REVISIONS
LTR DESCRIPTION DATE (YR-MO-DA) APPROVED
A
Update boilerplate. Add QD certification. Change code ident. no. to
67268. Editorial changes throughout. --les
00-06-22
Raymond Monnin
B
Update to current requirements. Editorial changes throughout. - gap 06-01-05
Raymond Monnin
CURRENT CAGE CODE 67268
The original first page of this drawing has been replaced.
REV
SHEET
REV
SHEET
REV STATUS REV B B B B B B B B B B
OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10
PMIC N/A PREPARED BY
Joe A. Kerby
DEFENSE SUPPLY CENTER COLUMBUS
STANDARD
MICROCIRCUIT
DRAWING
CHECKED BY
D. A. DiCenzo
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
APPROVED BY
N. A. Hauch
MICROCIRCUIT, DIGITAL, ADVANCED
SCHOTTKY TTL, QUAD NONINVERTING BUS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DRAWING APPROVAL DATE
87-05-08
TRANSCEIVERS WITH THREE-STATE OUTPUTS,
MONOLITHIC SILICON
AMSC N/A
REVISION LEVEL
B SIZE
A CAGE CODE
14933
5962-86834
SHEET
1 OF
10
DSCC FORM 2233
APR 97 5962-E083-06
.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-86834
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
B SHEET 2
DSCC FORM 2234
APR 97
1. SCOPE
1.1 Scope. T his drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-86834 01 C X
Drawing number Device type
(see 1.2.1) Case outline
(see 1.2.2) Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type Generic number Circuit function
01 54F243 Quad noninverting bus transceivers,
with three-state outputs
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style
C GDIP1-T14 or CDIP2-T14 14 Dual-in-line
D GDFP1-F14 or CDFP2-F14 14 Flat pack
2 CQCC1-N20 20 Square leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage range (VCC) ............................................................................ -0.5 V dc to +7.0 V dc
DC input voltage range (VIN) .......................................................................... -0.5 V dc to VCC +0.5 V dc
Storage temperature range (TSTG) ................................................................. -65°C to +150°C
Maximum power dissipation (PD) ................................................................... 495 mW 1/
Lead temperature (soldering, 10 seconds) ..................................................... +300°C
Thermal resistance, junction-to-case (θJC) ..................................................... See MIL-STD-1835
Junction temperature (TJ) .............................................................................. +175°C 2/
1.4 Recommended operating conditions.
Supply voltage range (VCC) .............................................................................. 4.5 V dc minimum to 5.5 V dc maximum
Minimum high level input voltage (VIH) ............................................................. 2.0 V dc
Maximum low level input voltage (VIL) ............................................................. 0.8 V dc
Normalized fanout (each output):
Low-level logic .............................................................................................. 33 maximum
High-level logic ............................................................................................. 50 maximum
Case operating temperature range (TC) ........................................................... -55°C to +125°C
___________
1/ Maximum power dissipation is defined as VCC x ICC, and must withstand the added PD due to short circuit test; e.g., IOS.
2/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions
in accordance with method 5004 of MIL-STD-883.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-86834
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
B SHEET 3
DSCC FORM 2234
APR 97
2. APPLICABLE DOCUMENT S
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil;quicksearch/ or www.dodssp.daps.mil or from the
Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used. This drawing has been modified to allow the manufacturer
to use the alternate die/fabrication requirements of paragraph A.3.2.2 of MIL-PRF-38535 or other alternative approved by the
qualifying activity.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-86834
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
B SHEET 4
DSCC FORM 2234
APR 97
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN
number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used. For product built in accordance with A.3.2.2 of
MIL-PRF-38535, or as modified in the manufacturer’s QM plan, the “QD” certification mark shall be used in place of the "Q" or
"QML" certification mark.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
4. VERIFICAT ION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. T he test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test
method 1015 of MIL-STD-883.
(2) TA = +125°C, minimum.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-86834
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
B SHEET 5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Test Symbol Test conditions
-55°C TC +125°C Group A
subgroups Limits Unit
unless otherwise specified Min Max
High level output voltage VOH V
CC = 4.5 V, IOH = -3 mA,
VIL = 0.8 V, VIH = 2.0 mA 1, 2, 3 2.4 V
V
OH1 V
CC = 4.5 V, IOH = -12 mA,
VIL = 0.8 V, VIH = 2.0 mA 1, 2, 3 2.0 V
Low level output voltage VOL V
CC = 4.5 V, IOL = 48 mA,
VIL = 0.8 V, VIH = 2.0 mA 1, 2, 3 0.55 V
Input clamp voltage VIC
II = -18 mA, TC = +25°C,
VCC = 0.0 V 1 -1.2 V
High-level input current IIH1
VCC = 5.5 V, VIH = 2.7 V 1, 2, 3 20 µA
I
IH2 V
CC = 5.5 V, VIH = 7.0 V enable inputs
only 1, 2, 3 100 µA
I
IH3
VCC = 5.5 V, VIH = 5.5 V data inputs only 1, 2, 3 1.0 mA
Low-level input current IIL1
VCC = 5.5 V, VIL = 0.5 V EBA input 1, 2, 3 -0.3 -1.0 mA
I
IL2
VCC = 5.5 V, VIL = 0.5 V EBA input 1, 2, 3 -.06 -1.6 mA
Short-circuit output current IOS
VCC = 5.5 V, VOUT = 0.0 V 1/ 1, 2, 3 -100 -325 mA
Low-level input, off-state
low-output current IIOZL VCC = 5.5 V, VIOZL = 0.5 V 1, 2, 3 -0.3 -1.6 mA
High-level input, off-state
low-output current IIOZH VCC = 5.5 V, VIOZH = 2.7 V 1, 2, 3 70 µA
Supply current, high ICCH
VCC = 5.5 V, VIN = 5.5 V 1, 2, 3 80 mA
Supply current, low ICCL
VCC = 5.5 V, VIN = 0.0 V 1, 2, 3 92 mA
Supply current, disable ICCZ
VCC = 5.5 V, VIN = Open 1, 2, 3 90 mA
Bn to An tPLH1
9, 10, 11 6.5 ns
Propagation delay
time, low-to-high
level An to Bn tPLH2
9, 10, 11 6.5 ns
Bn to An tPHL1
9, 10, 11 8.5 ns
Propagation delay
time, low-to-high
level An to Bn tPHL2
VCC = 5.5 V,
CL = 50 pF ±10% 2/
RL = 500 ±5%
9, 10, 11 8.5 ns
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-86834
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
B SHEET 6
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Test Symbol Test conditions
-55°C TC +125°C Group A
subgroups Limits Unit
unless otherwise specified Min Max
E, E, OE , to An
tPLZ1 9, 10, 11 8.5 ns Propagation
delay time, low
level to off-state E, E, OE , to Bn
tPLZ2 9, 10, 11 8.5 ns
E, E, OE , to An
tPHZ1 9, 10, 11 7.5 ns Propagation
delay time, high
level to off-state E, E, OE , to Bn
tPHZ2 9, 10, 11 7.5 ns
E, E, OE , to An
tPZL1 9, 10, 11 10.5 ns Propagation
delay time, off-
state to low
level E, E, OE , to Bn
tPZL2 9, 10, 11 10.5 ns
E, E, OE , to An
tPZH1 9, 10, 11 8.0 ns Propagation
delay time, off-
state to high
level E, E, OE , to Bn
tPZH2
VCC = 5.5 V,
CL = 50 pF ±10% 2/
RL = 500 ±5%
9, 10, 11 8.0 ns
1/ Not more than one output should be shorted at a time, and the duration of the short- circuit condition should not exceed one
second.
2/ Propagation delay time test ing and maximum clock frequency testing may be performed using either CL = 15 pF or CL = 50
pF. However, the manufacturer must certify and guarantee that the microcircuits meet the switching test limits specified for
a 50 pF load.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-86834
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
B SHEET 7
DSCC FORM 2234
APR 97
Device type 01
Case Outline C and D 2
Terminal Number Terminal Symbol Terminal Symbol
1 EAB NC
2 NC
EAB
3 A0 NC
4 A1 A0
5 A2 NC
6 A3 A1
7 GND NC
8 B3 A2
9 B2 A3
10 B1 GND
11 B0 NC
12 NC B3
13 EBA B2
14 VCC B1
15 - - - NC
16 - - - B0
17 - - - NC
18 - - - NC
19 - - - EBA
20 - - - VCC
FIGURE 1. Terminal connections.
Inputs Outputs
EAB EBA An Bn Bn An
L L H - H -
L L L - L -
H H - H - H
H H - L - L
H L X - Z -
H L - X - Z
H = High voltage level.
L = Low voltage level.
Z = High impedance state.
X = Irrelevant.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-86834
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
B SHEET 8
DSCC FORM 2234
APR 97
FIGURE 2. Tr uth table.
FIGURE 3. Logic diagram.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-86834
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
B SHEET 9
DSCC FORM 2234
APR 97
TABLE II. Electrical test requirements.
MIL-STD-883 test requirements
Subgroups
(in accordance with
MIL-STD-883, method 5005,
table I)
Interim electrical parameters
(method 5004)
- - -
Final electrical test parameters
(method 5004)
1*, 2, 3, 9
Group A test requirements
(method 5005)
1, 2, 3, 7, 9, 10, 11**
Groups C and D end-point
electrical parameters
(method 5005)
1, 2, 3
* PDA applies to subgroup 1.
** Subgroups 10 and 11, if not tested, shall be guaranteed to the specified
limits in table I.
4.3 Qualit y conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of
MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply.
4.3. 1 Group A inspection.
a. Tests shall be as specified in t able II herein.
b. Subgroups 4, 5, 6, and 8 in table I , method 5005 of MIL-STD-883 shall be omit ted.
c. Subgroup 7 shall include verification of the truth table.
4.3. 2 Groups C and D inspections.
a. End-point electrical parameters shall be as specified in table II herein.
b. Steady-state life test conditions, method 1005 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
test method 1005 of MIL-STD-883.
(2) TA = +125°C, minimum.
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-86834
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
B SHEET 10
DSCC FORM 2234
APR 97
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a
contractor-prepared specification or drawing.
6.3 Configuration control of SMD' s. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system
application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be
used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC
5962) should contact DSCC-VA, telephone (614) 692-0544.
6.5 Comments. Comments on t his drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone
(614) 692-0547.
6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors list ed in MIL-
HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submit ted to and accepted by
DSCC-VA.
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 06-01-05
Approved sources of supply for SMD 5962-86834 are listed below for immediate acquisition information only and shall
be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised
to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate
of compliance has been submitted to and accepted by DSCC-VA. This inf ormation bulletin is superseded by the next
dated revision of MIL-HDBK-103 and QML-38535.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
Reference military
specification PIN
5962-8683401CA 0C7V7 54F243/CA M38510/34802BCA
5962-8683401DA 0C7V7 54F243/DA M38510/34802BDA
5962-86834012A 0C7V7 54F243/2A M38510/34802B2A
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact t he vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
Vendor CAGE Vendor name
number and address
0C7V7 QP Semiconductor
2945 Oakmead Village Court
Santa Clara, CA 95051
The information contained herein is disseminat ed for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.