1
2017.1③
microSD™ Card Connectors
DM3 Series
■Features
◆Common to the entire Series
1. Extremely small in size
Small external dimensions and the above-the-board height
make the connectors the smallest on the market.
2. Reverse card insertion protection
Unique card slot design (patented) protects the connector
from damage when the card is attempted to be inserted in
reverse, allowing it to re-inserted correctly.
3. Effective ground and shield configuration
4-connection points of the metal cover to the printed circuit
board assures secure connection of the ground circuit and
provides EMI protection.
4. Rigid and strong construction
Despite its small size, high-strengths materials used in the
connectors produced a strong and rigid structure.
5. Card detection switch
The card detection switch is Normally Open
◆DM3AT and DM3BT (Push - Push, with
ejection mechanism)
·
Card fall-out prevention
Built-in card tray and the unique push insertion-push ejection
mechanism (patented) prevent accidental card ejection or fall-
out.
Despite its small size the connectors will eject the card to a
distance of 4.0mm, allowing easy hold and removal of the card.
·Exposed termination leads
Easy inspection and rework of the solder termination joints.
◆DM3CS (Hinge, Push-Pull, manual, without
ejection mechanism)
·Simple and reliable card insertion
Hinged metal cover provides location and guides the card
during the insertion / removal. Closing of the cover confirms
the electrical and mechanical connection with a tactile click
sensation.
·Reliable contact with the card contact pads
Unique contact design and card slide action will clean the
contact areas of the card.
·
Accessible termination areas
Contact solder terminations may be inspected and reworked.
◆DM3D (Push -Pull, manual, without
ejection mechanism)
·Partial card insertion hold
Card will not fall-out even when it is not fully inserted. Full
insertion and electrical / mechanical connection is confirmed
with a distinct tactile feel.
·
Accessible termination areas
An inner lead system that can be reworked is used in this design.
Contact solder terminations may be inspected and reworked.
Card insertion-ejection
Push-Push
Hinge-manual
insertion/
ejection
Push-Pull
manual insertion/
ejection
DM3AT
DM3BT
DM3CS
DM3D
2~4
5~6
7~8
9~10
Series Image Page
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DM3 Series●microSD™ Card Connectors
2
DM3 AT – SF – PEJM5
■Product Specifications (DM3 Series)
Ratings
Current rating : 0.5A
Voltage rating : 125V AC
Operating temperature range : -25ç to +85ç (Note 1)
Storage temperature range : -40ç to +85ç (Note 2)
1 42 3
Operating humidity range : RH 95% max.
(No condensation)
Measure at 500V DC
500 V AC / 1 minute
1mA
Frequency : 10 to 55Hz, single amplitude of 0.75mm,
3 directions for 2 hours
96 hours at of 40 ± 2ç, and humidity of 90 to 95%
-55ç ➝5 to 35ç ➝85ç ➝5 to 35ç
Times : 30 min. ➝5 min. ➝30 min. ➝5 min.
5 cycles
10,000 cycles, 400 to 600 cycles per hour (DM3AT, DM3B)
5,000 cycles, 400 to 600 cycles per hour (DM3C, DM3D)
Reflow : At the recommended temperature profile
Manual soldering : 350ç for 3 seconds
1000Mø min. (Initial value)
No flashover or insulation breakdown
100mø max. (Initial value)
No electrical discontinuity of 100 ns or longer
No damage, cracks or parts dislocation.
Contact resistance : 40mø max. (change from initial value)
Insulation resistance : 100Mø min.
No damage, cracks or parts dislocation.
Contact resistance : 40mø max. (change from initial value)
Insulation resistance : 100Mø min.
No damage, cracks or parts dislocation.
Contact resistance : 40mø max. (change from initial value)
No deformation of components affecting performance.
1. Insulation resistance
2. Withstanding voltage
3. Contact resistance
4. Vibration
5. Humidity
6. Temperature cycle
7. Durability
8. Resistance to
soldering heat
Item Specification Conditions
Note 1 : Includes temperature rise caused by current flow.
Note 2 : The term "storage" refers to products stored for long period prior to mounting and use.
Series name : DM3
Connector type :
AT Push-Push (ejection mechanism), Top board mounting (Standard)
BT Push-Push (ejection mechanism), Bottom board mounting (Reverse)
CS Hinge, Push-Pull (no ejection mechanism), Top board mounting (Standard)
D Push-Pull (no ejection mechanism), Top board mounting (Standard)
Number of contacts : 8
Termination type :
SF Right-angle SMT(Standard)
DSF Right-angle SMT(Reverse)
Card ejection code : PEJM5, PEJS
(Push insert/push eject)
None : Manual card
insertion/ejection
1
4
2
3
■Materials / Finish
Remarks
UL94V-0
-------------------
-------------------
-------------------
Part Material Finish
Insulator
Contacts
Guide cover
Other components
LCP
Copper alloy
Stainless steel
Copper alloy
Stainless steel
Piano wire
(DM3AT)
(DM3BT)
(DM3AT, DM3BT)
(DM3BT)
Color : Black
Contact area : Gold plated
Lead area : Gold plated
Lead area : Gold plated
-------------------
Nickel plated
DM3AT, DM3BT
Remarks
UL94V-0
-------------------
-------------------
Part Material Finish
Insulator
Contacts
Guide cover
LCP
Copper alloy
Stainless steel
Color : Black
Contact area : Gold plated
Lead area : Gold plated
------------------- (DM3CS)
Tin plated (DM3D)
DM3CS, DM3D
■Product Number Structure
Refer to the chart below when determining the product specifications from the product number.
Please select from the product numbers listed in this catalog when placing orders.
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3
DM3 Series●microSD™ Card Connectors
■Recommended PCB mounting pattern
8.65
1.3
15.1
C0.15
14.1MAX
2.7
0.8
2.8
1
1.9
(3.2)
3.259.1
9.25MAX
10MIN
7.7
1.55
P=1.1
0.7
1
1.2
14.5
0.15MIN
1.2
3.7
9.9
14.05
7.9MIN
0.7
13.3MIN
0.58.2MIN
4.4MAX
6MIN
0.15
5.7MAX
8.9MIN
Ｌ
Ｃ
Ｌ
Ｃ
1
3
3
3
C
L
indicates the center line of the
microSD card slot.
No conductive traces.
Card inserted
Card detection switch
Without the card
Open Closed
(A) (B) (A) (B)
1
3
2
Note
All dimensions : mm
■DM3AT Push-Push (ejection mechanism), Top board mounting (Standard)
Part No. HRS No.
DM3AT-SF-PEJM5 609-0031-0
CARD DETECTION
SWITCH(B)
#5(CLK) #4(VDD)
#3(CMD)
#2(CD/DAT3)
#1(DAT2)
CARD DETECTION
SWITCH(A)
microSD CARD
2.9±0.15
(3.2)
(7.35)
(15)
(0.8)
(16.75):CARD OVER STROKE POSITION
(17.55):CARD LOCK POSITION
(21.55):CARD EJECT POSITION
15.95
13.85
(11)
(5.5)
15.95
L
C
1.68
#8(DAT1)
#7(DAT0)
#6(VSS)
2
2
1
All dimensions : mm
Mar.1.2021Copyright2021HIROSEELECTRICCO.,LTD.AllRightsReserved.
DM3 Series●microSD™ Card Connectors
4
BPackaging Specifications
(16.35)
14.2
20
Ø1.5
1.75
2
P=4 UNREELING DIRECTION
28.4
32
(3.2)
●Embossed carrier tape dimensions (1,500 pcs/reel)
●Reel Dimensions
32.4
Ø380
Ø80
START
PORTION EQUIPPED
WITH COMPONENTS
EMBOSSED CARRIER TAPE
OVAL
CIRCLE
TOP COVER TAPE
EMPTY(160mm MIN)
EMPTY(100mm MIN)
END
LEADER(400mm MIN)TRAILER
All dimensions : mm
Mar.1.2021Copyright2021HIROSEELECTRICCO.,LTD.AllRightsReserved.
5
DM3 Series●microSD™ Card Connectors
■DM3BT, Push-Push (ejection mec hanism), Bottom board mounting (Re verse)
Part No. HRS No.
DM3BT-DSF-PEJS 609-0029-9
C
L(5.5)
(11)
microSD CARD
#8(DAT1)
#7(DAT0)
#6(VSS)
#5(CLK)
#4(VDD)
#3(CMD)
#2(CD/DAT3)
#1(DAT2)
15.95
(21.55):CARD EJECT POSITION
(17.55):CARD LOCK POSITION
(16.75):CARD OVER STROKE POSITION
(15)
(0.55)
16.05
CARD DETECTION
SWITCH(A)
CARD DETECTION
SWITCH(B)
13.85
15.45
2.9±0.15
2.7MAX
6.7MAX
2.38MAX
(3.2)
1.83
15.1
(6.5)
1
3
3
3
2
2
■Recommended PCB mounting pattern
13.3
9.7
0.7
1.2
0.7
P=1.1
7.7
10MIN
9.25MAX
8.93.05
1.9
1.2
3.2
0.8
14.75
0.2
1.4
14.3
3.5
7.7MIN
0.35MIN
1±0.05
1.9
1.5
8.65
0.5
Ｃ0.15
(3.2)
Ｌ
Ｃ1
4
C
L
indicates the center line of the
microSD card slot.
Oblique-hatched area is projection
of contact.
Card inserted
Card detection switch
Without the card
Open Closed
(A) (B) (A) (B)
1
3
2
No conductive traces.
4
Note
All dimensions : mm
All dimensions : mm
Mar.1.2021Copyright2021HIROSEELECTRICCO.,LTD.AllRightsReserved.
DM3 Series●microSD™ Card Connectors
6
32.4
CIRCLE TRAILER
OVAL
START
Ø80
Ø380
EMPTY(160mm MIN)
EMBOSSED CARRIER TAPE
PORTION EQUIPPED
WITH COMPONENTS
LEADER(400mm MIN)
END
EMPTY(100mm MIN)
TOP COVER TAPE
BPackaging Specifications
(3.75)
UNREELING DIRECTION
32
28.4
P＝4
2
1.75
Ø1.5
20
14.2
(16.35)
●Embossed carrier tape dimensions (1,200 pcs/reel)
●Reel Dimensions
All dimensions : mm
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7
DM3 Series●microSD™ Card Connectors
■Recommended PCB mounting pattern
5.4MIN
7.8MAX
7.8MAX
0.55MIN8.25MIN
2.9MAX
(13.8)
(14.1)
12.4
4.1MIN
3.5MAX
10.1MIN
9.5MAX
7.7
P＝1.1 0.7
1.4
1.2
1.5
１9.3 2.8
2.6
12.9
2.6
12.9
14.4
1.2
2.7
2.7
1.65
6.3
1.4
(3.2)
Ｃ
Ｌ
1
333
GND(1)
GND(2)
GND(3)
GND(4)
GND(1)
GND(2)
GND(3)
GND(4)
ClosedOpen
C
L
indicates the center line of the
microSD card slot.
No conductive traces.
Card inserted
Card detection switch
Without the card
1
3
2
Note
■
DM3CS, Hinge, Push -Pull (no ejection mechanism), Top board mounting (Standard)
Part No. HRS No.
DM3CS-SF 609-0032-3
12
0.1
13.9
(15.45):LOCK POSITION
14.1
13.8
(6.9)
(11) (0.93)
(1.78)
(5.5)
(0.2) 1.83
Ｃ
Ｌ
CARD DETECTION SWITCH
microSD CARD
＃8(DAT1)
＃7(DAT0)
＃6(VSS)
＃5(CLK) ＃4(VDD)
＃3(CMD)
＃2(CD/DAT3)
＃1(DAT2)
1
2
All dimensions : mm
All dimensions : mm
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8
DM3 Series●microSD™ Card Connectors
Ø80
Ø380
32.4
START
CIRCLE
OVAL
EMPTY(160mm MIN)
EMPTY(100mm MIN)
TOP COVER TAPE
END
EMBOSSED CARRIER TAPE
PORTION EQUIPPED
WITH COMPONENTS
LEADER(400mm MIN)TRAILER
BPackaging Specifications
(3.4)
14.2
20
Ø1.5
1.75
2
P＝4
28.4
32
UNREELING DIRECTION
●Embossed carrier tape dimensions (1,300 pcs/reel)
●Reel Dimensions
All dimensions : mm
Mar.1.2021Copyright2021HIROSEELECTRICCO.,LTD.AllRightsReserved.
9
DM3 Series●microSD™ Card Connectors
■Recommended PCB mounting pattern
1.5
1.75
1.5
1.1
7.7
7.5
9.15
10.7
6.85
1.5
8.35
1
0.55
9.4
10.9
0.8
0.8
8.1MIN
1
1.85
0.4MIN 2.55MAX
( 4.5 )
5.05MIN
4MAX
6MIN
8.2MAX
10.2MIN
1.4
3
C
L1
C
L
indicates the center line of the
microSD card slot.
No conductive traces.
Card inserted
Card detection switch
Without the card
Open Closed
(A) (B) (A) (B)
1
3
2
Note
■DM3D, Push-Pull (no ejection mechanism), Top board mounting (Standard)
Part No. HRS No.
DM3D-SF 609-0025-8
microSD Card
Card
Center
＃1(DAT2)
＃2(CD/DAT3)
＃3(CMD)
＃4(VDD)
＃5(CLK)
＃6(VSS)
＃7(DAT0)
＃8(DAT1)
Card Detection
Switch (B)
Card Detection
Switch (A)
(15.8):CARD FULLY INSERTED
1
0.9
(4.5)
(6)
(11)
2.7
1.55
11.45
11.45
11.95
3.35
(5.5)
(15)
(0.7)
9.65
2
2
All dimensions : mm
All dimensions : mm
Mar.1.2021Copyright2021HIROSEELECTRICCO.,LTD.AllRightsReserved.
DM3 Series●microSD™ Card Connectors
10
Lead section (400mm min.)
Mounting section
End section
Top cover tape
Blank section
(100mm min.)
Embossed carrier tape
Blank section
(160mm min.)
24.4
Ø380
Ø80
Unreeling direction
BPackaging Specifications
Unreeling direction
2
24
22.25
11.5 1.75
Ø1.5
16
( 11.85 )
P=4
●Embossed carrier tape dimensions (2,000 pcs/reel)
●Reel Dimensions
All dimensions : mm
Mar.1.2021Copyright2021HIROSEELECTRICCO.,LTD.AllRightsReserved.
11
DM3 Series●microSD™ Card Connectors
●Refer to applicable Operation Manual listed below for additional precautions.
Series
DM3AT Series
DM3BT Series
DM3CS Series
DM3D Series
ETAD-F0345
ETAD-F0324
ETAD-F0335
ETAD-F0353
Operation Manual Number
BRecommended temperature profile
BPrecautions
1. Do not immerse or clean the entire connector with cleaning solutions as this may affect proper operation of the
ejection mechanism and electrical performance of the connector
2. Do not apply excessive force to the connector when handling or after installation on the PC board.
3. The connectors will reliably connect and operate with the correctly inserted microSDTM cards.
Follow the correct insertion / ejection procedure for the specific connector in use.
Attempts of incorrect insertion of the card may cause damage to the connector or the card.
4. The connector must be correctly mounted on the PC board before the card can be inserted. Do not insert the card in
the un-mounted connector.
5. Mounting on the Flexible Printed Circuit (FPC)
To assure correct performance it is recommended that a flat reinforcement plate 0.3 mm min. thick be used under
the FPC.
6.
Small visible residual manufacturing fluids or tooling marks do not affect connector's performance.
7. Repeated insertions and removal of the cards may leave some marks on the card itself. This will have no affect on
the connector performance.
HRS test condition
Solder method : Reflow, IR/hot air
Environment : Room air
Solder composition : Paste, 96.5%Sn/3.0%Ag/0.5%Cu
(Senju Metal Industry, Co., Ltd.'s
Part Number:M705-GRN360-K2-V)
Test board : Glass epoxy 60mm∞100mm∞1.0mm thick
Metal mask : 0.12mm thick
Number of reflow cycles
: 2cycles max.
The temperature profiles shown are based on the above
conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume / thickness and board
size / thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
Temperature
50
90 to 120 seconds
Preheating
50
seconds
Soldering
Time (Seconds)
(ç)
100
150
200
250
150ç
200ç
230ç min.
Peak:250ç MAX
Mar.1.2021Copyright2021HIROSEELECTRICCO.,LTD.AllRightsReserved.
DM3 Series●microSD™ Card Connectors
12 The characteristics and the specifications contained herein are for reference purpose. Please refer to the latest customer drawings prior to use.
The contents of this catalog are current as of date of 01/2017. Contents are subject to change without notice for the purpose of improvements.
Mar.1.2021Copyright2021HIROSEELECTRICCO.,LTD.AllRightsReserved.