Wideband, 40 dB Isolation at 1 GHz, CMOS
1.65 V to 2.75 V, SPST Switches
ADG901/ADG902
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 www.analog.com
Fax: 781.461.3113 © 2005 Analog Devices, Inc. All rights reserved.
FEATURES
Wideband switch: −3 dB @ 4.5 GHz
ADG901—absorptive switch
ADG902—reflective switch
High off isolation: 40 dB @ 1 GHz
Low insertion loss: 0.8 dB @1 GHz
Single 1.65 V to 2.75 V power supply
CMOS/LVTTL control logic
8-lead MSOP and tiny 3 mm × 3 mm LFCSP packages
Low power consumption (<1 μA)
APPLICATIONS
Wireless communications
General purpose RF switching
Dual-band applications
High speed filter selection
Digital transceiver front end switch
IF switching
Tuner modules
Antenna diversity switching list
FUNCTIONAL BLOCK DIAGRAM
ADG901
RF2RF1
CTRL
50Ω50Ω
ADG902
RF2RF1
CTRL
03336-001
Figure 1.
GENERAL DESCRIPTION
The ADG901/ADG902 are wideband switches that use a CMOS
process to provide high isolation and low insertion loss to
1 GHz. The ADG901 is an absorptive (matched) switch with
50 Ω terminated shunt legs, while the ADG902 is a reflective
switch. These devices are designed such that the isolation is
high over the dc to 1 GHz frequency range. They have on-board
CMOS control logic, thus eliminating the need for external
controlling circuitry. The control inputs are both CMOS and
LVTTL compatible. The low power consumption of these
CMOS devices makes them ideally suited to wireless
applications and general-purpose high frequency switching.
PRODUCT HIGHLIGHTS
1. −40 dB Off Isolation @ 1 GHz
2. 0.8 dB Insertion Loss @ 1 GHz
3. Tiny 8-Lead MSOP/LFCSP Packages
0
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
10k 100k 100M1M 10M 1G 10G
03336-002
FREQUENCY (Hz)
ISOLATION (dB)
V
DD
= 2.5V
V
DD
= 1.8V
T
A
= 25°C
Figure 2. Off Isolation vs. Frequency
–3.0
–2.8
–2.2
–1.6
–1.2
–3.0
–2.6
–2.4
–2.0
–1.8
–1.4
–1.0
–0.8
10k 100k 100M1M 10M 1G 10G
03336-003
FREQUENCY (Hz)
INSERTION LOSS (dB)
–0.6
–0.4
V
DD
= 2.5V
T
A
= 25°C
Figure 3. Insertion Loss vs. Frequency
ADG901/ADG902
Rev. B | Page 2 of 16
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions..............................5
Typical Performance Characteristics ..............................................6
Ter mi no log y .......................................................................................8
Test Circuits ........................................................................................9
Applications..................................................................................... 10
Absorptive vs. Reflective Switches ........................................... 10
ADG90x Evaluation Board ........................................................... 11
Outline Dimensions ....................................................................... 12
Ordering Guide............................................................................... 13
REVISION HISTORY
10/05—Rev. A to Rev. B
Changes to Figure 1..........................................................................1
Changes to Table 1............................................................................3
Changes to Ordering Guide ..........................................................12
10/04—Rev. 0 to Rev. A.
Changes to Features ......................................................................... 1
Changes to Product Highlights ...................................................... 1
Changes to Specifications................................................................ 2
Changes to Ordering Guide ............................................................ 3
Change to ADG9xx Evaluation Board Section............................. 9
Changes to Ordering Guide .......................................................... 10
8/03—Revision 0: Initial Version
ADG901/ADG902
Rev. B | Page 3 of 16
SPECIFICATIONS
VDD = 1.65 V to 2.75 V, GND = 0 V, input power = 0 dBm, all specifications TMIN to TMAX, unless otherwise specified.1
Table 1.
B Version
Parameter Symbol Conditions Min Typ2Max Unit
AC ELECTRICAL CHARACTERISTICS
Operating Frequency3 DC 2.5 GHz
−3 dB Frequency4 4.5 GHz
Input Power4 0 V dc bias 7 dBm
0.5 V dc bias 16 dBm
Insertion Loss S21, S12 DC to 100 MHz; VDD = 2.5 V ± 10% 0.4 0.7 dB
500 MHz; VDD = 2.5 V ± 10% 0.5 0.8 dB
1000 MHz; VDD = 2.5 V ± 10% 0.8 1.25 dB
Isolation—RF1 to RF2 S21, S12 100 MHz 60 61 dB
CP Package 500 MHz 43 45 dB
1000 MHz 34 40 dB
Isolation—RF1 to RF2 S21, S12 100 MHz 51 60 dB
RM Package 500 MHz 37.5 47 dB
1000 MHz 31 37 dB
Return Loss (On Channel)4 S11, S22 DC to 100 MHz 20 28 dB
500 MHz 23 29 dB
1000 MHz 25 28 dB
Return Loss (Off Channel)4 S11, S22 DC to 100 MHz 18 23 dB
500 MHz 17 21 dB
1000 MHz 15 19 dB
On Switching Time4tON 50% CTRL to 90% RF 3.6 6 ns
Off Switching Time4tOFF 50% CTRL to 10% RF 5.8 9.5 ns
Rise Time4tRISE 10% to 90% RF 3.1 5.5 ns
Fall Time4tFALL 90% to 10% RF 6.0 8.5 ns
1 dB Compression4P−1 dB B1000 MHz 17 dBm
Third-Order Intermodulation Intercept IP3 900 MHz/901 MHz, 4 dBm 28.5 36 dBm
Video Feedthrough5 2.5 mV p-p
DC ELECTRICAL CHARACTERISTICS
Input High Voltage VINH VDD = 2.25 V to 2.75 V 1.7 V
V
INH VDD = 1.65 V to 1.95 V 0.65 VDD V
Input Low Voltage VINL VDD = 2.25 V to 2.75 V 0.7 V
V
INL VDD = 1.65 V to 1.95 V 0.35
VDD
V
Input Leakage Current II 0 ≤ VIN ≤ 2.75 V ±0.1 ±1 μA
CAPACITANCE4
RF1/RF2, RF Port On Capacitance CRF on f = 1 MHz 1.2 pF
CTRL Input Capacitance CCTRL f = 1 MHz 2.1 pF
POWER REQUIREMENTS
VDD 1.65 2.75 V
Quiescent Power Supply Current IDD Digital inputs = 0 V or VDD 0.1 1 μA
1 Temperature range for B version: −40°C to +85°C.
2 Typical values are at VDD = 2.5 V and 25°C, unless otherwise specified.
3 Point at which insertion loss degrades by 1 dB.
4 Guaranteed by design, not subject to production test.
5 The dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 Ω test setup, measured with 1 ns
rise time pulses and 500 MHz bandwidth.
ADG901/ADG902
Rev. B | Page 4 of 16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise specified.
Table 2.
Parameter Rating
VDD to GND −0.5 V to +4 V
Inputs to GND −0.5 V to VDD + 0.3
V1
Continuous Current 30 mA
Input Power 18 dBm
Operating Temperature Range
Industrial (B Version) −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
MSOP Package
θJA Thermal Impedance 206°C/W
LFCSP Package
θ JA Thermal Impedance (2-Layer
board) 84°C/W
θ JA Thermal Impedance (4-Layer
board) 48°C/W
Lead Temperature, Soldering (10 sec) 300°C
IR Reflow, Peak Temperature (<20 sec) 235°C
ESD 1 kV
1 RF1/RF2 off port inputs to ground: −0.5 V to VDD – 0.5 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
ADG901/ADG902
Rev. B | Page 5 of 16
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
03336-004
ADG901/
ADG902
TOP VIEW
(Not to Scale)
V
DD 1
CTRL
2
GND
3
RF1
4
RF2
8
GND
7
GND
6
GND
5
Figure 4. 8-Lead MSOP (RM-8) and
8-Lead 3 mm × 3 mm LFCSP (CP-8 – Exposed pad tied to substrate, GND
Table 3. Pin Function Descriptions
Pin No. Mnemonic Description
1 VDD Power Supply Input. These parts can be operated from 1.65 V to 2.75 V; VDD should be decoupled to GND.
2 CTRL CMOS or LVTTL Logic Level. CTRL input should not exceed VDD.
0 → RF1 Isolated from RF2.
1 → RF1 to RF2.
3, 5, 6, 7 GND Ground Reference Point for All Circuitry on the Part.
4 RF1 RF1 Port.
8 RF2 RF2 Port.
Table 4. Truth Table
CTRL Signal Path
0 RF1 isolated from RF2
1 RF1 to RF2
ADG901/ADG902
Rev. B | Page 6 of 16
TYPICAL PERFORMANCE CHARACTERISTICS
–0.4
–3.0
–2.2
–2.0
–1.8
–1.6
–1.4
–2.8
–2.6
–2.4
–1.2
–1.0
–0.8
–0.6
10k 100k 100M1M 10M 1G 10G
03336-005
FREQUENCY (Hz)
INSERTION LOSS (dB)
T
A
= 25°C
V
DD
= 2.5V
V
DD
= 2.75V
V
DD
= 2.25V
Figure 5. Insertion Loss vs. Frequency over Supplies (S12 and S21)
–0.40
–1.00
–0.85
–0.80
–0.75
–0.70
–0.65
–0.95
–0.90
–0.60
–0.55
–0.50
–0.45
10k 100k 100M1M 10M 1G 10G
03336-006
FREQUENCY (Hz)
INSERTION LOSS (dB)
V
DD
= 2.75V
V
DD
= 2.25V
V
DD
= 2.5V
T
A
= 25°C
Figure 6. Insertion Loss vs. Frequency over Supplies (S12 and S21)
(Zoomed Figure 5 Plot)
–0.4
–3.0
–2.2
–2.0
–1.8
–1.6
–1.4
–2.8
–2.6
–2.4
–1.2
–1.0
–0.8
–0.6
10k 100k 100M1M 10M 1G 10G
03336-007
FREQUENCY (Hz)
INSERTION LOSS (dB)
V
DD
= 1.8V V
DD
= 1.95V
V
DD
= 1.65V
T
A
= 25°C
Figure 7. Insertion Loss vs. Frequency over Supplies (S12 and S21)
–0.4
–3.0
–2.2
–2.0
–1.8
–1.6
–1.4
–2.8
–2.6
–2.4
–1.2
–1.0
–0.8
–0.6
10k 100k 100M1M 10M 1G 10G
03336-008
FREQUENCY (Hz)
INSERTION LOSS (dB)
+25°C+85°C
–40°C
V
DD
= 2.5V
Figure 8. Insertion Loss vs. Frequency over Temperature (S12 and S21)
0
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
–95
–85
–75
–65
–55
–45
–35
–25
–15
–5
10k 100k 100M1M 10M 1G 10G
03336-009
FREQUENCY (Hz)
ISOLATION (dB)
V
DD
= 2.5V
V
DD
= 1.8V
T
A
= 25°C
Figure 9. OFF Isolation vs. Frequency over Supplies (S12 and S21)
0
–90
–80
–70
–60
–50
–40
–30
–20
–10
–85
–75
–65
–55
–45
–35
–25
–15
–5
10k 100k 100M1M 10M 1G 10G
03336-010
FREQUENCY (Hz)
ISOLATION (dB)
+85°C
+25°C
–40°C
V
DD
= 2.5V
Figure 10. Off Isolation vs. Frequency over Temperature (S12 and S21)
ADG901/ADG902
Rev. B | Page 7 of 16
0
–35
–30
–20
–10
–25
–15
–5
10k 100k 100M1M 10M 1G 10G
03336-011
FREQUENCY (Hz)
RETURN LOSS (dB)
T
A
= 25°C
V
DD
= 2.5V
ON SWITCH
OFF SWITCH
Figure 11. Return Loss vs. Frequency (S11)
03336-012
CH1 = CTRL = 1V/DIV
CH2 = RFx = 100mV/DIV t
RISE
= 2.8ns
t
FALL
= 5.1ns
CH2
CH1
Figure 12. Switch Timing
03336-013
CH1 500mV CH2 1mV 10.0ns
1
2
CTRL
RFx
CH2 pk-pk
2.016mV
Figure 13. Video Feedthrough
40
0
5
10
15
20
25
30
35
250 350 450 550 650 750 850
03336-014
FREQUENCY (MHz)
IP
3
(dBm)
V
DD
= 2.5V
T
A
= 25°C
Figure 14. IP3 vs. Frequency
20
0
2
4
6
8
10
12
14
16
18
0 250 500 750 1000 1250 1500
03336-015
FREQUENCY (MHz)
P
–1dB
(dBm)
V
DD
= 2.5V
T
A
= 25°C
Figure 15. P−1dB vs. Frequency
ADG901/ADG902
Rev. B | Page 8 of 16
TERMINOLOGY
VDD
Most positive power supply potential.
IDD
Positive supply current.
GND
Ground (0 V) reference.
CTRL
Logic control input.
VINL
Maximum input voltage for Logic 0.
VINH
Minimum input voltage for Logic 1.
IINL (IINH)
Input current of the digital input.
CIN
Digital input capacitance.
tON
Delay between applying the digital control input and the output
switching on.
tOFF
Delay between applying the digital control input and the output
switching off.
tRISE
Rise time. Time for the RF signal to rise from 10% to 90% of the
on level.
tFALL
Fall time. Time for the RF signal to fall from 90% to 10% of the
on level.
Off Isolation
The attenuation between input and output ports of the switch
when the switch control voltage is in the off condition.
Insertion Loss
The attenuation between input and output ports of the switch
when the switch control voltage is in the on condition.
P−1 dB
1 dB compression point. The RF input power level at which the
switch insertion loss increases by 1 dB over its low level value. It
is a measure of how much power the on switch can handle
before the insertion loss increases by 1 dB.
IP3
Third-order intermodulation intercept. This is a measure of the
power in false tones that occur when closely spaced tones are
passed through a switch, whereby the nonlinearity of the switch
causes these false tones to be generated.
Return Loss
The amount of reflected power relative to the incident power at
a port. Large return loss indicates good matching. By measuring
return loss the VSWR can be calculated from conversion charts.
voltage standing wave ratio (VSWR) indicates the degree of
matching present at a switch RF port.
Video Feedthrough
The spurious signals present at the RF ports of the switch when
the control voltage is switched from high to low or low to high
without an RF signal present.
ADG901/ADG902
Rev. B | Page 9 of 16
TEST CIRCUITS
Similar setups for ADG902.
03336-016
V
DD
V
DD
0.1
μ
F
V
S
CTRL
RF2RF1
GND
R
L
50
Ω
V
OUT
V
CTRL
50% 50%
V
OUT
t
ON
t
OFF
90% 10%
Figure 16. Switching Timing: tON, tOFF
03336-017
V
DD
V
DD
0.1
μ
F
V
S
CTRL
RF2
RF1
GND
R
L
50
Ω
V
OUT
V
CTRL
50% 50%
V
OUT
t
RISE
t
FALL
90% 10%
90%
10%
Figure 17. Switch Timing: tRISE, tFALL
03336-018
OUT
VS
V
VS
50
Ω
NETWORK
ANALYZER
VOUT
RL
50
Ω
0.1
μ
F
V
CTRL
GND
RF2
CTRL
ADG901
RF1
50
Ω
50
Ω
VDD
VDD
OFF ISOLATION = 20 LOG
Figure 18. Off Isolation
03336-019
V
S
50
Ω
NETWORK
ANALYZER
V
OUT
R
L
50
Ω
0.1
μ
F
V
DD
V
CTRL
GND
RF2
CTRL
ADG901
RF1
50
Ω
50
Ω
V
DD
INSERTION LOSS = 20 LOG V
OUT
V
S
Figure 19. Insertion Loss
03336-020
OSCILLOSCOPE
0.1μF
V
DD
V
CTRL
NC
RF2
CTRL
RF1
GND
ADG901
50Ω
50Ω
V
DD
Figure 20. Video Feedthrough
03336-021
COMBINER
RF
SOURCE
RF
SOURCE
SPECTRUM
ANALYZER
0.1
μ
F
VDD
VCTRL
GND
RF2
CTRL
ADG901
RF1
50
Ω
50
Ω
VDD
Figure 21. IP3
03336-022
RF
SOURCE
SPECTRUM
ANALYZER
0.1μF
GND
RF2
CTRL
ADG901
RF1
50Ω
50Ω
V
DD
V
CTRL
V
DD
V
S
Figure 22. P–1 dB
ADG901/ADG902
Rev. B | Page 10 of 16
APPLICATIONS
The ADG901/ADG902 are ideal solutions for low power, high
frequency applications. The low insertion loss, high isolation
between ports, low distortion, and low current consumption of
these parts make them excellent solutions for many high
frequency switching applications.
Applications include switching between high frequency filters,
ASK generators, and FSK generators.
ABSORPTIVE vs. REFLECTIVE SWITCHES
The ADG901 is an absorptive (matched) switch with
50 Ω terminated shunt legs and the ADG902 is a reflective
switch with 0 Ω terminated shunts to ground. The ADG901
absorptive switch has a good VSWR on each port, regardless of
the switch mode. An absorptive switch should be used when
there is a need for a good VSWR that is looking into the port
but not passing the through signal to the common port. The
ADG901 is therefore ideal for applications that require
minimum reflections back to the RF source. It also ensures that
the maximum power is transferred to the load.
The ADG902 reflective switch is suitable for applications where
high off port VSWR does not matter and the switch has some
other desired performance feature. It can be used in many
applications, including high speed filter selection. In most cases,
an absorptive switch can be used instead of a reflective switch,
but not vice versa.
ADG901/ADG902
Rev. B | Page 11 of 16
ADG90x EVALUATION BOARD
The ADG90x evaluation board allows designers to evaluate the
high performance wideband switches with a minimum of effort.
To prove that these devices meet user requirements, the user
requires only a power supply and a network analyzer along with
the evaluation board. An application note is available with the
evaluation board and provides complete information on
operating the evaluation board.
The RF1 port (see Figure 23) is connected through a
50 Ω transmission line to the top left SMA Connector J1. RF2 is
connected through a 50 Ω transmission line to the top SMA
Connector J2. J3 is connected to GND. A through transmission
line connects J4 and J5 and this transmission line is used to
estimate the loss of the PCB over the environmental conditions
being evaluated.
The board is constructed of a 4-layer, FR4 material with
a dielectric constant of 4.3 and an overall thickness of
0.062 inches. Two ground layers with grounded planes
provide ground for the RF transmission lines. The trans-
mission lines were designed using a coplanar waveguide
with ground plane model using a trace width of 0.052 inches,
clearance to ground plane of 0.030 inches, dielectric thickness
of 0.029 inches, and a metal thickness of 0.014 inches.
03336-023
Figure 23. ADG90x Evaluation Board Top View
ADG901/ADG902
Rev. B | Page 12 of 16
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-187-AA
0.80
0.60
0.40
8°
0°
4
8
1
5
PIN 1 0.65 BSC
SEATING
PLANE
0.38
0.22
1.10 MAX
3.20
3.00
2.80
COPLANARITY
0.10
0.23
0.08
3.20
3.00
2.80
5.15
4.90
4.65
0.15
0.00
0.95
0.85
0.75
Figure 24. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
1
0.50
BSC
0.60 MAX PIN 1
INDICATO
R
1.50
REF
0.50
0.40
0.30
2.75
BSC SQ
TOP
VIEW
12° MAX 0.70 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDICATOR
0.90 MAX
0.85 NOM
0.30
0.23
0.18
0.05 MAX
0.01 NOM
0.20 REF
1.89
1.74
1.59
4
1.60
1.45
1.30
3.00
BSC SQ
5
8
Figure 25. 8-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body
(CP-8-2)
Dimensions shown in millimeters
ADG901/ADG902
Rev. B | Page 13 of 16
ORDERING GUIDE
Model Temperature Range Package Description Package Option Branding
ADG901BRM −40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 W6B
ADG901BRM-500RL7 −40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 W6B
ADG901BRM-REEL7 −40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 W6B
ADG901BRMZ1 −40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 S1T
ADG901BRMZ-REEL71 −40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 S1T
ADG901BCP-500RL7 −40°C to +85°C 8-Lead Lead Frame Chip Scale Package [LFCSP] CP-8-2 W6B
ADG901BCP-REEL7 −40°C to +85°C 8-Lead Lead Frame Chip Scale Package [LFCSP] CP-8-2 W6B
ADG901BCPZ-REEL7 −40°C to +85°C 8-Lead Lead Frame Chip Scale Package [LFCSP] CP-8-2 S1T
ADG902BRM −40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 W7B
ADG902BRM-500RL7 −40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 W7B
ADG902BRM-REEL7 −40°C to +85°C 8-Lead Lead Frame Chip Scale Package [LFCSP] RM-8 W7B
ADG902BRMZ1 −40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 S1V
ADG902BCP-500RL7 −40°C to +85°C 8-Lead Lead Frame Chip Scale Package [LFCSP] CP-8-2 W7B
ADG902BCP-REEL7 −40°C to +85°C 8-Lead Lead Frame Chip Scale Package [LFCSP] CP-8-2 W7B
ADG902BCP-REEL7 −40°C to +85°C 8-Lead Lead Frame Chip Scale Package [LFCSP] CP-8-2 S1V
EVAL-ADG901EB Evaluation Board
EVAL-ADG902EB Evaluation Board
1 Z = Pb-free part.
ADG901/ADG902 Preliminary Technical Data
Rev. B | Page 14 of 16
NOTES
ADG901/ADG902
Rev. B | Page 15 of 16
NOTES
ADG901/ADG902 Preliminary Technical Data
Rev. B | Page 16 of 16
NOTES
©2005 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D03336–0–10/05(B)
