Input Signal (2V Range) 72.2 dB
70MHz Input Signal (3.2V Range) 75.4 dB
140MHz Input Signal (2V Range) 71.4 dB
250MHz Input Signal (2V Range) 68.9 dB
SFDR Spurious Free Dynamic Range 5MHz Input Signal (2V Range) 90 dB
5MHz Input Signal (3.2V Range) (2nd and 3rd) 90 dB
5MHz Input Signal (3.2V Range) (Other) 94 dB
30MHz Input Signal (2V Range) 90 dB
30MHz Input Signal (3.2V Range) (2nd and 3rd) 80 88 dB
30MHz Input Signal (3.2V Range) (Other) 85 94 dB
70MHz Input Signal (2V Range) 85 dB
70MHz Input Signal (3.2V Range) (2nd and 3rd) 76 dB
70MHz Input Signal (3.2V Range) (Other) 94 dB
140MHz Input Signal (2VRange) (2nd and 3rd) 77 dB
140MHz Input Signal (2V Range) (Other) 93 dB
250MHz Input Signal (2V Range) (2nd and 3rd) 64 dB
250MHz Input Signal (2V Range) (Other) 89 dB
S/(N + D) Signal-to-(Noise + Distortion) Ratio 5MHz Input Signal (2V Range) 72.4 dB
5MHz Input Signal (3.2V Range) 74.5 76.0 dB
30MHz Input Signal (2V Range) 72.3 dB
30MHz Input Signal (3.2V Range) 75.6 dB
70MHz Input Signal (2V Range) 71 dB
70MHz Input Signal (3.2V Range) 71 dB
THD Total Harmonic Distortion 5MHz Input Signal, First 5 Harmonics (2V Range) 90 dB
5MHz Input Signal, First 5 Harmonics (3.2V Range) 90 dB
30MHz Input Signal, First 5 Harmonics (2V Range) 90 dB
30MHz Input Signal, First 5 Harmonics (3.2V Range) 85 dB
70MHz Input Signal, First 5 Harmonics (2V Range) 78 dB
70MHz Input Signal, First 5 Harmonics (3.2V Range) 74 dB
IMD Intermodulation Distortion f
IN1
= 2.52MHz, f
IN2
= 5.2MHz (2V Range) 97 dBc
f
IN1
= 2.52MHz, f
IN2
= 5.2MHz (3.2V Range) 93 dBc
Sample-and-Hold Bandwidth R
SOURCE
= 50240 MHz
TA = 25°C, AIN = –1dBFS (Note 5)
DY A IC ACCURACY
UW
4
LTC1748
1748fa
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
t
0
ENC Period (Note 9) 12.5 2000 ns
t
1
ENC High (Note 8) 6 1000 ns
t
2
ENC Low (Note 8) 6 1000 ns
t
3
Aperture Delay (Note 8) 0 ns
t
4
ENC to CLKOUT Falling C
L
= 10pF (Note 8) 1 2.4 4 ns
t
5
ENC to CLKOUT Rising C
L
= 10pF (Note 8) t
1
+ t
4
ns
For 80Msps 50% Duty Cycle C
L
= 10pF (Note 8) 7.25 8.65 10.25 ns
t
6
ENC to DATA Delay C
L
= 10pF (Note 8) 2 4.9 7.2 ns
t
7
ENC to DATA Delay (Hold Time) (Note 8) 1.4 3.4 4.7 ns
t
8
ENC to DATA Delay (Setup Time) C
L
= 10pF (Note 8) t
0
– t
6
ns
For 80Msps 50% Duty Cycle C
L
= 10pF (Note 8) 5.3 7.6 10.5 ns
t
9
CLKOUT to DATA Delay (Hold Time), (Note 8) 6ns
80Msps 50% Duty Cycle
t
10
CLKOUT to DATA Delay (Setup Time), C
L
= 10pF (Note 8) 2.1 ns
80Msps 50% Duty Cycle
t
11
DATA Access Time After OE C
L
= 10pF (Note 8) 10 25 ns
t
12
BUS Relinquish (Note 8) 10 25 ns
Data Latency 5 cycles
The indicates specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. (Note 5)
TI I G CHARACTERISTICS
UW
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
V
DD
Positive Supply Voltage 4.75 5.25 V
I
DD
Positive Supply Current 280 310 mA
P
DIS
Power Dissipation 1.4 1.55 W
OV
DD
Digital Output Supply Voltage 0.5 V
DD
V
The indicates specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. (Note 5)
POWER REQUIRE E TS
WU
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
V
IH
High Level Input Voltage V
DD
= 5.25V, MSBINV and OE 2.4 V
V
IL
Low Level Input Voltage V
DD
= 4.75V, MSBINV and OE 0.8 V
I
IN
Digital Input Current V
IN
= 0V to V
DD
±10 µA
C
IN
Digital Input Capacitance MSBINV and OE Only 1.5 pF
V
OH
High Level Output Voltage OV
DD
= 4.75V I
O
= –10µA 4.74 V
I
O
= –200µA4 4.74 V
V
OL
Low Level Output Voltage OV
DD
= 4.75V I
O
= 160µA 0.05 V
I
O
= 1.6mA 0.1 0.4 V
I
OZ
Hi-Z Output Leakage D13 to D0 V
OUT
= 0V to V
DD
, OE = High ±10 µA
C
OZ
Hi-Z Output Capacitance D13 to D0 OE = High (Note 8) 15 pF
I
SOURCE
Output Source Current V
OUT
= 0V 50 mA
I
SINK
Output Sink Current V
OUT
= 5V 50 mA
The indicates specifications which apply over the full
operating temperature range, otherwise specifications are at TA = 25°C. (Note 5)
DIGITAL I PUTS A D DIGITAL OUTPUTS
UU
5
LTC1748
1748fa
Note 1: Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired.
Note 2: All voltage values are with respect to GND (unless otherwise
noted).
Note 3: When these pin voltages are taken below GND or above V
DD
, they
will be clamped by internal diodes. This product can handle input currents
of greater than 100mA below GND or above V
DD
without latchup.
Note 4: When these pin voltages are taken below GND, they will be
clamped by internal diodes. This product can handle input currents of
>100mA below GND without latchup. These pins are not clamped to V
DD
.
Note 5: V
DD
= 5V, f
SAMPLE
= 80MHz, differential ENC/ENC = 2V
P-P
80MHz
sine wave, input range = ±1.6V differential, unless otherwise specified.
Note 6: Integral nonlinearity is defined as the deviation of a code from a
straight line passing through the actual endpoints of the transfer curve.
The deviation is measured from the center of the quantization band.
Note 7: Bipolar offset is the offset voltage measured from –0.5 LSB
when the output code flickers between 00 0000 0000 0000 and 11
1111 1111 1111.
Note 8: Guaranteed by design, not subject to test.
Note 9: Recommended operating conditions.
ELECTRICAL CHARACTERISTICS
TYPICAL PERFOR A CE CHARACTERISTICS
UW
INL, 3.2V Range DNL, 3.2V Range
8192 Point FFT,
Input Frequency = 15.068MHz,
1dB, 3.2V Range
FREQUENCY (MHz)
0
AMPLITUDE (dBFS)
–60
–30
–20
40
1748 G03
–70
–80
–120 10 20 30
515 25 35
–100
0
–10
–40
–50
–90
–110
T
A
= 25°C
8192 Point FFT,
Input Frequency = 15.068MHz,
10dB, 3.2V Range
FREQUENCY (MHz)
0
AMPLITUDE (dBFS)
–60
–30
–20
40
1748 G04
–70
–80
–120 10 20 30
515 25 35
–100
0
–10
–40
–50
–90
–110
T
A
= 25°C
8192 Point FFT,
Input Frequency = 15.068MHz,
20dB, 3.2V Range
FREQUENCY (MHz)
0
AMPLITUDE (dBFS)
–60
–30
–20
40
1748 G05
–70
–80
–120 10 20 30
515 25 35
–100
0
–10
–40
–50
–90
–110
T
A
= 25°C
8192 Point FFT,
Input Frequency = 30.068MHz,
1dB, 3.2V Range
FREQUENCY (MHz)
0
AMPLITUDE (dBFS)
–60
–30
–20
40
1748 G06
–70
–80
–120 10 20 30
515 25 35
–100
0
–10
–40
–50
–90
–110
T
A
= 25°C
OUTPUT CODE
0
–2.5
ERROR (LSB)
–2.0
–1.0
–0.5
0
2.5 T
A
= 25°C
1.0
4096 8192
1748 G01
–1.5
1.5
2.0
0.5
12288 16384
OUTPUT CODE
0
–1.0
ERROR (LSB)
–0.8
–0.4
–0.2
0
1.0
0.4
4096 8192
1748 G02
–0.6
0.6
0.8
0.2
12288 16384
T
A
= 25°C
6
LTC1748
1748fa
TYPICAL PERFOR A CE CHARACTERISTICS
UW
8192 Point FFT,
Input Frequency = 40.64MHz,
1dB, 3.2V Range
8192 Point FFT,
Input Frequency = 40.64MHz,
10dB, 3.2V Range
8192 Point FFT,
Input Frequency = 40.64MHz,
20dB, 3.2V Range
8192 Point FFT,
Input Frequency = 50.64MHz,
1dB, 3.2V Range
8192 Point FFT,
Input Frequency = 30.068MHz,
20dB, 3.2V Range
8192 Point FFT,
Input Frequency = 30.068MHz,
10dB, 3.2V Range
FREQUENCY (MHz)
0
AMPLITUDE (dBFS)
–60
–30
–20
40
1748 G07
–70
–80
–120 10 20 30
515 25 35
–100
0
–10
–40
–50
–90
–110
T
A
= 25°C
FREQUENCY (MHz)
0
AMPLITUDE (dBFS)
–60
–30
–20
40
1748 G08
–70
–80
–120 10 20 30
515 25 35
–100
0
–10
–40
–50
–90
–110
T
A
= 25°C
FREQUENCY (MHz)
0
AMPLITUDE (dBFS)
–60
–30
–20
40
1748 G09
–70
–80
–120 10 20 30
515 25 35
–100
0
–10
–40
–50
–90
–110
T
A
= 25°C
FREQUENCY (MHz)
0
AMPLITUDE (dBFS)
–60
–30
–20
40
1748 G10
–70
–80
–120 10 20 30
515 25 35
–100
0
–10
–40
–50
–90
–110
T
A
= 25°C
FREQUENCY (MHz)
0
AMPLITUDE (dBFS)
–60
–30
–20
40
1748 G11
–70
–80
–120 10 20 30
515 25 35
–100
0
–10
–40
–50
–90
–110
T
A
= 25°C
FREQUENCY (MHz)
0
AMPLITUDE (dBFS)
–60
–30
–20
40
1748 G12
–70
–80
–120 10 20 30
515 25 35
–100
0
–10
–40
–50
–90
–110
T
A
= 25°C
8192 Point FFT,
Input Frequency = 50.64MHz,
10dB, 3.2V Range
8192 Point FFT,
Input Frequency = 50.64MHz,
20dB, 3.2V Range
8192 Point FFT,
Input Frequency = 69.1MHz,
1dB, 3.2V Range
FREQUENCY (MHz)
0
AMPLITUDE (dBFS)
–60
–30
–20
40
1748 G13
–70
–80
–120 10 20 30
515 25 35
–100
0
–10
–40
–50
–90
–110
T
A
= 25°C
FREQUENCY (MHz)
0
AMPLITUDE (dBFS)
–60
–30
–20
40
1748 G14
–70
–80
–120 10 20 30
515 25 35
–100
0
–10
–40
–50
–90
–110
T
A
= 25°C
FREQUENCY (MHz)
0
AMPLITUDE (dBFS)
–60
–30
–20
40
1748 G15
–70
–80
–120 10 20 30
515 25 35
–100
0
–10
–40
–50
–90
–110
T
A
= 25°C
7
LTC1748
1748fa
TYPICAL PERFOR A CE CHARACTERISTICS
UW
8192 Point 2-Tone FFT,
Input Frequency = 5MHz and
7MHz, –7dB, 3.2V Range
8192 Point FFT,
Input Frequency = 69.1MHz,
20dB, 3.2V Range
8192 Point FFT,
Input Frequency = 69.1MHz,
10dB, 3.2V Range
FREQUENCY (MHz)
0
AMPLITUDE (dBFS)
–60
–30
–20
40
1748 G16
–70
–80
–120 10 20 30
515 25 35
–100
0
–10
–40
–50
–90
–110
T
A
= 25°C
FREQUENCY (MHz)
0
AMPLITUDE (dBFS)
–60
–30
–20
40
1748 G17
–70
–80
–120 10 20 30
515 25 35
–100
0
–10
–40
–50
–90
–110
T
A
= 25°C
FREQUENCY (MHz)
0
AMPLITUDE (dBFS)
–60
–30
–20
40
1748 G18
–70
–80
–120 10 20 30
515 25 35
–100
0
–10
–40
–50
–90
–110
T
A
= 25°C
8192 Point 2-Tone FFT,
Input Frequency = 25MHz and
30MHz, –7dB, 3.2V Range
FREQUENCY (MHz)
0
AMPLITUDE (dBFS)
–60
–30
–20
40
1748 G19
–70
–80
–120 10 20 30
515 25 35
–100
0
–10
–40
–50
–90
–110
T
A
= 25°C
8192 Point 2-Tone FFT,
Input Frequency = 65MHz and
70MHz, –7dB, 3.2V Range
FREQUENCY (MHz)
0
AMPLITUDE (dBFS)
–60
–30
–20
40
1748 G20
–70
–80
–120 10 20 30
515 25 35
–100
0
–10
–40
–50
–90
–110
T
A
= 25°C
SFDR vs 15MHz Input Level
INPUT LEVEL (dBFS)
–80
SFDR dBc AND dBFS
60
90
100
0
1748 G21
50
40
0–60 –40 –20
–70 –50 –30 –10
20
120
110 dBFS
dBc
80
70
30
10
T
A
= 25°C
SFDR vs 30MHz Input Level
INPUT LEVEL (dBFS)
–80
SFDR dBc AND dBFS
60
90
100
0
1748 G22
50
40
0–60 –40 –20
–70 –50 –30 –10
20
120
110
80
70
30
10
dBFS
dBc
T
A
= 25°C
SFDR vs 50.3MHz Input Level SFDR vs 70.3MHz Input Level
INPUT LEVEL (dBFS)
–80
SFDR dBc AND dBFS
60
90
100
0
1748 G23
50
40
0–60 –40 –20
–70 –50 –30 –10
20
120
110
80
70
30
10
dBFS
dBc
T
A
= 25°C
INPUT LEVEL (dBFS)
–80
SFDR dBc AND dBFS
60
90
100
0
1748 G24
50
40
0–60 –40 –20
–70 –50 –30 –10
20
120
110
80
70
30
10
dBFS
dBc
T
A
= 25°C
8
LTC1748
1748fa
TYPICAL PERFOR A CE CHARACTERISTICS
UW
SFDR vs Input Frequency and
Amplitude, 3.2V Range,
2nd and 3rd Harmonic
INPUT FREQUENCY (MHz)
0
SFDR (dBFS)
75
80
85
60 100
1748 G25
70
65
60 20 40 80
90
95
100 –20dB
–10dB
6dB
–1dB
TA = 25°C
SFDR vs Input Frequency and
Amplitude, 2V Range,
2nd and 3rd Harmonic Shorted Input Histogram
INPUT FREQUENCY (MHz)
0
SFDR (dBFS)
75
80
85
60 100
1748 G26
70
65
60 20 40 80
90
95
100 –20dB
–10dB
6dB
–1dB
T
A
= 25°C
CODE
8147
0
COUNT
2000
6000
8000
10000
8151
18000
1748 G27
4000
8149
8148 8152 8153
8150
12000
14000
16000
TA = 25°C
SNR vs Input Frequency
3.2V Range
INPUT FREQUENCY (MHz)
0
SNR (dBFS)
75.5
76.0
76.5
60 100
1748 G28
75.0
74.5
74.0 20 40 80
77.0
77.5
78.0 TA = 25°C
SNR vs Input Level and Frequency
3.2V Range
INPUT LEVEL
–80
SNR (dBFS)
76.2
76.4
76.6
0
1748 G29
76.0
75.8
75.2 –60 –40 –20
75.6
75.4
77.0
76.8
15MHz
30MHz
50MHz
70MHz
T
A
= 25°C
SFDR vs Sample Rate, 5MHz Input,
1dB, 3.2V Range
SAMPLE RATE (Msps)
0
SFDR (dBFS)
75
80
85
60 100
1748 G30
70
65
60 20 40 80
90
95
100 T
A
= 25°C
SNR vs Sample Rate, 5MHz Input,
1dB, 3.2V Range
SAMPLE RATE (Msps)
0
72
SNR (dBFS)
73
74
75
76
77
78
20 40 60 80
1748 G31
100
T
A
= 25°C
High Input Frequency SFDR,
–1dB, 2V Range
INPUT FREQUENCY (MHz)
0
SFDR (dBFS)
75
80
85
150 250
1748 G33
70
65
60 50 100 200
90
95
100 4TH OR HIGHER HARMONIC
2ND OR 3RD HARMONIC
INPUT FREQUENCY (MHz)
0
68.5
SNR (dBFS)
69.0
70.0
70.5
71.0
100 200 250
73.0
1748 G34
69.5
50 150
71.5
72.0
72.5
High Input Frequency SNR,
–1dB, 2V Range
9
LTC1748
1748fa
UU
U
PI FU CTIO S
SENSE (Pin 1): Reference Sense Pin. Ground selects ±1V.
V
DD
selects ±1.6V. Greater than 1V and less than 1.6V
applied to the SENSE pin selects an input range of ±V
SENSE
,
±1.6V is the largest valid input range.
V
CM
(Pin 2): 2.35V Output and Input Common Mode Bias.
Bypass to ground with 4.7µF ceramic chip capacitor.
GND (Pins 3, 6, 9, 12, 13, 16, 19, 21, 36, 37): ADC Power
Ground.
A
IN+
(Pin 4): Positive Differential Analog Input.
A
IN
(Pin 5): Negative Differential Analog Input.
V
DD
(Pins 7, 8, 17, 18, 20): 5V Supply. Bypass to AGND
with 1µF ceramic chip capacitors at Pin 8 and Pin 18.
REFLB (Pin 10): ADC Low Reference. Bypass to Pin 11
with 0.1µF ceramic chip capacitor. Do not connect to
Pin␣ 14.
REFHA (Pin 11): ADC High Reference. Bypass to Pin 10 with
0.1µF ceramic chip capacitor, to Pin 14 with a 4.7µF ceramic
capacitor and to ground with 1µF ceramic capacitor.
REFLA (Pin 14): ADC Low Reference. Bypass to Pin 15 with
0.1µF ceramic chip capacitor, to Pin 11 with a 4.7µF ce-
ramic capacitor and to ground with 1µF ceramic capacitor.
REFHB (Pin 15): ADC High Reference. Bypass to Pin 14
with 0.1µF ceramic chip capacitor. Do not connect to
Pin␣ 11.
MSBINV (Pin 22): MSB Inversion Control. Low inverts
the MSB, 2’s complement output format. High does not
invert the MSB, offset binary output format.
ENC (Pin 23): Encode Input. The input sample starts on the
positive edge.
ENC (Pin 24): Encode Complement Input. Conversion
starts on the negative edge. Bypass to ground with 0.1µF
ceramic for single-ended ENCODE signal.
OE (Pin 25): Output Enable. Low enables outputs. Logic
high makes outputs Hi-Z. OE should not exceed the
votlage on OV
DD
.
CLKOUT (Pin 26): Data Valid Output. Latch data on the
rising edge of CLKOUT.
OGND (Pins 27, 38, 47): Output Driver Ground.
D0-D3 (Pins 28 to 31): Digital Outputs.
OV
DD
(Pins 32, 43): Positive Supply for the Output Driv-
ers. Bypass to ground with 0.1µF ceramic chip capacitor.
D4-D6 (Pins 33 to 35): Digital Outputs.
D7-D10 (Pins 39 to 42): Digital Outputs.
D11-D13 (Pins 44 to 46): Digital Outputs.
OF (Pin 48): Over/Under Flow Output. High when an over
or under flow has occurred.
Supply Current vs Sample Rate
SAMPLE RATE (Msps)
0
280
290
300
80
1748 G32
270
260
20 40 60 100
250
240
230
SUPPLY CURRENT (mA)
T
A
= 25°C
TYPICAL PERFOR A CE CHARACTERISTICS
UW
Offset and Gain Error
vs Temperature
TEMPERATURE (°C)
–50
ERROR (LSB)
6GAIN ERROR
OFFSET ERROR
10
1748 G35
0
–4
–30 –10 30
–6
–8
8
4
2
–2
50 70 90
10
LTC1748
1748fa
TI I G DIAGRA
UWW
1748 TD
t
3
t
7
t
6
t
4
t
5
t
10
t
9
N
t
2
t
0
t
1
t
8
DATA (N – 5)
DB13 TO DB0
ANALOG
INPUT
ENC
DATA
CLKOUT
DATA (N – 4)
DB13 TO DB0 DATA (N – 3)
t
12
t
11
DATA N
DB13 TO DB0, OF AND CLKOUT
OE
DATA
APPLICATIO S I FOR ATIO
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DYNAMIC PERFORMANCE
Signal-to-Noise Plus Distortion Ratio
The signal-to-noise plus distortion ratio [S/(N + D)] is the
ratio between the RMS amplitude of the fundamental input
frequency and the RMS amplitude of all other frequency
components at the ADC output. The output is band limited
to frequencies above DC to below half the sampling
frequency.
Signal-to-Noise Ratio
The signal-to-noise ratio (SNR) is the ratio between the
RMS amplitude of the fundamental input frequency and
the RMS amplitude of all other frequency components
except the first five harmonics and DC.
Total Harmonic Distortion
Total harmonic distortion is the ratio of the RMS sum of all
harmonics of the input signal to the fundamental itself. The
out-of-band harmonics alias into the frequency band
between DC and half the sampling frequency. THD is
expressed as:
THD Log VVV Vn
V
=+++
20 234
1
222 2
...
where V1 is the RMS amplitude of the fundamental fre-
quency and V2 through Vn are the amplitudes of the
second through nth harmonics. The THD calculated in this
data sheet uses all the harmonics up to the fifth.
Intermodulation Distortion
If the ADC input signal consists of more than one spectral
component, the ADC transfer function nonlinearity can
produce intermodulation distortion (IMD) in addition to
THD.
IMD is the change in one sinusoidal input caused by
the presence of another sinusoidal input at a different
frequency.
If two pure sine waves of frequencies fa and fb are applied
to the ADC input, nonlinearities in the ADC transfer func-
tion can create distortion products at the sum and differ-
ence frequencies of mfa ± nfb, where m and n = 0, 1, 2, 3,
etc.
The 3rd order intermodulation products are 2fa + fb,
2fb + fa, 2fa – fb and 2fb – fa. The intermodulation
distortion is defined as the ratio of the RMS value of either
input tone to the RMS value of the largest 3rd order
intermodulation product.
11
LTC1748
1748fa
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Spurious Free Dynamic Range (SFDR)
Spurious free dynamic range is the peak harmonic or
spurious noise that is the largest spectral component
excluding the input signal and DC.
This value is expressed
in decibels relative to the RMS value of a full scale input
signal.
Input Bandwidth
The input bandwidth is that input frequency at which the
amplitude of the reconstructed fundamental is reduced by
3dB for a full scale input signal.
Aperture Delay Time
The time from when a rising ENC equals the ENC voltage
to the instant that the input signal is held by the sample and
hold circuit.
Aperture Delay Jitter
The variation in the aperture delay time from conversion to
conversion. This random variation will result in noise
when sampling an AC input. The signal to noise ratio due
to the jitter alone will be:
SNR
JITTER
= –20log (2π) • F
IN
• T
JITTER
CONVERTER OPERATION
The LTC1748 is a CMOS pipelined multistep converter.
The converter has four pipelined ADC stages; a sampled
analog input will result in a digitized value five cycles later,
see the Timing Diagram section. The analog input is
differential for improved common mode noise immunity
and to maximize the input range. Additionally, the differen-
tial input drive will reduce even order harmonics of the
sample-and-hold circuit. The encode input is also
differential for improved common mode noise immunity.
The LTC1748 has two phases of operation, determined by
the state of the differential ENC/ENC input pins. For brev-
ity, the text will refer to ENC greater than ENC as ENC high
and ENC less than ENC as ENC low.
Each pipelined stage shown in Figure 1 contains an ADC,
a reconstruction DAC and an interstage residue amplifier.
DIFF
REF
AMP
REF
BUF
4.7µF
1µF
0.1µF 0.1µF
1µF
INTERNAL CLOCK SIGNALSREFL REFH
DIFFERENTIAL
INPUT
LOW JITTER
CLOCK
DRIVER
RANGE
SELECT
2.35V
REFERENCE
FIRST PIPELINED
ADC STAGE
(5 BITS)
FOURTH PIPELINED
ADC STAGE
(4 BITS)
SECOND PIPELINED
ADC STAGE
(4 BITS)
ENCREFHAREFLB REFLA REFHB ENC
SHIFT REGISTER
AND CORRECTION
OEMSBINV OGND
OF
OV
DD
0.5V TO
5V
D13
D0
CLKOUT
1748 F01
INPUT
S/H
SENSE
V
CM
A
IN
A
IN+
4.7µF
THIRD PIPELINED
ADC STAGE
(4 BITS)
OUTPUT
DRIVERS
CONTROL LOGIC
AND
CALIBRATION LOGIC
Figure 1. Functional Block Diagram
12
LTC1748
1748fa
In operation, the ADC quantizes the input to the stage and
the quantized value is subtracted from the input by the
DAC to produce a residue. The residue is amplified and
output by the residue amplifier. Successive stages operate
out of phase so that when the odd stages are outputting
their residue, the even stages are acquiring that residue
and visa versa.
When ENC is low, the analog input is sampled differentially
directly onto the input sample-and-hold capacitors, inside
the “Input S/H” shown in the block diagram. At the instant
that ENC transitions from low to high, the sampled input
is held. While ENC is high, the held input voltage is
buffered by the S/H amplifier which drives the first pipelined
ADC stage. The first stage acquires the output of the S/H
during this high phase of ENC. When ENC goes back low,
the first stage produces its residue which is acquired by
the second stage. At the same time, the input S/H goes
back to acquiring the analog input. When ENC goes back
high, the second stage produces its residue which is
acquired by the third stage. An identical process is re-
peated for the third stage, resulting in a third stage residue
that is sent to the fourth stage ADC for final evaluation.
Each ADC stage following the first has additional range to
accommodate flash and amplifier offset errors. Results
from all of the ADC stages are digitally synchronized such
that the results can be properly combined in the correction
logic before being sent to the output buffer.
SAMPLE/HOLD OPERATION AND INPUT DRIVE
Sample/Hold Operation
Figure 2 shows an equivalent circuit for the LTC1748
CMOS differential sample-and-hold. The differential ana-
log inputs are sampled directly onto sampling capacitors
(C
SAMPLE
) through CMOS transmission gates. This direct
capacitor sampling results in lowest possible noise for a
given sampling capacitor size. The capacitors shown
attached to each input (C
PARASITIC
) are the summation of
all other capacitance associated with each input.
During the sample phase when ENC/ENC is low, the
transmission gate connects the analog inputs to the sam-
pling capacitors and they charge to, and track the differen-
tial input voltage. When ENC/ENC transitions from low to
high the sampled input voltage is held on the sampling
capacitors. During the hold phase when ENC/ENC is high
the sampling capacitors are disconnected from the input
and the held voltage is passed to the ADC core for
processing. As ENC/ENC transitions from high to low the
inputs are reconnected to the sampling capacitors to
acquire a new sample. Since the sampling capacitors still
hold the previous sample, a charging glitch proportional to
the change in voltage between samples will be seen at this
time. If the change between the last sample and the new
sample is small the charging glitch seen at the input will be
small. If the input change is large, such as the change seen
with input frequencies near Nyquist, then a larger charging
glitch will be seen.
Common Mode Bias
The ADC sample-and-hold circuit requires differential drive
to achieve specified performance. Each input should swing
±0.8V for the 3.2V range or ±0.5V for the 2V range, around
a common mode voltage of 2.35V. The V
CM
output pin
(Pin␣ 2) may be used to provide the common mode bias level.
V
CM
can be tied directly to the center tap of a transformer
to set the DC input level or as a reference level to an op amp
differential driver circuit. The V
CM
pin must be bypassed to
ground close to the ADC with a 4.7µF or greater capacitor.
APPLICATIO S I FOR ATIO
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C
SAMPLE
4pF
V
DD
LTC1748
A
IN+
1748 F02
C
SAMPLE
4pF
BIAS
V
DD
5V
A
IN
ENC
ENC
2V
6k
2V
6k
C
PARASITIC
4pF
C
PARASITIC
4pF
Figure 2. Equivalent Input Circuit
13
LTC1748
1748fa
Input Drive Impedance
As with all high performance, high speed ADCs the dy-
namic performance of the LTC1748 can be influenced by
the input drive circuitry, particularly the second and third
harmonics. Source impedance and input reactance can
influence SFDR. At the falling edge of encode the sample-
and-hold circuit will connect the 4pF sampling capacitor to
the input pin and start the sampling period. The sampling
period ends when encode rises, holding the sampled input
on the sampling capacitor. Ideally the input circuitry
should be fast enough to fully charge the sampling capaci-
tor during the sampling period 1/(2F
ENCODE
); however,
this is not always possible and the incomplete settling may
degrade the SFDR. The sampling glitch has been designed
to be as linear as possible to minimize the effects of
incomplete settling.
For the best performance, it is recomended to have a
source impedence of 100 or less for each input. The S/H
circuit is optimized for a 50 source impedance. If the
source impedance is less than 50, a series resistor
should be added to increase this impedance to 50. The
source impedence should be matched for the differential
inputs. Poor matching will result in higher even order
harmonics, especially the second.
Input Drive Circuits
Figure 3 shows the LTC1748 being driven by an RF
transformer with a center tapped secondary. The second-
ary center tap is DC biased with VCM, setting the ADC input
signal at its optimum DC level. Figure 3 shows a 1:1 turns
ratio transformer. Other turns ratios can be used if the
source impedence seen by the ADC does not exceed
100 for each ADC input. A disadvantage of using a
transformer is the loss of low frequency response. Most
small RF transformers have poor performance at frequen-
cies below 1MHz.
Figure 4 demonstrates the use of operational amplifiers to
convert a single ended input signal into a differential input
signal. The advantage of this method is that it provides low
frequency input response; however, the limited gain band-
width of most op amps will limit the SFDR at high input
frequencies.
The 25 resistors and 12pF capacitors on the analog
inputs serve two purposes: isolating the drive circuitry
from the sample-and-hold charging glitches and limiting
the wideband noise at the converter input. For input
frequencies higher than 100MHz, the capacitors may need
to be decreased to prevent excessive signal loss.
Reference Operation
Figure 5 shows the LTC1748 reference circuitry consisting
of a 2.35V bandgap reference, a difference amplifier and
switching and control circuit. The internal voltage refer-
ence can be configured for two pin selectable input ranges
of 2V(±1V differential) or 3.2V(±1.6V differential). Tying
the SENSE pin to ground selects the 2V range; tying the
SENSE pin to V
DD
selects the 3.2V range.
The 2.35V bandgap reference serves two functions: its
output provides a DC bias point for setting the common
APPLICATIO S I FOR ATIO
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1:1 25
0.1µF
ANALOG
INPUT
V
CM
A
IN+
A
IN
10010012pF
12pF
12pF
1748 F03
4.7µF
25
25
25LTC1748
25
5V
SINGLE-ENDED
INPUT
2.35V ±1/2
RANGE
V
CM
A
IN+
A
IN
12pF
12pF
12pF
1748 F04
4.7µF
25
100
500500
25
25
LTC1748
+
1/2 LT1810
+
1/2 LT1810
Figure 4. Differential Drive with Op Amps
Figure 3. Single-Ended to Differential Conversion
Using a Transformer
14
LTC1748
1748fa
mode voltage of any external input circuitry; additionally,
the reference is used with a difference amplifier to gener-
ate the differential reference levels needed by the internal
ADC circuitry.
An external bypass capacitor is required for the 2.35V
reference output, V
CM
. This provides a high frequency low
impedance path to ground for internal and external cir-
cuitry. This is also the compensation capacitor for the
reference. It will not be stable without this capacitor.
The difference amplifier generates the high and low refer-
ence for the ADC. High speed switching circuits are
connected to these outputs and they must be externally
bypassed. Each output has two pins: REFHA and REFHB
for the high reference and REFLA and REFLB for the low
reference. The doubled output pins are needed to reduce
package inductance. Bypass capacitors must be con-
nected as shown in Figure 5.
Other voltage ranges in between the pin selectable ranges
can be programmed with two external resistors as shown
in Figure 6a. An external reference can be used by applying
its output directly or through a resistor divider to SENSE.
It is not recommended to drive the SENSE pin with a logic
device since the logic threshold is close to ground and
V
DD
. The SENSE pin should be tied high or low as close to
the converter as possible. If the SENSE pin is driven
externally, it should be bypassed to ground as close to the
device as possible with a 1µF ceramic capacitor.
Input Range
The input range can be set based on the application. For
oversampled signal processing in which the input fre-
quency is low (<10MHz), the largest input range will
provide the best signal-to-noise performance while main-
taining excellent SFDR. For high input frequencies
(>40MHz), the 2V range will have the best SFDR perfor-
mance for the 2nd and 3rd harmonics, but the SNR will
degrade by 3.5dB. See the Typical Performance Charac-
teristics section.
Driving the Encode Inputs
The noise performance of the LTC1748 can depend on the
encode signal quality as much as on the analog input. The
ENC/ENC inputs are intended to be driven differentially,
primarily for noise immunity from common mode noise
sources. Each input is biased through a 6k resistor to a 2V
bias. The bias resistors set the DC operating point for
transformer coupled drive circuits and can set the logic
threshold for single-ended drive circuits.
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VCM
REFHA
REFLB
SENSE
TIE TO VDD FOR 3.2V RANGE;
TIE TO GND FOR 2V RANGE;
RANGE = 2 • VSENSE FOR
1V < VSENSE < 1.6V
2.35V
REFLA
REFHB
4.7µF
4.7µF
INTERNAL ADC
HIGH REFERENCE
BUFFER
0.1µF
1748 F05
LTC1748
4
DIFF AMP
1µF
1µF0.1µF
INTERNAL ADC
LOW REFERENCE
2.35V BANDGAP
REFERENCE
1.6V 1V
RANGE
DETECT
AND
CONTROL
Figure 5. Equivalent Reference Circuit
VCM
SENSE
2.35V
1.1V
4.7µF
12.5k
1µF
11k
1748 F06a
LTC1748
V
CM
SENSE
2.35V
5V 1.25V64
1, 2
4.7µF
1µF0.1µF
1748 F06b
LTC1748
LT1790-1.25
Figure 6a. 2.2V Range ADC
Figure 6b. 2.5V Range ADC with External Reference
15
LTC1748
1748fa
Any noise present on the encode signal will result in
additional aperture jitter that will be RMS summed with the
inherent ADC aperture jitter.
In applications where jitter is critical (high input frequen-
cies) take the following into consideration:
1. Differential drive should be used.
2. Use as large an amplitude as possible; if transformer
coupled use a higher turns ratio to increase the
amplitude.
3. If the ADC is clocked with a sinusoidal signal, filter the
encode signal to reduce wideband noise.
4. Balance the capacitance and series resistance at both
encode inputs so that any coupled noise will appear at
both inputs as common mode noise.
APPLICATIO S I FOR ATIO
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V
DD
LTC1748
1748 F07
BIAS
V
DD
5V
ENC
ENC
ANALOG INPUT
2V BIAS
2V BIAS
1:4
0.1µF
CLOCK
INPUT 50
6k
6k
TO INTERNAL
ADC CIRCUITS
Figure 7. Transformer Driven ENC/ENC
1748 F08a
ENC2V
V
THRESHOLD
= 2V ENC
0.1µF
LTC1748
1748 F08b
ENC
ENC
130
3.3V
3.3V 130
D0
Q0
Q0
MC100LVELT22
LTC1748
8383
Figure 8a. Single-Ended ENC Drive,
Not Recommended for Low Jitter Figure 8b. ENC Drive Using a CMOS-to-PECL Translator
The encode inputs have a common mode range of 1.8V to
V
DD
. Each input may be driven from ground to V
DD
for
single-ended drive.
Maximum and Minimum Encode Rates
The maximum encode rate for the LTC1748 is 80Msps. For
the ADC to operate properly the encode signal should have
a 50% (±4%) duty cycle. Each half cycle must have at least
6ns for the ADC internal circuitry to have enough settling
time for proper operation. Achieving a precise 50% duty
cycle is easy with differential sinusoidal drive using a
transformer or using symmetric differential logic such as
PECL or LVDS. When using a single-ended encode signal
asymmetric rise and fall times can result in duty cycles that
are far from 50%.
16
LTC1748
1748fa
At sample rates slower than 80Msps the duty cycle can
vary from 50% as long as each half cycle is at least 6ns.
The lower limit of the LTC1748 sample rate is determined
by droop of the sample-and-hold circuits. The pipelined
architecture of this ADC relies on storing analog signals on
small valued capacitors. Junction leakage will discharge
the capacitors. The specified minimum operating fre-
quency for the LTC1748 is 1Msps.
DIGITAL OUTPUTS
Digital Output Buffers
Figure 9 shows an equivalent circuit for a single output
buffer. Each buffer is powered by OV
DD
and OGND, iso-
lated from the ADC power and ground. The additional
N-channel transistor in the output driver allows operation
down to low voltages. The internal resistor in series with
the output makes the output appear as 50 to external
circuitry and may eliminate the need for external damping
resistors.
Output Loading
As with all high speed/high resolution converters the
digital output loading can affect the performance. The
digital outputs of the LTC1748 should drive a minimal
capacitive load to avoid possible interaction between the
digital outputs and sensitive input circuitry. The output
should be buffered with a device such as an ALVCH16373
CMOS latch. For full speed operation the capacitive load
should be kept under 10pF. A resistor in series with the
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output may be used but is not required since the ADC has
a series resistor of 43 on chip.
Lower OV
DD
voltages will also help reduce interference
from the digital outputs.
Format
The LTC1748 parallel digital output can be selected for
offset binary or 2’s complement format. The format is
selected with the MSBINV pin; high selects offset binary.
Overflow Bit
An overflow output bit indicates when the converter is
overranged or underranged. When OF outputs a logic high
the converter is either overranged or underranged.
Output Clock
The ADC has a delayed version of the ENC input available
as a digital output, CLKOUT. The CLKOUT pin can be used
to synchronize the converter data to the digital system.
This is necessary when using a sinusoidal encode. Data
will be updated just after CLKOUT falls and can be latched
on the rising edge of CLKOUT.
Output Driver Power
Separate output power and ground pins allow the output
drivers to be isolated from the analog circuitry. The power
supply for the digital output buffers, OV
DD
, should be tied
to the same power supply as for the logic being driven. For
example if the converter is driving a DSP powered by a 3V
supply then OV
DD
should be tied to that same 3V supply.
LTC1748
1748 F09
OV
DD
V
DD
V
DD
0.1µF
43TYPICAL
DATA
OUTPUT
OGND
OV
DD
0.5V TO
V
DD
PREDRIVER
LOGIC
DATA
FROM
LATCH
OE
Figure 9. Equivalent Circuit for a Digital Output Buffer
17
LTC1748
1748fa
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OV
DD
can be powered with any voltage up to 5V. The logic
outputs will swing between OGND and OV
DD
.
Output Enable
The outputs may be disabled with the output enable pin,
OE. OE low disables all data outputs including OF and
CLKOUT. The data access and bus relinquish times are too
slow to allow the outputs to be enabled and disabled
during full speed operation. The output Hi-Z state is
intended for use during long periods of inactivity. The
voltage on OE can swing between GND and OV
DD
. OE
should not be driven above OV
DD
.
GROUNDING AND BYPASSING
The LTC1748 requires a printed circuit board with a clean
unbroken ground plane. A multilayer board with an inter-
nal ground plane is recommended. The pinout of the
LTC1748 has been optimized for a flowthrough layout so
that the interaction between inputs and digital outputs is
minimized. Layout for the printed circuit board should
ensure that digital and analog signal lines are separated as
much as possible. In particular, care should be taken not
to run any digital track alongside an analog signal track or
underneath the ADC.
High quality ceramic bypass capacitors should be used at
the V
DD,
V
CM
, REFHA, REFHB, REFLA and REFLB pins as
shown in the block diagram on the front page of this data
sheet. Bypass capacitors must be located as close to the
pins as possible. Of particular importance are the capaci-
tors between REFHA and REFLB and between REFHB and
REFLA. These capacitors should be as close to the device
as possible (1.5mm or less). Size 0402 ceramic capacitors
are recomended. The large 4.7µF capacitor between REFHA
and REFLA can be somewhat further away. The traces
connecting the pins and bypass capacitors must be kept
short and should be made as wide as possible.
The LTC1748 differential inputs should run parallel and
close to each other. The input traces should be as short as
possible to minimize capacitance and to minimize noise
pickup.
An analog ground plane separate from the digital process-
ing system ground should be used. All ADC ground pins
labeled GND should connect to this plane. All ADC V
DD
bypass capacitors, reference bypass capacitors and input
filter capacitors should connect to this analog plane. The
LTC1748 has three output driver ground pins, labeled
OGND (Pins 27, 38 and 47). These grounds should con-
nect to the digital processing system ground. The output
driver supply, OV
DD
should be connected to the digital
processing system supply. OV
DD
bypass capacitors should
bypass to the digital system ground. The digital process-
ing system ground should be connected to the analog
plane at ADC OGND (Pin 38).
HEAT TRANSFER
Most of the heat generated by the LTC1748 is transferred
from the die through the package leads onto the printed
circuit board. In particular, ground pins 12, 13, 36 and 37
are fused to the die attach pad. These pins have the lowest
thermal resistance between the die and the outside envi-
ronment. It is critical that all ground pins are connected to
a ground plane of sufficient area. The layout of the evalu-
ation circuit shown on the following pages has a low ther-
mal resistance path to the internal ground plane by using
multiple vias near the ground pins. A ground plane of this
size results in a thermal resistance from the die to ambient
of 35°C/W. Smaller area ground planes or poorly connected
ground pins will result in higher thermal resistance.
18
LTC1748
1748fa
APPLICATIO S I FOR ATIO
WUUU
C4
4.7µF
C3
10µF
R5
13
4
1
2
5V
U3
LT1521-3
RN5A 33
R9
33
RN5B 33
RN5C 33
RN5D 33
RN6A 33
RN6B 33
RN6C 33
RN6D 33
RN7A 33
RN7B 33
RN7C 33
RN7D 33
RN8A 33
RN8B 33
RN8C 33
C12 0.1µF
C10 0.1µF
OF
OGND
D13
D12
D11
OVDD
D10
D9
D8
D7
OGND
GND
GND
D6
D5
D4
OVDD
D3
D2
D1
D0
OGND
CLKOUT
OE
SENSE
VCM
GND
AIN+
AIN
GND
VDD
VDD
GND
REFLB
REFHA
GND
GND
REFLA
REFHB
GND
VDD
VDD
GND
VDD
GND
MSBINV
ENC
ENC
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
2OE
2Q8
2Q7
GND
2Q6
2Q5
VCC
2Q4
2Q3
GND
2Q2
2Q1
1Q8
1Q7
GND
1Q6
1Q5
VCC
1Q4
1Q3
GND
1Q2
1Q1
1OE
2LE
2D8
2D7
GND
2D6
2D5
VCC
2D4
2D3
GND
2D2
2D1
1D8
1D7
GND
1D6
1D5
VCC
1D4
1D3
GND
1D2
1D1
1LE
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
U4
P174VCX16373V
U5
LTC1748
C19
0.1µFC20
0.1µFC21
0.1µFC22
0.1µF
1748 TA01
C28
0.1µF
J2
3201S-40G1
3V
3V
CLKOUT
CLKOUT
U2
10T74ALVC1G86
JP2
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
IN
TAB
OUT
GND
C1
2µF
C23
0.1µF
C16
10µF
E1
5V
E4
PGND
JP4JP3
5V
INPUT
RANGE
SELECT
TWOS
COMPLEMENT
SELECT
RY*
C24
12pF
C25
12pF
*RX, RY = OPTIONAL INPUT RANGE SET
**DO NOT INSTALL R1 AND R10
J1
OPTIONAL
+INPUT
J4
OPTIONAL
INPUT
ENCODE
INPUT
J3
ANALOG
INPUT
C5
12pF
C29
1µF
R1**
0
R10**
0
R2
24.9
T1
MINICIRCUITS T1-1T
R4
100
R3
100
R8
0
R22
100
T2
MINICIRCUITS T1-1T
R21
100JP5
OPTIONAL
XTAL CLK
R7
24.9
J5
C8
4.7µF
C13
0.1µF
C18
4.7µFRB
24.9
RA
24.9
C26
0.1µF
C7
0.1µF
C8
4.7µF
C9
0.1µF
C27
0.1µF
C15
0.1µF
RX*
C14
4.7µF
C32
30pF
C11
1µF
C2
0.1µF
R6
200
JP1
C31
0.1µF
C17
0.1µF
C30
0.1µF
5V
14
11
87
4
1
E3
GND E4
GND E5
GND
Y1
Evaluation Circuit Schematic of the LTC1748
19
LTC1748
1748fa
APPLICATIO S I FOR ATIO
WUUU
Silkscreen Top Layer 1 Component Side
Layer 2 GND Plane Layer 3 Power Plane
Layer 4 Solder Side
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
20
LTC1748
1748fa
LINEAR TECHNOLO GY CORPORATION 2003
LT/TP 1103 1K REV A • PRINTED IN THE USA
PART NUMBER DESCRIPTION COMMENTS
LTC1405 12-Bit, 5Msps Sampling ADC with Parallel Output Pin Compatible with the LTC1420
LTC1406 8-Bit, 20Msps ADC Undersampling Capability up to 70MHz
LTC1411 14-Bit, 2.5Msps ADC 5V, No Pipeline Delay, 80dB SINAD
LTC1412 12-Bit, 3Msps, Sampling ADC ±5V, No Pipeline Delay, 72dB SINAD
LTC1414 14-Bit, 2.2Msps ADC ±5V, 81dB SINAD and 95dB SFDR
LTC1420 12-Bit, 10Msps ADC 71dB SINAD and 83dB SFDR at Nyquist
LTC1461 Micropower Precision Series Reference 0.04% Max Initial Accuracy, 3ppm/°C Drift
LTC1666 12-Bit, 50Msps DAC Pin Compatible with the LTC1668, LTC1667
LTC1667 14-Bit, 50Msps DAC Pin Compatible with the LTC1668, LTC1666
LTC1668 16-Bit, 50Msps DAC 16-Bit, No Missing Codes, 90dB SINAD, –100dB THD
LTC1741 12-Bit, 65Msps ADC Pin Compatible with the LTC1748
LTC1742 14-Bit, 65Msps ADC Pin Compatible with the LTC1748
LTC1743 12-Bit, 50Msps ADC Pin Compatible with the LTC1748
LTC1744 14-Bit, 50Msps ADC Pin Compatible with the LTC1748
LTC1745 12-Bit, 25Msps ADC Pin Compatible with the LTC1748
LTC1746 14-Bit, 25Msps ADC Pin Compatible with the LTC1748
LTC1747 12-Bit, 80Msps ADC Pin Compatible with the LTC1748
LT®1807 325MHz, Low Distortion Dual Op Amp Rail-to-Rail Input and Output
RELATED PARTS
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
FAX: (408) 434-0507
www.linear.com
PACKAGE DESCRIPTIO
U
FW Package
48-Lead Plastic TSSOP (6.1mm)
(Reference LTC DWG # 05-08-1651)
FW48 TSSOP 0502
0.09 – 0.20
(.0035 – .008)
0° – 8°
0.45 – 0.75
(.018 – .029) 0.17 – 0.27
(.0067 – .0106)
0.50
(.0197)
BSC
6.0 – 6.2**
(.236 – .244)
7.9 – 8.3
(.311 – .327)
134
5678 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
12.4 – 12.6*
(.488 – .496)
1.20
(.0473)
MAX
0.05 – 0.15
(.002 – .006)
2
48 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 2547
C.10
-T-
-C-
MILLIMETERS
(INCHES)
DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED .152mm (.006") PER SIDE
DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
*
**
0.32 ±0.05 0.50 TYP
6.2 ±0.10
8.1 ±0.10
RECOMMENDED SOLDER PAD LAYOUT
0.95 ±0.10