TLP240GA,TLP240GAF
1
Photocouplers Photorelay
TLP240GA,TLP240GAF
TLP240GA,TLP240GAF
TLP240GA,TLP240GAF
TLP240GA,TLP240GAF
Start of commercial production
2013-02
1.
1.
1.
1. Applications
Applications
Applications
Applications
• Mechanical relay replacements
• Security Systems
• Measuring Instruments
• Factory Automation (FA)
• Amusement Equipment
• Smart Meters
• Electricity Meters
2.
2.
2.
2. General
General
General
General
The TLP240GA and TLP240GAF photorelay consist of a photo MOSFET optically coupled to an infrared light
emitting diode. They are housed in a 4-pin DIP package. They provide an isolation voltage of 5000 Vrms, making
them suitable for applications that require reinforced insulation.
3.
3.
3.
3. Features
Features
Features
Features
(1) Halogen-free
For details, see "Devices in Halogen-Free Resin Packages" at the end of this datasheet.
(2) Normally opened (1-Form-A)
(3) OFF-state output terminal voltage: 400 V (min)
(4) Trigger LED current: 3 mA (max)
(5) ON-state current: 120 mA (max)
(6) ON-state resistance: 28 Ω (max, t < 1 s), 35 Ω (max, Continuous)
(7) Isolation voltage: 5000 Vrms (min)
(8) Safety standards
UL-approved: UL1577, File No.E67349
cUL-approved: CSA Component Acceptance Service No.5A File No.E67349
VDE-approved: EN60747-5-5 (Note 1)
(Note 1)
(Note 1)
(Note 1)
CQC-approved: GB4943.1, GB8898 Japan Factory
Note 1: When an EN60747-5-5 approved type is needed, please designate the Option (D4)
Option (D4)
Option (D4)
Option (D4).
4.
4.
4.
4. Mechanical Parameters
Mechanical Parameters
Mechanical Parameters
Mechanical Parameters
Characteristics
Creepage distances
Clearance distances
Internal isolation thickness
7.62-mm Pitch
TLP240GA
7.0 (min)
7.0 (min)
0.4 (min)
10.16-mm Pitch
TLP240GAF
8.0 (min)
8.0 (min)
0.4 (min)
Unit
mm
2017-10-12
Rev.5.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP240GA,TLP240GAF
2
5.
5.
5.
5. Packaging (Note)
Packaging (Note)
Packaging (Note)
Packaging (Note)
TLP240GA
11-5B2S
TLP240GA(LF1,TP1)
11-5B201S
TLP240GA(LF5,TP5)
11-5B205S
TLP240GAF
11-5B202S
TLP240GAF(LF4,TP4)
11-5B204S
Note: Through-hole type: TLP240GA, TLP240GAF
Lead forming option: (LF1), (LF4), (LF5)
Taping option: (TP1), (TP4), (TP5)
6.
6.
6.
6. Pin Assignment
Pin Assignment
Pin Assignment
Pin Assignment
1: Anode
2: Cathode
3: Drain
4: Drain
7.
7.
7.
7. Internal Circuit
Internal Circuit
Internal Circuit
Internal Circuit
2017-10-12
Rev.5.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP240GA,TLP240GAF
3
8.
8.
8.
8. Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
LED
Detector
Common
Characteristics
Input forward current
Input forward current derating
Input forward current (pulsed)
Input reverse voltage
Input power dissipation
Input power dissipation derating
Junction temperature
OFF-state output terminal voltage
ON-state current
ON-state current derating
ON-state current (pulsed)
Output power dissipation
Output power dissipation derating
Junction temperature
Storage temperature
Operating temperature
Lead soldering temperature
Isolation voltage
(Ta ≥ 25 )
(100 µs pulse, 100 pps)
(Ta ≥ 25 )
(Ta ≥ 25 )
(t = 100 ms, Duty = 1/10)
(Ta ≥ 25 )
(10 s)
AC, 60 s, R.H. ≤ 60 %
Symbol
IF
∆IF/∆Ta
IFP
VR
PD
∆PD/∆Ta
Tj
VOFF
ION
∆ION/∆Ta
IONP
PO
∆PO/∆Ta
Tj
Tstg
Topr
Tsol
BVS
Note
(Note 1)
Rating
30
-0.3
1
5
50
-0.5
125
400
120
-1.2
360
500
-5.0
125
-55 to 125
-40 to 85
260
5000
Unit
mA
mA/
A
V
mW
mW/
V
mA
mA/
mA
mW
mW/
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are
shorted together.
9.
9.
9.
9. Recommended Operating Conditions (Note)
Recommended Operating Conditions (Note)
Recommended Operating Conditions (Note)
Recommended Operating Conditions (Note)
Characteristics
Supply voltage
Input forward current
ON-state current
Operating temperature
Symbol
VDD
IF
ION
Topr
Note Min
5
-20
Typ.
7.5
Max
320
25
120
65
Unit
V
mA
mA
Note: The recommended operating conditions are given as a design guide necessary to obtain the intended
performance of the device. Each parameter is an independent value. When creating a system design using
this device, the electrical characteristics specified in this data sheet should also be considered.
2017-10-12
Rev.5.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP240GA,TLP240GAF
4
10.
10.
10.
10. Electrical Characteristics (Unless otherwise specified, T
Electrical Characteristics (Unless otherwise specified, T
Electrical Characteristics (Unless otherwise specified, T
Electrical Characteristics (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
LED
Detector
Characteristics
Input forward voltage
Input reverse current
Input capacitance
OFF-state current
Output capacitance
Symbol
VF
IR
Ct
IOFF
COFF
Note Test Condition
IF = 10 mA
VR = 5 V
V = 0 V, f = 1 MHz
VOFF = 400 V
V = 0 V, f = 1 MHz
Min
1.1
Typ.
1.27
50
80
Max
1.4
10
1000
Unit
V
µA
pF
nA
pF
11.
11.
11.
11. Coupled Electrical Characteristics (Unless otherwise specified, T
Coupled Electrical Characteristics (Unless otherwise specified, T
Coupled Electrical Characteristics (Unless otherwise specified, T
Coupled Electrical Characteristics (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Trigger LED current
Return LED current
ON-state resistance
Symbol
IFT
IFC
RON
Note
(Note 1)
Test Condition
ION = 120 mA
IOFF = 10 µA
ION = 120 mA, IF = 5 mA, t < 1 s
ION = 120 mA, IF = 5 mA, Continuous
Min
0.1
Typ.
0.6
17
22
Max
3
28
35
Unit
mA
Ω
Note 1: Thermally saturated state.
12.
12.
12.
12. Isolation Characteristics (Unless otherwise specified, T
Isolation Characteristics (Unless otherwise specified, T
Isolation Characteristics (Unless otherwise specified, T
Isolation Characteristics (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Total capacitance (input to output)
Isolation resistance
Isolation voltage
Symbol
CS
RS
BVS
Note
(Note 1)
(Note 1)
(Note 1)
Test Condition
VS = 0 V, f = 1 MHz
VS = 500 V, R.H. ≤ 60 %
AC, 60 s
AC, 1 s in oil
DC, 60 s in oil
Min
1 × 1012
5000
Typ.
0.8
1014
10000
10000
Max
Unit
pF
Ω
Vrms
Vdc
Note 1: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are
shorted together.
13.
13.
13.
13. Switching Characteristics (Unless otherwise specified, T
Switching Characteristics (Unless otherwise specified, T
Switching Characteristics (Unless otherwise specified, T
Switching Characteristics (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Turn-on time
Turn-off time
Symbol
tON
tOFF
Note Test Condition
See Fig. 13.1.
RL = 200 Ω, VDD = 20 V, IF = 5 mA
Min
Typ.
0.6
0.2
Max
2
1
Unit
ms
Fig.
Fig.
Fig.
Fig. 13.1
13.1
13.1
13.1 Switching Time Test Circuit and Waveform
Switching Time Test Circuit and Waveform
Switching Time Test Circuit and Waveform
Switching Time Test Circuit and Waveform
2017-10-12
Rev.5.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP240GA,TLP240GAF
5
14.
14.
14.
14. Characteristics Curves (Note)
Characteristics Curves (Note)
Characteristics Curves (Note)
Characteristics Curves (Note)
Fig.
Fig.
Fig.
Fig. 14.1
14.1
14.1
14.1 I
I
I
IF
F
F
F - T
- T
- T
- Ta
a
a
aFig.
Fig.
Fig.
Fig. 14.2
14.2
14.2
14.2 I
I
I
ION
ON
ON
ON - T
- T
- T
- Ta
a
a
a
Fig.
Fig.
Fig.
Fig. 14.3
14.3
14.3
14.3 I
I
I
IF
F
F
F - V
- V
- V
- VF
F
F
FFig.
Fig.
Fig.
Fig. 14.4
14.4
14.4
14.4 I
I
I
ION
ON
ON
ON - V
- V
- V
- VON
ON
ON
ON
Fig.
Fig.
Fig.
Fig. 14.5
14.5
14.5
14.5 R
R
R
RON
ON
ON
ON - T
- T
- T
- Ta
a
a
aFig.
Fig.
Fig.
Fig. 14.6
14.6
14.6
14.6 I
I
I
IFT
FT
FT
FT - T
- T
- T
- Ta
a
a
a
2017-10-12
Rev.5.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP240GA,TLP240GAF
6
Fig.
Fig.
Fig.
Fig. 14.7
14.7
14.7
14.7 t
t
t
tON
ON
ON
ON, t
, t
, t
, tOFF
OFF
OFF
OFF - I
- I
- I
- IF
F
F
FFig.
Fig.
Fig.
Fig. 14.8
14.8
14.8
14.8 t
t
t
tON
ON
ON
ON, t
, t
, t
, tOFF
OFF
OFF
OFF - T
- T
- T
- Ta
a
a
a
Fig.
Fig.
Fig.
Fig. 14.9
14.9
14.9
14.9 I
I
I
IOFF
OFF
OFF
OFF - T
- T
- T
- Ta
a
a
a
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
2017-10-12
Rev.5.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP240GA,TLP240GAF
7
15.
15.
15.
15. Soldering and Storage
Soldering and Storage
Soldering and Storage
Soldering and Storage
15.1.
15.1.
15.1.
15.1. Precautions for Soldering
Precautions for Soldering
Precautions for Soldering
Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
• When using soldering reflow.
The soldering temperature profile is based on the package surface temperature.
(See the figure shown below, which is based on the package surface temperature.)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
Fig.
Fig.
Fig.
Fig. 15.1.1
15.1.1
15.1.1
15.1.1 An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
• When using soldering flow
Preheat the device at a temperature of 150 (package surface temperature) for 60 to 120 seconds.
Mounting condition of 260 within 10 seconds is recommended.
Flow soldering must be performed once.
• When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not
exceeding 350
Heating by soldering iron must be done only once per lead.
15.2.
15.2.
15.2.
15.2. Precautions for General Storage
Precautions for General Storage
Precautions for General Storage
Precautions for General Storage
• Avoid storage locations where devices may be exposed to moisture or direct sunlight.
• Follow the precautions printed on the packing label of the device for transportation and storage.
• Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %,
respectively.
• Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
• Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
• When restoring devices after removal from their packing, use anti-static containers.
• Do not allow loads to be applied directly to devices while they are in storage.
• If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
2017-10-12
Rev.5.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP240GA,TLP240GAF
8
16.
16.
16.
16. Land Pattern Dimensions (for reference only)
Land Pattern Dimensions (for reference only)
Land Pattern Dimensions (for reference only)
Land Pattern Dimensions (for reference only)
Unit: mm
TLP240GA
Fig.
Fig.
Fig.
Fig. 16.1
16.1
16.1
16.1 Lead forming and taping option
Lead forming and taping option
Lead forming and taping option
Lead forming and taping option
(LF1), (TP1), (LF5), (TP5)
TLP240GAF
Fig.
Fig.
Fig.
Fig. 16.2
16.2
16.2
16.2 Lead forming and taping option
Lead forming and taping option
Lead forming and taping option
Lead forming and taping option
(LF4), (TP4)
17.
17.
17.
17. Marking (Note)
Marking (Note)
Marking (Note)
Marking (Note)
TLP240GA TLP240GAF
Note: A different marking is used for photocouplers that have been qualified according to option (D4) of EN60747.
See Fig.18.3 and Fig.18.4.
2017-10-12
Rev.5.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP240GA,TLP240GAF
9
18.
18.
18.
18. EN60747-5-5 Option (D4) Specification
EN60747-5-5 Option (D4) Specification
EN60747-5-5 Option (D4) Specification
EN60747-5-5 Option (D4) Specification
• Part number: TLP240GA (Note 1)
(Note 1)
(Note 1)
(Note 1)
• The following part naming conventions are used for the devices that have been qualified according to
option (D4) of EN60747.
Example: TLP240GA(D4TP1,F(O
D4: EN60747 option
TP1: Tape type
F: [[G]]/RoHS COMPATIBLE (Note 2)
(Note 2)
(Note 2)
(Note 2)
O: Domestic ID (Country/Region of origin: Japan)
Note 1: Use TOSHIBA standard type number for safety standard application.
e.g., TLP240GA(D4TP1,F(O → TLP240GA
Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's
RoHS compatibility.
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the
restriction of the use of certain hazardous substances in electrical and electronic equipment.
Fig.
Fig.
Fig.
Fig. 18.1
18.1
18.1
18.1 EN60747 Insulation Characteristics
EN60747 Insulation Characteristics
EN60747 Insulation Characteristics
EN60747 Insulation Characteristics
2017-10-12
Rev.5.0
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Toshiba Electronic Devices & Storage Corporation
TLP240GA,TLP240GAF
10
Table
Table
Table
Table 18.1
18.1
18.1
18.1 Insulation Related Specifications (Note)
Insulation Related Specifications (Note)
Insulation Related Specifications (Note)
Insulation Related Specifications (Note)
Insulation Related Parameters
Minimum creepage distance
Minimum clearance
Minimum insulation thickness
Comparative tracking index
Symbol
Cr
Cl
ti
CTI
TLP240GA
7.0 mm
7.0 mm
0.4 mm
175
TLP240GAF
8.0 mm
8.0 mm
0.4 mm
175
Note: If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value.
(e.g., at a standard distance between soldering eye centers of 7.5 mm). If this is not permissible, the user shall
take suitable measures.
Note: This photocoupler is suitable for safe electrical isolation
safe electrical isolation
safe electrical isolation
safe electrical isolation only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuits.
Fig.
Fig.
Fig.
Fig. 18.2
18.2
18.2
18.2 Marking on Packing for EN60747
Marking on Packing for EN60747
Marking on Packing for EN60747
Marking on Packing for EN60747
TLP240GA
Fig.
Fig.
Fig.
Fig. 18.3
18.3
18.3
18.3 Marking Example (Note)
Marking Example (Note)
Marking Example (Note)
Marking Example (Note)
TLP240GAF
Fig.
Fig.
Fig.
Fig. 18.4
18.4
18.4
18.4 Marking Example (Note)
Marking Example (Note)
Marking Example (Note)
Marking Example (Note)
Note: The above marking is applied to the photocouplers that have been qualified according to option (D4) of
EN60747.
2017-10-12
Rev.5.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP240GA,TLP240GAF
11
Fig.
Fig.
Fig.
Fig. 18.5
18.5
18.5
18.5 Measurement Procedure
Measurement Procedure
Measurement Procedure
Measurement Procedure
2017-10-12
Rev.5.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP240GA,TLP240GAF
12
19.
19.
19.
19. Ordering Information (Example of Item Name)
Ordering Information (Example of Item Name)
Ordering Information (Example of Item Name)
Ordering Information (Example of Item Name)
Item Name
TLP240GA(F(O
TLP240GA(LF1,F(O
TLP240GA(LF5,F(O
TLP240GA(TP1,F(O
TLP240GA(TP5,F(O
TLP240GA(D4,F(O
TLP240GA(D4LF1,F(O
TLP240GA(D4LF5,F(O
TLP240GA(D4TP1,F(O
TLP240GA(D4TP5,F(O
TLP240GAF(F(O
TLP240GAF(LF4,F(O
TLP240GAF(TP4,F(O
TLP240GAF(D4,F(O
TLP240GAF(D4LF4F(O
TLP240GAF(D4TP4F(O
Packaging (Note 1)
TH
LF1
LF5
LF1
LF5
TH
LF1
LF5
LF1
LF5
TH, Wide forming
LF4, Wide forming
LF4, Wide forming
TH, Wide forming
LF4, Wide forming
LF4, Wide forming
VDE Option
EN60747-5-5
EN60747-5-5
EN60747-5-5
EN60747-5-5
EN60747-5-5
EN60747-5-5
EN60747-5-5
EN60747-5-5
Packing (MOQ)
Magazine (100 pcs)
Magazine (100 pcs)
Magazine (100 pcs)
Tape and reel (1500 pcs)
Tape and reel (1500 pcs)
Magazine (100 pcs)
Magazine (100 pcs)
Magazine (100 pcs)
Tape and reel (1500 pcs)
Tape and reel (1500 pcs)
Magazine (100 pcs)
Magazine (100 pcs)
Tape and reel (1000 pcs)
Magazine (100 pcs)
Magazine (100 pcs)
Tape and reel (1000 pcs)
Note 1: TH: Through-hole, LF: Lead forming for surface mount
20.
20.
20.
20. Devices in Halogen-Free Resin Packages
Devices in Halogen-Free Resin Packages
Devices in Halogen-Free Resin Packages
Devices in Halogen-Free Resin Packages
This product is Halogen-Free
Toshiba Electronic Devices & Storage Corporation ("Toshiba") defines a "Halogen-Free resin semiconductor
product" as a semiconductor product in which:
(1) the encapsulating resins do not contain any of the following elements: bromine (Br), chlorine (Cl) and antimony
(Sb), respectively, in an amount exceeding 0.09 weight percent, and do not contain chlorine and bromine in an
aggregate amount exceeding 0.15 weight percent of the encapsulating resins, and/or
(2) the resin portion(s) in printed circuit boards do not contain any of the following elements: bromine,
chlorine and antimony, respectively, in an amount exceeding 0.09 weight percent, and do not contain
chlorine and bromine in an aggregate amount exceeding 0.15 weight percent of the each resin portion(s) in
printed circuit boards.
For avoidance of doubt, "Halogen-Free resin semiconductor product" does not mean, and Toshiba does not make
any warranty of any kind, that said semiconductor product is entirely free of antimony or of any of the following
elements of the halogen family: bromine, chlorine, iodine (I), fluorine (F) and astatine (At).
In addition, a Halogen-Free resin semiconductor product may contain antimony and/or any of the elements of
the halogen family as mentioned in the above paragraph in one or more portion(s) of the semiconductor product
other than the encapsulating resins and the resin portion(s) in printed circuit boards.
The information provided herein is accurate as of the date that it was provided, to the best of the knowledge and
belief of the Toshiba Electronic Devices & Storage Corporation ("Toshiba"), Toshiba bases such knowledge and
belief on information provided by third parties, and Toshiba makes no representation or warranty as to the
accuracy of such third party information. Toshiba has taken and will continue to take, reasonable steps to provide
accurate information to its customers, but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals.
2017-10-12
Rev.5.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP240GA,TLP240GAF
13
Package Dimensions
Package Dimensions
Package Dimensions
Package Dimensions
Unit: mm
TLP240GA
Weight: 0.26 g (typ.)
Package Name(s)
TOSHIBA: 11-5B2S
2017-10-12
Rev.5.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP240GA,TLP240GAF
14
Package Dimensions
Package Dimensions
Package Dimensions
Package Dimensions
Unit: mm
TLP240GA(LF1,TP1)
Weight: 0.25 g (typ.)
Package Name(s)
TOSHIBA: 11-5B201S
2017-10-12
Rev.5.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP240GA,TLP240GAF
15
Package Dimensions
Package Dimensions
Package Dimensions
Package Dimensions
Unit: mm
TLP240GA(LF5,TP5)
Weight: 0.25 g (typ.)
Package Name(s)
TOSHIBA: 11-5B205S
2017-10-12
Rev.5.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP240GA,TLP240GAF
16
Package Dimensions
Package Dimensions
Package Dimensions
Package Dimensions
Unit: mm
TLP240GAF
Weight: 0.26 g (typ.)
Package Name(s)
TOSHIBA: 11-5B202S
2017-10-12
Rev.5.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP240GA,TLP240GAF
17
Package Dimensions
Package Dimensions
Package Dimensions
Package Dimensions
Unit: mm
TLP240GAF(LF4,TP4)
Weight: 0.25 g (typ.)
Package Name(s)
TOSHIBA: 11-5B204S
2017-10-12
Rev.5.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP240GA,TLP240GAF
18
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA".
Hardware, software and systems described in this document are collectively referred to as "Product".
• TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE").
("UNINTENDED USE").
("UNINTENDED USE").
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation,
equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles,
trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices,
elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR
IF YOU USE PRODUCT FOR
IF YOU USE PRODUCT FOR
IF YOU USE PRODUCT FOR
UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT.
UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT.
UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT.
UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales
representative.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any
intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and
regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration
Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all
applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
2017-10-12
Rev.5.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
