INTEGRATED CIRCUITS DATA SHEET Package outlines Package information January 1995 File under Integrated Circuits, IC04 Philips Semiconductors Package information Package outlines INDEX PACKAGE VERSIONS DESCRIPTION PAGE SO SOT108-1 plastic small outline package; 14 leads; body width 3.9 mm 3 SOT109-1 plastic small outline package; 16 leads; body width 3.9 mm 4 SOT162-1 plastic small outline package; 16 leads; body width 7.5 mm 5 SOT163-1 plastic small outline package; 20 leads; body width 7.5 mm 6 SOT137-1 plastic small outline package; 24 leads; body width 7.5 mm 7 SOT136-1 plastic small outline package; 28 leads; body width 7.5 mm 8 SOT337-1 plastic shrink small outline package; 14 leads; body width 5.3 mm 9 SOT338-1 plastic shrink small outline package; 16 leads; body width 5.3 mm 10 SOT339-1 plastic shrink small outline package; 20 leads; body width 5.3 mm 11 SOT340-1 plastic shrink small outline package; 24 leads; body width 5.3 mm 12 SOT341-1 plastic shrink small outline package; 28 leads; body width 5.3 mm 13 plastic dual in-line package; 14 leads (300 mil) 14 SSOP DIP SOT27-1 SOT38-1(1) plastic dual in-line package; 16 leads (300 mil); long body 15 SOT102-1 plastic dual in-line package; 18 leads (300 mil) 16 SOT146-1 plastic dual in-line package; 20 leads (300 mil) 17 SOT101-1 plastic dual in-line package; 24 leads (600 mil) 18 SOT117-1 plastic dual in-line package; 28 leads (600 mil) 19 SOT129-1 plastic dual in-line package; 40 leads (600 mil) 20 SOT73-1 ceramic dual in-line package; 14 leads; glass seal 21 SOT74-1 ceramic dual in-line package; 16 leads; glass seal 22 SOT133-1 ceramic dual in-line package; 18 leads; glass seal 23 SOT152-2 ceramic dual in-line package; 20 leads; glass seal 24 SOT94-1 ceramic dual in-line package; 24 leads; glass seal 25 SOT135-1 ceramic dual in-line package; 28 leads; glass seal 26 CDIP Note 1. Corrected 26 June 1997. January 1995 2 Philips Semiconductors Package information Package outlines SO SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index Lp 1 L 7 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.35 0.014 0.0075 0.34 0.16 0.15 0.244 0.039 0.050 0.041 0.228 0.016 0.010 0.057 inches 0.069 0.004 0.049 0.028 0.024 0.01 0.01 0.028 0.004 0.012 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT108-1 076E06S MS-012AB January 1995 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-23 97-05-22 3 o 8 0o Philips Semiconductors Package information Package outlines SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.39 0.014 0.0075 0.38 0.16 0.15 0.050 0.039 0.016 0.028 0.020 0.01 0.01 0.004 0.028 0.012 inches 0.244 0.041 0.228 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07S MS-012AC January 1995 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-23 97-05-22 4 o 8 0o Philips Semiconductors Package information Package outlines SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index Lp L 1 8 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.41 0.40 0.30 0.29 0.419 0.043 0.050 0.055 0.394 0.016 inches 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT162-1 075E03 MS-013AA January 1995 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 5 Philips Semiconductors Package information Package outlines SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index Lp L 1 10 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.419 0.043 0.050 0.055 0.394 0.016 inches 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013AC January 1995 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 6 Philips Semiconductors Package information Package outlines SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 D E A X c HE y v M A Z 13 24 Q A2 A (A 3) A1 pin 1 index Lp L 1 12 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 15.6 15.2 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.61 0.60 0.30 0.29 0.419 0.043 0.050 0.055 0.394 0.016 inches 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT137-1 075E05 MS-013AD January 1995 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 7 Philips Semiconductors Package information Package outlines SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 D E A X c y HE v M A Z 15 28 Q A2 A (A 3) A1 pin 1 index Lp L 1 14 e bp 0 detail X w M 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 18.1 17.7 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.71 0.69 0.30 0.29 0.419 0.043 0.050 0.055 0.394 0.016 inches 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT136-1 075E06 MS-013AE January 1995 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 8 o 8 0o Philips Semiconductors Package information Package outlines SSOP SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm D SOT337-1 E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index Lp L 7 1 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 2.0 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 1.4 0.9 8 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT337-1 January 1995 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 96-01-18 MO-150AB 9 o Philips Semiconductors Package information Package outlines SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm D SOT338-1 E A X c y HE v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index Lp L 8 1 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 2.0 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 1.00 0.55 8 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT338-1 January 1995 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 94-01-14 95-02-04 MO-150AC 10 o Philips Semiconductors Package information Package outlines SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm D SOT339-1 E A X c HE y v M A Z 20 11 Q A2 pin 1 index A (A 3) A1 Lp L 1 10 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 2.0 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 7.4 7.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 0.9 0.5 8 0o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT339-1 January 1995 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 93-09-08 95-02-04 MO-150AE 11 o Philips Semiconductors Package information Package outlines SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm D SOT340-1 E A X c HE y v M A Z 24 13 Q A2 A (A 3) A1 pin 1 index Lp L 1 12 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 2.0 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 8.4 8.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 0.8 0.4 8 0o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT340-1 January 1995 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 93-09-08 95-02-04 MO-150AG 12 o Philips Semiconductors Package information Package outlines SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm D SOT341-1 E A X c HE y v M A Z 28 15 Q A2 pin 1 index A (A 3) A1 Lp L 1 14 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 2.0 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 10.4 10.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 1.1 0.7 8 0o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT341-1 January 1995 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 93-09-08 95-02-04 MO-150AH 13 o Philips Semiconductors Package information Package outlines DIP DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b MH 8 14 pin 1 index E 1 7 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.13 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 2.2 inches 0.17 0.020 0.13 0.068 0.044 0.021 0.015 0.014 0.009 0.77 0.73 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT27-1 050G04 MO-001AA January 1995 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-03-11 14 Philips Semiconductors Package information Package outlines DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 2.2 inches 0.19 0.020 0.15 0.055 0.045 0.021 0.015 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT38-1 050G09 MO-001AE January 1995 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-10-02 95-01-19 15 Philips Semiconductors Package information Package outlines DIP18: plastic dual in-line package; 18 leads (300 mil) SOT102-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 10 18 pin 1 index E 1 9 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 1.40 1.14 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 0.85 inches 0.19 0.020 0.15 0.055 0.044 0.021 0.015 0.055 0.044 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.033 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 93-10-14 95-01-23 SOT102-1 January 1995 EUROPEAN PROJECTION 16 Philips Semiconductors Package information Package outlines DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 11 20 pin 1 index E 1 10 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 0.36 0.23 26.92 26.54 inches 0.17 0.020 0.13 0.068 0.051 0.021 0.015 0.014 0.009 1.060 1.045 D e e1 L ME MH w Z (1) max. 6.40 6.22 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 2.0 0.25 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.078 (1) E (1) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT146-1 January 1995 REFERENCES IEC JEDEC EIAJ SC603 17 EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-05-24 Philips Semiconductors Package information Package outlines seating plane DIP24: plastic dual in-line package; 24 leads (600 mil) SOT101-1 ME D A2 L A A1 c e Z b1 w M (e 1) b MH 13 24 pin 1 index E 1 12 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 5.1 0.51 4.0 1.7 1.3 0.53 0.38 0.32 0.23 32.0 31.4 14.1 13.7 2.54 15.24 3.9 3.4 15.80 15.24 17.15 15.90 0.25 2.2 inches 0.20 0.020 0.16 0.066 0.051 0.021 0.015 0.013 0.009 1.26 1.24 0.56 0.54 0.10 0.60 0.15 0.13 0.62 0.60 0.68 0.63 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT101-1 051G02 MO-015AD January 1995 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-23 18 Philips Semiconductors Package information Package outlines seating plane handbook, full pagewidthdual in-line package; 28 leads (600 mil) DIP28: plastic SOT117-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 15 28 pin 1 index E 1 14 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 5.1 0.51 4.0 1.7 1.3 0.53 0.38 0.32 0.23 36.0 35.0 14.1 13.7 2.54 15.24 3.9 3.4 15.80 15.24 17.15 15.90 0.25 1.7 inches 0.20 0.020 0.16 0.066 0.051 0.020 0.014 0.013 0.009 1.41 1.34 0.56 0.54 0.10 0.60 0.15 0.13 0.62 0.60 0.68 0.63 0.01 0.067 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT117-1 051G05 MO-015AH January 1995 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-14 19 Philips Semiconductors Package information Package outlines seating plane DIP40: plastic dual in-line package; 40 leads (600 mil) SOT129-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 21 40 pin 1 index E 1 20 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c mm 4.7 0.51 4.0 1.70 1.14 0.53 0.38 0.36 0.23 52.50 51.50 inches 0.19 0.020 0.16 0.067 0.045 0.021 0.015 0.014 0.009 2.067 2.028 D (1) e e1 L ME MH w Z (1) max. 14.1 13.7 2.54 15.24 3.60 3.05 15.80 15.24 17.42 15.90 0.254 2.25 0.56 0.54 0.10 0.60 0.14 0.12 0.62 0.60 0.69 0.63 0.01 0.089 E (1) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT129-1 051G08 MO-015AJ January 1995 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-14 20 Philips Semiconductors Package information Package outlines CDIP 8.25 max seating plane 19.94 max handbook, full pagewidth 5.08 max 3.4 2.9 0.51 min 2.54 max 0.32 0.23 0.254 M 2.54 (12x) 0.51 0.38 7.62 10.0 7.6 1.5 MBB907 14 8 1 7 Dimensions in mm. Ceramic dual in-line package; 14 leads; glass seal (CDIP14; SOT73-1). January 1995 21 Philips Semiconductors Package information Package outlines 8.25 max seating plane 19.94 max 1/1 page = 296 mm (Datasheet) 27 mm 5.08 max 3.4 2.9 0.51 min 0.32 0.23 1.27 max 2.54 (14x) 0.51 0.38 0.254 M 7.62 10.0 7.6 1.5 MBB908 16 9 1 8 Dimensions in mm. Ceramic dual in-line package; 16 leads; glass seal (CDIP16; SOT74-1). January 1995 22 Philips Semiconductors Package information Package outlines 8.25 max seating plane 23.6 max handbook, full pagewidth 5.08 max 3.4 2.9 0.51 min 2.54 (16x) 1.27 max 0.51 0.38 0.254 M 0.32 0.23 0 to 15 o 1.5 18 10 1 9 7.62 Dimensions in mm. Ceramic dual in-line package; 18 leads; glass seal (CDIP18; SOT133-1). January 1995 23 MBB936 Philips Semiconductors Package information Package outlines seating plane 25.4 max handbook, full pagewidth 8.25 max 5.08 max 3.4 2.9 0.51 min 0.32 0.23 1.27 max 2.54 (18x) 0.51 0.38 0.254 M 7.62 10.0 7.6 1.5 MBB906 20 11 1 10 Dimensions in mm. Ceramic dual in-line package; 20 leads; glass seal (CDIP20; SOT152-2). January 1995 24 Philips Semiconductors Package information 15.9 max 33 max seating plane handbook, full pagewidth Package outlines 5.84 max 3.4 2.9 0.51 min 2.54 max 2.54 (22x) 0.58 0.38 0.254 M 0.32 0.23 15.24 0 to 15 o 1.7 max 24 13 1 12 Dimensions in mm. Ceramic dual in-line package; 24 leads; glass seal (CDIP24; SOT94-1). January 1995 25 MBB910 Philips Semiconductors Package information Package outlines 15.9 max 38.1 max seating plane handbook, full pagewidth 5.84 max 3.4 2.9 0.51 min 2.54 max 0.254 M 0.32 0.23 0.58 0.38 2.54 (26x) 0 to 15 o 1.7 max 28 15 1 14 Dimensions in mm. Ceramic dual in-line package; 28 leads; glass seal (CDIP28; SOT135-1). January 1995 26 15.24 MBB911