SPEC NO: DSAD0155 REV NO: V.1 DATE: DEC/28/2002 PAGE: 1 OF 4
APPROVED : J. Lu CHECKED :Joe Lee DRAWN: F.Y.YUAN
SURFACE MOUNT DISPLAY
Notes:
1. All dimensions are in millimeters (inches),Tolerance is ±0.25(0.01") unless otherwise noted.
2. Specifications are subject to change without notice.
Features
!0.3 INCH DIGIT HEIGHT.
!LOW CURRENT OPERATION.
!EXCELLENT CHARACTER APPEARANCE.
!I.C. COMPATIBLE.
!MECHANICALLY RUGGED.
!GRAY FACE,WHITE SEGMENT.
!PACKAGE : 1100PCS / REEL.
Package Dimensions& Internal Circuit Diagram
KPSC03-113 WHITE
Description
The source color devices are made with InGaN on SiC
Light Emitting Diode.
Digitally signed by Nenuphar
cn=Nenuphar, ou=d3e, o=display, c=CN
Date: 2002.12.29 08:38:15 +08'00'
Reason: Document is certified
SPEC NO: DSAD0155 REV NO: V.1 DATE: DEC/28/2002 PAGE: 2 OF 4
APPROVED : J. Lu CHECKED :Joe Lee DRAWN: F.Y.YUAN
Electrical / Optical Characteristics at T)=25°°
°°
°C
Absolute Maximum Ratings at T)=25°°
°°
°C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Selection Guide
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SPEC NO: DSAD0155 REV NO: V.1 DATE: DEC/28/2002 PAGE: 3 OF 4
APPROVED : J. Lu CHECKED :Joe Lee DRAWN: F.Y.YUAN
White KPSC03-113
KPSC03-113
SMT Reflow Soldering Instruction
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
SPEC NO: DSAD0155 REV NO: V.1 DATE: DEC/28/2002 PAGE: 4 OF 4
APPROVED : J. Lu CHECKED :Joe Lee DRAWN: F.Y.YUAN
Recommended Soldering Pattern
(Units : mm)
Tape Specification
(Units : mm)
