INTEGRATED DISCRETES IP4220CZ6 Dual USB 2.0 Integrated ESD protection to IEC 61000-4-2 level 4 Product Specification Philips Semiconductors 2005 January 05 Philips Semiconductors Product Specification Dual USB 2.0 Integrated ESD Protection IP4220CZ6 FEATURES * * * * ESD IEC 61000-4-2 level 4, 8kV contact discharge compliant protection Four ultra-low input capacitance (1 pF typ.) ESD rail-to-rail protection diodes Low voltage clamping due to integrated Zener diode Small 6 lead SO6 (SOT457) package APPLICATIONS General-purpose downstream ESD protection high frequency analog signals and high-speed serial data transmission for ports inside: * * * * * * Cellular and PCS mobile handsets PC-/Notebook USB2.0/IEEE1394 ports DVI interfaces Cordless telephones Wireless data (WAN/LAN) systems PDAs 1 6 2 5 3 4 DESCRIPTION The IP4220CZ6 is designed to protect I/Os being sensitive concerning capacitive load, such as USB 2.0, Ethernet, DVI etc. from destruction by Electro Static Discharges (ESD). Therefore, the IP4220CZ6 incorporates four pairs of ultra-low capacity rail-to-rail diodes plus an additional Zener diode to provide protection to downstream signal and supply components from Electrostatic Discharge (ESD) voltages as high as 8 kV contact discharge. Due to the rail-to-rail diodes being connected to the Zener diode, the protection is working independent form the availability of a supply voltage. The IP4220CZ6 is fabricated using thin film-onsilicon technology and integrates 4 ultra-low capacity rail-to-rail ESD protection diodes in a miniature 6-lead SOT457 package. 2005 January 05 2 Figure 1: IP4220CZ6 schematic and pinning diagram Philips Semiconductors Product Specification Dual USB 2.0 Integrated ESD Protection IP4220CZ6 ABSOLUTE MAXIMUM RATINGS SYMBOL PARAMETER VI/O DC input voltage range ESD Electrostatic Discharge, all pins Tstg TEST CONDITIONS MIN MAX UNIT 0 +5.5 V -8 +8 kV -55 +125 C MAX UNIT -40 +85 C TYP MAX UNIT IEC 61000-4-2, Level 4, Contact Device storage temperature range RECOMMENDED OPERATING CONDITIONS MIN Operating temperature range ELECTRICAL CHARACTERISTICS Tc = 25C unless otherwise specified SYMBOL PARAMETER TEST CONDITIONS MIN CI/O Pin capacitance to ground, Pins 1, 3, 4, 6 Vdc = 0 V; f = 1 MHz Pin 5 = +3.0 V - 1.0 - pF Ilkg Diode reverse leakage current, Pins 1, 3, 4, 6 to ground V = + 3.0V - - 100 nA CZener Zener diode capacitance to ground, Pin 5 to 2 Vdc = 0 V; f = 1 MHz Pin 5 = +3.0 V - 40 - pF VBR I/O Zener diode breakdown voltage, Pin 5 to 2 I = 1mA 6 - 9 V VF Forward voltage - 0.7 - V 2005 January 05 3 Philips Semiconductors Product Specification Dual USB 2.0 Integrated ESD Protection IP4220CZ6 Application Information Universal Serial Bus 2.0 protection The IP4220CZ6 is optimized to protect e.g. two USB 2.0 ports of Electro-Static-Discharge (ESD). Each device is capable of protection both USB data lines and the VBUS supply. A typical application is shown in the schematic below. VBUS D+ DGND USB 2.0 IEEE1394 Controller VBUS 6 1 VBUS D+ DGND Figure 2: Typical application of IP4220CZ6 2005 January 05 4 GND Philips Semiconductors Product Specification Dual USB 2.0 Integrated ESD Protection IP4220CZ6 PACKAGE OUTLINE Plastic small outline package; 6 leads; body width 1.5 mm Figure 3: IP4220CZ6 outline dimensions 2005 January 05 5 SOT457 Philips Semiconductors Product Specification Dual USB 2.0 Integrated ESD Protection IP4220CZ6 DEFINITIONS Data Sheet Identification Product Status Objective Specification Formative or in Design Preliminary Specification Preproduction Product Product Specification Full Production Definition This data sheet contains the target or goal specifications for product development. Specifications may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve the design and supply the best possible product. This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve the design and supply the best possible product. Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale. 2005 January 05 6