SEMiX151GAL12T4s
© by SEMIKRON Rev. 43 24.10.2008 1
SEMiX®1s
GAL
Trench IGBT Modules
SEMiX151GAL12T4s
Features
Homogeneous Si
Trench = Trenchgate technology
•V
CE(sat) with positive temperature
coefficient
High short circuit capability
UL recognised file no. E63532
Typical Applications
AC inverter drives
•UPS
Electronic Welding
Remarks
Case temperature limited to TC=125°C
max.
Product reliability results are valid for
Tj=150°C
Absolute Maximum Ratings
Symbol Conditions Values Unit
IGBT
VCES 1200 V
ICTj= 175 °C Tc=2C 232 A
Tc=8C 179 A
ICnom 150 A
ICRM ICRM = 3xICnom 450 A
VGES -20 ... 20 V
tpsc
VCC = 800 V
VGE 15 V
Tj= 150 °C
VCES 1200 V
10 µs
Tj-40 ... 175 °C
Inverse diode
IFTj= 175 °C Tc=2C 189 A
Tc=8C 141 A
IFnom 150 A
IFRM IFRM = 3xIFnom 450 A
IFSM tp= 10 ms, sin 180°, Tj=2C A
Tj-40 ... 175 °C
Freewheeling diode
IFTj= 175 °C Tc=2C 189 A
Tc=8C 141 A
IFnom 150 A
IFRM IFRM = 3xIFnom 450 A
IFSM tp= 10 ms, sin 180°, Tj=2C A
Tj-40 ... 175 °C
Module
It(RMS) 600 A
Tstg -40 ... 125 °C
Visol AC sinus 50Hz, t = 1 min 4000 V
Characteristics
Symbol Conditions min. typ. max. Unit
IGBT
VCE(sat) IC=150A
VGE =15V
chiplevel
Tj=2C 1.8 2.05 V
Tj= 150 °C 2.20 2.4 V
VCE0 Tj=2C 0.8 0.9 V
Tj= 150 °C 0.7 0.8 V
rCE VGE =15V Tj=2C 6.7 7.7 m
Tj= 150 °C 10.0 10.7 m
VGE(th) VGE=VCE, IC=6mA 5 5.8 6.5 V
ICES VGE =0V
VCE = 1200 V
Tj=2C 0.1 0.3 mA
Tj= 150 °C mA
Cies VCE =25V
VGE =0V
f=1MHz 9.3 nF
Coes f=1MHz 0.58 nF
Cres f=1MHz 0.51 nF
QGVGE =- 8 V...+ 15 V 850 nC
RGint Tj=2C 5.00
SEMiX151GAL12T4s
2 Rev. 43 24.10.2008 © by SEMIKRON
td(on) VCC = 600 V
IC=150A
Tj= 150 °C
RG on =1
RG off =1
di/dton = 3900 A/µs
di/dtoff = 2000 A/µs
185 ns
tr42 ns
Eon 16.6 mJ
td(off) 410 ns
tf70 ns
Eoff 13.8 mJ
Rth(j-c) per IGBT 0.19 K/W
Rth(j-s) per IGBT K/W
Inverse diode
VF = VEC IF=150A
VGE =0V
chiplevel
Tj=2C 2.1 2.5 V
Tj= 150 °C 2.1 2.4 V
VF0 Tj=2C 1.1 1.3 1.5 V
Tj= 150 °C 0.7 0.9 1.1 V
rFTj=2C 4.3 5.6 6.4 m
Tj= 150 °C 6.7 7.8 8.5 m
IRRM IF=150A
di/dtoff = 3400 A/µs
VGE =-15V
VCC = 600 V
Tj= 150 °C 115 A
Qrr Tj= 150 °C 23 µC
Err Tj= 150 °C 8.9 mJ
Rth(j-c) per diode 0.31 K/W
Rth(j-s) per diode K/W
Freewheeling diode
VF = VEC IF=150A
VGE =0V
chiplevel
Tj=2C 2.1 2.5 V
Tj= 150 °C 2.1 2.4 V
VF0 Tj=2C 1.1 1.3 1.5 V
Tj= 150 °C 0.7 0.9 1.1 V
rFTj=2C 4.3 5.6 6.4 m
Tj= 150 °C 6.7 7.8 8.5 m
IRRM IF=150A
di/dtoff = 3400 A/µs
VGE =-15V
VCC = 600 V
Tj= 150 °C 115 A
Qrr Tj= 150 °C 23 µC
Err Tj= 150 °C 8.9 mJ
Rth(j-c) per diode 0.31 K/W
Rth(j-s) per diode K/W
Module
LCE 16 nH
RCC'+EE' res., terminal-chip TC=2C 0.7 m
TC= 125 °C 1m
Rth(c-s) per module 0.075 K/W
Msto heat sink (M5) 3 5 Nm
Mtto terminals (M6) 2.5 5 Nm
Nm
w145 g
Temperature sensor
R100 Tc=100°C (R25=5 k)0,493
±5% k
B100/125
R(T)=R100exp[B100/125(1/T-1/T100)];
T[K];
3550
±2% K
Characteristics
Symbol Conditions min. typ. max. Unit
SEMiX®1s
GAL
Trench IGBT Modules
SEMiX151GAL12T4s
Features
Homogeneous Si
Trench = Trenchgate technology
•V
CE(sat) with positive temperature
coefficient
High short circuit capability
UL recognised file no. E63532
Typical Applications
AC inverter drives
•UPS
Electronic Welding
Remarks
Case temperature limited to TC=125°C
max.
Product reliability results are valid for
Tj=150°C
SEMiX151GAL12T4s
© by SEMIKRON Rev. 43 24.10.2008 3
Fig. 1 Typ. output characteristic, inclusive RCC'+ EE' Fig. 2 Rated current vs. temperature IC = f (TC)
Fig. 3 Typ. turn-on /-off energy = f (IC)Fig. 4 Typ. turn-on /-off energy = f (RG)
Fig. 5 Typ. transfer characteristic Fig. 6 Typ. gate charge characteristic
SEMiX151GAL12T4s
4 Rev. 43 24.10.2008 © by SEMIKRON
Fig. 7 Typ. switching times vs. ICFig. 8 Typ. switching times vs. gate resistor RG
Fig. 9 Typ. transient thermal impedance Fig. 10 Typ. CAL diode forward charact., incl. RCC'+EE'
Fig. 11 Typ. CAL diode peak reverse recovery current Fig. 12 Typ. CAL diode recovery charge
SEMiX151GAL12T4s
© by SEMIKRON Rev. 43 24.10.2008 5
This technical information specifies semiconductor devices. No warranty or guarantee expressed or implied is made regarding delivery,
performance or suitability.
SEMiX 1s
GAL