© Semiconductor Components Industries, LLC, 2012
February, 2012 Rev. 2
1Publication Order Number:
2SC5658M3/D
2SC5658M3T5G,
2SC5658RM3T5G
NPN Silicon General
Purpose Amplifier Transistor
This NPN transistor is designed for general purpose amplifier
applications. This device is housed in the SOT-723 package which is
designed for low power surface mount applications, where board
space is at a premium.
Features
Reduces Board Space
High hFE, 210460 (typical)
Low VCE(sat), < 0.5 V
ESD Performance: Human Body Model; u 2000 V,
Machine Model; u 200 V
Available in 8 mm, 7-inch/3000 Unit Tape and Reel
These are PbFree Devices
MAXIMUM RATINGS (TA = 25°C)
Rating Symbol Value Unit
Collector-Base Voltage V(BR)CBO 50 Vdc
Collector-Emitter Voltage V(BR)CEO 50 Vdc
Emitter-Base Voltage V(BR)EBO 5.0 Vdc
Collector Current Continuous IC100 mAdc
THERMAL CHARACTERISTICS
Rating Symbol Max Unit
Power Dissipation (Note 1) PD260 mW
Junction Temperature TJ150 °C
Storage Temperature Range Tstg 55 ~ +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Device mounted on a FR-4 glass epoxy printed circuit board using the
minimum recommended footprint.
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Device Package Shipping
ORDERING INFORMATION
2SC5658M3T5G SOT723
(PbFree)
3000/Tape & Reel
SOT723
CASE 631AA
MARKING
DIAGRAM
1
2
3
XXM
XX = Specific Device Code
(B9 = 2SC5658M3T5G
RM = 2SC5658RM3T5G)
M = Date Code
COLLECTOR
3
1
BASE
2
EMITTER
NPN GENERAL
PURPOSE AMPLIFIER
TRANSISTORS
SURFACE MOUNT
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
2SC5658RM3T5G SOT723
(PbFree)
3000/Tape & Reel
2SC5658M3T5G, 2SC5658RM3T5G
http://onsemi.com
2
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Characteristic Symbol Min Typ Max Unit
Collector-Base Breakdown Voltage (IC = 50 mAdc, IE = 0) V(BR)CBO 50 Vdc
Collector-Emitter Breakdown Voltage (IC = 1.0 mAdc, IB = 0) V(BR)CEO 50 Vdc
Emitter-Base Breakdown Voltage (IE = 50 mAdc, IE = 0) V(BR)EBO 5.0 Vdc
Collector-Base Cutoff Current (VCB = 30 Vdc, IE = 0) ICBO 0.5 mA
Emitter-Base Cutoff Current (VEB = 4.0 Vdc, IB = 0) IEBO 0.5 mA
Collector-Emitter Saturation Voltage (Note 2)
(IC = 50 mAdc, IB = 5.0 mAdc)
VCE(sat)
0.4
Vdc
DC Current Gain (Note 2)
(VCE = 6.0 Vdc, IC = 1.0 mAdc) 2SC5658M3T5G
(VCE = 6.0 Vdc, IC = 1.0 mAdc) 2SC5658RM3T5G
hFE
120
215
560
375
Transition Frequency (VCE = 12 Vdc, IC = 2.0 mAdc, f = 30 MHz) fT180 MHz
Output Capacitance (VCB = 12 Vdc, IC = 0 Adc, f = 1.0 MHz) COB 2.0 pF
2. Pulse Test: Pulse Width 300 ms, D.C. 2%.
2SC5658M3T5G, 2SC5658RM3T5G
http://onsemi.com
3
TYPICAL ELECTRICAL CHARACTERISTICS
Figure 1. IC VCE Figure 2. Collector Emitter Saturation Voltage
vs. Collector Current
Figure 3. Base Emitter Saturation Voltage vs.
Collector Current
Figure 4. DC Current Gain vs. Collector
Current
60
0
50
40
30
20
10
0
24 6 8
TA = 25°C160 mA
140 mA
120 mA
100 mA
80 mA
60 mA
40 mA
IB = 20 mA
Figure 5. Saturation Region Figure 6. BaseEmitter TurnON Voltage vs.
Collector Current
VCE, COLLECTOR VOLTAGE (V) IC, COLLECTOR CURRENT (mA)
0.01 0.1 1 10 100
1
0.1
0.01
VCE, COLLECTOREMITTER
SATURATION VOLTAGE (V)
IC, COLLECTOR CURRENT (mA)
TA = 150°C
TA = 25°C
TA = 55°C
IC/IB = 10
1.2
1.1
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.01 0.1 1 10 100
IC, COLLECTOR CURRENT (mA)
VBE(sat), BASEEMITTER
SATURATION VOLTAGE (V)
TA = 150°C
TA = 25°C
TA = 55°C
IC/IB = 10
IC, COLLECTOR CURRENT (mA)
hFE, DC CURRENT GAIN
1000
100
10
0.1 1 10 100 1000
TA = 150°C
TA = 25°C
TA = 55°C
VCE = 6 V
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0.01 0.1 1 10 100
IB, BASE CURRENT (mA)
VCE(sat), COLLECTOREMITTER
SATURATION VOLTAGE (V)
TA = 25°C
10 mA
30 mA
30 mA
50 mA
IC = 100 mA
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1 1 10 100 1000
IC, COLLECTOR CURRENT (mA)
VBE(ON), BASEEMITTER ON
VOLTAGE (V)
TA = 55°C
TA = 25°C
TA = 150°C
VCE = 2 V
2SC5658M3T5G, 2SC5658RM3T5G
http://onsemi.com
4
TYPICAL ELECTRICAL CHARACTERISTICS
Figure 7. Capacitance
100
VR, REVERSE VOLTAGE (V)
C, CAPACITANCE (pF)
Cibo
10
1
Cobo
0.1 1 10 100 0.1 1 10 100 1000
1000
100
10
ftau, CURRENT GAIN BANDWIDTH
PRODUCT (MHz)
Figure 8. Current Gain Bandwidth Product vs.
Collector Current
IC, COLLECTOR CURRENT (mA)
VCE = 2 V
TA = 25°C
Figure 9. Safe Operating Area
VCE, COLLECTOR REVERSE VOLTAGE (V)
IC, COLLECTOR CURRENT (mA)
1 10 100
1000
100
10
1
10 ms
100 ms
10 s
Thermal
Limit
2SC5658M3T5G, 2SC5658RM3T5G
http://onsemi.com
5
PACKAGE DIMENSIONS
SOT723
CASE 631AA01
ISSUE D
DIM MIN NOM MAX
MILLIMETERS
A0.45 0.50 0.55
b0.15 0.21 0.27
b1 0.25 0.31 0.37
C0.07 0.12 0.17
D1.15 1.20 1.25
E0.75 0.80 0.85
e0.40 BSC
H1.15 1.20 1.25
L
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
D
b1
E
b
e
A
L
C
H
Y
X
X0.08 Y
2X
E
12
3
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
L2 0.15 0.20 0.25
0.29 REF
3X
L2
3X
1
2X
TOP VIEW
BOTTOM VIEW
SIDE VIEW
RECOMMENDED
DIMENSIONS: MILLIMETERS
0.40
1.50
2X
PACKAGE
OUTLINE
0.27
2X
0.52
3X 0.36
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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2SC5658M3/D
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